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フリップチップ技術市場レポート

Flip Chip Technology Market Report

フリップチップ技術市場レポート : 製品（メモリ、CMOSイメージセンサー、LED、CPU、RF、アナログ、ミックスドシグナルおよびパワーIC、GPU、SOC）、パッケージング技術（3D IC、2.5D IC、2D IC）、バンピング技術（銅ピラー、はんだバンピング、ゴールドバンピングなど）、業種（エレクトロニクス、ヘルスケア、自動車および輸送、ITおよび通信、航空宇宙および防衛など）、および地域別 2024-2032年
Flip Chip Technology Market Report by Product (Memory, CMOS Image Sensor, LED, CPU, RF, Analog, Mixed Signal and Power IC, GPU, SOC), Packaging Technology (3D IC, 2.5D IC, 2D IC), Bumping Technology (Copper Pillar, Solder Bumping, Gold Bumping, and Others), Industry Vertical (Electronics, Healthcare, Automotive and Transport, IT and Telecommunication, Aerospace and Defense, and Others), and Region 2024-2032

商品番号 : SMB-66430

出版社IMARC Group
出版年月2024年9月
ページ数139
価格タイプシングルユーザライセンス
価格USD 3,899
種別英文調査報告書

Report Overview

The global flip chip technology market size reached US$ 31.1 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 51.4 Billion by 2032, exhibiting a growth rate (CAGR) of 5.5% during 2024-2032.

世界のフリップチップ技術市場規模は、2023 年に 311 億米ドルに達します。今後について、IMARC グループは、市場が 2032 年までに 514 億米ドルに達し、2024 年から 2032 年の間に 5.5% の成長率 (CAGR) を示すと予想しています。

Flip chip, or direct chip attach, technology is a semiconductor packaging solution that involves flipping the active area of a chip to cover all interconnections, package leads and metallic solders. It is a controlled collapse chip connection (C4)-based solution that uses bumps or balls soldered into the circuit board and underfilled with epoxy. Flip chip technology is used for interconnecting semiconductor devices, integrated circuit chips and micro-electromechanical systems (MEMS) to the external circuitry. In comparison to the traditionally used wire-based systems, flip chip technology consumes lesser space, enables a larger number of interconnects with shorter distances and enhances the efficiency of ultrasonic and microwave operations. As a result, it is widely used in the assembly of laptops, desktops, gaming devices, central processing units (CPUs) and chipsets.

フリップチップ技術市場レポート
Flip Chip Technology Market Report

Flip Chip Technology Market Trends:

Significant growth in the electronics industry across the globe is one of the key factors creating a positive outlook for the market. Flip chip technology is widely used in consumer electronics and robotic solutions for device miniaturization, enhanced electrical efficiency and minimal power consumption. Moreover, the increasing requirement for multi-functional devices in various industries, such as automotive, telecommunication, medical and military, is providing a thrust to the market growth. For instance, the global positioning system (GPS), satellite-based navigation and radio detection and ranging (RADAR) systems use the technology for geo-sensing and operating military devices. In line with this, the emerging trend of real-world gaming is also contributing to the growth of the market. Flip chip technology is extensively used for embedding sensors and processors in gaming consoles and graphic cards for improved data transmission. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), and the utilization of flip chip technology for improved microwave and ultrasonic operations, are favoring the growth of the market. Other factors, including the increasing requirement for circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market toward growth.

Report Coverage:

Report FeaturesDetails
Base Year of the Analysis2023
Historical Period2018-2023
Forecast Period2024-2032
UnitsUS$ Billion
Segment CoverageProduct, Packaging Technology, Bumping Technology, Industry Vertical, Region
Region CoveredAsia Pacific, Europe, North America, Latin America, Middle East and Africa
Countries CoveredUnited States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
Companies Covered3M Company, Amkor Technology Inc., ASE Group, Fujitsu Limited, Intel Corporation, Jiangsu Changdian Technology Co. Ltd., Powertech Technology Inc., Samsung Electronics Co.Ltd., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and United Microelectronics Corporation
Customization Scope10% Free Customization
Report Price and Purchase OptionSingle User License: US$ 3899
Five User License: US$ 4899
Corporate License: US$ 5899
Post-Sale Analyst Support10-12 Weeks
Delivery FormatPDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global flip chip technology market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on product, packaging technology, bumping technology and industry vertical.

Breakup by Product:

  • Memory
  • CMOS Image Sensor
  • LED
  • CPU
  • RF, Analog, Mixed Signal and Power IC
  • GPU
  • SOC

Breakup by Packaging Technology:

  • 3D IC
  • 2.5D IC
  • 2D IC

Breakup by Bumping Technology:

  • Copper Pillar
  • Solder Bumping
  • Gold Bumping
  • Others

Breakup by Industry Vertical:

  • Electronics
  • Healthcare
  • Automotive and Transport
  • IT and Telecommunication
  • Aerospace and Defense
  • Others

Breakup by Region:

  • North America

o            United States

o            Canada

  • Asia-Pacific

o            China

o            Japan

o            India

o            South Korea

o            Australia

o            Indonesia

o            Others

  • Europe

o            Germany

o            France

o            United Kingdom

o            Italy

o            Spain

o            Russia

o            Others

  • Latin America

o            Brazil

o            Mexico

o            Others

  • Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being 3M Company, Amkor Technology Inc., ASE Group, Fujitsu Limited, Intel Corporation, Jiangsu Changdian Technology Co. Ltd., Powertech Technology Inc., Samsung Electronics Co.Ltd., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and United Microelectronics Corporation.

Key Questions Answered in This Report:

  • How has the global flip chip technology market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global flip chip technology market?
  • What are the key regional markets?
  • What is the breakup of the market based on the product?
  • What is the breakup of the market based on the packaging technology?
  • What is the breakup of the market based on the bumping technology?
  • What is the breakup of the market based on the industry vertical?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global flip chip technology market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1   Preface

2   Scope and Methodology

2.1    Objectives of the Study

2.2    Stakeholders

2.3    Data Sources

2.3.1    Primary Sources

2.3.2    Secondary Sources

2.4    Market Estimation

2.4.1    Bottom-Up Approach

2.4.2    Top-Down Approach

2.5    Forecasting Methodology

3   Executive Summary

4   Introduction

4.1    Overview

4.2    Key Industry Trends

5   Global Flip Chip Technology Market

5.1    Market Overview

5.2    Market Performance

5.3    Impact of COVID-19

5.4    Market Forecast

6   Market Breakup by Product

6.1    Memory

6.1.1 Market Trends

6.1.2 Market Forecast

6.2    CMOS Image Sensor

6.2.1 Market Trends

6.2.2 Market Forecast

6.3    LED

6.3.1 Market Trends

6.3.2 Market Forecast

6.4    CPU

6.4.1 Market Trends

6.4.2 Market Forecast

6.5    RF, Analog, Mixed Signal and Power IC

6.5.1 Market Trends

6.5.2 Market Forecast

6.6    GPU

6.6.1 Market Trends

6.6.2 Market Forecast

6.7    SOC

6.7.1 Market Trends

6.7.2 Market Forecast

7   Market Breakup by Packaging Technology

7.1    3D IC

7.1.1 Market Trends

7.1.2 Market Forecast

7.2    2.5D IC

7.2.1 Market Trends

7.2.2 Market Forecast

7.3    2D IC

7.3.1 Market Trends

7.3.2 Market Forecast

8   Market Breakup by Bumping Technology

8.1    Copper Pillar

8.1.1 Market Trends

8.1.2 Market Forecast

8.2    Solder Bumping

8.2.1 Market Trends

8.2.2 Market Forecast

8.3    Gold Bumping

8.3.1 Market Trends

8.3.2 Market Forecast

8.4    Others

8.4.1 Market Trends

8.4.2 Market Forecast

9   Market Breakup by Industry Vertical

9.1    Electronics

9.1.1 Market Trends

9.1.2 Market Forecast

9.2    Healthcare

9.2.1 Market Trends

9.2.2 Market Forecast

9.3    Automotive and Transport

9.3.1 Market Trends

9.3.2 Market Forecast

9.4    IT and Telecommunication

9.4.1 Market Trends

9.4.2 Market Forecast

9.5    Aerospace and Defense

9.5.1 Market Trends

9.5.2 Market Forecast

9.6    Others

9.6.1 Market Trends

9.6.2 Market Forecast

10  Market Breakup by Region

10.1    North America

10.1.1 United States

10.1.1.1 Market Trends

10.1.1.2 Market Forecast

10.1.2 Canada

10.1.2.1 Market Trends

10.1.2.2 Market Forecast

10.2    Asia-Pacific

10.2.1 China

10.2.1.1 Market Trends

10.2.1.2 Market Forecast

10.2.2 Japan

10.2.2.1 Market Trends

10.2.2.2 Market Forecast

10.2.3 India

10.2.3.1 Market Trends

10.2.3.2 Market Forecast

10.2.4 South Korea

10.2.4.1 Market Trends

10.2.4.2 Market Forecast

10.2.5 Australia

10.2.5.1 Market Trends

10.2.5.2 Market Forecast

10.2.6 Indonesia

10.2.6.1 Market Trends

10.2.6.2 Market Forecast

10.2.7 Others

10.2.7.1 Market Trends

10.2.7.2 Market Forecast

10.3    Europe

10.3.1 Germany

10.3.1.1 Market Trends

10.3.1.2 Market Forecast

10.3.2 France

10.3.2.1 Market Trends

10.3.2.2 Market Forecast

10.3.3 United Kingdom

10.3.3.1 Market Trends

10.3.3.2 Market Forecast

10.3.4 Italy

10.3.4.1 Market Trends

10.3.4.2 Market Forecast

10.3.5 Spain

10.3.5.1 Market Trends

10.3.5.2 Market Forecast

10.3.6 Russia

10.3.6.1 Market Trends

10.3.6.2 Market Forecast

10.3.7 Others

10.3.7.1 Market Trends

10.3.7.2 Market Forecast

10.4    Latin America

10.4.1 Brazil

10.4.1.1 Market Trends

10.4.1.2 Market Forecast

10.4.2 Mexico

10.4.2.1 Market Trends

10.4.2.2 Market Forecast

10.4.3 Others

10.4.3.1 Market Trends

10.4.3.2 Market Forecast

10.5    Middle East and Africa

10.5.1 Market Trends

10.5.2 Market Breakup by Country

10.5.3 Market Forecast

11  SWOT Analysis

11.1    Overview

11.2    Strengths

11.3    Weaknesses

11.4    Opportunities

11.5    Threats

12  Value Chain Analysis

13  Porters Five Forces Analysis

13.1    Overview

13.2    Bargaining Power of Buyers

13.3    Bargaining Power of Suppliers

13.4    Degree of Competition

13.5    Threat of New Entrants

13.6    Threat of Substitutes

14  Price Analysis

15  Competitive Landscape

15.1    Market Structure

15.2    Key Players

15.3    Profiles of Key Players

15.3.1    3M Company

15.3.1.1 Company Overview

15.3.1.2 Product Portfolio

15.3.1.3 Financials

15.3.1.4 SWOT Analysis

15.3.2    Amkor Technology Inc.

15.3.2.1 Company Overview

15.3.2.2 Product Portfolio

15.3.2.3 Financials

15.3.2.4 SWOT Analysis

15.3.3    ASE Group

15.3.3.1 Company Overview

15.3.3.2 Product Portfolio

15.3.3.3 Financials

15.3.4    Fujitsu Limited

15.3.4.1 Company Overview

15.3.4.2 Product Portfolio

15.3.4.3 Financials

15.3.4.4 SWOT Analysis

15.3.5    Intel Corporation

15.3.5.1 Company Overview

15.3.5.2 Product Portfolio

15.3.5.3 Financials

15.3.5.4 SWOT Analysis

15.3.6    Jiangsu Changdian Technology Co. Ltd.

15.3.6.1 Company Overview

15.3.6.2 Product Portfolio

15.3.6.3 Financials

15.3.7    Powertech Technology Inc.

15.3.7.1 Company Overview

15.3.7.2 Product Portfolio

15.3.7.3 Financials

15.3.7.4 SWOT Analysis

15.3.8    Samsung Electronics Co.Ltd.

15.3.8.1 Company Overview

15.3.8.2 Product Portfolio

15.3.8.3 Financials

15.3.8.4 SWOT Analysis

15.3.9    Taiwan Semiconductor Manufacturing Company Limited

15.3.9.1 Company Overview

15.3.9.2 Product Portfolio

15.3.9.3 Financials

15.3.9.4 SWOT Analysis

15.3.10    Texas Instruments Incorporated

15.3.10.1 Company Overview

15.3.10.2 Product Portfolio

15.3.10.3 Financials

15.3.10.4 SWOT Analysis

15.3.11    United Microelectronics Corporation

15.3.11.1 Company Overview

15.3.11.2 Product Portfolio

15.3.11.3 Financials

15.3.11.4 SWOT Analysis

List of Tables

Table 1: Global: Flip Chip Technology Market: Key Industry Highlights, 2023 and 2032

Table 2: Global: Flip Chip Technology Market Forecast: Breakup by Product (in Million US$), 2024-2032

Table 3: Global: Flip Chip Technology Market Forecast: Breakup by Packaging Technology (in Million US$), 2024-2032

Table 4: Global: Flip Chip Technology Market Forecast: Breakup by Bumping Technology (in Million US$), 2024-2032

Table 5: Global: Flip Chip Technology Market Forecast: Breakup by Industry Vertical (in Million US$), 2024-2032

Table 6: Global: Flip Chip Technology Market Forecast: Breakup by Region (in Million US$), 2024-2032

Table 7: Global: Flip Chip Technology Market: Competitive Structure

Table 8: Global: Flip Chip Technology Market: Key Players

List of Figures

Figure 1: Global: Flip Chip Technology Market: Major Drivers and Challenges

Figure 2: Global: Flip Chip Technology Market: Sales Value (in Billion US$), 2018-2023

Figure 3: Global: Flip Chip Technology Market Forecast: Sales Value (in Billion US$), 2024-2032

Figure 4: Global: Flip Chip Technology Market: Breakup by Product (in %), 2023

Figure 5: Global: Flip Chip Technology Market: Breakup by Packaging Technology (in %), 2023

Figure 6: Global: Flip Chip Technology Market: Breakup by Bumping Technology (in %), 2023

Figure 7: Global: Flip Chip Technology Market: Breakup by Industry Vertical (in %), 2023

Figure 8: Global: Flip Chip Technology Market: Breakup by Region (in %), 2023

Figure 9: Global: Flip Chip Technology (Memory) Market: Sales Value (in Million US$), 2018 & 2023

Figure 10: Global: Flip Chip Technology (Memory) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 11: Global: Flip Chip Technology (CMOS Image Sensor) Market: Sales Value (in Million US$), 2018 & 2023

Figure 12: Global: Flip Chip Technology (CMOS Image Sensor) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 13: Global: Flip Chip Technology (LED) Market: Sales Value (in Million US$), 2018 & 2023

Figure 14: Global: Flip Chip Technology (LED) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 15: Global: Flip Chip Technology (CPU) Market: Sales Value (in Million US$), 2018 & 2023

Figure 16: Global: Flip Chip Technology (CPU) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 17: Global: Flip Chip Technology (RF, Analog, Mixed Signal and Power IC) Market: Sales Value (in Million US$), 2018 & 2023

Figure 18: Global: Flip Chip Technology (RF, Analog, Mixed Signal and Power IC) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 19: Global: Flip Chip Technology (GPU) Market: Sales Value (in Million US$), 2018 & 2023

Figure 20: Global: Flip Chip Technology (GPU) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 21: Global: Flip Chip Technology (SOC) Market: Sales Value (in Million US$), 2018 & 2023

Figure 22: Global: Flip Chip Technology (SOC) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 23: Global: Flip Chip Technology (3D IC) Market: Sales Value (in Million US$), 2018 & 2023

Figure 24: Global: Flip Chip Technology (3D IC) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 25: Global: Flip Chip Technology (2.5D IC) Market: Sales Value (in Million US$), 2018 & 2023

Figure 26: Global: Flip Chip Technology (2.5D IC) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 27: Global: Flip Chip Technology (2D IC) Market: Sales Value (in Million US$), 2018 & 2023

Figure 28: Global: Flip Chip Technology (2D IC) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 29: Global: Flip Chip Technology (Copper Pillar) Market: Sales Value (in Million US$), 2018 & 2023

Figure 30: Global: Flip Chip Technology (Copper Pillar) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 31: Global: Flip Chip Technology (Solder Bumping) Market: Sales Value (in Million US$), 2018 & 2023

Figure 32: Global: Flip Chip Technology (Solder Bumping) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 33: Global: Flip Chip Technology (Gold Bumping) Market: Sales Value (in Million US$), 2018 & 2023

Figure 34: Global: Flip Chip Technology (Gold Bumping) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 35: Global: Flip Chip Technology (Other Bumping Technologies) Market: Sales Value (in Million US$), 2018 & 2023

Figure 36: Global: Flip Chip Technology (Other Bumping Technologies) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 37: Global: Flip Chip Technology (Electronics) Market: Sales Value (in Million US$), 2018 & 2023

Figure 38: Global: Flip Chip Technology (Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 39: Global: Flip Chip Technology (Healthcare) Market: Sales Value (in Million US$), 2018 & 2023

Figure 40: Global: Flip Chip Technology (Healthcare) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 41: Global: Flip Chip Technology (Automotive and Transport) Market: Sales Value (in Million US$), 2018 & 2023

Figure 42: Global: Flip Chip Technology (Automotive and Transport) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 43: Global: Flip Chip Technology (IT and Telecommunication) Market: Sales Value (in Million US$), 2018 & 2023

Figure 44: Global: Flip Chip Technology (IT and Telecommunication) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 45: Global: Flip Chip Technology (Aerospace and Defense) Market: Sales Value (in Million US$), 2018 & 2023

Figure 46: Global: Flip Chip Technology (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 47: Global: Flip Chip Technology (Other Industry Verticals) Market: Sales Value (in Million US$), 2018 & 2023

Figure 48: Global: Flip Chip Technology (Other Industry Verticals) Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 49: North America: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 50: North America: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 51: United States: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 52: United States: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 53: Canada: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 54: Canada: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 55: Asia-Pacific: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 56: Asia-Pacific: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 57: China: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 58: China: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 59: Japan: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 60: Japan: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 61: India: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 62: India: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 63: South Korea: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 64: South Korea: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 65: Australia: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 66: Australia: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 67: Indonesia: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 68: Indonesia: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 69: Others: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 70: Others: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 71: Europe: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 72: Europe: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 73: Germany: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 74: Germany: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 75: France: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 76: France: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 77: United Kingdom: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 78: United Kingdom: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 79: Italy: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 80: Italy: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 81: Spain: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 82: Spain: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 83: Russia: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 84: Russia: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 85: Others: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 86: Others: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 87: Latin America: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 88: Latin America: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 89: Brazil: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 90: Brazil: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 91: Mexico: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 92: Mexico: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 93: Others: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 94: Others: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 95: Middle East and Africa: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023

Figure 96: Middle East and Africa: Flip Chip Technology Market: Breakup by Country (in %), 2023

Figure 97: Middle East and Africa: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032

Figure 98: Global: Flip Chip Technology Industry: SWOT Analysis

Figure 99: Global: Flip Chip Technology Industry: Value Chain Analysis

Figure 100: Global: Flip Chip Technology Industry: Porter’s Five Forces Analysis

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