耐高温半導体デバイスの市場機会

Semiconductor Devices for High-Temperature Applications: Market Opportunities

耐高温半導体デバイスの市場機会

商品番号 : SMB-75732

出版社BCC Research
出版年月2025年3月
ページ数141
価格タイプシングルユーザライセンス
価格USD 4,650
種別英文調査報告書

Report Highlights

The global market for semiconductor devices for high-temperature applications is estimated to increase from $11.8 billion in 2024 to reach $18.5 billion by 2029, at a compound annual growth rate (CAGR) of 9.4% from 2024 through 2029.

耐高温半導体デバイスの世界市場は、2024年から2029年にかけて年平均成長率(CAGR)9.4%で拡大し、2024年の118億ドルから2029年には185億ドルに達すると予測されています。

耐高温半導体デバイスの市場機会
Semiconductor Devices for High-Temperature Applications

Summary

Semiconductor devices for high-temperature applications are devices that can work with full reliability and efficiency at operating temperatures higher than 125°C. The market is growing, driven by the emergence of III-V materials such as silicon carbide (SiC) and gallium nitride (GaN), growing demand for high-temperature applications across increasing electric vehicles (EVs) worldwide and expanding renewable energy infrastructure.

耐高温半導体デバイスは、125°C を超える動作温度で完全な信頼性と効率性を発揮できるデバイスです。この市場は、炭化ケイ素 (SiC) や窒化ガリウム (GaN) などの III-V 族材料の出現、世界中で増加する電気自動車 (EV) による高温用途の需要の高まり、再生可能エネルギー インフラストラクチャの拡大によって成長しています。

Semiconductor devices for high-temperature applications use a variety of materials such as silicon, SiC, GaN and others. These materials offer different benefits in high-temperature environments. Silicon can work beyond temperatures of 125°C, although it is more suitable for temperatures below 125°C due to less reliability when exposed to a high-temperature range. However, due to its technological maturity and cost-effectiveness, industries still prefer silicon over other materials. The use of materials such as GaN and SiC is increasing globally, due to their ability to work in high-temperature environments.

Report Scope

This report provides an overview of the global semiconductor devices for high-temperature applications market and analyzes market trends. It provides the global revenue (in $ millions) for segments and regions, considering 2023 as the base year, with estimated market data for 2024 through 2029. The market is based on materials, device types, operating temperatures, industries and regions. Geographical segments covered are North America (U.S., Canada, Mexico), Europe (U.K., Germany, France, Italy, Rest of Europe), Asia-Pacific (China, Japan, South Korea, Rest of Asia-Pacific) and the Rest of the World (RoW), which includes South America, Middle East and Africa. The report also focuses on emerging technologies and vendor landscape. It concludes with profiles of the major players in the market.

このレポートは、耐高温半導体デバイスの世界市場の概要を示し、市場動向を分析しています。2023年を基準年として、セグメントと地域別の世界収益(百万ドル単位)を提供し、2024年から2029年までの市場推定データを示しています。市場は、材料、デバイスタイプ、動作温度、業界、地域に基づいています。地理的セグメントは、北米(米国、カナダ、メキシコ)、ヨーロッパ(英国、ドイツ、フランス、イタリア、その他のヨーロッパ)、アジア太平洋(中国、日本、韓国、その他のアジア太平洋)、南米、中東、アフリカを含むその他の世界(RoW)です。レポートでは、新興技術とベンダーの状況にも焦点を当てています。最後に、市場の主要プレーヤーのプロファイルを示します。

Report Synopsis

Report MetricsDetails
Base year considered2023
Forecast period considered2024-2029
Base year market size$10.9 billion
Market size forecast$18.5 billion
Growth rateCAGR of 9.4% for the forecast period of 2024-2029
Units considered$ Millions
Segments coveredMaterials, Device Types, Operating Temperature, Industry
Regions coveredNorth America, Europe, Asia-Pacific, Rest of the World
Countries coveredU.S., Canada, Mexico, Italy, Germany, U.K., France, Spain, the Netherlands, China, Japan, South Korea, India, Australia, New Zealand, South America, Middle East and Africa
Key Market Drivers
  • Emergence of UWBG Materials
  • Growing Demand for High-Temperature Electronics
  • Growing Demand for Electric Aircraft and EVs
Companies studied
ANALOG DEVICES INC.ALLEGRO MICROSYSTEMS INC.
CISSOIDFUJITSU
GENERAL ELECTRIC CO.HONEYWELL INTERNATIONAL INC.
INFINEON TECHNOLOGIES AGLATTICE SEMICONDUCTOR
MITSUBISHI ELECTRIC CORP.NXP SEMICONDUCTORS
QORVO INC.RENESAS ELECTRONICS CORP.
RTXTDK CORP.
TEXAS INSTRUMENTS INC.TOSHIBA CORP.
WOLFSPEED INC.

Report Includes

– 59 data tables and 54 additional tables

– An analysis of the global market for semiconductor devices for high-temperature applications

– Analyses of the global market trends, with data from 2023, estimates for 2024, forecasts for 2025 and 2026, and projections of compound annual growth rates (CAGRs) through 2029

– Evaluation of the market potential for semiconductor devices for high- temperature applications, industry growth drivers, and forecasts for this market’s segments and sub-segments

– Estimates of the actual market size and revenue forecast for the global market for semiconductor devices for high-temperature applications, and a corresponding market share analysis by material type, device type, operating temperature, industry and region

– Description of gallium nitride (GaN), silicon carbide (SiC) and gallium arsenide (GaAs); their products and applications

– Discussion of the market dynamics and shifts, and the regulations, industry challenges, and macroeconomic factors affecting the demand for semiconductor devices for high-temperature applications

– Discussion on the industry’s ESG challenges and practices

– Identification of the companies that are best positioned to meet this demand because of their proprietary technologies, strategic alliances or other advantages

– Insights into the industry structure for semiconductor devices for high-temperature applications, and the competitive landscape

– Company profiles of major players within the industry, including Infineon Technologies AG, NXP Semiconductors, TDK Corp., Wolfspeed Inc., and Allegro MicroSystems LLC.

Table of Contents

Chapter 1 Executive Summary

Market Outlook

Scope of Report

Market Summary

Market Dynamics and Growth Factors

Emerging Technologies

Segmental Analysis

Regional Insights and Emerging Markets

Conclusion

Chapter 2 Market Overview

Current Market Scenario and Future Expectations

Macro-Economic Factors Analysis

Impact of Rising Inflation and Labor Shortages

Currency Exchange Rate Fluctuations

Geopolitical Tension and Trade Dynamics

Porter’s Five Force Analysis

Value Chain Analysis

Regulatory Landscape

Chapter 3 Market Dynamics

Key Takeaways

Market Drivers

Emergence of UWBG Materials

Growing Demand for High-Temperature Electronics

Growing Demand for Electric Aircraft and EVs

Market Restraints

Complexity in Design, Testing and Manufacturing for Semiconductor Devices

Higher Cost of Specialized Materials

Packaging Limitations and Absence of Standardized Testing

Market Opportunities

Growing Government Initiatives and Collaborative Efforts

Advancing Ultra-High-Temperature Electronics

Increasing Global Space Exploration

Chapter 4 Emerging Trends and Technologies

Overview

Emerging Trends

Advances in High-Temperature SiC Technologies and Manufacturing

Rising Focus on Ultra-High-Temperature Semiconductors Materials Beyond Silicon

Emerging Technologies

Packaging Innovations Enabling Reliable High-Temperature Semiconductor Operation

Ferroelectric Non-volatile Memory (NVM) and Thermal Management Innovations

Patent Analysis

Geographical Patterns

Key Findings

Chapter 5 Market Segmentation Analysis

Segmentation Breakdown

Market Breakdown by Materials

Key Takeaways

Silicon

III-V materials

Gallium Arsenide (GaAs)

Gallium Nitride (GaN)

Silicon Carbide (SiC)

Others

Market Breakdown by Device Types

Key Takeaways

Microcontrollers and Processing

Power Semiconductors

Power Management and Control

Others

Market Breakdown by Operating Temperature

Key Takeaways

126°C to 250°C

Higher than 250°C

Market Breakdown by Industry

Key Takeaways

Industrial and Instrumentation

Automotive

Aerospace and Defense

Energy and Power

Others

Geographic Breakdown

Market Breakdown by Region

Key Takeaways

North America

Europe

Asia-Pacific

Rest of the World

Chapter 6 Competitive Intelligence

Key Takeaways

Market Ecosystem Analysis

Analysis of Key Companies

Infineon Technologies AG

NXP Semiconductors

TDK Corp.

Strategic Analysis

Chapter 7 Sustainability in the Semiconductor Devices for High-Temperature Applications Industry: An ESG Perspective

Key Takeaways

Key ESG Issues in the Semiconductor Devices for High-Temperature Applications Market

Key Environmental Issues in Semiconductor Devices for High-Temperature Applications

Social Responsibility in Semiconductor Devices for High-Temperature Applications

Governance in Semiconductor Devices for High-Temperature Applications

ESG Performance Analysis

Environmental Performance

Social Performance

Governance Performance

Current Status of ESG in the Semiconductor Devices for High-Temperature Applications Market

Concluding Remarks from BCC Research

Chapter 8 Appendix

Methodology

Abbreviations

Company Profiles

ALLEGRO MICROSYSTEMS INC.

ANALOG DEVICES INC.

CISSOID

FUJITSU

GENERAL ELECTRIC CO.

HONEYWELL INTERNATIONAL INC.

INFINEON TECHNOLOGIES AG

LATTICE SEMICONDUCTOR

MITSUBISHI ELECTRIC CORP.

NXP SEMICONDUCTORS

QORVO INC.

RENESAS ELECTRONICS CORP.

RTX

TDK CORP.

TEXAS INSTRUMENTS INC.

TOSHIBA CORP.

WOLFSPEED INC.

List of Tables

Summary Table : Global Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029

Table 1 : Semiconductor Devices for High-Temperature Applications: Regulatory Bodies, Standards Organizations and Government Agencies, by Region

Table 2 : Published Patents on Semiconductor Devices for High-Temperature Applications, January 2024-September 2024

Table 3 : Global Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029

Table 4 : Global Market for Silicon in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029

Table 5 : Global Market for III-V materials in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029

Table 6 : Global Market for Semiconductor Devices for High-Temperature Applications, by III-V Materials, Through 2029

Table 7 : Global Market for Gallium Arsenide (GaAs) in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029

Table 8 : Global Market for GaN in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029

Table 9 : Global Market for III-SiC in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029

Table 10 : Global Market for Other III-V Materials in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029

Table 11 : Global Market for Semiconductor Devices for High-Temperature Applications, by Device Type, Through 2029

Table 12 : Global Market for Microcontrollers and Processing Devices for High-Temperature Applications, by Region, Through 2029

Table 13 : Global Market for Power Semiconductors for High-Temperature Applications, by Region, Through 2029

Table 14 : Global Market for Power Management and Control for High-Temperature Applications, by Region, Through 2029

Table 15 : Global Market for Other Device Types for High-Temperature Applications, by Region, Through 2029

Table 16 : Global Market for Semiconductor Devices for High-Temperature Applications, by Operating Temperature, Through 2029

Table 17 : Global Market for Semiconductor Devices for Temperatures Between 126°C and 250°C, by Region, Through 2029

Table 18 : Global Market for Semiconductor Devices for Temperatures Exceeding 250°C, by Region, Through 2029

Table 19 : Global Market for Semiconductor Devices for High-Temperature Applications, by Industry, Through 2029

Table 20 : Global Market for Semiconductor Devices for High-Temperature Applications in Industrial and Instrumentation, by Region, Through 2029

Table 21 : Global Market for Semiconductor Devices for High-Temperature Applications in the Automotive Industry, by Region, Through 2029

Table 22 : Global Market for Semiconductor Devices for High-Temperature Applications in Aerospace and Defense Industry, by Region, Through 2029

Table 23 : Global Market for Semiconductor Devices for High-Temperature Applications in Energy and Power Industries, by Region, Through 2029

Table 24 : Global Market for Semiconductor Devices for High-Temperature Applications in Other Industries, by Region, Through 2029

Table 25 : Global Market for Semiconductor Devices for High-Temperature Applications, by Region, Through 2029

Table 26 : North American Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2029

Table 27 : North American Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029

Table 28 : North American Market for Semiconductor Devices for High-Temperature Applications, by Device Type, Through 2029

Table 29 : North American Market for Semiconductor Devices for High-Temperature Applications, by Operating Temperature, Through 2029

Table 30 : North American Market for Semiconductor Devices for High-Temperature Applications, by Industry, Through 2029

Table 31 : European Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2029

Table 32 : European Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029

Table 33 : European Market for Semiconductor Devices for High-Temperature Applications, by Device Type, Through 2029

Table 34 : European Market for Semiconductor Devices for High-Temperature Applications, by Operating Temperature, Through 2029

Table 35 : European Market for Semiconductor Devices for High-Temperature Applications, by Industry, Through 2029

Table 36 : Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2029

Table 37 : Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029

Table 38 : Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Device Type, Through 2029

Table 39 : Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Operating Temperature, Through 2029

Table 40 : Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Industry, Through 2029

Table 41 : RoW Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029

Table 42 : RoW Market for Semiconductor Devices for High-Temperature Applications, by Device Type, Through 2029

Table 43 : RoW Market for Semiconductor Devices for High-Temperature Applications, by Operating Temperature, Through 2029

Table 44 : RoW Market for Semiconductor Devices for High-Temperature Applications, by Industry, Through 2029

Table 45 : Ranking of Key Players in the Global Semiconductor Devices Market for High-Temperature Applications, 2023

Table 46 : Global Semiconductor Devices for High-Temperature Applications Market: Key Recent Developments, January 2022– November 2024

Table 47 : Global Semiconductor Devices Market for High-Temperature Applications: Environmental Impact

Table 48 : Global Semiconductor Devices Market for High-Temperature Applications: Social Impact

Table 49 : Global Semiconductor Devices Market for High-Temperature Applications: Governance Impact

Table 50 : Global Semiconductor Devices for High-Temperature Applications Market: ESG Risk Ratings Metric, 2023

Table 51 : Abbreviations Used in the Report

Table 52 : Allegro Microsystems Inc.: Company Snapshot

Table 53 : Allegro Microsystems Inc.: Financial Performance, FY 2022 and 2023

Table 54 : Allegro Microsystems Inc.: Product Portfolio

Table 55 : Allegro Microsystems Inc.: News/Key Developments, 2024

Table 56 : Analog Devices Inc.: Company Snapshot

Table 57 : Analog Devices Inc.: Financial Performance, FY 2023 and 2024

Table 58 : Analog Devices Inc.: Product Portfolio

Table 59 : Analog Devices Inc.: News/Key Developments, 2023

Table 60 : Cissoid: Company Snapshot

Table 61 : Cissoid: Product Portfolio

Table 62 : Fujitsu: Company Snapshot

Table 63 : Fujitsu: Financial Performance, FY 2022 and 2023

Table 64 : Fujitsu: Product Portfolio

Table 65 : Fujitsu: Key Developments, 2022 and 2023

Table 66 : General Electric Co.: Company Snapshot

Table 67 : General Electric Co.: Financial Performance, FY 2022 and 2023

Table 68 : General Electric Co.: Product Portfolio

Table 69 : General Electric Co.: News/Key Developments, 2023

Table 70 : Honeywell International Inc.: Company Snapshot

Table 71 : Honeywell International Inc.: Financial Performance, FY 2022 and 2023

Table 72 : Honeywell International Inc.: Product Portfolio

Table 73 : Infineon Technologies AG: Company Snapshot

Table 74 : Infineon Technologies AG: Financial Performance, FY 2023 and 2024

Table 75 : Infineon Technologies AG: Product Portfolio

Table 76 : Infineon Technologies AG: News/Key Developments, 2023

Table 77 : Lattice Semiconductor: Company Snapshot

Table 78 : Lattice Semiconductor: Financial Performance, FY 2022 and 2023

Table 79 : Lattice Semiconductor: Product Portfolio

Table 80 : Mitsubishi Electric Corp.: Company Snapshot

Table 81 : Mitsubishi Electric Corp.: Financial Performance, FY 2022 and 2023

Table 82 : Mitsubishi Electric Corp.: Product Portfolio

Table 83 : NXP Semiconductors: Company Snapshot

Table 84 : NXP Semiconductors: Financial Performance, FY 2022 and 2023

Table 85 : NXP Semiconductors: Product Portfolio

Table 86 : NXP Semiconductors: News/Key Developments, 2024

Table 87 : Qorvo Inc.: Company Snapshot

Table 88 : Qorvo Inc.: Financial Performance, FY 2022 and 2023

Table 89 : Qorvo Inc.: Product Portfolio

Table 90 : Renesas Electronics Corp.: Company Snapshot

Table 91 : Renesas Electronics Corp.: Financial Performance, FY 2022 and 2023

Table 92 : Renesas Electronics Corp.: Product Portfolio

Table 93 : Renesas Electronics Corp.: News/Key Developments, 2023

Table 94 : RTX: Company Snapshot

Table 95 : RTX: Financial Performance, FY 2022 and 2023

Table 96 : RTX: Product Portfolio

Table 97 : RTX: News/Key Developments, 2024

Table 98 : TDK Corp.: Company Snapshot

Table 99 : TDK Corp.: Financial Performance, FY 2022 and 2023

Table 100 : TDK Corp.: Product Portfolio

Table 101 : TDK Corp.: News/Key Developments, 2024

Table 102 : Texas Instruments Inc.: Company Snapshot

Table 103 : Texas Instruments Inc.: Financial Performance, FY 2022 and 2023

Table 104 : Texas Instruments Inc.: Product Portfolio

Table 105 : Toshiba Corp.: Company Snapshot

Table 106 : Toshiba Corp.: Financial Performance, FY 2022 and 2023

Table 107 : Toshiba Corp.: Product Portfolio

Table 108 : Toshiba Corp.: News/Key Developments, 2024

Table 109 : Wolfspeed Inc.: Company Snapshot

Table 110 : Wolfspeed Inc.: Financial Performance, FY 2022 and 2023

Table 111 : Wolfspeed Inc.: Product Portfolio

Table 112 : Wolfspeed Inc.: News/Key Developments, 2023

List of Figures

Summary Figure : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by Materials, 2023

Figure 1 : Value Chain for Semiconductor Devices for High-Temperature Applications Market

Figure 2 : Market Dynamics of Semiconductor Devices for High-Temperature Applications Market

Figure 3 : Share of Published Patents and Patent Applications on Semiconductor Devices for High-Temperature Applications, by Applicants in Key Regions, July 2023–August 2024

Figure 4 : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by Materials, 2023

Figure 5 : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by III-V Materials, 2023

Figure 6 : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by Device Type, 2023

Figure 7 : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by Operating Temperature, 2023

Figure 8 : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by Industry, 2023

Figure 9 : Global Market Shares of Semiconductor Devices for High-Temperature Applications Market, by Region, 2023

Figure 10 : Global Semiconductor Devices Market for High-Temperature Applications Ecosystem

Figure 11 : Allegro Microsystems Inc.: Revenue Shares, by Business Unit, FY 2023

Figure 12 : Allegro Microsystems Inc.: Revenue Shares, by Region, FY 2023

Figure 13 : Analog Devices Inc.: Revenue Shares, by Business Unit, FY 2024

Figure 14 : Analog Devices Inc.: Revenue Shares, by Region, FY 2024

Figure 15 : Fujitsu: Revenue Shares, by Business Unit, FY 2023

Figure 16 : Fujitsu: Revenue Shares, by Region, FY 2023

Figure 17 : General Electric Co.: Revenue Shares, by Business Unit, FY 2023

Figure 18 : General Electric Co.: Revenue Shares, by Region, FY 2023

Figure 19 : Honeywell International Inc.: Revenue Shares, by Business Unit, FY 2023

Figure 20 : Honeywell International Inc.: Revenue Shares, by Region, FY 2023

Figure 21 : Infineon Technologies AG: Revenue Shares, by Business Unit, FY 2024

Figure 22 : Infineon Technologies AG: Revenue Shares, by Region, FY 2024

Figure 23 : Lattice Semiconductor: Revenue Shares, by Business Unit, FY 2023

Figure 24 : Lattice Semiconductor: Revenue Shares, by Region, FY 2023

Figure 25 : Mitsubishi Electric Corp.: Revenue Shares, by Business Unit, FY 2023

Figure 26 : Mitsubishi Electric Corp.: Revenue Shares, by Region, FY 2023

Figure 27 : NXP Semiconductors: Revenue Shares, by Business Unit, FY 2023

Figure 28 : NXP Semiconductors: Revenue Shares, by Region, FY 2023

Figure 29 : Qorvo Inc.: Revenue Shares, by Business Unit, FY 2023

Figure 30 : Qorvo Inc.: Revenue Shares, by Region, FY 2023

Figure 31 : Renesas Electronics Corp.: Revenue Shares, by Business Unit, FY 2023

Figure 32 : Renesas Electronics Corp.: Revenue Shares, by Region, FY 2023

Figure 33 : RTX: Revenue Shares, by Business Unit, FY 2023

Figure 34 : RTX: Revenue Shares, by Region, FY 2023

Figure 35 : TDK Corp.: Revenue Shares, by Business Unit, FY 2023

Figure 36 : TDK Corp.: Revenue Shares, by Region, FY 2023

Figure 37 : Texas Instruments Inc.: Revenue Shares, by Business Unit, FY 2023

Figure 38 : Texas Instruments Inc.: Revenue Shares, by Region, FY 2023

Figure 39 : Wolfspeed Inc.: Revenue Shares, by Business Unit, FY 2023

Figure 40 : Wolfspeed Inc.: Revenue Shares, by Region, FY 2023