Multilayer Printed Circuit Board Market : Global Opportunity Analysis and Industry Forecast, 2024-2032
商品番号 : SMB-67901
| 出版社 | Allied Market Research |
| 出版年月 | 2024年7月 |
| ページ数 | 300 |
| 価格タイプ | シングルユーザライセンス |
| 価格 | USD 4,155 |
| 種別 | 英文調査報告書 |
Multilayer Printed Circuit Board Market
The multilayer printed circuit board market was valued at $88.1 billion in 2023, and is projected to reach $144.7 billion by 2032, growing at a CAGR of 5.7% from 2024 to 2032.
多層プリント基板市場は、2023 年に 881 億ドルと評価され、2032 年までに 1,447 億ドルに達すると予測されており、2024 年から 2032 年にかけて 5.7% の CAGR で成長します。
A multilayer printed circuit board (PCB) is a sophisticated structure integrated in electronic devices to increase the available area for wiring via insulating materials and multiple layers of conductive copper pathways. Multilayer PCBs differ from the conventional single-layer PCBs as the former stacks different independent circuit layers via intricate lamination processes. These boards are crucial for complex electronics as they lodge more circuits in a compact space, refine noise reduction, and enhance signal integrity.
With increasing adoption of consumer electronics such as smartphones, laptops, and wearable devices, the demand for multilayer PCB is rising substantially. In addition, the expansion of telecommunication infrastructure and rollout of 5G networks is driving the growth of the multilayer printed circuit board market. The adoption of microvia technology is a prominent trend gaining popularity in the market. Microvia is a small, drilled hole which elevates the performance of PCBs by facilitating interconnections, improving heat dissipation, and enabling complex routing & finer pitch components.
However, multilayer PCBs witness strong competition from alternative technologies, including flexible PCBs and organic PCBs. This competitive landscape hinders the development of the multilayer printed circuit board market. Moreover, the high expense associated with the procurement of raw materials and the production of PCBs restrains market growth. Contrarily, the establishment of initiatives and roadmaps by various organizations toward the development of multilayer PCBs are anticipated to open new avenues for the market expansion. For instance, the European Union launched a Multilayer PCB Development Initiative on January 2023. This initiative involves the allocation of funds to expand the manufacturing capabilities for multilayer PCB across member states.
Segment Review
The multilayer printed circuit board market is segmented into layer, substrate, end use industry, and region. On the basis of layer, the market is bifurcated into layer 4-6 and layer 6+. As per substrate, it is divided into rigid, flexible, and rigid-flex. According to end-use industry, it is classified into industrial electronics, healthcare, aerospace & defense, automotive, IT & telecom, consumer electronics, and others. Region wise, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
Key Findings
On the basis of layer, the layer 4-6 segment dominated the market in 2023.
As per substrate, the rigid segment was the highest shareholder in 2023.
According to end-use industry, consumer electronics segment acquired a high stake in the market in 2023.
Region wise, Asia-Pacific was the highest revenue generator in 2023.
Competition Analysis
The leading players operating in the global multilayer printed circuit board market include Sumitomo Electric Industries, Ltd., Nippon Mektron, Ltd., Compeq Manufacturing Co., Ltd., Amphenol ZD Tech, TTM Technologies, Inc., TE Connectivity Ltd., Unimicron Technology Corporation, AT&S Austria Technologie & Systemtechnik AG, Molex, and Hon Hai Precision Industry Co., Ltd. These major players have adopted various key development strategies such as business expansion, new product launches, and partnerships, to strengthen their foothold in the competitive market.
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Multilayer Printed Circuit Board Market Report Highlights
| Aspects | Details |
Market Size By 2032 | USD 144.7 Billion |
Growth Rate | CAGR of 5.7% |
Forecast period | 2024 – 2032 |
Report Pages | 300 |
By Layer |
|
By Substrate |
|
By End Use Industry |
|
By Region |
|
Key Market Players | Nippon Mektron, Ltd., Unimicron Technology Corporation, Amphenol ZD Tech, Compeq Manufacturing Co., Ltd., TTM Technologies, Inc., Sumitomo Electric Industries, Ltd., AT&S Austria Technologie & Systemtechnik AG, Molex, TE Connectivity Ltd., Hon Hai Precision Industry Co., Ltd. |
Key Market Segments
By Layer
- Layer 4-6
- Layer 6+
By Substrate
- Rigid
- Flexible
- Rigid-Flex
By End Use Industry
- Industrial Electronics
- Healthcare
- Aerospace Defense
- Automotive
- IT Telecom
- Consumer Electronics
- Others
By Region
- North America
○ U.S.
○ Canada
○ Mexico
- Europe
○ France
○ Germany
○ Italy
○ UK
○ Rest of Europe
- Asia-Pacific
○ China
○ Japan
○ India
○ South Korea
○ Rest of Asia-Pacific
- LAMEA
○ Latin America
○ Middle East
○ Africa
- Key Market Players
○ Sumitomo Electric Industries, Ltd.
○ Nippon Mektron, Ltd.
○ Compeq Manufacturing Co., Ltd.
○ Amphenol ZD Tech
○ TTM Technologies, Inc.
○ TE Connectivity Ltd.
○ Unimicron Technology Corporation
○ AT&S Austria Technologie & Systemtechnik AG
○ Molex
○ Hon Hai Precision Industry Co., Ltd.
Table of Contents
CHAPTER 1: INTRODUCTION
1.1. Report Description
1.2. Key Market Segments
1.3. Key Benefits
1.4. Research Methodology
1.4.1. Primary Research
1.4.2. Secondary Research
1.4.3. Analyst Tools and Models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO Perspective
CHAPTER 3: MARKET LANDSCAPE
3.1. Market Definition and Scope
3.2. Key Findings
3.2.1. Top Investment Pockets
3.2.2. Top Winning Strategies
3.3. Porter’s Five Forces Analysis
3.3.1. Bargaining Power of Suppliers
3.3.2. Threat of New Entrants
3.3.3. Threat of Substitutes
3.3.4. Competitive Rivalry
3.3.5. Bargaining Power among Buyers
3.5. Market Dynamics
3.5.1. Drivers
3.5.2. Restraints
3.5.3. Opportunities
CHAPTER 4: MULTILAYER PRINTED CIRCUIT BOARD MARKET, BY LAYER
4.1. Market Overview
4.1.1 Market Size and Forecast, By Layer
4.2. Layer 4-6
4.2.1. Key Market Trends, Growth Factors and Opportunities
4.2.2. Market Size and Forecast, By Region
4.2.3. Market Share Analysis, By Country
4.3. Layer 6+
4.3.1. Key Market Trends, Growth Factors and Opportunities
4.3.2. Market Size and Forecast, By Region
4.3.3. Market Share Analysis, By Country
CHAPTER 5: MULTILAYER PRINTED CIRCUIT BOARD MARKET, BY SUBSTRATE
5.1. Market Overview
5.1.1 Market Size and Forecast, By Substrate
5.2. Rigid
5.2.1. Key Market Trends, Growth Factors and Opportunities
5.2.2. Market Size and Forecast, By Region
5.2.3. Market Share Analysis, By Country
5.3. Flexible
5.3.1. Key Market Trends, Growth Factors and Opportunities
5.3.2. Market Size and Forecast, By Region
5.3.3. Market Share Analysis, By Country
5.4. Rigid-Flex
5.4.1. Key Market Trends, Growth Factors and Opportunities
5.4.2. Market Size and Forecast, By Region
5.4.3. Market Share Analysis, By Country
CHAPTER 6: MULTILAYER PRINTED CIRCUIT BOARD MARKET, BY END USE INDUSTRY
6.1. Market Overview
6.1.1 Market Size and Forecast, By End Use Industry
6.2. Industrial Electronics
6.2.1. Key Market Trends, Growth Factors and Opportunities
6.2.2. Market Size and Forecast, By Region
6.2.3. Market Share Analysis, By Country
6.3. Healthcare
6.3.1. Key Market Trends, Growth Factors and Opportunities
6.3.2. Market Size and Forecast, By Region
6.3.3. Market Share Analysis, By Country
6.4. Aerospace Defense
6.4.1. Key Market Trends, Growth Factors and Opportunities
6.4.2. Market Size and Forecast, By Region
6.4.3. Market Share Analysis, By Country
6.5. Automotive
6.5.1. Key Market Trends, Growth Factors and Opportunities
6.5.2. Market Size and Forecast, By Region
6.5.3. Market Share Analysis, By Country
6.6. IT Telecom
6.6.1. Key Market Trends, Growth Factors and Opportunities
6.6.2. Market Size and Forecast, By Region
6.6.3. Market Share Analysis, By Country
6.7. Consumer Electronics
6.7.1. Key Market Trends, Growth Factors and Opportunities
6.7.2. Market Size and Forecast, By Region
6.7.3. Market Share Analysis, By Country
6.8. Others
6.8.1. Key Market Trends, Growth Factors and Opportunities
6.8.2. Market Size and Forecast, By Region
6.8.3. Market Share Analysis, By Country
CHAPTER 7: MULTILAYER PRINTED CIRCUIT BOARD MARKET, BY REGION
7.1. Market Overview
7.1.1 Market Size and Forecast, By Region
7.2. North America
7.2.1. Key Market Trends and Opportunities
7.2.2. Market Size and Forecast, By Layer
7.2.3. Market Size and Forecast, By Substrate
7.2.4. Market Size and Forecast, By End Use Industry
7.2.5. Market Size and Forecast, By Country
7.2.6. U.S. Multilayer Printed Circuit Board Market
7.2.6.1. Market Size and Forecast, By Layer
7.2.6.2. Market Size and Forecast, By Substrate
7.2.6.3. Market Size and Forecast, By End Use Industry
7.2.7. Canada Multilayer Printed Circuit Board Market
7.2.7.1. Market Size and Forecast, By Layer
7.2.7.2. Market Size and Forecast, By Substrate
7.2.7.3. Market Size and Forecast, By End Use Industry
7.2.8. Mexico Multilayer Printed Circuit Board Market
7.2.8.1. Market Size and Forecast, By Layer
7.2.8.2. Market Size and Forecast, By Substrate
7.2.8.3. Market Size and Forecast, By End Use Industry
7.3. Europe
7.3.1. Key Market Trends and Opportunities
7.3.2. Market Size and Forecast, By Layer
7.3.3. Market Size and Forecast, By Substrate
7.3.4. Market Size and Forecast, By End Use Industry
7.3.5. Market Size and Forecast, By Country
7.3.6. France Multilayer Printed Circuit Board Market
7.3.6.1. Market Size and Forecast, By Layer
7.3.6.2. Market Size and Forecast, By Substrate
7.3.6.3. Market Size and Forecast, By End Use Industry
7.3.7. Germany Multilayer Printed Circuit Board Market
7.3.7.1. Market Size and Forecast, By Layer
7.3.7.2. Market Size and Forecast, By Substrate
7.3.7.3. Market Size and Forecast, By End Use Industry
7.3.8. Italy Multilayer Printed Circuit Board Market
7.3.8.1. Market Size and Forecast, By Layer
7.3.8.2. Market Size and Forecast, By Substrate
7.3.8.3. Market Size and Forecast, By End Use Industry
7.3.9. UK Multilayer Printed Circuit Board Market
7.3.9.1. Market Size and Forecast, By Layer
7.3.9.2. Market Size and Forecast, By Substrate
7.3.9.3. Market Size and Forecast, By End Use Industry
7.3.10. Rest of Europe Multilayer Printed Circuit Board Market
7.3.10.1. Market Size and Forecast, By Layer
7.3.10.2. Market Size and Forecast, By Substrate
7.3.10.3. Market Size and Forecast, By End Use Industry
7.4. Asia-Pacific
7.4.1. Key Market Trends and Opportunities
7.4.2. Market Size and Forecast, By Layer
7.4.3. Market Size and Forecast, By Substrate
7.4.4. Market Size and Forecast, By End Use Industry
7.4.5. Market Size and Forecast, By Country
7.4.6. China Multilayer Printed Circuit Board Market
7.4.6.1. Market Size and Forecast, By Layer
7.4.6.2. Market Size and Forecast, By Substrate
7.4.6.3. Market Size and Forecast, By End Use Industry
7.4.7. Japan Multilayer Printed Circuit Board Market
7.4.7.1. Market Size and Forecast, By Layer
7.4.7.2. Market Size and Forecast, By Substrate
7.4.7.3. Market Size and Forecast, By End Use Industry
7.4.8. India Multilayer Printed Circuit Board Market
7.4.8.1. Market Size and Forecast, By Layer
7.4.8.2. Market Size and Forecast, By Substrate
7.4.8.3. Market Size and Forecast, By End Use Industry
7.4.9. South Korea Multilayer Printed Circuit Board Market
7.4.9.1. Market Size and Forecast, By Layer
7.4.9.2. Market Size and Forecast, By Substrate
7.4.9.3. Market Size and Forecast, By End Use Industry
7.4.10. Rest of Asia-Pacific Multilayer Printed Circuit Board Market
7.4.10.1. Market Size and Forecast, By Layer
7.4.10.2. Market Size and Forecast, By Substrate
7.4.10.3. Market Size and Forecast, By End Use Industry
7.5. LAMEA
7.5.1. Key Market Trends and Opportunities
7.5.2. Market Size and Forecast, By Layer
7.5.3. Market Size and Forecast, By Substrate
7.5.4. Market Size and Forecast, By End Use Industry
7.5.5. Market Size and Forecast, By Country
7.5.6. Latin America Multilayer Printed Circuit Board Market
7.5.6.1. Market Size and Forecast, By Layer
7.5.6.2. Market Size and Forecast, By Substrate
7.5.6.3. Market Size and Forecast, By End Use Industry
7.5.7. Middle East Multilayer Printed Circuit Board Market
7.5.7.1. Market Size and Forecast, By Layer
7.5.7.2. Market Size and Forecast, By Substrate
7.5.7.3. Market Size and Forecast, By End Use Industry
7.5.8. Africa Multilayer Printed Circuit Board Market
7.5.8.1. Market Size and Forecast, By Layer
7.5.8.2. Market Size and Forecast, By Substrate
7.5.8.3. Market Size and Forecast, By End Use Industry
CHAPTER 8: COMPETITIVE LANDSCAPE
8.1. Introduction
8.2. Top Winning Strategies
8.3. Product Mapping of Top 10 Player
8.4. Competitive Dashboard
8.5. Competitive Heatmap
8.6. Top Player Positioning, 2023
CHAPTER 9: COMPANY PROFILES
9.1. Sumitomo Electric Industries, Ltd.
9.1.1. Company Overview
9.1.2. Key Executives
9.1.3. Company Snapshot
9.1.4. Operating Business Segments
9.1.5. Product Portfolio
9.1.6. Business Performance
9.1.7. Key Strategic Moves and Developments
9.2. Nippon Mektron, Ltd.
9.2.1. Company Overview
9.2.2. Key Executives
9.2.3. Company Snapshot
9.2.4. Operating Business Segments
9.2.5. Product Portfolio
9.2.6. Business Performance
9.2.7. Key Strategic Moves and Developments
9.3. Compeq Manufacturing Co., Ltd.
9.3.1. Company Overview
9.3.2. Key Executives
9.3.3. Company Snapshot
9.3.4. Operating Business Segments
9.3.5. Product Portfolio
9.3.6. Business Performance
9.3.7. Key Strategic Moves and Developments
9.4. Amphenol ZD Tech
9.4.1. Company Overview
9.4.2. Key Executives
9.4.3. Company Snapshot
9.4.4. Operating Business Segments
9.4.5. Product Portfolio
9.4.6. Business Performance
9.4.7. Key Strategic Moves and Developments
9.5. TTM Technologies, Inc.
9.5.1. Company Overview
9.5.2. Key Executives
9.5.3. Company Snapshot
9.5.4. Operating Business Segments
9.5.5. Product Portfolio
9.5.6. Business Performance
9.5.7. Key Strategic Moves and Developments
9.6. TE Connectivity Ltd.
9.6.1. Company Overview
9.6.2. Key Executives
9.6.3. Company Snapshot
9.6.4. Operating Business Segments
9.6.5. Product Portfolio
9.6.6. Business Performance
9.6.7. Key Strategic Moves and Developments
9.7. Unimicron Technology Corporation
9.7.1. Company Overview
9.7.2. Key Executives
9.7.3. Company Snapshot
9.7.4. Operating Business Segments
9.7.5. Product Portfolio
9.7.6. Business Performance
9.7.7. Key Strategic Moves and Developments
9.8. AT&S Austria Technologie And Systemtechnik AG
9.8.1. Company Overview
9.8.2. Key Executives
9.8.3. Company Snapshot
9.8.4. Operating Business Segments
9.8.5. Product Portfolio
9.8.6. Business Performance
9.8.7. Key Strategic Moves and Developments
9.9. Molex
9.9.1. Company Overview
9.9.2. Key Executives
9.9.3. Company Snapshot
9.9.4. Operating Business Segments
9.9.5. Product Portfolio
9.9.6. Business Performance
9.9.7. Key Strategic Moves and Developments
9.10. Hon Hai Precision Industry Co., Ltd.
9.10.1. Company Overview
9.10.2. Key Executives
9.10.3. Company Snapshot
9.10.4. Operating Business Segments
9.10.5. Product Portfolio
9.10.6. Business Performance
9.10.7. Key Strategic Moves and Developments
List of Tables
TABLE 1. GLOBAL MULTILAYER PRINTED CIRCUIT BOARD MARKET, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 2. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR LAYER 4-6, BY REGION, 2024 – 2032 ($BILLION)
TABLE 3. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR LAYER 6+, BY REGION, 2024 – 2032 ($BILLION)
TABLE 4. GLOBAL MULTILAYER PRINTED CIRCUIT BOARD MARKET, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 5. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR RIGID, BY REGION, 2024 – 2032 ($BILLION)
TABLE 6. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR FLEXIBLE, BY REGION, 2024 – 2032 ($BILLION)
TABLE 7. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR RIGID-FLEX, BY REGION, 2024 – 2032 ($BILLION)
TABLE 8. GLOBAL MULTILAYER PRINTED CIRCUIT BOARD MARKET, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 9. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR INDUSTRIAL ELECTRONICS, BY REGION, 2024 – 2032 ($BILLION)
TABLE 10. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR HEALTHCARE, BY REGION, 2024 – 2032 ($BILLION)
TABLE 11. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR AEROSPACE DEFENSE, BY REGION, 2024 – 2032 ($BILLION)
TABLE 12. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR AUTOMOTIVE, BY REGION, 2024 – 2032 ($BILLION)
TABLE 13. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR IT TELECOM, BY REGION, 2024 – 2032 ($BILLION)
TABLE 14. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2024 – 2032 ($BILLION)
TABLE 15. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR OTHERS, BY REGION, 2024 – 2032 ($BILLION)
TABLE 16. MULTILAYER PRINTED CIRCUIT BOARD MARKET, BY REGION, 2024 – 2032 ($BILLION)
TABLE 17. NORTH AMERICA MULTILAYER PRINTED CIRCUIT BOARD, BY COUNTRY, 2024 – 2032 ($BILLION)
TABLE 18. NORTH AMERICA MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 19. NORTH AMERICA MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 20. NORTH AMERICA MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 21. U.S. MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 22. U.S. MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 23. U.S. MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 24. CANADA MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 25. CANADA MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 26. CANADA MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 27. MEXICO MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 28. MEXICO MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 29. MEXICO MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 30. EUROPE MULTILAYER PRINTED CIRCUIT BOARD, BY COUNTRY, 2024 – 2032 ($BILLION)
TABLE 31. EUROPE MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 32. EUROPE MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 33. EUROPE MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 34. FRANCE MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 35. FRANCE MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 36. FRANCE MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 37. GERMANY MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 38. GERMANY MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 39. GERMANY MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 40. ITALY MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 41. ITALY MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 42. ITALY MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 43. UK MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 44. UK MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 45. UK MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 46. REST OF EUROPE MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 47. REST OF EUROPE MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 48. REST OF EUROPE MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 49. ASIA-PACIFIC MULTILAYER PRINTED CIRCUIT BOARD, BY COUNTRY, 2024 – 2032 ($BILLION)
TABLE 50. ASIA-PACIFIC MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 51. ASIA-PACIFIC MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 52. ASIA-PACIFIC MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 53. CHINA MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 54. CHINA MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 55. CHINA MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 56. JAPAN MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 57. JAPAN MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 58. JAPAN MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 59. INDIA MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 60. INDIA MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 61. INDIA MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 62. SOUTH KOREA MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 63. SOUTH KOREA MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 64. SOUTH KOREA MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 65. REST OF ASIA-PACIFIC MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 66. REST OF ASIA-PACIFIC MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 67. REST OF ASIA-PACIFIC MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 68. LAMEA MULTILAYER PRINTED CIRCUIT BOARD, BY COUNTRY, 2024 – 2032 ($BILLION)
TABLE 69. LAMEA MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 70. LAMEA MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 71. LAMEA MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 72. LATIN AMERICA MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 73. LATIN AMERICA MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 74. LATIN AMERICA MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 75. MIDDLE EAST MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 76. MIDDLE EAST MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 77. MIDDLE EAST MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 78. AFRICA MULTILAYER PRINTED CIRCUIT BOARD, BY LAYER, 2024 – 2032 ($BILLION)
TABLE 79. AFRICA MULTILAYER PRINTED CIRCUIT BOARD, BY SUBSTRATE, 2024 – 2032 ($BILLION)
TABLE 80. AFRICA MULTILAYER PRINTED CIRCUIT BOARD, BY END USE INDUSTRY, 2024 – 2032 ($BILLION)
TABLE 81. SUMITOMO ELECTRIC INDUSTRIES, LTD.: KEY EXECUTIVES
TABLE 82. SUMITOMO ELECTRIC INDUSTRIES, LTD.: COMPANY SNAPSHOT
TABLE 83. SUMITOMO ELECTRIC INDUSTRIES, LTD.: OPERATING SEGMENTS
TABLE 84. SUMITOMO ELECTRIC INDUSTRIES, LTD.: PRODUCT PORTFOLIO
TABLE 85. SUMITOMO ELECTRIC INDUSTRIES, LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 86. NIPPON MEKTRON, LTD.: KEY EXECUTIVES
TABLE 87. NIPPON MEKTRON, LTD.: COMPANY SNAPSHOT
TABLE 88. NIPPON MEKTRON, LTD.: OPERATING SEGMENTS
TABLE 89. NIPPON MEKTRON, LTD.: PRODUCT PORTFOLIO
TABLE 90. NIPPON MEKTRON, LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 91. COMPEQ MANUFACTURING CO., LTD.: KEY EXECUTIVES
TABLE 92. COMPEQ MANUFACTURING CO., LTD.: COMPANY SNAPSHOT
TABLE 93. COMPEQ MANUFACTURING CO., LTD.: OPERATING SEGMENTS
TABLE 94. COMPEQ MANUFACTURING CO., LTD.: PRODUCT PORTFOLIO
TABLE 95. COMPEQ MANUFACTURING CO., LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 96. AMPHENOL ZD TECH: KEY EXECUTIVES
TABLE 97. AMPHENOL ZD TECH: COMPANY SNAPSHOT
TABLE 98. AMPHENOL ZD TECH: OPERATING SEGMENTS
TABLE 99. AMPHENOL ZD TECH: PRODUCT PORTFOLIO
TABLE 100. AMPHENOL ZD TECH: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 101. TTM TECHNOLOGIES, INC.: KEY EXECUTIVES
TABLE 102. TTM TECHNOLOGIES, INC.: COMPANY SNAPSHOT
TABLE 103. TTM TECHNOLOGIES, INC.: OPERATING SEGMENTS
TABLE 104. TTM TECHNOLOGIES, INC.: PRODUCT PORTFOLIO
TABLE 105. TTM TECHNOLOGIES, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 106. TE CONNECTIVITY LTD.: KEY EXECUTIVES
TABLE 107. TE CONNECTIVITY LTD.: COMPANY SNAPSHOT
TABLE 108. TE CONNECTIVITY LTD.: OPERATING SEGMENTS
TABLE 109. TE CONNECTIVITY LTD.: PRODUCT PORTFOLIO
TABLE 110. TE CONNECTIVITY LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 111. UNIMICRON TECHNOLOGY CORPORATION: KEY EXECUTIVES
TABLE 112. UNIMICRON TECHNOLOGY CORPORATION: COMPANY SNAPSHOT
TABLE 113. UNIMICRON TECHNOLOGY CORPORATION: OPERATING SEGMENTS
TABLE 114. UNIMICRON TECHNOLOGY CORPORATION: PRODUCT PORTFOLIO
TABLE 115. UNIMICRON TECHNOLOGY CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 116. ATANDS AUSTRIA TECHNOLOGIE AND SYSTEMTECHNIK AG: KEY EXECUTIVES
TABLE 117. ATANDS AUSTRIA TECHNOLOGIE AND SYSTEMTECHNIK AG: COMPANY SNAPSHOT
TABLE 118. ATANDS AUSTRIA TECHNOLOGIE AND SYSTEMTECHNIK AG: OPERATING SEGMENTS
TABLE 119. ATANDS AUSTRIA TECHNOLOGIE AND SYSTEMTECHNIK AG: PRODUCT PORTFOLIO
TABLE 120. ATANDS AUSTRIA TECHNOLOGIE AND SYSTEMTECHNIK AG: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 121. MOLEX: KEY EXECUTIVES
TABLE 122. MOLEX: COMPANY SNAPSHOT
TABLE 123. MOLEX: OPERATING SEGMENTS
TABLE 124. MOLEX: PRODUCT PORTFOLIO
TABLE 125. MOLEX: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 126. HON HAI PRECISION INDUSTRY CO., LTD.: KEY EXECUTIVES
TABLE 127. HON HAI PRECISION INDUSTRY CO., LTD.: COMPANY SNAPSHOT
TABLE 128. HON HAI PRECISION INDUSTRY CO., LTD.: OPERATING SEGMENTS
TABLE 129. HON HAI PRECISION INDUSTRY CO., LTD.: PRODUCT PORTFOLIO
TABLE 130. HON HAI PRECISION INDUSTRY CO., LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
List of Figures
FIGURE 1. GLOBAL MULTILAYER PRINTED CIRCUIT BOARD MARKET SEGMENTATION
FIGURE 2. GLOBAL MULTILAYER PRINTED CIRCUIT BOARD MARKET
FIGURE 3. SEGMENTATION MULTILAYER PRINTED CIRCUIT BOARD MARKET
FIGURE 4. TOP INVESTMENT POCKET IN MULTILAYER PRINTED CIRCUIT BOARD MARKET
FIGURE 5. MODERATE BARGAINING POWER OF BUYERS
FIGURE 6. MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 7. MODERATE THREAT OF NEW ENTRANTS
FIGURE 8. LOW THREAT OF SUBSTITUTION
FIGURE 9. HIGH COMPETITIVE RIVALRY
FIGURE 10. OPPORTUNITIES, RESTRAINTS AND DRIVERS: GLOBALMULTILAYER PRINTED CIRCUIT BOARD MARKET
FIGURE 11. GLOBAL MULTILAYER PRINTED CIRCUIT BOARD MARKET SEGMENTATION, BY LAYER
FIGURE 12. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR LAYER 4-6, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 13. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR LAYER 6+, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 14. GLOBAL MULTILAYER PRINTED CIRCUIT BOARD MARKET SEGMENTATION, BY SUBSTRATE
FIGURE 15. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR RIGID, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 16. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR FLEXIBLE, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 17. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR RIGID-FLEX, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 18. GLOBAL MULTILAYER PRINTED CIRCUIT BOARD MARKET SEGMENTATION, BY END USE INDUSTRY
FIGURE 19. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR INDUSTRIAL ELECTRONICS, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 20. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR HEALTHCARE, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 21. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR AEROSPACE DEFENSE, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 22. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR AUTOMOTIVE, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 23. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR IT TELECOM, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 24. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 25. MULTILAYER PRINTED CIRCUIT BOARD MARKET FOR OTHERS, BY COUNTRY, 2024 – 2032 ($BILLION)
FIGURE 26. TOP WINNING STRATEGIES, BY YEAR, 2021-2023*
FIGURE 27. TOP WINNING STRATEGIES, BY DEVELOPMENT, 2021-2023*
FIGURE 28. TOP WINNING STRATEGIES, BY COMPANY, 2021-2023*
FIGURE 29. PRODUCT MAPPING OF TOP 10 PLAYERS
FIGURE 30. COMPETITIVE DASHBOARD
FIGURE 31. COMPETITIVE HEATMAP: MULTILAYER PRINTED CIRCUIT BOARD MARKET
FIGURE 32. TOP PLAYER POSITIONING, 2023
FIGURE 33. SUMITOMO ELECTRIC INDUSTRIES, LTD.: NET SALES, 2021-2023 ($BILLION)
FIGURE 34. SUMITOMO ELECTRIC INDUSTRIES, LTD.: REVENUE SHARE, BY SEGMENT, 2023 (%)
FIGURE 35. SUMITOMO ELECTRIC INDUSTRIES, LTD.: REVENUE SHARE, BY REGION, 2023 (%)
FIGURE 36. NIPPON MEKTRON, LTD.: NET SALES, 2021-2023 ($BILLION)
FIGURE 37. NIPPON MEKTRON, LTD.: REVENUE SHARE, BY SEGMENT, 2023 (%)
FIGURE 38. NIPPON MEKTRON, LTD.: REVENUE SHARE, BY REGION, 2023 (%)
FIGURE 39. COMPEQ MANUFACTURING CO., LTD.: NET SALES, 2021-2023 ($BILLION)
FIGURE 40. COMPEQ MANUFACTURING CO., LTD.: REVENUE SHARE, BY SEGMENT, 2023 (%)
FIGURE 41. COMPEQ MANUFACTURING CO., LTD.: REVENUE SHARE, BY REGION, 2023 (%)
FIGURE 42. AMPHENOL ZD TECH: NET SALES, 2021-2023 ($BILLION)
FIGURE 43. AMPHENOL ZD TECH: REVENUE SHARE, BY SEGMENT, 2023 (%)
FIGURE 44. AMPHENOL ZD TECH: REVENUE SHARE, BY REGION, 2023 (%)
FIGURE 45. TTM TECHNOLOGIES, INC.: NET SALES, 2021-2023 ($BILLION)
FIGURE 46. TTM TECHNOLOGIES, INC.: REVENUE SHARE, BY SEGMENT, 2023 (%)
FIGURE 47. TTM TECHNOLOGIES, INC.: REVENUE SHARE, BY REGION, 2023 (%)
FIGURE 48. TE CONNECTIVITY LTD.: NET SALES, 2021-2023 ($BILLION)
FIGURE 49. TE CONNECTIVITY LTD.: REVENUE SHARE, BY SEGMENT, 2023 (%)
FIGURE 50. TE CONNECTIVITY LTD.: REVENUE SHARE, BY REGION, 2023 (%)
FIGURE 51. UNIMICRON TECHNOLOGY CORPORATION: NET SALES, 2021-2023 ($BILLION)
FIGURE 52. UNIMICRON TECHNOLOGY CORPORATION: REVENUE SHARE, BY SEGMENT, 2023 (%)
FIGURE 53. UNIMICRON TECHNOLOGY CORPORATION: REVENUE SHARE, BY REGION, 2023 (%)
FIGURE 54. ATANDS AUSTRIA TECHNOLOGIE AND SYSTEMTECHNIK AG: NET SALES, 2021-2023 ($BILLION)
FIGURE 55. ATANDS AUSTRIA TECHNOLOGIE AND SYSTEMTECHNIK AG: REVENUE SHARE, BY SEGMENT, 2023 (%)
FIGURE 56. ATANDS AUSTRIA TECHNOLOGIE AND SYSTEMTECHNIK AG: REVENUE SHARE, BY REGION, 2023 (%)
FIGURE 57. MOLEX: NET SALES, 2021-2023 ($BILLION)
FIGURE 58. MOLEX: REVENUE SHARE, BY SEGMENT, 2023 (%)
FIGURE 59. MOLEX: REVENUE SHARE, BY REGION, 2023 (%)
FIGURE 60. HON HAI PRECISION INDUSTRY CO., LTD.: NET SALES, 2021-2023 ($BILLION)
FIGURE 61. HON HAI PRECISION INDUSTRY CO., LTD.: REVENUE SHARE, BY SEGMENT, 2023 (%)
FIGURE 62. HON HAI PRECISION INDUSTRY CO., LTD.: REVENUE SHARE, BY REGION, 2023 (%)
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