Semiconductor Manufacturing Equipment Market - Global Forecast To 2032
商品番号 : SMB-11081
| 出版社 | MarketsandMarkets |
| 出版年月 | 2025年11月 |
| ページ数 | 316 |
| 図表数 | 349 |
| 価格タイプ | シングルユーザライセンス |
| 価格 | USD 4,950 |
| 種別 | 英文調査報告書 |
半導体製造装置市場 – リソグラフィー、ウェーハ表面処理、ウェーハ洗浄、成膜、組立・パッケージング、ダイシング、計測、ボンディング、ウェーハテスト/ICテスト、メモリ、ロジック、ディスクリート、アナログ – 2032年までの世界予測
世界の半導体製造装置市場は、2025年の1,663億5,000万米ドルから2032年には3,443億6,000万米ドルに拡大し、年平均成長率（CAGR）11.0%で成長すると予測されています。自動車用半導体セクターの急速な成長は、2025年の半導体製造装置市場の主要な牽引役として浮上しています。自動車業界が電動化、自動運転、コネクティビティの強化、ソフトウェア定義アーキテクチャへの移行を進める中で、マイクロコントローラ、電源管理IC、センサー、ADASプロセッサなど、高信頼性半導体部品の需要が急増し続けています。EVへの急速なシフトと車両1台あたりの半導体搭載量の増加により、トラクションインバータ、バッテリー管理システム、パワーエレクトロニクス、センシングモジュール、ADASプラットフォームに使用される高度なチップの需要が大幅に増加しています。自動車メーカーとティア1サプライヤーは、車載グレードの半導体を生産するためにファブの生産能力を拡大し、既存ラインをアップグレードしています。これは、リソグラフィー、成膜、エッチング、計測、検査ツールといった重要な装置への投資を直接的に増加させています。車載アプリケーションにおける厳格な性能、信頼性、トレーサビリティ要件を踏まえ、このセグメントは精密製造と堅牢な品質管理を重視しており、車載グレードのツールセットを備えた半導体製造装置サプライヤーにメリットをもたらします。
本レポートでは、半導体製造装置市場を、前工程装置と後工程装置を含む製造段階、エンドユーザー、地域別にセグメント化しています。また、市場に影響を与える主要な推進要因、制約要因、機会、課題についても分析しています。南北アメリカ、アジア太平洋、EMEAの3つの主要地域における市場の詳細な分析を提供しています。さらに、主要プレーヤーのバリューチェーン分析と、半導体製造装置エコシステムにおける競合分析も含まれています。
本レポートを購入する主なメリットは以下のとおりです。
- 半導体製造装置市場の成長に影響を与える主要な推進要因（微細化の進展と先端ノードの採用）、制約要因（高い資本コストと運用コスト）、機会（先進パッケージング技術の採用増加）、課題（厳格な規制遵守）の分析
- 製品／ソリューション／サービス開発／イノベーション：半導体製造装置市場における今後の技術、研究開発活動に関する詳細な洞察
- 市場開発：様々な地域の半導体製造装置市場を分析することにより、収益性の高い市場に関する包括的な情報を提供します
- 市場多様化：未開拓地域における新しい半導体製造装置、最近の開発状況、半導体製造装置市場への投資に関する包括的な情報
- 競合評価：Applied Materials, Inc.（米国）、ASML（オランダ）、LAM RESEARCH CORPORATION（米国）、東京エレクトロン株式会社（日本）、KLA Corporation（米国）などの主要企業の市場シェア、成長戦略、および提供内容に関する詳細な評価
Report Description
The global semiconductor manufacturing equipment market is projected to grow from USD 166.35 billion in 2025 to USD 344.36 billion by 2032, at a CAGR of 11.0%. The rapid acceleration of the automotive semiconductor sector is emerging as a major driver of the semiconductor manufacturing equipment market in 2025. As the automotive industry transitions toward electrification, autonomous driving, enhanced connectivity, and software-defined architectures, demand for high-reliability semiconductor components, including microcontrollers, power-management ICs, sensors, and ADAS processors, continues to rise sharply. The rapid shift toward EVs and higher semiconductor content per vehicle is substantially increasing demand for advanced chips used in traction inverters, battery-management systems, power electronics, sensing modules, and ADAS platforms. Automakers and tier-one suppliers are expanding fab capacity and upgrading existing lines to produce automotive-grade semiconductors, directly boosting investments in critical equipment such as lithography, deposition, etch, metrology, and inspection tools. Given the stringent performance, reliability, and traceability requirements in automotive applications, the segment places strong emphasis on precision manufacturing and robust quality control, benefiting semiconductor manufacturing equipment suppliers with automotive-qualified toolsets.
“OSAT Companies to Record Highest CAGR During Forecast Period”
OSAT companies are expected to record the highest CAGR during the forecast period because they are at the center of the industry’s rapid shift toward advanced packaging and high-density testing requirements. As chip designs evolve to support AI/ML, HPC, 5G, automotive autonomy, and heterogeneous integration, the demand for sophisticated backend processes such as 2.5D/3D packaging, fan-out wafer-level packaging, system-in-package (SiP), and high-performance automated test equipment continues to surge.
Fabless companies are increasingly outsourcing assembly and testing to reduce costs and accelerate time-to-market, prompting OSATs to expand their capacity and adopt more advanced equipment. Furthermore, increased miniaturization, the adoption of chiplet-based architectures, and the transition toward packaging-driven performance improvements are significantly boosting OSAT investments. Collectively, these factors position OSAT companies as the fastest-growing segment in the semiconductor manufacturing equipment market based on end users.
“Testing Equipment Led Semiconductor Manufacturing Back-end Equipment Market in 2024”
Testing equipment holds the largest share of the back-end semiconductor manufacturing equipment market because every semiconductor device must undergo multiple mandatory test stages to ensure functional accuracy, performance reliability, and defect-free operation before shipment. As chips become more complex, with higher I/O counts, smaller geometries, chiplet architectures, and advanced packaging formats, the need for comprehensive electrical, functional, burn-in, and system-level testing increases significantly.
Moreover, the rise of applications such as AI accelerators, automotive electronics, industrial automation, and 5G requires extremely high reliability and safety standards, further increasing the intensity and coverage requirements of testing. The cost of device failure has risen sharply, making robust testing a non-negotiable step for semiconductor manufacturers. As a result, OSATs, IDMs, and fabless companies consistently invest in advanced automated test equipment (ATE), probing systems, and inspection technologies, thereby solidifying the leading position of testing equipment in the back-end semiconductor manufacturing equipment market.
“China to Dominate Asia Pacific Semiconductor Manufacturing Equipment Market throughout Forecast Period”
China holds the largest share of the semiconductor manufacturing equipment market due to its aggressive national push to expand domestic semiconductor production capacity and reduce dependence on foreign chip suppliers. The country has been investing heavily in new fabs, equipment procurement, and advanced manufacturing infrastructure as part of government-led initiatives, such as “Made in China 2025” and successive Five-year Plans, which prioritize semiconductor self-sufficiency.
China also hosts one of the world’s fastest-growing ecosystems of foundries, memory manufacturers, and OSAT companies, such as JCET and Tongfu Microelectronics, driving continuous equipment purchases for capacity expansion and technology upgrades. Additionally, supply-chain localization efforts, coupled with increased government subsidies, tax incentives, and capital investments, have significantly boosted demand for equipment across lithography, etch, deposition, and backend packaging segments.
Breakdown of Primaries
Various executives from key organizations operating in the semiconductor manufacturing equipment market were interviewed in-depth, including CEOs, marketing directors, and innovation and technology directors.
- By Company Type: Tier 1 – 25%, Tier 2 – 35%, and Tier 3 – 40%
- By Designation: C-level Executives – 40%, Directors – 30%, and Others – 30%
- By Region: Asia Pacific – 45%, Americas – 35%, EMEA – 20%
The semiconductor manufacturing equipment market is dominated by globally established players, such as Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), LAM RESEARCH CORPORATION (US), KLA Corporation (US), SCREEN Holdings Co., Ltd. (Japan), Teradyne Inc. (US), ADVANTEST CORPORATION (Japan), Hitachi High-Tech Corporation (Japan), Plasma-Therm (US), ASM International N.V. (Netherlands), EV Group (EVG) (Austria), Onto Innovation (US), Nordson Corporation (US), ADT – Advanced Dicing Technologies (Israel), Beneq (Finland), CVD Equipment Corporation (US), Eugenus, Inc. (South Korea), Nikon Corporation (Japan), Semiconductor Equipment Corp. (US), SENTECH Instruments GmbH (Germany), Canon Inc. (Japan), KOKUSAI ELECTRIC CORPORATION (Japan), SEMES (South Korea), and FormFactor (US). The study includes an in-depth competitive analysis of these key players in the semiconductor manufacturing equipment market, with their company profiles, recent developments, and key market strategies.
Study Coverage
The report segments the semiconductor manufacturing equipment market by manufacturing phase, including front-end equipment and back-end equipment, end user, and region. The report also examines the key drivers, restraints, opportunities, and challenges influencing the market. It provides a detailed view of the market across three main regions: the Americas, Asia Pacific, and EMEA. The report includes a value chain analysis of the key players and their competitive analysis of the semiconductor manufacturing equipment ecosystem.
Key benefits of buying the report are as follows:
- Analysis of key drivers (rising miniaturization and advanced node adoption), restraints (high capital and operational costs), opportunities (rising adoption of advanced packaging technologies), and challenges (stringent regulatory compliance) influencing the growth of the semiconductor manufacturing equipment market
- Products/Solution/Service Development/Innovation: Detailed insights into upcoming technologies, research, and development activities in the semiconductor manufacturing equipment market
- Market Development: Comprehensive information about lucrative markets, provided by analyzing the semiconductor manufacturing equipment market across varied regions
- Market Diversification: Exhaustive information about new semiconductor manufacturing equipment in untapped geographies, recent developments, and investments in the semiconductor manufacturing equipment market
- Competitive Assessment: In-depth assessment of market shares and growth strategies and offerings of leading players, such as Applied Materials, Inc. (US), ASML (Netherlands), LAM RESEARCH CORPORATION (US), Tokyo Electron Limited (Japan), and KLA Corporation (US)
Table of Contents
1 INTRODUCTION 30
1.1 STUDY OBJECTIVES 30
1.2 MARKET DEFINITION 31
1.3 STUDY SCOPE 31
1.3.1 MARKETS COVERED AND REGIONAL SCOPE 31
1.3.2 INCLUSIONS AND EXCLUSIONS 32
1.3.3 YEARS CONSIDERED 32
1.4 CURRENCY CONSIDERED 33
1.5 UNIT CONSIDERED 33
1.6 LIMITATIONS 33
1.7 STAKEHOLDERS 33
1.8 SUMMARY OF CHANGES 34
2 EXECUTIVE SUMMARY 35
2.1 MARKET HIGHLIGHTS AND KEY INSIGHTS 35
2.2 KEY MARKET PARTICIPANTS: MAPPING OF STRATEGIC DEVELOPMENTS 36
2.3 DISRUPTIVE TRENDS IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 37
2.4 HIGH-GROWTH SEGMENTS 38
2.5 SNAPSHOT: GLOBAL MARKET SIZE, GROWTH RATE, AND FORECAST 39
3 PREMIUM INSIGHTS 40
3.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 40
3.2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY END USER 41
3.3 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT 41
3.4 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION 42
4 MARKET OVERVIEW 43
4.1 INTRODUCTION 43
4.2 MARKET DYNAMICS 43
4.2.1 DRIVERS 44
4.2.1.1 Increasing miniaturization and advanced node adoption 44
4.2.1.2 Rising autonomous vehicle adoption and digitalization 44
4.2.1.3 Rapid expansion of semiconductor fabrication capacity 45
4.2.1.4 Proliferation of AI, HPC, and data-centric workloads 45
4.2.2 RESTRAINTS 46
4.2.2.1 High capital and operational costs 46
4.2.2.2 Rising complexity of semiconductor manufacturing processes 47
4.2.3 OPPORTUNITIES 48
4.2.3.1 Mounting adoption of advanced packaging technologies 48
4.2.3.2 Government-led initiatives to strengthen semiconductor manufacturing 48
4.2.4 CHALLENGES 49
4.2.4.1 Complexities associated with transitioning to smaller geometries and higher transistor densities 49
4.2.4.2 Rising implementation of stringent environmental norms 50
4.3 UNMET NEEDS AND WHITE SPACES 51
4.4 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES 52
4.5 STRATEGIC MOVES BY TIER 1/2/3 PLAYERS 53
5 INDUSTRY TRENDS 54
5.1 PORTER’S FIVE FORCES ANALYSIS 54
5.1.1 INTENSITY OF COMPETITIVE RIVALRY 55
5.1.2 BARGAINING POWER OF SUPPLIERS 55
5.1.3 BARGAINING POWER OF BUYERS 56
5.1.4 THREAT OF SUBSTITUTES 56
5.1.5 THREAT OF NEW ENTRANTS 56
5.2 MACROECONOMICS INDICATORS 56
5.2.1 INTRODUCTION 56
5.2.2 GDP TRENDS AND FORECAST 57
5.2.3 TRENDS IN GLOBAL FOUNDRY INDUSTRY 57
5.2.4 TRENDS IN GLOBAL IDM INDUSTRY 57
5.2.5 TRENDS IN GLOBAL OSAT INDUSTRY 58
5.3 VALUE CHAIN ANALYSIS 58
5.4 ECOSYSTEM ANALYSIS 61
5.5 PRICING ANALYSIS 63
5.5.1 AVERAGE SELLING PRICE TREND OF FRONT-END LITHOGRAPHY EQUIPMENT OFFERED BY KEY PLAYERS, BY TYPE, 2021–2024 63
5.5.2 AVERAGE SELLING PRICE TREND OF STANDARD LITHOGRAPHY EQUIPMENT, BY REGION, 2021–2024 64
5.6 TRADE ANALYSIS 65
5.6.1 IMPORT SCENARIO (HS CODE 848620) 65
5.6.2 EXPORT SCENARIO (HS CODE 848620) 66
5.7 KEY CONFERENCES AND EVENTS, 2025–2026 67
5.8 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS 68
5.9 INVESTMENT AND FUNDING SCENARIO 68
5.10 CASE STUDY ANALYSIS 69
5.10.1 HCL AND FOXCONN COLLABORATE TO ESTABLISH OSAT FACILITY IN INDIA TO NAVIGATE REGULATORY COMPLEXITIES 69
5.10.2 SYNOVA SA IMPLEMENTS LASER MICROJET TECHNOLOGY TO ACHIEVE PRECISE AND HIGH-QUALITY WAFER DICING AND DIE SINGULATION 70
5.10.3 INTEL SECURES ASML’S HIGH-NA EUV MACHINES TO PRODUCE ADVANCED CHIPS WITH GREATER PRECISION AND EFFICIENCY 70
5.11 IMPACT OF 2025 US TARIFF ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 70
5.11.1 INTRODUCTION 70
5.11.2 KEY TARIFF RATES 71
5.11.3 PRICE IMPACT ANALYSIS 71
5.11.4 IMPACT ON COUNTRIES/REGIONS 72
5.11.4.1 US 72
5.11.4.2 Europe 72
5.11.4.3 Asia Pacific 72
5.11.5 IMPACT ON END USERS 73
6 TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACTS, PATENTS, INNOVATIONS, AND FUTURE APPLICATIONS 74
6.1 KEY EMERGING TECHNOLOGIES 74
6.1.1 EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY 74
6.1.2 WAFER BONDING 74
6.2 COMPLEMENTARY TECHNOLOGIES 75
6.2.1 FLIP CHIP 75
6.3 TECHNOLOGY/PRODUCT ROADMAP 75
6.4 PATENT ANALYSIS 77
6.5 IMPACT OF AI/GEN AI ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 80
6.5.1 TOP USE CASES AND MARKET POTENTIAL 81
6.5.2 BEST PRACTICES FOLLOWED BY OEMS IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 81
6.5.3 CASE STUDIES RELATED TO AI IMPLEMENTATION IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 82
6.5.4 INTERCONNECTED ECOSYSTEM AND IMPACT ON MARKET PLAYERS 82
6.5.5 CLIENTS’ READINESS TO ADOPT AI/GEN AI-INTEGRATED SEMICONDUCTOR MANUFACTURING EQUIPMENT 83
7 REGIONAL LANDSCAPE AND SUSTAINABILITY INITIATIVES 84
7.1 REGIONAL REGULATIONS AND COMPLIANCE 84
7.1.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 84
7.1.2 INDUSTRY STANDARDS 85
7.2 SUSTAINABILITY INITIATIVES 86
7.2.1 CARBON IMPACT AND ECO-APPLICATION FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT 86
7.3 IMPACT OF REGULATORY POLICIES ON SUSTAINABILITY INITIATIVES 87
7.4 CERTIFICATIONS, LABELING, AND ECO-STANDARDS 88
8 CUSTOMER LANDSCAPE AND BUYER BEHAVIOR 90
8.1 DECISION-MAKING PROCESS 90
8.2 KEY STAKEHOLDERS INVOLVED IN BUYING PROCESS AND THEIR EVALUATION CRITERIA 91
8.2.1 KEY STAKEHOLDERS IN BUYING PROCESS 91
8.2.2 BUYING CRITERIA 92
8.3 ADOPTION BARRIERS AND INTERNAL CHALLENGES 92
8.4 UNMET NEEDS OF VARIOUS END USERS 93
8.5 MARKET PROFITABILITY 94
9 OVERVIEW OF WAFER TYPES IN SEMICONDUCTOR MANUFACTURING EQUIPMENT 95
9.1 INTRODUCTION 95
9.2 SILICON (SI) 95
9.3 SILICON CARBIDE (SIC) 96
9.4 GALLIUM NITRIDE (GAN) 97
9.5 GALLIUM ARSENIDE (GAAS) 97
9.6 OTHER WAFER TYPES 98
10 END PRODUCTS OF SEMICONDUCTOR MANUFACTURING EQUIPMENT 99
10.1 INTRODUCTION 99
10.2 MEMORY 99
10.3 LOGIC DEVICES 100
10.3.1 MPU 100
10.3.2 CPU 100
10.3.3 GPU 100
10.3.4 DSP 101
10.3.5 OTHERS 101
10.4 DISCRETE DEVICES 101
10.5 ANALOG ICS 101
10.6 OTHER END PRODUCTS 102
11 VARIED IC DIMENSIONS WITHIN SEMICONDUCTOR MANUFACTURING EQUIPMENT 103
11.1 INTRODUCTION 103
11.2 2D ICS 103
11.3 2.5D ICS 103
11.4 3D ICS 104
12 WAFER SIZES PROCESSED BY SEMICONDUCTOR MANUFACTURING EQUIPMENT 105
12.1 INTRODUCTION 105
12.2 ≤150 MM 105
12.3 200 MM 105
12.4 300 MM 106
13 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE 107
13.1 INTRODUCTION 108
13.2 FRONT-END 109
13.2.1 EMPHASIS ON ENERGY EFFICIENCY, DEFECT REDUCTION, AND SUSTAINABILITY TO FOSTER SEGMENTAL GROWTH 109
13.3 BACK-END 112
13.3.1 ADVANCES IN WAFER-LEVEL FAN-OUT PACKAGING AND FOCUS ON TEST OPTIMIZATION TO EXPEDITE SEGMENTAL GROWTH 112
13.4 OTHER PHASES 115
14 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY FRONT-END EQUIPMENT 119
14.1 INTRODUCTION 120
14.2 LITHOGRAPHY EQUIPMENT 121
14.2.1 FOCUS ON OPTICAL PRECISION AND OVERLAY ACCURACY TO SUPPORT NEXT-GENERATION FABRICATION TO DRIVE MARKET 121
14.2.2 PHOTOLITHOGRAPHY 124
14.2.2.1 Deep ultraviolet (DUV) 125
14.2.2.2 Extreme ultraviolet (EUV) 125
14.2.3 ELECTRON BEAM LITHOGRAPHY 125
14.2.4 ION BEAM LITHOGRAPHY 126
14.2.5 NANOIMPRINT LITHOGRAPHY 126
14.2.6 OTHER LITHOGRAPHY EQUIPMENT 127
14.3 DEPOSITION EQUIPMENT 128
14.3.1 EVOLUTION OF DEVICE SCALING AND 3D INTEGRATION TO CONTRIBUTE TO SEGMENTAL GROWTH 128
14.3.2 CVD 131
14.3.3 PVD 131
14.4 WAFER SURFACE CONDITIONING EQUIPMENT 131
14.4.1 ETCHING EQUIPMENT 135
14.4.1.1 Ability to achieve precise dimensional control, high aspect ratios, and minimal defect generation to boost segmental growth 135
14.4.2 CMP EQUIPMENT 138
14.4.2.1 Use to enable accurate photolithography alignment, reliable interconnect formation, and optimal device performance to drive market 138
14.5 WAFER CLEANING EQUIPMENT 141
14.5.1 FOCUS ON ENSURING DEFECT-FREE DEVICE FABRICATION TO ACCELERATE SEGMENTAL GROWTH 141
14.6 METROLOGY & INSPECTION EQUIPMENT 143
14.6.1 ABILITY TO HELP MEET DESIGN AND RELIABILITY SPECIFICATIONS TO BOLSTER SEGMENTAL GROWTH 143
14.6.2 WAFER/SUBSTRATE INSPECTION 146
14.6.3 EPITAXIAL LAYER METROLOGY 146
14.6.4 IN-LINE PROCESS METROLOGY 146
14.6.5 ELECTRICAL & WAFER TEST METROLOGY 147
14.6.6 DEFECT REVIEW & CLASSIFICATION 147
14.7 OTHER FRONT-END EQUIPMENT 147
15 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY BACK-END EQUIPMENT 150
15.1 INTRODUCTION 151
15.2 PACKAGING 152
15.2.1 EMPHASIS ON HETEROGENEOUS INTEGRATION AND CHIPLET-BASED ARCHITECTURES IN SEMICONDUCTOR DEVICES TO FUEL SEGMENTAL GROWTH 152
15.3 DICING 155
15.3.1 MOUNTING DEMAND FOR HIGH-PRECISION SEMICONDUCTOR DEVICES TO SUPPORT SEGMENTAL GROWTH 155
15.3.1.1 Blade dicing 158
15.3.1.2 Laser dicing 158
15.3.1.3 Stealth dicing 158
15.3.1.4 Scribing & breaking tools 158
15.4 BONDING 158
15.4.1 DEVELOPMENT OF ADVANCED SEMICONDUCTOR PACKAGING TECHNOLOGY TO CONTRIBUTE TO SEGMENTAL GROWTH 158
15.4.2 DIE ATTACH 161
15.4.3 WIRE BONDING 161
15.4.4 FLIP-CHIP BONDING 161
15.4.5 HYBRID BONDING 162
15.5 WAFER TESTING/IC TESTING 162
15.5.1 ABILITY TO ENSURE FUNCTIONALITY, RELIABILITY, AND PERFORMANCE OF SEMICONDUCTOR DEVICES TO FOSTER SEGMENTAL GROWTH 162
16 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY END USER 165
16.1 INTRODUCTION 166
16.2 FOUNDRIES 167
16.2.1 CAPACITY EXPANSION AND INVESTMENT IN SMALL PROCESS NODES TO BOLSTER SEGMENTAL GROWTH 167
16.3 IDMS 168
16.3.1 ADOPTION OF ADVANCED PACKAGING TECHNIQUES TO CONTRIBUTE TO SEGMENTAL GROWTH 168
16.4 OSAT COMPANIES 168
16.4.1 FOCUS ON ADVANCED ASSEMBLY, BONDING, AND INSPECTION OF SEMICONDUCTOR DEVICES TO FOSTER SEGMENTAL GROWTH 168
16.5 OTHER END USERS 169
17 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION 170
17.1 INTRODUCTION 171
17.2 AMERICAS 172
17.2.1 US 175
17.2.1.1 Surge in fab construction to accelerate market growth 175
17.2.2 REST OF AMERICAS 176
17.3 ASIA PACIFIC 177
17.3.1 CHINA 180
17.3.1.1 Government initiatives to strengthen semiconductor equipment supply chain to boost market growth 180
17.3.2 JAPAN 181
17.3.2.1 High expertise in precision engineering and materials science to augment market growth 181
17.3.3 SOUTH KOREA 182
17.3.3.1 Escalating memory chip production to contribute to market growth 182
17.3.4 TAIWAN 183
17.3.4.1 Increasing investment in cleanroom equipment to foster market growth 183
17.3.5 INDIA 184
17.3.5.1 Evolving semiconductor supply-chain ecosystem to accelerate market growth 184
17.3.6 REST OF ASIA PACIFIC 185
17.4 EMEA 186
17.4.1 EUROPE 189
17.4.1.1 Increasing investment in semiconductor facility construction to fuel market growth 189
17.4.2 MIDDLE EAST & AFRICA 190
17.4.2.1 Strong focus on localizing advanced manufacturing capabilities to bolster market growth 190
18 COMPETITIVE LANDSCAPE 192
18.1 OVERVIEW 192
18.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2024–2025 192
18.3 REVENUE ANALYSIS, 2020–2024 194
18.4 MARKET SHARE ANALYSIS, 2024 195
18.5 COMPANY VALUATION AND FINANCIAL METRICS 197
18.6 PRODUCT COMPARISON 198
18.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024 199
18.7.1 STARS 199
18.7.2 EMERGING LEADERS 199
18.7.3 PERVASIVE PLAYERS 199
18.7.4 PARTICIPANTS 199
18.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024 201
18.7.5.1 Company footprint 201
18.7.5.2 Region footprint 202
18.7.5.3 Manufacturing phase footprint 203
18.7.5.4 Front-end equipment footprint 204
18.7.5.5 Back-end equipment footprint 205
18.7.5.6 End user footprint 206
18.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024 207
18.8.1 PROGRESSIVE COMPANIES 207
18.8.2 RESPONSIVE COMPANIES 207
18.8.3 DYNAMIC COMPANIES 207
18.8.4 STARTING BLOCKS 207
18.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2024 209
18.8.5.1 Detailed list of key startups/SMEs 209
18.8.5.2 Competitive benchmarking of key startups/SMEs 210
18.9 COMPETITIVE SCENARIO 211
18.9.1 PRODUCT LAUNCHES 211
18.9.2 DEALS 212
19 COMPANY PROFILES 213
19.1 INTRODUCTION 213
19.2 KEY PLAYERS 213
19.2.1 APPLIED MATERIALS, INC. 213
19.2.1.1 Business overview 213
19.2.1.2 Products/Solutions/Services offered 215
19.2.1.3 Recent developments 219
19.2.1.3.1 Product launches 219
19.2.1.3.2 Deals 219
19.2.1.3.3 Expansions 220
19.2.1.4 MnM view 220
19.2.1.4.1 Key strengths/Right to win 220
19.2.1.4.2 Strategic choices 221
19.2.1.4.3 Weaknesses/Competitive threats 221
19.2.2 ASML 222
19.2.2.1 Business overview 222
19.2.2.2 Products/Solutions/Services offered 223
19.2.2.3 Recent developments 225
19.2.2.3.1 Product launches 225
19.2.2.3.2 Deals 226
19.2.2.4 MnM view 226
19.2.2.4.1 Key strengths/Right to win 226
19.2.2.4.2 Strategic choices 226
19.2.2.4.3 Weaknesses/Competitive threats 227
19.2.3 TOKYO ELECTRON LIMITED 228
19.2.3.1 Business overview 228
19.2.3.2 Products/Solutions/Services offered 229
19.2.3.3 Recent developments 231
19.2.3.3.1 Product launches 231
19.2.3.3.2 Deals 231
19.2.3.4 MnM view 232
19.2.3.4.1 Key strengths/Right to win 232
19.2.3.4.2 Strategic choices 232
19.2.3.4.3 Weaknesses/Competitive threats 232
19.2.4 LAM RESEARCH CORPORATION 233
19.2.4.1 Business overview 233
19.2.4.2 Products/Solutions/Services offered 234
19.2.4.3 Recent developments 237
19.2.4.3.1 Product launches 237
19.2.4.3.2 Deals 238
19.2.4.3.3 Expansions 238
19.2.4.4 MnM view 238
19.2.4.4.1 Key strengths/Right to win 238
19.2.4.4.2 Strategic choices 239
19.2.4.4.3 Weaknesses/Competitive threats 239
19.2.5 KLA CORPORATION 240
19.2.5.1 Business overview 240
19.2.5.2 Products/Solutions/Services offered 241
19.2.5.3 Recent developments 243
19.2.5.3.1 Product launches 243
19.2.5.3.2 Expansions 244
19.2.5.4 MnM view 244
19.2.5.4.1 Key strengths/Right to win 244
19.2.5.4.2 Strategic choices 244
19.2.5.4.3 Weaknesses/Competitive threats 245
19.2.6 SCREEN HOLDINGS CO., LTD. 245
19.2.6.1 Business overview 245
19.2.6.2 Products/Solutions/Services offered 246
19.2.6.3 Recent developments 248
19.2.6.3.1 Product launches 248
19.2.6.3.2 Deals 248
19.2.6.4 MnM view 249
19.2.6.4.1 Key strengths/Right to win 249
19.2.6.4.2 Strategic choices 249
19.2.6.4.3 Weaknesses/Competitive threats 249
19.2.7 TERADYNE INC. 250
19.2.7.1 Business overview 250
19.2.7.2 Products/Solutions/Services offered 251
19.2.7.3 Recent developments 252
19.2.7.3.1 Product launches 252
19.2.7.3.2 Deals 253
19.2.7.4 MnM view 253
19.2.7.4.1 Key strengths/Right to win 253
19.2.7.4.2 Strategic choices 253
19.2.7.4.3 Weaknesses/Competitive threats 253
19.2.8 ZEISS GROUP 254
19.2.8.1 Business overview 254
19.2.8.2 Products/Solutions/Services offered 255
19.2.8.3 Recent developments 256
19.2.8.3.1 Product launches 256
19.2.8.3.2 Deals 257
19.2.8.4 MnM view 257
19.2.8.4.1 Key strengths/Right to win 257
19.2.8.4.2 Strategic choices 257
19.2.8.4.3 Weaknesses/Competitive threats 257
19.2.9 ADVANTEST CORPORATION 258
19.2.9.1 Business overview 258
19.2.9.2 Products/Solutions/Services offered 259
19.2.9.3 Recent developments 260
19.2.9.3.1 Deals 260
19.2.9.4 MnM view 261
19.2.9.4.1 Key strengths/Right to win 261
19.2.9.4.2 Strategic choices 261
19.2.9.4.3 Weaknesses/Competitive threats 261
19.2.10 HITACHI HIGH-TECH CORPORATION 262
19.2.10.1 Business overview 262
19.2.10.2 Products/Solutions/Services offered 263
19.2.10.3 Recent developments 263
19.2.10.3.1 Product launches 263
19.2.10.3.2 Deals 264
19.2.10.4 MnM view 264
19.2.10.4.1 Key strengths/Right to win 264
19.2.10.4.2 Strategic choices 264
19.2.10.4.3 Weaknesses/Competitive threats 264
19.2.11 PLASMA-THERM 265
19.2.11.1 Business overview 265
19.2.11.2 Products/Solutions/Services offered 265
19.2.11.3 MnM view 266
19.2.11.3.1 Key strengths/Right to win 266
19.2.11.3.2 Strategic choices 266
19.2.11.3.3 Weaknesses/Competitive threats 266
19.3 OTHER PLAYERS 267
19.3.1 ASM INTERNATIONAL 267
19.3.2 EV GROUP (EVG) 268
19.3.3 ONTO INNOVATION 269
19.3.4 NORDSON CORPORATION 271
19.3.5 ADT – ADVANCED DICING TECHNOLOGIES 272
19.3.6 BENEQ 273
19.3.7 CVD EQUIPMENT CORPORATION 274
19.3.8 EUGENE TECHNOLOGY CO. LTD. 275
19.3.9 NIKON CORPORATION 276
19.3.10 SEMICONDUCTOR EQUIPMENT CORP. 277
19.3.11 SENTECH INSTRUMENTS GMBH 278
19.3.12 CANON INC. 279
19.3.13 KOKUSAI ELECTRIC CORPORATION 280
19.3.14 SEMES 282
19.3.15 FORMFACTOR 283
19.4 END USERS 285
19.4.1 FOUNDRIES 285
19.4.1.1 Taiwan Semiconductor Manufacturing Company Limited 285
19.4.1.2 Samsung 286
19.4.1.3 GlobalFoundries 287
19.4.1.4 SMIC 288
19.4.1.5 United Microelectronics Corporation 289
19.4.2 IDM FIRMS 290
19.4.2.1 Intel Corporation 290
19.4.2.2 Texas Instruments Incorporated 291
19.4.2.3 Infineon Technologies AG 292
19.4.3 OSAT COMPANIES 293
19.4.3.1 ASE Technology Holding Co., Ltd. 293
19.4.3.2 Amkor Technology 294
20 RESEARCH METHODOLOGY 295
20.1 RESEARCH DATA 295
20.2 SECONDARY AND PRIMARY RESEARCH 296
20.2.1 SECONDARY DATA 297
20.2.1.1 List of key secondary sources 298
20.2.1.2 Key data from secondary sources 298
20.2.2 PRIMARY DATA 299
20.2.2.1 List of primary interview participants 299
20.2.2.2 Breakdown of primaries 299
20.2.2.3 Key data from primary sources 300
20.2.2.4 Key industry insights 300
20.3 MARKET SIZE ESTIMATION 300
20.3.1 BOTTOM-UP APPROACH 301
20.3.1.1 Approach to arrive at market size using bottom-up analysis (demand side) 301
20.3.2 TOP-DOWN APPROACH 302
20.3.2.1 Approach to arrive at market size using top-down analysis (supply side) 302
20.3.3 MARKET SIZE CALCULATION FOR BASE YEAR 303
20.4 MARKET FORECAST APPROACH 304
20.4.1 SUPPLY SIDE 304
20.4.2 DEMAND SIDE 304
20.5 MARKET BREAKDOWN AND DATA TRIANGULATION 304
20.6 RESEARCH ASSUMPTIONS 305
20.7 RESEARCH LIMITATIONS 306
20.8 RISK ANALYSIS 307
21 APPENDIX 308
21.1 INSIGHTS FROM INDUSTRY EXPERTS 308
21.2 DISCUSSION GUIDE 308
21.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 312
21.4 CUSTOMIZATION OPTIONS 314
21.5 RELATED REPORTS 314
21.6 AUTHOR DETAILS 315
LIST OF TABLES
TABLE 1 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: INCLUSIONS AND EXCLUSIONS 32
TABLE 2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: SUMMARY OF CHANGES 34
TABLE 3 UNMET NEEDS AND WHITE SPACES 51
TABLE 4 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES 52
TABLE 5 STRATEGIC MOVES BY TIER 1/2/3 PLAYERS 53
TABLE 6 IMPACT OF PORTER’S FIVE FORCES 54
TABLE 7 ROLE OF COMPANIES IN SEMICONDUCTOR MANUFACTURING EQUIPMENT ECOSYSTEM 61
TABLE 8 AVERAGE SELLING PRICE TREND OF FRONT-END LITHOGRAPHY EQUIPMENT OFFERED BY KEY PLAYERS, 2021–2024 (USD MILLION) 63
TABLE 9 AVERAGE SELLING PRICE TREND OF STANDARD LITHOGRAPHY EQUIPMENT,
BY REGION, 2021–2024 (USD MILLION) 64
TABLE 10 IMPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2020–2024 (USD MILLION) 65
TABLE 11 EXPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2020–2024 (USD MILLION) 66
TABLE 12 LIST OF KEY CONFERENCES AND EVENTS, 2025–2026 67
TABLE 13 US-ADJUSTED RECIPROCAL TARIFF RATES 71
TABLE 14 TECHNOLOGY/PRODUCT ROADMAP 75
TABLE 15 LIST OF MAJOR PATENTS, 2021−2024 78
TABLE 16 TOP USE CASES AND MARKET POTENTIAL 81
TABLE 17 BEST PRACTICES: COMPANIES IMPLEMENTING USE CASES 81
TABLE 18 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: CASE STUDIES RELATED TO AI IMPLEMENTATION 82
TABLE 19 INTERCONNECTED ECOSYSTEM AND IMPACT ON MARKET PLAYERS 82
TABLE 20 AMERICAS: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 84
TABLE 21 EMEA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 85
TABLE 22 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 85
TABLE 23 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP
THREE END USERS (%) 91
TABLE 24 KEY BUYING CRITERIA FOR THREE END USERS 92
TABLE 25 UNMET NEEDS OF END USERS IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 94
TABLE 26 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY MANUFACTURING PHASE, 2021–2024 (USD BILLION) 108
TABLE 27 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY MANUFACTURING PHASE, 2025–2032 (USD BILLION) 109
TABLE 28 FRONT-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY REGION, 2021–2024 (USD BILLION) 109
TABLE 29 FRONT-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY REGION, 2025–2032 (USD BILLION) 110
TABLE 30 FRONT-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 110
TABLE 31 FRONT-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 110
TABLE 32 FRONT-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN
ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 111
TABLE 33 FRONT-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN
ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 111
TABLE 34 FRONT-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 111
TABLE 35 FRONT-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 112
TABLE 36 BACK-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD BILLION) 113
TABLE 37 BACK-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD BILLION) 113
TABLE 38 BACK-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 113
TABLE 39 BACK-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 113
TABLE 40 BACK-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN
ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 114
TABLE 41 BACK-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN
ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 114
TABLE 42 BACK-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA,
BY REGION, 2021–2024 (USD MILLION) 115
TABLE 43 BACK-END: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA,
BY REGION, 2025–2032 (USD MILLION) 115
TABLE 44 OTHER PHASES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY REGION, 2021–2024 (USD BILLION) 116
TABLE 45 OTHER PHASES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY REGION, 2025–2032 (USD BILLION) 116
TABLE 46 OTHER PHASES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 116
TABLE 47 OTHER PHASES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 116
TABLE 48 OTHER PHASES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN
ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 117
TABLE 49 OTHER PHASES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN
ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 117
TABLE 50 OTHER PHASES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 117
TABLE 51 OTHER PHASES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 118
TABLE 52 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT, 2021–2024 (USD BILLION) 120
TABLE 53 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT, 2025–2032 (USD BILLION) 121
TABLE 54 LITHOGRAPHY EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 121
TABLE 55 LITHOGRAPHY EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 122
TABLE 56 LITHOGRAPHY EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 122
TABLE 57 LITHOGRAPHY EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 122
TABLE 58 LITHOGRAPHY EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 123
TABLE 59 LITHOGRAPHY EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 123
TABLE 60 LITHOGRAPHY EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 123
TABLE 61 LITHOGRAPHY EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 124
TABLE 62 PHOTOLITHOGRAPHY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2021–2024 (UNITS) 124
TABLE 63 PHOTOLITHOGRAPHY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2025–2032 (UNITS) 125
TABLE 64 DEPOSITION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 128
TABLE 65 DEPOSITION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 128
TABLE 66 DEPOSITION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 129
TABLE 67 DEPOSITION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 129
TABLE 68 DEPOSITION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 129
TABLE 69 DEPOSITION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 130
TABLE 70 DEPOSITION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 130
TABLE 71 DEPOSITION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 130
TABLE 72 WAFER SURFACE CONDITIONING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2021–2024 (USD MILLION) 132
TABLE 73 WAFER SURFACE CONDITIONING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2025–2032 (USD MILLION) 132
TABLE 74 WAFER SURFACE CONDITIONING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 132
TABLE 75 WAFER SURFACE CONDITIONING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 132
TABLE 76 WAFER SURFACE CONDITIONING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 133
TABLE 77 WAFER SURFACE CONDITIONING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 133
TABLE 78 WAFER SURFACE CONDITIONING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 133
TABLE 79 WAFER SURFACE CONDITIONING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 134
TABLE 80 WAFER SURFACE CONDITIONING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 134
TABLE 81 WAFER SURFACE CONDITIONING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 134
TABLE 82 ETCHING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 135
TABLE 83 ETCHING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 135
TABLE 84 ETCHING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 136
TABLE 85 ETCHING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 136
TABLE 86 ETCHING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 136
TABLE 87 ETCHING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 137
TABLE 88 ETCHING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 137
TABLE 89 ETCHING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 137
TABLE 90 CMP EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY REGION, 2021–2024 (USD MILLION) 138
TABLE 91 CMP EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY REGION, 2025–2032 (USD MILLION) 138
TABLE 92 CMP EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 139
TABLE 93 CMP EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 139
TABLE 94 CMP EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 139
TABLE 95 CMP EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 140
TABLE 96 CMP EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 140
TABLE 97 CMP EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 140
TABLE 98 WAFER CLEANING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 141
TABLE 99 WAFER CLEANING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 141
TABLE 100 WAFER CLEANING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 141
TABLE 101 WAFER CLEANING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 142
TABLE 102 WAFER CLEANING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 142
TABLE 103 WAFER CLEANING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 142
TABLE 104 WAFER CLEANING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 143
TABLE 105 WAFER CLEANING EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 143
TABLE 106 METROLOGY & INSPECTION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 144
TABLE 107 METROLOGY & INSPECTION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 144
TABLE 108 METROLOGY & INSPECTION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 144
TABLE 109 METROLOGY & INSPECTION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 144
TABLE 110 METROLOGY & INSPECTION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 145
TABLE 111 METROLOGY & INSPECTION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 145
TABLE 112 METROLOGY & INSPECTION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 145
TABLE 113 METROLOGY & INSPECTION EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 146
TABLE 114 OTHER FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 147
TABLE 115 OTHER FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 148
TABLE 116 OTHER FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 148
TABLE 117 OTHER FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 148
TABLE 118 OTHER FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 148
TABLE 119 OTHER FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 149
TABLE 120 OTHER FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 149
TABLE 121 OTHER FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 149
TABLE 122 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2021–2024 (USD BILLION) 151
TABLE 123 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2025–2032 (USD BILLION) 152
TABLE 124 PACKAGING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY REGION, 2021–2024 (USD MILLION) 152
TABLE 125 PACKAGING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY REGION, 2025–2032 (USD MILLION) 153
TABLE 126 PACKAGING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 153
TABLE 127 PACKAGING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 153
TABLE 128 PACKAGING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN
ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 154
TABLE 129 PACKAGING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN
ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 154
TABLE 130 PACKAGING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 154
TABLE 131 PACKAGING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 155
TABLE 132 DICING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 155
TABLE 133 DICING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 156
TABLE 134 DICING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 156
TABLE 135 DICING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 156
TABLE 136 DICING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 156
TABLE 137 DICING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 157
TABLE 138 DICING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA,
BY REGION, 2021–2024 (USD MILLION) 157
TABLE 139 DICING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA,
BY REGION, 2025–2032 (USD MILLION) 157
TABLE 140 BONDING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 159
TABLE 141 BONDING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 159
TABLE 142 BONDING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 159
TABLE 143 BONDING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 159
TABLE 144 BONDING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 160
TABLE 145 BONDING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 160
TABLE 146 BONDING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA,
BY REGION, 2021–2024 (USD MILLION) 160
TABLE 147 BONDING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA,
BY REGION, 2025–2032 (USD MILLION) 161
TABLE 148 WAFER TESTING/IC TESTING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 162
TABLE 149 WAFER TESTING/IC TESTING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 163
TABLE 150 WAFER TESTING/IC TESTING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2021–2024 (USD MILLION) 163
TABLE 151 WAFER TESTING/IC TESTING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2025–2032 (USD MILLION) 163
TABLE 152 WAFER TESTING/IC TESTING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2021–2024 (USD MILLION) 163
TABLE 153 WAFER TESTING/IC TESTING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN ASIA PACIFIC, BY COUNTRY, 2025–2032 (USD MILLION) 164
TABLE 154 WAFER TESTING/IC TESTING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2021–2024 (USD MILLION) 164
TABLE 155 WAFER TESTING/IC TESTING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EMEA, BY REGION, 2025–2032 (USD MILLION) 164
TABLE 156 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY END USER,
2021–2024 (USD BILLION) 166
TABLE 157 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY END USER,
2025–2032 (USD BILLION) 167
TABLE 158 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION,
2021–2024 (USD BILLION) 171
TABLE 159 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION,
2025–2032 (USD BILLION) 172
TABLE 160 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2021–2024 (USD BILLION) 173
TABLE 161 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2025–2032 (USD BILLION) 174
TABLE 162 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY COUNTRY, 2021–2024 (USD MILLION) 174
TABLE 163 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY COUNTRY, 2025–2032 (USD MILLION) 174
TABLE 164 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY END USER, 2021–2024 (USD BILLION) 174
TABLE 165 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY END USER, 2025–2032 (USD BILLION) 175
TABLE 166 US: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2021–2024 (USD MILLION) 176
TABLE 167 US: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2025–2032 (USD MILLION) 176
TABLE 168 REST OF AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2021–2024 (USD MILLION) 177
TABLE 169 REST OF AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2025–2032 (USD MILLION) 177
TABLE 170 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2021–2024 (USD BILLION) 178
TABLE 171 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2025–2032 (USD BILLION) 179
TABLE 172 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY COUNTRY, 2021–2024 (USD MILLION) 179
TABLE 173 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY COUNTRY, 2025–2032 (USD MILLION) 179
TABLE 174 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY END USER, 2021–2024 (USD BILLION) 180
TABLE 175 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY END USER, 2025–2032 (USD BILLION) 180
TABLE 176 CHINA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2021–2024 (USD MILLION) 181
TABLE 177 CHINA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2025–2032 (USD MILLION) 181
TABLE 178 JAPAN: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2021–2024 (USD MILLION) 182
TABLE 179 JAPAN: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2025–2032 (USD MILLION) 182
TABLE 180 SOUTH KOREA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2021–2024 (USD MILLION) 183
TABLE 181 SOUTH KOREA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2025–2032 (USD MILLION) 183
TABLE 182 TAIWAN: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2021–2024 (USD MILLION) 183
TABLE 183 TAIWAN: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2025–2032 (USD MILLION) 184
TABLE 184 INDIA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2021–2024 (USD MILLION) 184
TABLE 185 INDIA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2025–2032 (USD MILLION) 185
TABLE 186 REST OF ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY MANUFACTURING PHASE, 2021–2024 (USD MILLION) 185
TABLE 187 REST OF ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY MANUFACTURING PHASE, 2025–2032 (USD MILLION) 186
TABLE 188 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY MANUFACTURING PHASE, 2021–2024 (USD BILLION) 187
TABLE 189 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY MANUFACTURING PHASE, 2025–2032 (USD BILLION) 187
TABLE 190 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2021–2024 (USD MILLION) 188
TABLE 191 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2025–2032 (USD MILLION) 188
TABLE 192 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY END USER, 2021–2024 (USD BILLION) 188
TABLE 193 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY END USER, 2025–2032 (USD BILLION) 188
TABLE 194 EUROPE: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY MANUFACTURING PHASE, 2021–2024 (USD MILLION) 189
TABLE 195 EUROPE: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY MANUFACTURING PHASE, 2025–2032 (USD MILLION) 189
TABLE 196 MIDDLE EAST & AFRICA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY MANUFACTURING PHASE, 2021–2024 (USD MILLION) 190
TABLE 197 MIDDLE EAST & AFRICA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY MANUFACTURING PHASE, 2025–2032 (USD MILLION) 191
TABLE 198 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, OCTOBER 2024–NOVEMBER 2025 192
TABLE 199 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET:
DEGREE OF COMPETITION, 2024 195
TABLE 200 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: REGION FOOTPRINT 202
TABLE 201 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET:
MANUFACTURING PHASE FOOTPRINT 203
TABLE 202 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET:
FRONT-END EQUIPMENT FOOTPRINT 204
TABLE 203 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: BACK-END EQUIPMENT FOOTPRINT 205
TABLE 204 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: END USER FOOTPRINT 206
TABLE 205 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DETAILED LIST OF KEY STARTUPS/SMES, 2024 209
TABLE 206 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES, 2024 210
TABLE 207 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: PRODUCT LAUNCHES, OCTOBER 2024–NOVEMBER 2025 211
TABLE 208 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DEALS, OCTOBER 2024–NOVEMBER 2025 212
TABLE 209 APPLIED MATERIALS, INC.: COMPANY OVERVIEW 214
TABLE 210 APPLIED MATERIALS, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 215
TABLE 211 APPLIED MATERIALS, INC.: PRODUCT LAUNCHES 219
TABLE 212 APPLIED MATERIALS, INC.: DEALS 219
TABLE 213 APPLIED MATERIALS, INC.: EXPANSIONS 220
TABLE 214 ASML: COMPANY OVERVIEW 222
TABLE 215 ASML: PRODUCTS/SOLUTIONS/SERVICES OFFERED 223
TABLE 216 ASML: PRODUCT LAUNCHES 225
TABLE 217 ASML: DEALS 226
TABLE 218 TOKYO ELECTRON LIMITED: COMPANY OVERVIEW 228
TABLE 219 TOKYO ELECTRON LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 229
TABLE 220 TOKYO ELECTRON LIMITED: PRODUCT LAUNCHES 231
TABLE 221 TOKYO ELECTRON LIMITED: DEALS 231
TABLE 222 LAM RESEARCH CORPORATION: COMPANY OVERVIEW 233
TABLE 223 LAM RESEARCH CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 234
TABLE 224 LAM RESEARCH CORPORATION: PRODUCT LAUNCHES 237
TABLE 225 LAM RESEARCH CORPORATION: DEALS 238
TABLE 226 LAM RESEARCH CORPORATION: EXPANSIONS 238
TABLE 227 KLA CORPORATION: COMPANY OVERVIEW 240
TABLE 228 KLA CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 241
TABLE 229 KLA CORPORATION: PRODUCT LAUNCHES 243
TABLE 230 KLA CORPORATION: EXPANSIONS 244
TABLE 231 SCREEN HOLDINGS CO., LTD.: COMPANY OVERVIEW 245
TABLE 232 SCREEN HOLDINGS CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 246
TABLE 233 SCREEN HOLDINGS CO., LTD.: PRODUCT LAUNCHES 248
TABLE 234 SCREEN HOLDINGS CO., LTD.: DEALS 248
TABLE 235 TERADYNE INC.: COMPANY OVERVIEW 250
TABLE 236 TERADYNE INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 251
TABLE 237 TERADYNE INC.: PRODUCT LAUNCHES 252
TABLE 238 TERADYNE INC.: DEALS 253
TABLE 239 ZEISS GROUP: COMPANY OVERVIEW 254
TABLE 240 ZEISS GROUP: PRODUCTS/SOLUTIONS/SERVICES OFFERED 255
TABLE 241 ZEISS GROUP: PRODUCT LAUNCHES 256
TABLE 242 ZEISS GROUP: DEALS 257
TABLE 243 ADVANTEST CORPORATION: COMPANY OVERVIEW 258
TABLE 244 ADVANTEST CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 259
TABLE 245 ADVANTEST CORPORATION: DEALS 260
TABLE 246 HITACHI HIGH-TECH CORPORATION: COMPANY OVERVIEW 262
TABLE 247 HITACHI HIGH-TECH CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 263
TABLE 248 HITACHI HIGH-TECH CORPORATION: PRODUCT LAUNCHES 263
TABLE 249 HITACHI HIGH-TECH CORPORATION: DEALS 264
TABLE 250 PLASMA-THERM: COMPANY OVERVIEW 265
TABLE 251 PLASMA-THERM: PRODUCTS/SOLUTIONS/SERVICES OFFERED 265
TABLE 252 ASM INTERNATIONAL: COMPANY OVERVIEW 267
TABLE 253 EV GROUP (EVG): COMPANY OVERVIEW 268
TABLE 254 ONTO INNOVATION: COMPANY OVERVIEW 269
TABLE 255 NORDSON CORPORATION: COMPANY OVERVIEW 271
TABLE 256 ADT – ADVANCED DICING TECHNOLOGIES: COMPANY OVERVIEW 272
TABLE 257 BENEQ: COMPANY OVERVIEW 273
TABLE 258 CVD EQUIPMENT CORPORATION: COMPANY OVERVIEW 274
TABLE 259 EUGENE TECHNOLOGY CO. LTD.: COMPANY OVERVIEW 275
TABLE 260 NIKON CORPORATION: COMPANY OVERVIEW 276
TABLE 261 SEMICONDUCTOR EQUIPMENT CORP.: COMPANY OVERVIEW 277
TABLE 262 SENTECH INSTRUMENTS GMBH: COMPANY OVERVIEW 278
TABLE 263 CANON INC.: COMPANY OVERVIEW 279
TABLE 264 KOKUSAI ELECTRIC CORPORATION: COMPANY OVERVIEW 280
TABLE 265 SEMES: COMPANY OVERVIEW 282
TABLE 266 FORMFACTOR: COMPANY OVERVIEW 283
TABLE 267 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED:
COMPANY OVERVIEW 285
TABLE 268 SAMSUNG: COMPANY OVERVIEW 286
TABLE 269 GLOBALFOUNDRIES: COMPANY OVERVIEW 287
TABLE 270 SMIC: COMPANY OVERVIEW 288
TABLE 271 UNITED MICROELECTRONICS CORPORATION: COMPANY OVERVIEW 289
TABLE 272 INTEL CORPORATION: COMPANY OVERVIEW 290
TABLE 273 TEXAS INSTRUMENTS INCORPORATED: COMPANY OVERVIEW 291
TABLE 274 INFINEON TECHNOLOGIES AG: COMPANY OVERVIEW 292
TABLE 275 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW 293
TABLE 276 AMKOR TECHNOLOGY: COMPANY OVERVIEW 294
TABLE 277 MAJOR SECONDARY SOURCES 298
TABLE 278 PRIMARY INTERVIEW PARTICIPANTS 299
TABLE 279 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: RESEARCH ASSUMPTIONS 305
TABLE 280 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: RISK ANALYSIS 307
LIST OF FIGURES
FIGURE 1 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SEGMENTATION AND REGIONAL SCOPE 31
FIGURE 2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DURATION COVERED 32
FIGURE 3 MARKET HIGHLIGHTS AND KEY INSIGHTS 35
FIGURE 4 GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SIZE,
2021–2032 36
FIGURE 5 MAJOR STRATEGIES ADOPTED BY KEY PLAYERS IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, 2024–2025 36
FIGURE 6 DISRUPTIVE TRENDS IMPACTING GROWTH OF SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 37
FIGURE 7 HIGH-GROWTH SEGMENTS IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, 2024 38
FIGURE 8 INDIA TO EXHIBIT HIGHEST CAGR IN ASIA PACIFIC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET FROM 2025 TO 2032 39
FIGURE 9 MOUNTING DEMAND FOR ADVANCED, HIGHLY EFFICIENT CHIPS TO DRIVE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 40
FIGURE 10 FOUNDRIES SEGMENT TO HOLD LARGEST MARKET SHARE IN 2025 41
FIGURE 11 LITHOGRAPHY SEGMENT TO DOMINATE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET DURING FORECAST PERIOD 41
FIGURE 12 ASIA PACIFIC TO CAPTURE LARGEST SHARE OF SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN 2032 42
FIGURE 13 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES 43
FIGURE 14 INVESTMENT IN SEMICONDUCTOR FAB, 2024 AND 2027 45
FIGURE 15 IMPACT ANALYSIS: DRIVERS 46
FIGURE 16 IMPACT ANALYSIS: RESTRAINTS 48
FIGURE 17 IMPACT ANALYSIS: OPPORTUNITIES 49
FIGURE 18 IMPACT ANALYSIS: CHALLENGES 51
FIGURE 19 PORTER’S FIVE FORCES ANALYSIS 55
FIGURE 20 SEMICONDUCTOR MANUFACTURING EQUIPMENT VALUE CHAIN ANALYSIS 59
FIGURE 21 SEMICONDUCTOR MANUFACTURING EQUIPMENT ECOSYSTEM 61
FIGURE 22 AVERAGE SELLING PRICE TREND OF FRONT-END LITHOGRAPHY EQUIPMENT PROVIDED BY KEY PLAYERS, BY TYPE, 2021–2024 63
FIGURE 23 AVERAGE SELLING PRICE TREND OF STANDARD LITHOGRAPHY EQUIPMENT IN THREE REGIONS, 2021–2024 64
FIGURE 24 IMPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS FOR TOP FIVE COUNTRIES, 2020–2024 65
FIGURE 25 EXPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS FOR TOP
FIVE COUNTRIES, 2020–2024 66
FIGURE 26 TRENDS/DISRUPTIONS INFLUENCING CUSTOMER BUSINESS 68
FIGURE 27 INVESTMENT AND FUNDING SCENARIO, 2019–2024 69
FIGURE 28 PATENTS APPLIED AND GRANTED, 2015–2024 77
FIGURE 29 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE END USERS 91
FIGURE 30 KEY BUYING CRITERIA FOR TOP THREE END USERS 92
FIGURE 31 ADOPTION BARRIERS AND INTERNAL CHALLENGES 93
FIGURE 32 FRONT-END SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE IN 2032 108
FIGURE 33 LITHOGRAPHY SEGMENT TO CAPTURE LARGEST MARKET SHARE IN
2025 AND 2032 120
FIGURE 34 WAFER TESTING/IC TESTING SEGMENT TO DOMINATE MARKET DURING FORECAST PERIOD 151
FIGURE 35 FOUNDRIES SEGMENT TO CAPTURE LARGEST MARKET SHARE IN 2025 AND 2032 166
FIGURE 36 ASIA PACIFIC TO CAPTURE LARGEST MARKET SHARE IN 2025 AND 2032 171
FIGURE 37 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SNAPSHOT 173
FIGURE 38 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SNAPSHOT 178
FIGURE 39 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SNAPSHOT 187
FIGURE 40 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: REVENUE ANALYSIS OF TOP FIVE PLAYERS, 2020–2024 194
FIGURE 41 MARKET SHARE ANALYSIS OF COMPANIES OFFERING SEMICONDUCTOR MANUFACTURING EQUIPMENT, 2024 195
FIGURE 42 COMPANY VALUATION 197
FIGURE 43 FINANCIAL METRICS (EV/EBITDA) 198
FIGURE 44 PRODUCT COMPARISON 198
FIGURE 45 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPANY EVALUATION MATRIX (KEY PLAYERS), 2024 200
FIGURE 46 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPANY FOOTPRINT 201
FIGURE 47 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPANY EVALUATION MATRIX (STARTUPS/SMES), 2024 208
FIGURE 48 APPLIED MATERIALS, INC.: COMPANY SNAPSHOT 214
FIGURE 49 ASML: COMPANY SNAPSHOT 223
FIGURE 50 TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT 229
FIGURE 51 LAM RESEARCH CORPORATION: COMPANY SNAPSHOT 234
FIGURE 52 KLA CORPORATION: COMPANY SNAPSHOT 241
FIGURE 53 SCREEN HOLDINGS CO., LTD.: COMPANY SNAPSHOT 246
FIGURE 54 TERADYNE INC.: COMPANY SNAPSHOT 251
FIGURE 55 ZEISS GROUP: COMPANY SNAPSHOT 255
FIGURE 56 ADVANTEST CORPORATION: COMPANY SNAPSHOT 259
FIGURE 57 HITACHI HIGH-TECH CORPORATION: COMPANY SNAPSHOT 262
FIGURE 58 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: RESEARCH DESIGN 295
FIGURE 59 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: RESEARCH APPROACH 297
FIGURE 60 DATA CAPTURED FROM SECONDARY SOURCES 298
FIGURE 61 BREAKDOWN OF PRIMARY INTERVIEWS, BY COMPANY TYPE, DESIGNATION, AND REGION 299
FIGURE 62 DATA CAPTURED FROM PRIMARY SOURCES 300
FIGURE 63 CORE FINDINGS FROM INDUSTRY EXPERTS 300
FIGURE 64 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: RESEARCH FLOW 301
FIGURE 65 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: BOTTOM-UP APPROACH 302
FIGURE 66 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: TOP-DOWN APPROACH 303
FIGURE 67 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SIZE ESTIMATION METHODOLOGY (SUPPLY SIDE) 303
FIGURE 68 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DATA TRIANGULATION 305
FIGURE 69 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: INSIGHTS FROM INDUSTRY EXPERTS 308
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