Semiconductor Ceramic Packaging Materials Market - Global Forecast To 2030
商品番号 : SMB-90891
| 出版社 | MarketsandMarkets |
| 出版年月 | 2025年11月 |
| ページ数 | 272 |
| 図表数 | 320 |
| 価格タイプ | シングルユーザライセンス |
| 価格 | USD 4,950 |
| 種別 | 英文調査報告書 |
半導体セラミックパッケージング材料市場 – 材料（アルミナ、窒化アルミニウム、窒化ケイ素、炭化ケイ素、酸化ベリリウム）、パッケージング技術（スルーホールパッケージ、表面実装パッケージ – リード付き、表面実装パッケージ – リードレス、高度小型パッケージ）、最終用途産業（民生用電子機器、自動車、ヘルスケア、IT・通信、航空宇宙・防衛）、および地域別 – 2030年までの世界予測
半導体セラミックパッケージング材料の市場規模は、2025年の18億5,000万米ドルから2030年には27億8,000万米ドルに拡大し、予測期間中に8.5%のCAGRを記録すると予測されています。
現代の電子機器の複雑化と小型化に伴い、半導体セラミックパッケージ材料の需要は高まっており、信頼性の高い熱管理と信号整合性の維持を可能にするパッケージングが求められています。電気自動車、産業オートメーション、先進医療機器など、高出力・高周波アプリケーションの採用拡大に伴い、優れた熱伝導性と機械的強度を備えた材料へのニーズが高まっています。さらに、高密度マルチチップモジュールやシステムインパッケージ設計への移行に伴い、高精度な組み立てと長期的な信頼性を支えるセラミックスが求められています。また、無毒性、耐久性、安定性を備えた材料に対する環境規制の強化も、従来のパッケージよりもセラミックスを優遇する要因となっています。こうした技術面、産業面、そして規制面からの圧力が相まって、市場需要の持続的な成長を促しています。
本レポートは、半導体セラミックパッケージング材料市場を材料、パッケージング技術、最終用途産業、地域に基づいてセグメント化し、様々な地域における市場全体の価値を推定しています。主要業界プレーヤーの詳細な分析を実施し、半導体セラミックパッケージング材料市場に関連する事業概要、製品・サービス、主要戦略、事業拡大に関する洞察を提供しています。
この調査レポートは、業界分析（業界動向）、主要企業の市場ランキング分析、企業プロファイルなど、さまざまなレベルの分析に焦点を当てており、これらを組み合わせることで、競争環境、半導体セラミックパッケージング材料市場の新興および高成長セグメント、高成長地域、市場の推進要因、制約、機会、課題の全体像を把握できます。
本レポートは、以下の点について洞察を提供します。
- 半導体セラミックパッケージング材料市場の成長に影響を与える推進要因（車載エレクトロニクスとEVパワーモジュールの拡大によりセラミックパッケージの採用が増加）、制約要因（ポリマーベースや金属ベースのパッケージングに比べてセラミックパッケージング材料のコストが高い）、機会（半導体製造の地域的ローカライズによる投資促進）、課題（セラミック材料の設計柔軟性の限界により、複雑な形状の製造が困難）の分析。
- 市場浸透：世界の半導体セラミックパッケージング材料市場における主要企業が提供する半導体セラミックパッケージング材料に関する包括的な情報。
- 製品開発／イノベーション：半導体セラミックパッケージング材料市場における今後の技術、事業拡大、およびパートナーシップに関する詳細な洞察。
- 市場開発：成長著しい新興市場に関する包括的な情報を提供する本レポートでは、地域をまたいで半導体セラミックパッケージング材料市場の市場を分析しています。
- 市場能力：半導体セラミックパッケージング材料市場における企業の生産能力と今後の生産能力については、入手可能な限り提供しています。
- 競合評価：半導体セラミックパッケージング材料市場における主要企業の市場シェア、戦略、製品、および製造能力に関する詳細な評価。
Report Overview
The semiconductor ceramic packaging materials market size is projected to grow from USD 1.85 billion in 2025 to USD 2.78 billion by 2030, registering a CAGR of 8.5% during the forecast period.
The demand for semiconductor ceramic packaging materials is increasing due to the growing complexity and miniaturization of modern electronic devices, which require packaging that can reliably manage heat and maintain signal integrity. Rising adoption of high-power and high-frequency applications, such as electric vehicles, industrial automation, and advanced medical devices, is driving the need for materials with superior thermal conductivity and mechanical strength. Additionally, the shift toward high-density multi-chip modules and system-in-package designs requires ceramics that can support precise assembly and long-term reliability. Increasing environmental and regulatory requirements for non-toxic, durable, and stable materials also favor ceramics over traditional packaging. These combined technological, industrial, and regulatory pressures are collectively fueling sustained growth in market demand.
“By material, the alumina segment is anticipated to account for the largest market share during the forecast period”
Alumina accounts for the largest share in the semiconductor ceramic packaging materials market due to its proven reliability, versatility, and cost-effectiveness across a wide range of applications. Its combination of good thermal conductivity, excellent electrical insulation, and high mechanical strength allows it to meet the performance requirements of both low- and high-power semiconductor devices. Alumina is compatible with established manufacturing processes, including co-firing and metallization techniques, enabling scalable production with minimal defects. Its widespread availability and relatively lower raw material cost compared to other materials make it a preferred choice for mass-market applications. Additionally, alumina’s stability under thermal cycling and harsh environmental conditions ensures long-term device performance, reinforcing its dominant position in the market.
“By end-use industry, the consumer electronics segment is anticipated to account for the largest market share during the forecast period”
Consumer electronics account for the largest share of the semiconductor ceramic packaging materials market because the sector drives high-volume demand for reliable and durable semiconductor components. Rapid growth in global electronics consumption, including smartphones, laptops, tablets, audio devices, and wearable technology, increases the need for packaging materials that can maintain performance under frequent use and varying environmental conditions. Manufacturers prioritize components that ensure long-term stability and minimize device failure, supporting brand reputation and customer satisfaction. The wide variety of products and continuous technological upgrades in this industry, including advanced displays, processing power, and connectivity features, make consumer electronics the primary driver of ceramic packaging material demand.
“By packaging technology, the surface mount packages – leadless segment is anticipated to account for the largest market share during the forecast period”
Surface mount packages- leadless account for the largest share in the semiconductor ceramic packaging materials market because they allow for more precise and efficient assembly of semiconductor devices compared to traditional through-hole methods. This technology supports higher component density on printed circuit boards, enabling compact designs and improved signal integrity in advanced electronics. It also enhances mechanical stability and reduces the risk of solder joint failures, which is critical for applications in automotive, aerospace, and high-performance computing. Additionally, leadless surface mount technology is compatible with automated manufacturing and inspection processes, improving production speed and consistency. Its ability to support miniaturization, high-frequency operation, and reliable thermal management makes this packaging technology the preferred choice for modern semiconductor applications, driving its growth in the market.
“Asia Pacific is anticipated to account for the largest market share during the forecast period”
Asia Pacific holds the largest share in the semiconductor ceramic packaging materials market because the region is a global hub for semiconductor assembly, testing, and packaging operations. Strong investments in research and development of advanced packaging technologies drive demand for high-performance ceramic materials. The concentration of electronics manufacturing clusters in countries like China, Taiwan, and South Korea enables efficient production and rapid adoption of new packaging solutions. Additionally, the growing presence of international semiconductor companies establishing regional operations and partnerships increases the consumption of ceramic materials. Supportive industrial policies, export-oriented production, and rising domestic demand for advanced electronics further strengthen the region’s market dominance.
In-depth interviews were conducted with chief executive officers (CEOs), marketing directors, other innovation and technology directors, and executives from various key organizations operating in the semiconductor ceramic packaging materials market, and information was gathered from secondary research to determine and verify the market size of several segments.
- By Company Type: Tier 1 – 50%, Tier 2 – 30%, and Tier 3 – 20%
- By Designation: Managers– 15%, Directors – 20%, and Others – 65%
- By Region: North America – 30%, Europe – 25%, Asia Pacific – 35%, the Middle East & Africa –5%, and South America- 5%
The semiconductor ceramic packaging materials market comprises major KYOCERA Corporation (Japan), CeramTec GmbH (Germany), CoorsTek (US), Materion Corporation (US), Resonac Holdings Corporation (Japan), NGK INSULATORS, LTD. (Japan), AGC Inc. (Japan), Morgan Advanced Materials (UK), MARUWA Co., Ltd. (Japan), and Tokuyama Corporation (Japan). The study includes an in-depth competitive analysis of these key players in the semiconductor ceramic packaging materials market, with their company profiles, recent developments, and key market strategies.
Research Coverage
This report segments the semiconductor ceramic packaging materials market on the basis of material, packaging technology, end-use industry, and region, and provides estimations for the overall value of the market across various regions. A detailed analysis of key industry players has been conducted to provide insights into their business overviews, products & services, key strategies, and expansions associated with the semiconductor ceramic packaging materials market.
Key Benefits of Buying This Report
This research report is focused on various levels of analysis — industry analysis (industry trends), market ranking analysis of top players, and company profiles, which together provide an overall view of the competitive landscape; emerging and high-growth segments of the semiconductor ceramic packaging materials market; high-growth regions; and market drivers, restraints, opportunities, and challenges.
The report provides insights on the following pointers:
- Analysis of drivers (expansion of automotive electronics and EV power modules boosting ceramic packaging adoption), restraints (high cost of ceramic packaging materials compared to polymer or metal-based packaging), opportunities (regional localization of semiconductor manufacturing encouraging investment), and challenges (limited design flexibility of ceramic materials makes fabricating complex geometries challenging) influencing the growth of semiconductor ceramic packaging materials market.
- Market Penetration: Comprehensive information on the semiconductor ceramic packaging materials offered by top players in the global semiconductor ceramic packaging materials market.
- Product Development/Innovation: Detailed insights on upcoming technologies, expansions, and partnerships in the semiconductor ceramic packaging materials market.
- Market Development: Comprehensive information about lucrative emerging markets, the report analyzes the markets for semiconductor ceramic packaging materials market across regions.
- Market Capacity: Production capacity of the companies is provided wherever available with upcoming capacities for the semiconductor ceramic packaging materials market.
- Competitive Assessment: In-depth assessment of market shares, strategies, products, and manufacturing capabilities of leading players in the semiconductor ceramic packaging materials market.
Table of Contents
1 INTRODUCTION 27
1.1 STUDY OBJECTIVES 27
1.2 MARKET DEFINITION 27
1.3 STUDY SCOPE 28
1.3.1 MARKETS COVERED 28
1.3.2 INCLUSIONS & EXCLUSIONS 28
1.3.3 YEARS CONSIDERED 29
1.3.4 CURRENCY CONSIDERED 29
1.3.5 UNITS CONSIDERED 29
1.4 LIMITATIONS 30
1.5 STAKEHOLDERS 30
2 RESEARCH METHODOLOGY 31
2.1 RESEARCH DATA 31
2.1.1 SECONDARY DATA 32
2.1.1.1 Key data from secondary sources 32
2.1.2 PRIMARY DATA 32
2.1.2.1 Key data from primary sources 33
2.1.2.2 Key primary sources 33
2.1.2.3 Key players for primary interviews 33
2.1.2.4 Breakdown of interviews with experts 34
2.1.2.5 Key industry insights 34
2.2 BASE NUMBER CALCULATION 35
2.2.1 SUPPLY-SIDE ANALYSIS 35
2.2.2 DEMAND-SIDE ANALYSIS 35
2.3 GROWTH FORECAST 35
2.3.1 SUPPLY SIDE 35
2.3.2 DEMAND SIDE 36
2.4 MARKET SIZE ESTIMATION 36
2.4.1 BOTTOM-UP APPROACH 37
2.4.2 TOP-DOWN APPROACH 37
2.5 DATA TRIANGULATION 38
2.6 RESEARCH ASSUMPTION 39
2.7 GROWTH FORECAST 39
2.8 RISK ASSESSMENT 40
2.9 FACTOR ANALYSIS 41
3 EXECUTIVE SUMMARY 42
4 PREMIUM INSIGHTS 47
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SEMICONDUCTOR CERAMIC
PACKAGING MATERIALS MARKET 47
4.2 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL 48
4.3 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY PACKAGING TECHNOLOGY 48
4.4 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY 49
4.5 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY 49
5 MARKET OVERVIEW 50
5.1 INTRODUCTION 50
5.2 MARKET DYNAMICS 50
5.2.1 DRIVERS 51
5.2.1.1 Expansion of automotive electronics and EV power modules 51
5.2.1.2 Growth in 5G infrastructure and RF devices 52
5.2.2 RESTRAINTS 53
5.2.2.1 Higher cost of ceramic packaging materials than polymer or
metal-based packaging 53
5.2.3 OPPORTUNITIES 53
5.2.3.1 Regional localization of semiconductor manufacturing
encouraging investment 53
5.2.3.2 Advanced multilayer ceramic materials for emerging 2.5D/
3D semiconductor packaging 54
5.2.4 CHALLENGES 54
5.2.4.1 Difficulty in bonding to dissimilar materials 54
5.2.4.2 Limited design flexibility makes fabricating complex
geometries challenging 55
5.3 GENERATIVE AI 55
5.3.1 INTRODUCTION 55
5.4 IMPACT ON SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET 57
6 INDUSTRY TRENDS 58
6.1 INTRODUCTION 58
6.2 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS 58
6.3 SUPPLY CHAIN ANALYSIS 59
6.4 IMPACT OF 2025 US TARIFF –SEMICONDUCTOR CERAMIC PACKAGING
MATERIALS MARKET 61
6.4.1 INTRODUCTION 61
6.4.2 KEY TARIFF RATES 61
6.4.3 PRICE IMPACT ANALYSIS 62
6.4.4 IMPACT ON REGION 62
6.4.4.1 North America 62
6.4.4.2 Europe 62
6.4.4.3 Asia Pacific 62
6.4.5 IMPACT ON END-USE INDUSTRY 62
6.5 INVESTMENT LANDSCAPE AND FUNDING SCENARIO 63
6.6 PRICING ANALYSIS 64
6.6.1 AVERAGE SELLING PRICE TREND OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY REGION, 2021–2024 64
6.6.2 AVERAGE SELLING PRICE TREND OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021–2024 65
6.6.3 AVERAGE SELLING PRICE TREND OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS, BY KEY PLAYER, 2024 65
6.7 ECOSYSTEM ANALYSIS 66
6.8 TECHNOLOGY ANALYSIS 67
6.8.1 KEY TECHNOLOGIES 67
6.8.2 COMPLEMENTARY TECHNOLOGIES 68
6.8.3 ADJACENT TECHNOLOGIES 69
6.9 PATENT ANALYSIS 70
6.9.1 METHODOLOGY 70
6.9.2 PATENTS GRANTED WORLDWIDE, 2015–2024 70
6.9.2.1 Patent publication trends 70
6.9.3 INSIGHTS 71
6.9.4 LEGAL STATUS OF PATENTS 71
6.9.5 JURISDICTION ANALYSIS 71
6.9.6 TOP APPLICANTS 72
6.9.7 LIST OF MAJOR PATENTS 73
6.10 TRADE ANALYSIS 76
6.10.1 IMPORT SCENARIO (HS CODE 85419000) 76
6.10.2 EXPORT SCENARIO (HS CODE 85419000) 77
6.11 KEY CONFERENCES AND EVENTS, 2026–2027 77
6.12 TARIFF AND REGULATORY LANDSCAPE 78
6.12.1 TARIFF ANALYSIS 78
6.13 STANDARDS AND REGULATORY LANDSCAPE 79
6.13.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND
OTHER ORGANIZATIONS 79
6.13.2 STANDARDS 82
6.14 PORTER’S FIVE FORCES ANALYSIS 83
6.14.1 THREAT OF NEW ENTRANTS 84
6.14.2 THREAT OF SUBSTITUTES 85
6.14.3 BARGAINING POWER OF SUPPLIERS 85
6.14.4 BARGAINING POWER OF BUYERS 85
6.14.5 INTENSITY OF COMPETITIVE RIVALRY 86
6.15 KEY STAKEHOLDERS AND BUYING CRITERIA 86
6.15.1 KEY STAKEHOLDERS IN BUYING PROCESS 87
6.15.2 BUYING CRITERIA 87
6.16 MACROECONOMIC OUTLOOK 88
6.16.1 GDP TRENDS AND FORECASTS OF MAJOR ECONOMIES 89
6.17 CASE STUDY ANALYSIS 89
6.17.1 LOW THERMAL RESISTANCE PACKAGING FOR HIGH POWER ELECTRONICS 89
6.17.2 EFFECTS OF ΒETA-SI3N4 SEEDS ON MICROSTRUCTURE AND PERFORMANCE OF SI3N4 CERAMICS IN SEMICONDUCTOR PACKAGE 91
6.17.3 PREPARATION OF DIAMOND FILM SUBSTRATES ON ALN CERAMIC AND
THEIR PERFORMANCE IN LED PACKAGING 92
7 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL 93
7.1 INTRODUCTION 94
7.2 ALUMINA 96
7.2.1 HIGH-TEMPERATURE PERFORMANCE IN SEMICONDUCTOR
DEVICES TO DRIVE DEMAND 96
7.3 ALUMINUM NITRIDE 96
7.3.1 SUPERIOR THERMAL AND ELECTRICAL PROPERTIES TO DRIVE MARKET 96
7.4 SILICON NITRIDE 97
7.4.1 HIGH MECHANICAL STRENGTH AND THERMAL SHOCK RESILIENCE
TO DRIVE DEMAND 97
7.5 SILICON CARBIDE 98
7.5.1 MATERIAL ADVANCEMENTS TO DRIVE HIGH DENSITY AND THERMALLY STABLE CHIP PACKAGING 98
7.6 BERYLLIUM OXIDE 98
7.6.1 EFFICIENT HEAT DISSIPATION TO DRIVE NEXT-GENERATION
HIGH-POWER PACKAGE DESIGNS 98
7.7 OTHER MATERIALS 99
7.7.1 BORON NITRIDE 99
7.7.2 ZIRCONIA 99
8 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY PACKAGING TECHNOLOGY 100
8.1 INTRODUCTION 101
8.2 THROUGH-HOLE PACKAGES 103
8.2.1 ENHANCED DEVICE DURABILITY AND THERMAL PERFORMANCE
TO DRIVE DEMAND 103
8.3 SURFACE MOUNT PACKAGES – LEADED 104
8.3.1 EFFICIENT ASSEMBLY AND RELIABLE PERFORMANCE TO DRIVE DEMAND 104
8.4 SURFACE MOUNT PACKAGES – LEADLESS 104
8.4.1 SUPERIOR ELECTRICAL PERFORMANCE AND EFFICIENT MANUFACTURING
TO DRIVE DEMAND 104
8.5 ADVANCED MINIATURIZED PACKAGES 105
8.5.1 HIGH-PERFORMANCE INTEGRATION AND EFFICIENT CONNECTIVITY
TO DRIVE MARKET 105
8.6 OTHER PACKAGING TECHNOLOGIES 105
8.6.1 FLIP-CHIP CERAMIC PACKAGES 105
8.6.2 MULTI-CHIP MODULES 106
9 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY 107
9.1 INTRODUCTION 108
9.2 CONSUMER ELECTRONICS 110
9.2.1 INCREASE IN ADVANCED CERAMIC PACKAGING ADOPTION FOR
HIGH-PERFORMANCE, RELIABLE DEVICES 110
9.3 AUTOMOTIVE 110
9.3.1 RISE IN VEHICLE PRODUCTION TO DRIVE MARKET 110
9.4 HEALTHCARE 111
9.4.1 EXPANSION OF HEALTHCARE MARKETS TO DRIVE DEMAND FOR
HIGH-PERFORMANCE PACKAGING MATERIALS 111
9.5 IT & TELECOMMUNICATION 112
9.5.1 5G AND DIGITAL INFRASTRUCTURE EXPANSION TO DRIVE DEMAND 112
9.6 AEROSPACE & DEFENSE 112
9.6.1 NEXT-GENERATION AEROSPACE TECHNOLOGIES TO DRIVE
HIGH-PERFORMANCE PACKAGING ADOPTION 112
9.7 OTHER END-USE INDUSTRIES 113
9.7.1 RAIL & TRANSPORTATION 113
9.7.2 RENEWABLE ENERGY 113
10 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY REGION 114
10.1 INTRODUCTION 115
10.2 ASIA PACIFIC 117
10.2.1 CHINA 124
10.2.1.1 Rapid growth of 5G infrastructure and consumer electronics market 124
10.2.2 JAPAN 126
10.2.2.1 Continuous investment in R&D for semiconductor packaging materials 126
10.2.3 INDIA 128
10.2.3.1 Government incentives through India Semiconductor Mission 128
10.2.4 SOUTH KOREA 130
10.2.4.1 Presence of major semiconductor manufacturers like Samsung
and SK hynix 130
10.2.5 TAIWAN 132
10.2.5.1 Leadership in semiconductor manufacturing 132
10.2.6 REST OF ASIA PACIFIC 134
10.3 NORTH AMERICA 136
10.3.1 US 142
10.3.1.1 Strong semiconductor, aerospace, and defense industries 142
10.3.2 CANADA 144
10.3.2.1 Expansion of technology infrastructure 144
10.3.3 MEXICO 146
10.3.3.1 Emergence as manufacturing hub to drive demand 146
10.4 EUROPE 148
10.4.1 GERMANY 155
10.4.1.1 Growth in automotive manufacturing and ADAS integration 155
10.4.2 ITALY 157
10.4.2.1 Industrial automation and IoT electronics growth 157
10.4.3 FRANCE 159
10.4.3.1 High investment in medical electronics demanding hermetic
ceramic packages 159
10.4.4 UK 161
10.4.4.1 Government initiatives for semiconductor sovereignty 161
10.4.5 SPAIN 163
10.4.5.1 Support for local semiconductor and electronics production 163
10.4.6 REST OF EUROPE 165
10.5 MIDDLE EAST & AFRICA 167
10.5.1 GCC COUNTRIES 167
10.5.1.1 Saudi Arabia 173
10.5.1.1.1 Saudi Arabia’s Vision 2030 spurs investment 173
10.5.1.2 UAE 175
10.5.1.2.1 National Strategy for Advanced Industries
(Operation 300bn) 175
10.5.1.3 Rest of GCC countries 177
10.5.1.4 South Africa 179
10.5.1.4.1 Expansion in automotive component manufacturing 179
10.5.1.5 Rest of Middle East & Africa 181
10.6 SOUTH AMERICA 183
10.6.1 ARGENTINA 189
10.6.1.1 Industrial modernization and import substitution 189
10.6.2 BRAZIL 191
10.6.2.1 Growing industrial and consumer electronics production 191
10.6.3 REST OF SOUTH AMERICA 193
11 COMPETITIVE LANDSCAPE 195
11.1 INTRODUCTION 195
11.2 KEY PLAYER STRATEGIES/RIGHT TO WIN 195
11.3 MARKET SHARE ANALYSIS, 2024 196
11.4 REVENUE ANALYSIS, 2021–2024 199
11.5 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024 199
11.5.1 STARS 199
11.5.2 EMERGING LEADERS 200
11.5.3 PERVASIVE PLAYERS 200
11.5.4 PARTICIPANTS 200
11.5.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024 201
11.5.5.1 Company footprint 201
11.5.5.2 Region footprint 202
11.5.5.3 Material footprint 202
11.5.5.4 Packaging technology footprint 203
11.5.5.5 End-use industry footprint 204
11.6 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024 205
11.6.1 PROGRESSIVE COMPANIES 205
11.6.2 RESPONSIVE COMPANIES 205
11.6.3 DYNAMIC COMPANIES 205
11.6.4 STARTING BLOCKS 205
11.6.5 COMPETITIVE BENCHMARKING 207
11.6.5.1 Detailed list of key startups/SMEs 207
11.6.5.2 Competitive benchmarking of key startups/SMEs 208
11.7 BRAND/PRODUCT COMPARISON 210
11.8 COMPANY VALUATION AND FINANCIAL METRICS 211
11.9 COMPETITIVE SCENARIO AND TRENDS 212
11.9.1 DEALS 212
11.9.2 EXPANSIONS 212
11.9.3 OTHER DEVELOPMENTS 214
12 COMPANY PROFILES 215
12.1 KEY PLAYERS 215
12.1.1 KYOCERA CORPORATION 215
12.1.1.1 Business overview 215
12.1.1.2 Products/Solutions/Services offered 216
12.1.1.3 Recent developments 218
12.1.1.3.1 Deals 218
12.1.1.3.2 Expansions 218
12.1.1.4 MnM view 219
12.1.1.4.1 Key strengths 219
12.1.1.4.2 Strategic choices 219
12.1.1.4.3 Weaknesses and competitive threats 220
12.1.2 CERAMTEC GMBH 221
12.1.2.1 Business overview 221
12.1.2.2 Products/Solutions/Services offered 221
12.1.2.3 MnM view 222
12.1.2.3.1 Key strengths 222
12.1.2.3.2 Strategic choices 223
12.1.2.3.3 Weaknesses and competitive threats 223
12.1.3 COORSTEK 224
12.1.3.1 Business overview 224
12.1.3.2 Products/Solutions/Services offered 224
12.1.3.3 Recent developments 225
12.1.3.3.1 Others 225
12.1.3.4 MnM view 225
12.1.3.4.1 Key strengths 225
12.1.3.4.2 Strategic choices 226
12.1.3.4.3 Weaknesses and competitive threats 226
12.1.4 MORGAN ADVANCED MATERIALS 227
12.1.4.1 Business overview 227
12.1.4.2 Products/Solutions/Services offered 228
12.1.4.3 Recent developments 229
12.1.4.3.1 Others 229
12.1.4.4 MnM view 230
12.1.4.4.1 Key strengths 230
12.1.4.4.2 Strategic choices 230
12.1.4.4.3 Weaknesses and competitive threats 230
12.1.5 NGK INSULATORS, LTD. 231
12.1.5.1 Business overview 231
12.1.5.2 Products/Solutions/Services offered 232
12.1.5.3 MnM view 233
12.1.5.3.1 Key strengths 233
12.1.5.3.2 Strategic choices 233
12.1.5.3.3 Weaknesses and competitive threats 233
12.1.6 MARUWA CO., LTD. 234
12.1.6.1 Business overview 234
12.1.6.2 Products/Solutions/Services offered 235
12.1.6.3 MnM view 235
12.1.6.3.1 Key strengths 235
12.1.6.3.2 Strategic choices 235
12.1.6.3.3 Weaknesses and competitive threats 235
12.1.7 AGC INC. 236
12.1.7.1 Business overview 236
12.1.7.2 Products/Solutions/Services offered 237
12.1.7.3 Recent developments 238
12.1.7.3.1 Others 238
12.1.7.4 MnM view 238
12.1.7.4.1 Key strengths 238
12.1.7.4.2 Strategic choices 238
12.1.7.4.3 Weaknesses and competitive threats 239
12.1.8 MATERION CORPORATION 240
12.1.8.1 Business overview 240
12.1.8.2 Products/Solutions/Services offered 241
12.1.8.3 MnM view 242
12.1.8.3.1 Key strengths 242
12.1.8.3.2 Strategic choices 242
12.1.8.3.3 Weaknesses and competitive threats 242
12.1.9 TOKUYAMA CORPORATION 243
12.1.9.1 Business overview 243
12.1.9.2 Products/Solutions/Services offered 244
12.1.9.3 Recent developments 244
12.1.9.3.1 Expansions 244
12.1.9.4 MnM view 245
12.1.9.4.1 Key strengths 245
12.1.9.4.2 Strategic choices 245
12.1.9.4.3 Weaknesses and competitive threats 245
12.1.10 FERROTEC CORPORATION 246
12.1.10.1 Business overview 246
12.1.10.2 Products/Solutions/Services offered 247
12.1.10.3 Recent developments 248
12.1.10.3.1 Expansions 248
12.1.10.4 MnM view 248
12.1.10.4.1 Key strengths 248
12.1.10.4.2 Strategic choices 248
12.1.10.4.3 Weaknesses and competitive threats 249
12.2 OTHER PLAYERS 250
12.2.1 GREAT CERAMIC 250
12.2.2 ADTECH CERAMICS 251
12.2.3 XIAMEN MASCERA TECHNOLOGY CO., LTD. 252
12.2.4 ORTECH, INC. 253
12.2.5 ADVANCED CERAMIC MATERIALS 254
12.2.6 STC MATERIAL SOLUTIONS 255
12.2.7 NISHIMURA ADVANCED CERAMICS CO., LTD. 256
12.2.8 JAPAN FINE CERAMICS CO., LTD. 257
12.2.9 WUXI SPECIAL CERAMIC ELECTRICAL CO., LTD. 258
12.2.10 JINGHUI INDUSTRY LTD. 259
12.2.11 FUJIAN HUAQING ELECTRONIC MATERIAL TECHNOLOGY CO., LTD. 260
12.2.12 HEBEI SUOYI NEW MATERIAL TECHNOLOGY CO., LTD. 261
12.2.13 NTK CERATEC CO., LTD. 262
12.2.14 XIAMEN INNOVACERA ADVANCED MATERIALS CO., LTD 263
12.2.15 XIAMEN FINE CERAMICS TECHNOLOGY CO., LTD. 264
13 APPENDIX 265
13.1 DISCUSSION GUIDE 265
13.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 268
13.3 CUSTOMIZATION OPTIONS 270
13.4 RELATED REPORTS 270
13.5 AUTHOR DETAILS 271
LIST OF TABLES
TABLE 1 AVERAGE SELLING PRICE TREND OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY REGION, 2021–2024 (USD/ KG) 64
TABLE 2 AVERAGE SELLING PRICE TREND OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021–2024 (USD/KG) 65
TABLE 3 AVERAGE SELLING PRICE OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS, BY KEY PLAYER (USD/KG), 2024 65
TABLE 4 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: ROLE
OF COMPANIES IN ECOSYSTEM 66
TABLE 5 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: KEY TECHNOLOGIES 68
TABLE 6 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
COMPLEMENTARY TECHNOLOGIES 69
TABLE 7 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: ADJACENT TECHNOLOGIES 69
TABLE 8 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: TOTAL
NUMBER OF PATENTS 70
TABLE 9 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS: LIST OF MAJOR
PATENT OWNERS 72
TABLE 10 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS: LIST OF MAJOR
PATENTS, 2015–2024 73
TABLE 11 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: LIST
OF KEY CONFERENCES AND EVENTS, 2026–2027 77
TABLE 12 TARIFF RELATED TO SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET 78
TABLE 13 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES,
AND OTHER ORGANIZATIONS 79
TABLE 14 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 80
TABLE 15 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES,
AND OTHER ORGANIZATIONS 80
TABLE 16 MIDDLE EAST & AFRICA: REGULATORY BODIES, GOVERNMENT AGENCIES,
AND OTHER ORGANIZATIONS 81
TABLE 17 SOUTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES,
AND OTHER ORGANIZATIONS 82
TABLE 18 STANDARDS AND REGULATIONS FOR PLAYERS IN SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET 82
TABLE 19 IMPACT OF PORTER’S FIVE FORCES ON SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET 83
TABLE 20 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY END-USE INDUSTRY (%) 87
TABLE 21 KEY BUYING CRITERIA, BY END-USE INDUSTRY 88
TABLE 22 GDP TRENDS AND FORECASTS, BY KEY COUNTRY, 2023–2025 (USD MILLION) 89
TABLE 23 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021–2024 (USD MILLION) 94
TABLE 24 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2025–2030 (USD MILLION) 95
TABLE 25 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021–2024 (TONS) 95
TABLE 26 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2025–2030 (TONS) 95
TABLE 27 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2021–2024 (USD MILLION) 102
TABLE 28 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2025–2030 (USD MILLION) 102
TABLE 29 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2021–2024 (TONS) 102
TABLE 30 SEMICONDUCTOR CERAMIC PACKAGING MATERIAL MARKET, BY PACKAGING TECHNOLOGY, 2025–2030 (TONS) 103
TABLE 31 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 108
TABLE 32 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 109
TABLE 33 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 109
TABLE 34 SEMICONDUCTOR CERAMIC PACKAGING MATERIAL MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 109
TABLE 35 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY REGION,
2021–2024 (USD MILLION) 116
TABLE 36 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY REGION,
2025–2030 (USD MILLION) 116
TABLE 37 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY REGION,
2021–2024 (TONS) 116
TABLE 38 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY REGION,
2025–2030 (TONS) 117
TABLE 39 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY COUNTRY, 2021–2024 (USD MILLION) 118
TABLE 40 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY COUNTRY, 2025–2030 (USD MILLION) 119
TABLE 41 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY COUNTRY, 2021–2024 (TONS) 119
TABLE 42 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY COUNTRY, 2025–2030 (TONS) 119
TABLE 43 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY MATERIAL, 2021–2024 (USD MILLION) 120
TABLE 44 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY MATERIAL, 2025–2030 (USD MILLION) 120
TABLE 45 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY MATERIAL, 2021–2024 (TONS) 120
TABLE 46 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY MATERIAL, 2025–2030 (TONS) 121
TABLE 47 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY PACKAGING TECHNOLOGY, 2021–2024 (USD MILLION) 121
TABLE 48 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY PACKAGING TECHNOLOGY, 2025–2030 (USD MILLION) 121
TABLE 49 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY PACKAGING TECHNOLOGY, 2021–2024 (TONS) 122
TABLE 50 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY PACKAGING TECHNOLOGY, 2025–2030 (TONS) 122
TABLE 51 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 122
TABLE 52 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 123
TABLE 53 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 123
TABLE 54 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 123
TABLE 55 CHINA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 124
TABLE 56 CHINA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 125
TABLE 57 CHINA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 125
TABLE 58 CHINA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 125
TABLE 59 JAPAN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 126
TABLE 60 JAPAN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 127
TABLE 61 JAPAN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 127
TABLE 62 JAPAN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 127
TABLE 63 INDIA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 128
TABLE 64 INDIA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 129
TABLE 65 INDIA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 129
TABLE 66 INDIA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 129
TABLE 67 SOUTH KOREA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 131
TABLE 68 SOUTH KOREA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 131
TABLE 69 SOUTH KOREA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 131
TABLE 70 SOUTH KOREA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 132
TABLE 71 TAIWAN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 133
TABLE 72 TAIWAN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 133
TABLE 73 TAIWAN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 133
TABLE 74 TAIWAN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 134
TABLE 75 REST OF ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 135
TABLE 76 REST OF ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 135
TABLE 77 REST OF ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 135
TABLE 78 REST OF ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 136
TABLE 79 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2021–2024 (USD MILLION) 137
TABLE 80 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2025–2030 (USD MILLION) 138
TABLE 81 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2021–2024 (TONS) 138
TABLE 82 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2025–2030 (TONS) 138
TABLE 83 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021–2024 (USD MILLION) 138
TABLE 84 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2025–2030 (USD MILLION) 139
TABLE 85 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021–2024 (TONS) 139
TABLE 86 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2025–2030 (TONS) 139
TABLE 87 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2021–2024 (USD MILLION) 140
TABLE 88 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2025–2030 (USD MILLION) 140
TABLE 89 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2021–2024 (TONS) 140
TABLE 90 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2025–2030 (TONS) 141
TABLE 91 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 141
TABLE 92 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 141
TABLE 93 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 142
TABLE 94 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 142
TABLE 95 US: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 143
TABLE 96 US: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 143
TABLE 97 US: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 144
TABLE 98 US: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 144
TABLE 99 CANADA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 145
TABLE 100 CANADA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 145
TABLE 101 CANADA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 146
TABLE 102 CANADA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 146
TABLE 103 MEXICO: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 147
TABLE 104 MEXICO: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 147
TABLE 105 MEXICO: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 148
TABLE 106 MEXICO: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 148
TABLE 107 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY COUNTRY, 2021–2024 (USD MILLION) 149
TABLE 108 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY COUNTRY, 2025–2030 (USD MILLION) 150
TABLE 109 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY COUNTRY, 2021–2024 (TONS) 150
TABLE 110 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY COUNTRY, 2025–2030 (TONS) 150
TABLE 111 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY MATERIAL, 2021–2024 (USD MILLION) 151
TABLE 112 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY MATERIAL, 2025–2030 (USD MILLION) 151
TABLE 113 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY MATERIAL, 2021–2024 (TONS) 151
TABLE 114 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY MATERIAL, 2025–2030 (TONS) 152
TABLE 115 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY PACKAGING TECHNOLOGY, 2021–2024 (USD MILLION) 152
TABLE 116 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY PACKAGING TECHNOLOGY, 2025–2030 (USD MILLION) 152
TABLE 117 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY PACKAGING TECHNOLOGY, 2021–2024 (TONS) 153
TABLE 118 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY PACKAGING TECHNOLOGY, 2025–2030 (TONS) 153
TABLE 119 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 153
TABLE 120 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 154
TABLE 121 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 154
TABLE 122 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 154
TABLE 123 GERMANY: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 155
TABLE 124 GERMANY: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 156
TABLE 125 GERMANY: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 156
TABLE 126 GERMANY: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 156
TABLE 127 ITALY: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 157
TABLE 128 ITALY: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 158
TABLE 129 ITALY: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 158
TABLE 130 ITALY: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 158
TABLE 131 FRANCE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 159
TABLE 132 FRANCE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 160
TABLE 133 FRANCE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 160
TABLE 134 FRANCE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 160
TABLE 135 UK: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 161
TABLE 136 UK: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 162
TABLE 137 UK: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 162
TABLE 138 UK: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 162
TABLE 139 SPAIN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 163
TABLE 140 SPAIN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 164
TABLE 141 SPAIN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 164
TABLE 142 SPAIN: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 164
TABLE 143 REST OF EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 165
TABLE 144 REST OF EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 166
TABLE 145 REST OF EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 166
TABLE 146 REST OF EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 166
TABLE 147 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2021–2024 (USD MILLION) 168
TABLE 148 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2025–2030 (USD MILLION) 168
TABLE 149 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2021–2024 (TONS) 168
TABLE 150 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2025–2030 (TONS) 169
TABLE 151 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021–2024 (USD MILLION) 169
TABLE 152 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2025–2030 (USD MILLION) 169
TABLE 153 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021–2024 (TONS) 170
TABLE 154 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2025–2030 (TONS) 170
TABLE 155 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2021–2024 (USD MILLION) 170
TABLE 156 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2025–2030 (USD MILLION) 171
TABLE 157 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2021–2024 (TONS) 171
TABLE 158 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2025–2030 (TONS) 171
TABLE 159 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 172
TABLE 160 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 172
TABLE 161 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 172
TABLE 162 MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 173
TABLE 163 SAUDI ARABIA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 174
TABLE 164 SAUDI ARABIA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 174
TABLE 165 SAUDI ARABIA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 174
TABLE 166 SAUDI ARABIA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 175
TABLE 167 UAE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 176
TABLE 168 UAE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 176
TABLE 169 UAE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 176
TABLE 170 UAE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 177
TABLE 171 REST OF GCC COUNTRIES: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 178
TABLE 172 REST OF GCC COUNTRIES: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 178
TABLE 173 REST OF GCC COUNTRIES: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 178
TABLE 174 REST OF GCC COUNTRIES: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 179
TABLE 175 SOUTH AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 180
TABLE 176 SOUTH AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 180
TABLE 177 SOUTH AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 180
TABLE 178 SOUTH AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 181
TABLE 179 REST OF MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 182
TABLE 180 REST OF MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 182
TABLE 181 REST OF MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 182
TABLE 182 REST OF MIDDLE EAST & AFRICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 183
TABLE 183 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2021–2024 (USD MILLION) 183
TABLE 184 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2025–2030 (USD MILLION) 184
TABLE 185 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2021–2024 (TONS) 184
TABLE 186 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY, 2025–2030 (TONS) 184
TABLE 187 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021–2024 (USD MILLION) 185
TABLE 188 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2025–2030 (USD MILLION) 185
TABLE 189 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021–2024 (TONS) 185
TABLE 190 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2025–2030 (TONS) 186
TABLE 191 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2021–2024 (USD MILLION) 186
TABLE 192 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2025–2030 (USD MILLION) 186
TABLE 193 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2021–2024 (TONS) 187
TABLE 194 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2025–2030 (TONS) 187
TABLE 195 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 187
TABLE 196 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 188
TABLE 197 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 188
TABLE 198 SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 188
TABLE 199 ARGENTINA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 189
TABLE 200 ARGENTINA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 190
TABLE 201 ARGENTINA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 190
TABLE 202 ARGENTINA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 190
TABLE 203 BRAZIL: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 191
TABLE 204 BRAZIL: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 192
TABLE 205 BRAZIL: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2021–2024 (TONS) 192
TABLE 206 BRAZIL: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET,
BY END-USE INDUSTRY, 2025–2030 (TONS) 192
TABLE 207 REST OF SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (USD MILLION) 193
TABLE 208 REST OF SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (USD MILLION) 193
TABLE 209 REST OF SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2021–2024 (TONS) 194
TABLE 210 REST OF SOUTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2025–2030 (TONS) 194
TABLE 211 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS 195
TABLE 212 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: DEGREE
OF COMPETITION, 2024 197
TABLE 213 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: REGION FOOTPRINT 202
TABLE 214 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
MATERIAL FOOTPRINT 202
TABLE 215 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
PACKAGING TECHNOLOGY FOOTPRINT 203
TABLE 216 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
END-USE INDUSTRY FOOTPRINT 204
TABLE 217 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
DETAILED LIST OF KEY STARTUPS/SMES 207
TABLE 218 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES (1/2) 208
TABLE 219 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES (2/2) 209
TABLE 220 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: DEALS,
JANUARY 2021− OCTOBER 2025 212
TABLE 221 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: EXPANSIONS, JANUARY 2021− OCTOBER 2025 212
TABLE 222 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: OTHER DEVELOPMENTS, JANUARY 2021− OCTOBER 2025 214
TABLE 223 KYOCERA CORPORATION: COMPANY OVERVIEW 215
TABLE 224 KYOCERA CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 216
TABLE 225 KYOCERA CORPORATION: DEALS, JANUARY 2021–OCTOBER 2025 218
TABLE 226 KYOCERA CORPORATION: EXPANSIONS, JANUARY 2021–OCTOBER 2025 218
TABLE 227 CERAMTEC GMBH: COMPANY OVERVIEW 221
TABLE 228 CERAMTEC GMBH: PRODUCTS/SOLUTIONS/SERVICES OFFERED 221
TABLE 229 COORSTEK: COMPANY OVERVIEW 224
TABLE 230 COORSTEK: PRODUCTS/SOLUTIONS/SERVICES OFFERED 224
TABLE 231 COORSTEK: OTHERS, JANUARY 2021–OCTOBER 2025 225
TABLE 232 MORGAN ADVANCED MATERIALS: COMPANY OVERVIEW 227
TABLE 233 MORGAN ADVANCED MATERIALS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 228
TABLE 234 MORGAN ADVANCED MATERIALS: OTHERS, JANUARY 2021–OCTOBER 2025 229
TABLE 235 NGK INSULATORS, LTD.: COMPANY OVERVIEW 231
TABLE 236 NGK INSULATORS, LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 232
TABLE 237 MARUWA CO., LTD.: COMPANY OVERVIEW 234
TABLE 238 MARUWA CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 235
TABLE 239 AGC INC.: COMPANY OVERVIEW 236
TABLE 240 AGC INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 237
TABLE 241 AGC INC.: OTHERS, JANUARY 2021–OCTOBER 2025 238
TABLE 242 MATERION CORPORATION: COMPANY OVERVIEW 240
TABLE 243 MATERION CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 241
TABLE 244 TOKUYAMA CORPORATION: COMPANY OVERVIEW 243
TABLE 245 TOKUYAMA CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 244
TABLE 246 TOKUYAMA CORPORATION: EXPANSIONS, JANUARY 2021–OCTOBER 2025 244
TABLE 247 FERROTEC CORPORATION: COMPANY OVERVIEW 246
TABLE 248 FERROTEC CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 247
TABLE 249 FERROTEC CORPORATION: EXPANSIONS, JANUARY 2021–OCTOBER 2025 248
TABLE 250 GREAT CERAMIC: COMPANY OVERVIEW 250
TABLE 251 ADTECH CERAMICS: COMPANY OVERVIEW 251
TABLE 252 XIAMEN MASCERA TECHNOLOGY CO., LTD.: COMPANY OVERVIEW 252
TABLE 253 ORTECH, INC.: COMPANY OVERVIEW 253
TABLE 254 ADVANCED CERAMIC MATERIALS: COMPANY OVERVIEW 254
TABLE 255 STC MATERIAL SOLUTIONS: COMPANY OVERVIEW 255
TABLE 256 NISHIMURA ADVANCED CERAMICS CO., LTD.: COMPANY OVERVIEW 256
TABLE 257 JAPAN FINE CERAMICS CO., LTD.: COMPANY OVERVIEW 257
TABLE 258 WUXI SPECIAL CERAMIC ELECTRICAL CO., LTD.: COMPANY OVERVIEW 258
TABLE 259 JINGHUI INDUSTRY LTD.: COMPANY OVERVIEW 259
TABLE 260 FUJIAN HUAQING ELECTRONIC MATERIAL TECHNOLOGY CO., LTD.:
COMPANY OVERVIEW 260
TABLE 261 HEBEI SUOYI NEW MATERIAL TECHNOLOGY CO., LTD.: COMPANY OVERVIEW 261
TABLE 262 NTK CERATEC CO., LTD.: COMPANY OVERVIEW 262
TABLE 263 XIAMEN INNOVACERA ADVANCED MATERIALS CO., LTD: COMPANY OVERVIEW 263
TABLE 264 XIAMEN FINE CERAMICS TECHNOLOGY CO., LTD.: COMPANY OVERVIEW 264
LIST OF FIGURES
FIGURE 1 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET SEGMENTATION AND REGIONAL SCOPE 28
FIGURE 2 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: RESEARCH DESIGN 31
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: SUPPLY-SIDE APPROACH 35
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: DEMAND-SIDE APPROACH 35
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: REVENUE OF MARKET PLAYERS 36
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH AND
TOP-DOWN APPROACH 37
FIGURE 7 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
DATA TRIANGULATION 38
FIGURE 8 ALUMINA MATERIAL SEGMENT TO LEAD MARKET DURING FORECAST PERIOD 43
FIGURE 9 SURFACE MOUNT PACKAGES –LEADLESS SEGMENT TO GROW AT FASTEST
RATE DURING FORECAST PERIOD 44
FIGURE 10 CONSUMER ELECTRONICS INDUSTRY SEGMENT TO LEAD MARKET
DURING FORECAST PERIOD 45
FIGURE 11 ASIA PACIFIC TO REGISTER HIGHEST CAGR IN SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET DURING FORECAST PERIOD 46
FIGURE 12 GROWING USE OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS IN CONSUMER ELECTRONICS TO CREATE LUCRATIVE OPPORTUNITIES FOR
MARKET PLAYERS 47
FIGURE 13 ALUMINA SEGMENT TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD 48
FIGURE 14 SURFACE MOUNT PACKAGES –LEADLESS SEGMENT TO REGISTER
HIGHEST CAGR DURING FORECAST PERIOD 48
FIGURE 15 CONSUMER ELECTRONICS SEGMENT TO REGISTER HIGHEST CAGR
DURING FORECAST PERIOD 49
FIGURE 16 MEXICO TO BE FASTEST-GROWING MARKET FOR SEMICONDUCTOR
CERAMIC PACKAGING MATERIALS DURING FORECAST PERIOD 49
FIGURE 17 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET 51
FIGURE 18 USE OF GENERATIVE AI IN SEMICONDUCTOR CERAMIC PACKAGING
MATERIALS MARKET 56
FIGURE 19 TRENDS/DISRUPTIONS INFLUENCING CUSTOMER BUSINESS 59
FIGURE 20 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
SUPPLY CHAIN ANALYSIS 60
FIGURE 21 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
INVESTMENT AND FUNDING SCENARIO, 2021 VS. 2023 (USD MILLION) 63
FIGURE 22 AVERAGE SELLING PRICE TREND OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY REGION, 2021–2024 (USD/ KG) 64
FIGURE 23 AVERAGE SELLING PRICE TREND OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY KEY PLAYER, 2024 (USD/KG) 65
FIGURE 24 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: ECOSYSTEM 66
FIGURE 25 PATENTS GRANTED OVER LAST 10 YEARS, 2015−2024 70
FIGURE 26 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET: LEGAL
STATUS OF PATENTS, 2015–2024 71
FIGURE 27 PATENTS ANALYSIS FOR SEMICONDUCTOR CERAMIC PACKAGING MATERIALS,
BY JURISDICTION, 2015−2024 71
FIGURE 28 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENTS IN LAST 10 YEARS 72
FIGURE 29 IMPORTS OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS, BY COUNTRY, 2021–2024 (USD THOUSAND) 76
FIGURE 30 EXPORTS OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS, BY COUNTRY, 2021–2024 (USD THOUSAND) 77
FIGURE 31 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
PORTER’S FIVE FORCES ANALYSIS 84
FIGURE 32 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY END-USE INDUSTRY 87
FIGURE 33 KEY BUYING CRITERIA, BY END-USE INDUSTRY 88
FIGURE 34 ALUMINA TO BE LARGEST SEGMENT OF SEMICONDUCTOR CERAMIC
PACKAGING MATERIALS MARKET DURING FORECAST PERIOD 94
FIGURE 35 SURFACE MOUNT PACKAGES – LEADLESS TO BE LARGEST SEGMENT OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET DURING
FORECAST PERIOD 101
FIGURE 36 CONSUMER ELECTRONICS TO BE LARGEST SEGMENT OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET DURING FORECAST PERIOD 108
FIGURE 37 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD 115
FIGURE 38 ASIA PACIFIC: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS
MARKET SNAPSHOT 118
FIGURE 39 NORTH AMERICA: SEMICONDUCTOR CERAMIC PACKAGING
MATERIALS MARKET SNAPSHOT 137
FIGURE 40 EUROPE: SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET SNAPSHOT 149
FIGURE 41 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET
SHARE ANALYSIS, 2024 197
FIGURE 42 REVENUE ANALYSIS OF KEY PLAYERS, 2021–2024 (USD BILLION) 199
FIGURE 43 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
COMPANY EVALUATION MATRIX, KEY PLAYERS, 2024 200
FIGURE 44 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
COMPANY FOOTPRINT 201
FIGURE 45 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
COMPANY EVALUATION MATRIX, STARTUPS/SMES, 2024 206
FIGURE 46 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS: BRAND/
PRODUCT COMPARATIVE ANALYSIS 210
FIGURE 47 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
EV/EBITDA OF KEY COMPANIES, 2025 211
FIGURE 48 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET:
YEAR-TO-DATE (YTD) PRICE TOTAL RETURN, 2025 211
FIGURE 49 KYOCERA CORPORATION: COMPANY SNAPSHOT 216
FIGURE 50 MORGAN ADVANCED MATERIALS: COMPANY SNAPSHOT 228
FIGURE 51 NGK INSULATORS, LTD.: COMPANY SNAPSHOT 232
FIGURE 52 MARUWA CO., LTD.: COMPANY SNAPSHOT 234
FIGURE 53 AGC INC.: COMPANY SNAPSHOT 237
FIGURE 54 MATERION CORPORATION: COMPANY SNAPSHOT 241
FIGURE 55 TOKUYAMA CORPORATION: COMPANY SNAPSHOT 243
FIGURE 56 FERROTEC CORPORATION: COMPANY SNAPSHOT 246
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