MEMS Packaging Substrates Market - Global Forecast To 2030
商品番号 : SMB-90155
| 出版社 | MarketsandMarkets |
| 出版年月 | 2025年10月 |
| ページ数 | 273 |
| 図表数 | 311 |
| 価格タイプ | シングルユーザライセンス |
| 価格 | USD 4,950 |
| 種別 | 英文調査報告書 |
MEMSパッケージ基板市場 – 基板タイプ（ガラス、セラミック、有機、シリコン）、用途（センサー、アクチュエーター）、垂直分野（民生用電子機器、自動車、産業、ヘルスケア、防衛、航空宇宙）および地域別 – 2030年までの世界予測
MEMSパッケージ基板市場は、2025年に24億米ドルに達すると予測されており、2030年には32億3000万米ドルに達し、年平均成長率（CAGR）6.1%で成長すると見込まれています。市場の成長は、IoTおよび民生用電子機器におけるMEMSセンサーの採用増加、小型化の進展、高密度実装、そして自動車、医療、産業分野からの需要増加によって牽引されています。ウェーハレベルパッケージの進歩と、シリコン、ガラス、セラミックス材料の革新は、市場の成長と信頼性をさらに高めています。
本調査レポートは、MEMSパッケージ基板市場を基板の種類、用途、垂直市場、地域別に分類しています。MEMSパッケージ基板市場に関連する主要な推進要因、制約要因、課題、機会を概説し、2030年までの予測を提供しています。さらに、本レポートには、MEMSパッケージ基板市場エコシステムに属するすべての企業のリーダーシップマッピングと分析が含まれています。
本レポートは、MEMSパッケージ基板市場全体とそのサブセグメントの収益に関する詳細な推定値を提供することで、市場リーダー企業と新規参入企業を支援します。ステークホルダーが競争環境を理解し、事業のポジショニングを改善し、効果的な市場開拓戦略を策定するための洞察を得るのに役立ちます。さらに、本レポートは、ステークホルダーが市場の現状を把握し、主要な推進要因、制約要因、課題、そして機会に関する情報を提供するのに役立ちます。
このレポートでは、以下の点について洞察を提供しています。
- MEMSパッケージ基板市場における主要な推進要因（IoTおよび民生機器におけるMEMSセンサーの採用増加）、制約要因（先端材料およびプロセスの高コスト）、機会（医療・ヘルスケア機器の拡大）、課題（小型ノードにおける熱・電気管理）の分析
- 製品開発／イノベーション：MEMSパッケージ基板市場における今後の技術、研究開発活動、新製品・サービス投入に関する詳細な洞察
- 市場開発：収益性の高い市場に関する包括的な情報 – 本レポートでは、MEMSパッケージ基板市場を様々な地域にわたって分析しています。
- 市場の多様化：MEMSパッケージ基板市場における新製品・サービス、未開拓地域、最近の動向、投資に関する包括的な情報
- 競合評価：MEMSパッケージ基板市場における京セラ株式会社（日本）、AGC株式会社（日本）、信越化学工業株式会社（日本）、ショット（ドイツ）、Okmetic（フィンランド）などの主要企業の市場シェア、成長戦略、サービス提供に関する詳細な評価
Report Description
The MEMS packaging substrate market is projected to reach USD 2.40 billion in 2025 and is expected to grow to USD 3.23 billion by 2030, at a CAGR of 6.1%. The market growth is driven by increasing adoption of MEMS sensors in IoT and consumer electronics, along with rising miniaturization, high-density integration, and growing demand from automotive, medical, and industrial sectors. Advances in wafer-level packaging and innovations in silicon, glass, and ceramics materials further boost market growth and reliability.
“The telecommunication vertical will grow at a high CAGR in the forecast period.”
The telecommunication sector is expected to grow rapidly in the MEMS packaging substrates market, fueled by the quick expansion of 5G networks, edge computing, and IoT connectivity. Building high-speed communication infrastructure requires compact, high-performance MEMS components—such as RF switches, resonators, filters, and timing devices—to enable faster data transfer, lower latency, and better signal quality. MEMS packaging substrates are crucial in providing electrical insulation, thermal management, and signal integrity, which are vital for reliable operation in tough environments. As network architectures shift toward smaller, decentralized base stations and advanced antenna modules, the need for miniaturized, high-frequency MEMS parts increases significantly. Substrates made from silicon, glass, and ceramics offer the necessary dielectric strength, low signal loss, and thermal stability needed for high-frequency use. Moreover, the rise of smart devices, autonomous systems, and IoT endpoints boosts demand for efficient communication sensors and RF modules. With ongoing investments in 5G, satellite communications, and next-generation wireless tech, the telecommunication industry will continue to be a major growth driver for MEMS packaging substrate producers worldwide.
“Asia Pacific is projected to witness the highest CAGR in the MEMS packaging substrate market during the forecast period.”
The Asia-Pacific region is expected to see the highest CAGR growth in the MEMS packaging substrates market during the forecast period. Government initiatives and rapid technological advancements are key to maintaining the region’s leadership in this market. Programs like China’s “Made in China 2025,” Japan’s “Society 5.0,” and South Korea’s “K-Semiconductor Belt” actively promote innovation in semiconductor materials, advanced packaging, and MEMS device manufacturing. These policies support public–private partnerships, R&D funding, and expansion of substrate fabrication and wafer-level packaging technologies. Additionally, universities and research institutions in the region are advancing silicon, glass, and ceramic substrate engineering to enable next-generation MEMS applications. The focus on localized production, especially in China and India, reduces reliance on Western imports and strengthens regional resilience in the semiconductor supply chain. Coupled with ongoing investments in smart manufacturing, AI-driven inspection systems, and 3D packaging, Asia-Pacific’s innovation ecosystem remains competitive. As global demand for MEMS sensors and actuators grows, these proactive policies and technological strengths will position Asia-Pacific as the long-term leader in MEMS packaging substrate production.
Extensive primary interviews were conducted with key industry experts in the MEMS packaging substrates market to determine and verify the market size for various segments and subsegments gathered through secondary research. The breakdown of primary participants for the report is provided below: The study includes insights from a range of industry experts, from component suppliers to Tier 1 companies and OEMs. The breakdown of the primaries is as follows:
- By Company Type: Tier 1–40%, Tier 2–35%, and Tier 3–35%
- By Designation: Managers–45%, Directors–35%, and Others–20%
- By Region: North America–40%, Europe–35%, Asia Pacific–20%, and RoW–5%
The report highlights key players in the MEMS packaging substrates market along with their respective market rankings. Prominent companies featured include CoorsTek Inc. (US), CeramTec GmbH (Germany), KYOCERA Corporation (Japan), AGC Inc. (Japan), PLANOPTIK AG (Germany), Shin-Etsu Chemical Co., Ltd. (Japan), WaferPro (US), SCHOTT (Germany), Okmetic (Finland), HongRuiXing (Hubei) Electronics Co., Ltd. (China), among others.
Besides, NIKKO COMPANY (Japan), KOA Corporation (Japan), SHINKO ELECTRIC INDUSTRIES CO., LTD. (Japan), ASE (Taiwan), NTK CERAMIC CO., LTD. (Japan), Soitec (France), IceMOS Technology Ltd. (US), TECNISCO, LTD. (Japan), NIPPON CARBIDE INDUSTRIES CO., INC (Japan), RENA Technologies GmbH (Germany), Silicon Valley Microelectronics, Inc. (US), Valley Design Corp. (US), Heraeus Electronics (Germany), OHARA INC. (Japan), Rogers Corporation (US), among others, are some of the few companies in the MEMS packaging substrates market.
Research Coverage:
This research report categorizes the MEMS packaging substrates market by substrate type, application, vertical, and region. It outlines the main drivers, restraints, challenges, and opportunities related to the MEMS packaging substrates market and provides forecasts until 2030. Additionally, the report includes leadership mapping and analysis of all the companies within the MEMS packaging substrates market ecosystem.
Key Benefits of Buying the Report
The report will assist market leaders and new entrants by providing close estimates of revenue figures for the overall MEMS packaging substrates market and its subsegments. It will help stakeholders understand the competitive landscape and gain insights to better position their businesses and develop effective go-to-market strategies. Additionally, the report helps stakeholders stay informed about the market’s current state and offers information on key drivers, restraints, challenges, and opportunities.
The report provides insights on the following pointers:
- Analysis of key drivers (rising MEMS sensor adoption in IoT & consumer devices), restraints (high cost of advanced materials and processes), opportunities (medical & healthcare devices expansion), and challenges (thermal & electrical management at small nodes) of the MEMS packaging substrates market
- Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product & service launches in the MEMS packaging substrates market
- Market Development: Comprehensive information about lucrative markets – the report analyzes the MEMS packaging substrates market across varied regions.
- Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the MEMS packaging substrates market
- Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players, such as KYOCERA Corporation (Japan), AGC Inc. (Japan), Shin-Etsu Chemical Co., Ltd. (Japan), SCHOTT (Germany), and Okmetic (Finland) in the MEMS packaging substrates market
Table of Contents
1 INTRODUCTION 27
1.1 STUDY OBJECTIVES 27
1.2 MARKET DEFINITION 27
1.3 STUDY SCOPE 28
1.3.1 MARKETS COVERED AND REGIONAL SCOPE 28
1.3.2 INCLUSIONS AND EXCLUSIONS 29
1.3.3 YEAR CONSIDERED 29
1.3.4 CURRENCY CONSIDERED 30
1.3.5 UNIT CONSIDERED 30
1.4 LIMITATIONS 30
1.5 STAKEHOLDERS 30
2 EXECUTIVE SUMMARY 31
2.1 KEY INSIGHTS AND MARKET HIGHLIGHTS 31
2.2 KEY MARKET PARTICIPANTS: MAPPING OF STRATEGIC DEVELOPMENTS 32
2.3 DISRUPTIONS SHAPING MEMS PACKAGING SUBSTRATES MARKET 33
2.4 HIGH-GROWTH SEGMENTS 34
2.5 SNAPSHOT: GLOBAL MARKET SIZE, GROWTH RATE, AND FORECAST 35
3 PREMIUM INSIGHTS 36
3.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN MEMS PACKAGING
SUBSTRATES MARKET 36
3.2 MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE 36
3.3 MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION 37
3.4 MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL 37
3.5 MEMS PACKAGING SUBSTRATES MARKET IN ASIA PACIFIC,
BY VERTICAL AND COUNTRY 38
3.6 MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY 39
4 MARKET OVERVIEW 40
4.1 INTRODUCTION 40
4.2 MARKET DYNAMICS 40
4.2.1 DRIVERS 41
4.2.1.1 Rising adoption of MEMS sensors in IoT and consumer devices 41
4.2.1.2 Growing emphasis on miniaturization and high-density substrates 41
4.2.1.3 Rapid advances in automotive technologies 42
4.2.1.4 Significant innovations in materials and manufacturing processes 42
4.2.2 RESTRAINTS 43
4.2.2.1 High costs of specialized materials and manufacturing processes 43
4.2.2.2 Issues in integrating MEMS devices into substrates 44
4.2.2.3 Lack of uniform standards 44
4.2.3 OPPORTUNITIES 45
4.2.3.1 Increasing use of MEMS devices in healthcare sector 45
4.2.3.2 Global rollout of 5G networks and IoT adoption 45
4.2.3.3 Shift toward advanced packaging technologies 46
4.2.4 CHALLENGES 47
4.2.4.1 High dependence on optimized global supply chains 47
4.2.4.2 Thermal and electrical management challenges in MEMS devices 47
4.3 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES 48
4.4 STRATEGIC MOVES BY TIER 1/2/3 PLAYERS 49
5 INDUSTRY TRENDS 51
5.1 PORTER’S FIVE FORCES ANALYSIS 51
5.1.1 BARGAINING POWER OF SUPPLIERS 52
5.1.2 BARGAINING POWER OF BUYERS 52
5.1.3 THREAT OF NEW ENTRANTS 52
5.1.4 THREAT OF SUBSTITUTES 52
5.1.5 INTENSITY OF COMPETITIVE RIVALRY 52
5.2 MACROECONOMIC OUTLOOK 53
5.2.1 INTRODUCTION 53
5.2.2 GDP TRENDS AND FORECAST 53
5.2.3 TRENDS IN GLOBAL CONSUMER ELECTRONICS INDUSTRY 56
5.2.4 TRENDS IN GLOBAL AUTOMOTIVE INDUSTRY 56
5.3 VALUE CHAIN ANALYSIS 56
5.4 ECOSYSTEM ANALYSIS 58
5.5 PRICING ANALYSIS 59
5.5.1 PRICING RANGE OF MEMS PACKAGING SUBSTRATES,
BY SUBSTRATE TYPE, 2024 60
5.5.2 PRICING RANGE OF MEMS PACKAGING SUBSTRATES OFFERED
BY KEY PLAYERS, BY SUBSTRATE TYPE, 2024 60
5.5.3 AVERAGE SELLING PRICE TREND OF SILICON SUBSTRATES,
BY REGION, 2021–2024 61
5.6 TRADE ANALYSIS 62
5.6.1 IMPORT SCENARIO (HS CODE 902690) 62
5.6.2 EXPORT SCENARIO (HS CODE 902690) 63
5.7 KEY CONFERENCES AND EVENTS, 2025–2027 64
5.8 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS 65
5.9 INVESTMENT AND FUNDING SCENARIO 65
5.10 CASE STUDY ANALYSIS 66
5.10.1 UNMANNED SYSTEMS TECHNOLOGY VALIDATES ACCURACY AND RELIABILITY OF MEMS SENSORS FOR INTEGRATION INTO UNMANNED SURFACE VEHICLES 66
5.10.2 ARRB SYSTEMS USES SPATIAL DUAL MEMS GNSS/INS FOR ACCURATE NAVIGATION IN GNSS-DEGRADED ENVIRONMENTS 66
5.10.3 LIMNTECH SCIENTIFIC IMPROVES NAVIGATION FOR AUTOMATED ROAD MARKING IN CHALLENGING ENVIRONMENTS USING CERTUS MEMS INS 67
5.11 IMPACT OF 2025 US TARIFF ON MEMS PACKAGING SUBSTRATES MARKET 67
5.11.1 INTRODUCTION 67
5.11.2 KEY TARIFF RATES 68
5.11.3 PRICE IMPACT ANALYSIS 68
5.11.4 IMPACT ON COUNTRIES/REGIONS 69
5.11.4.1 US 69
5.11.4.2 Europe 70
5.11.4.3 Asia Pacific 70
5.11.5 IMPACT ON VERTICALS 71
6 TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACTS, PATENTS, INNOVATIONS, AND FUTURE APPLICATIONS 73
6.1 KEY TECHNOLOGIES 73
6.1.1 WAFER-LEVEL PACKAGING (WLP) AND BONDING 73
6.1.2 THROUGH-SUBSTRATE VIAS (TSV) AND THROUGH-GLASS VIAS (TGV) 73
6.2 COMPLEMENTARY TECHNOLOGIES 73
6.2.1 ADVANCED SUBSTRATE MATERIALS 73
6.2.2 MICROFABRICATION AND SUBSTRATE PROCESSING 74
6.3 PATENT ANALYSIS 74
6.4 IMPACT OF AI/GEN AI ON MEMS PACKAGING SUBSTRATES MARKET 82
6.4.1 TOP USE CASES AND MARKET POTENTIAL 82
6.4.2 BEST PRACTICES IN MEMS PACKAGING SUBSTRATES MARKET 82
6.4.3 CASE STUDIES OF AI IMPLEMENTATION IN MEMS PACKAGING
SUBSTRATES MARKET 83
6.4.4 INTERCONNECTED ADJACENT ECOSYSTEM AND IMPACT ON
MARKET PLAYERS 83
6.4.5 CLIENTS’ READINESS TO ADOPT AI/GEN AI IN MEMS
PACKAGING SUBSTRATES MARKET 84
7 REGULATORY LANDSCAPE 85
7.1 REGIONAL REGULATIONS AND COMPLIANCE 85
7.1.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND
OTHER ORGANIZATIONS 85
7.1.2 INDUSTRY STANDARDS 89
8 CUSTOMER LANDSCAPE AND BUYER BEHAVIOR 92
8.1 DECISION-MAKING PROCESS 92
8.2 BUYER STAKEHOLDERS AND BUYING EVALUATION CRITERIA 93
8.2.1 KEY STAKEHOLDERS AND BUYING PROCESS 93
8.2.2 BUYING CRITERIA 94
8.3 ADOPTION BARRIERS AND INTERNAL CHALLENGES 95
8.4 UNMET NEEDS IN VARIOUS VERTICALS 95
9 MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE 97
9.1 INTRODUCTION 98
9.2 SILICON 99
9.2.1 STRUCTURAL, THERMAL, AND PROCESS COMPATIBILITY
TO ACCELERATE SEGMENTAL GROWTH 99
9.3 GLASS 100
9.3.1 LOW RF SIGNAL ATTENUATION AND EXCELLENT ELECTRICAL INSULATION PROPERTIES TO FUEL SEGMENTAL GROWTH 100
9.4 CERAMIC 101
9.4.1 NEED FOR THERMAL CONDUCTIVITY AND ENVIRONMENTAL ROBUSTNESS
TO AUGMENT SEGMENTAL GROWTH 101
9.5 ORGANIC 102
9.5.1 ADOPTION IN LOW-COST, HIGH-VOLUME PACKAGING TO CONTRIBUTE
TO SEGMENTAL GROWTH 102
10 MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION 104
10.1 INTRODUCTION 105
10.2 SENSORS 106
10.2.1 INERTIAL SENSORS 108
10.2.1.1 Rising deployment of automotive safety systems to drive market 108
10.2.2 PRESSURE SENSORS 109
10.2.2.1 Increasing use of minimally invasive and implantable medical devices to bolster segmental growth 109
10.2.3 MICROPHONES 110
10.2.3.1 Growing popularity of voice assistants and trend of voice-activated IoT devices to expedite segmental growth 110
10.2.4 ENVIRONMENTAL SENSORS 112
10.2.4.1 Mounting adoption of IoT-enabled monitoring systems to
boost segmental growth 112
10.2.5 OPTICAL SENSORS 113
10.2.5.1 Increasing application in spectrometers, infrared detectors,
and imaging systems to foster segmental growth 113
10.2.6 OTHER SENSOR TYPES 114
10.3 ACTUATORS 116
10.3.1 OPTICAL 118
10.3.1.1 Growing focus on high-speed data transmission to augment segmental growth 118
10.3.2 MICROSPEAKER 119
10.3.2.1 Rising need for superior acoustic performance, structural integrity, and environmental protection to spur demand 119
10.3.3 MICROFLUIDIC 120
10.3.3.1 Strong focus on chemical resistance, biocompatibility, and precise fluidic sealing to drive market 120
10.3.4 INKJET HEAD 121
10.3.4.1 Increasing need for high precision in bioprinting, lab-on-a-chip devices, and printed electronics to spur demand 121
10.3.5 RADIO FREQUENCY 122
10.3.5.1 Growing usage in bio-integrated electronics, wearable sensors, and conformal devices to boost segmental growth 122
11 MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL 124
11.1 INTRODUCTION 125
11.2 AUTOMOTIVE 126
11.2.1 SHIFT TOWARD CONNECTED AND AUTONOMOUS VEHICLES TO
ACCELERATE SEGMENTAL GROWTH 126
11.3 CONSUMER ELECTRONICS 129
11.3.1 WIDESPREAD USE OF MEMS TECHNOLOGY TO DELIVER HIGH ELECTRICAL PERFORMANCE TO FOSTER SEGMENTAL GROWTH 129
11.4 DEFENSE 132
11.4.1 NEED FOR SYSTEMS RESISTANT TO SHOCK, VIBRATION, EXTREME TEMPERATURE CYCLES, AND ELECTROMAGNETIC INTERFERENCE
TO DRIVE MARKET 132
11.5 AEROSPACE 135
11.5.1 DEPLOYMENT OF LOW-EARTH ORBIT SATELLITES AND DEEP-SPACE EXPLORATION PROGRAMS TO AUGMENT SEGMENTAL GROWTH 135
11.6 INDUSTRIAL 138
11.6.1 RISE IN INDUSTRY 4.0 AND SMART MANUFACTURING TO CONTRIBUTE
TO SEGMENTAL GROWTH 138
11.7 HEALTHCARE 141
11.7.1 RISING PREVALENCE OF CHRONIC DISEASES AND AGING POPULATION
TO EXPEDITE SEGMENTAL GROWTH 141
11.8 TELECOM 145
11.8.1 RAPID EVOLUTION OF 5G AND 6G NETWORK INFRASTRUCTURE
TO BOLSTER SEGMENTAL GROWTH 145
12 MEMS PACKAGING SUBSTRATES MARKET, BY REGION 148
12.1 INTRODUCTION 149
12.2 NORTH AMERICA 150
12.2.1 US 153
12.2.1.1 Expanding manufacturing capacity and technological advancements to fuel market growth 153
12.2.2 CANADA 154
12.2.2.1 Government-led initiatives to strengthen domestic R&D and manufacturing to boost market growth 154
12.2.3 MEXICO 156
12.2.3.1 Rising development of near-market assembly and final-packaging hub to expedite market growth 156
12.3 EUROPE 157
12.3.1 GERMANY 160
12.3.1.1 Rising deployment of emerging technologies and investment
in connected cars to augment market growth 160
12.3.2 FRANCE 162
12.3.2.1 Increasing investment in semiconductor projects to bolster
market growth 162
12.3.3 UK 163
12.3.3.1 Growing emphasis on packaging, prototyping centers, and
substrate research to drive market 163
12.3.4 ITALY 165
12.3.4.1 Strong focus on expanding semiconductor manufacturing
capacity to fuel market growth 165
12.3.5 REST OF EUROPE 166
12.4 ASIA PACIFIC 167
12.4.1 CHINA 170
12.4.1.1 Surging EV adoption and industrial innovation to accelerate
market growth 170
12.4.2 JAPAN 172
12.4.2.1 Diversified automotive sector and demand for smart home and portable medical devices to foster market growth 172
12.4.3 SOUTH KOREA 173
12.4.3.1 Escalating semiconductor production to support market growth 173
12.4.4 INDIA 174
12.4.4.1 Government-led initiatives to enhance electronics manufacturing
to boost market growth 174
12.4.5 REST OF ASIA PACIFIC 176
12.5 ROW 177
12.5.1 MIDDLE EAST & AFRICA 180
12.5.1.1 Mounting adoption of smartphones, wearable devices, and IoT-enabled equipment to drive market 180
12.5.1.2 GCC countries 182
12.5.1.3 Africa & Rest of Middle East 182
12.5.2 SOUTH AMERICA 182
12.5.2.1 Increasing investment to support semiconductor manufacturing
to accelerate market growth 182
13 COMPETITIVE LANDSCAPE 184
13.1 OVERVIEW 184
13.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2021–2025 184
13.3 MARKET SHARE ANALYSIS, 2024 186
13.4 REVENUE ANALYSIS, 2021–2024 187
13.5 COMPANY VALUATION AND FINANCIAL METRICS 188
13.6 PRODUCT COMPARISON 189
13.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024 189
13.7.1 STARS 189
13.7.2 EMERGING LEADERS 189
13.7.3 PERVASIVE PLAYERS 190
13.7.4 PARTICIPANTS 190
13.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024 191
13.7.5.1 Company footprint 191
13.7.5.2 Region footprint 192
13.7.5.3 Substrate type footprint 193
13.7.5.4 Application footprint 194
13.7.5.5 Vertical footprint 195
13.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024 196
13.8.1 PROGRESSIVE COMPANIES 196
13.8.2 RESPONSIVE COMPANIES 196
13.8.3 DYNAMIC COMPANIES 196
13.8.4 STARTING BLOCKS 196
13.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2024 198
13.8.5.1 Detailed list of key startups/SMEs 198
13.8.5.2 Competitive benchmarking of key startups/SMEs 199
13.9 COMPETITIVE SCENARIO 200
13.9.1 PRODUCT LAUNCHES 200
13.9.2 DEALS 201
13.9.3 EXPANSIONS 202
14 COMPANY PROFILES 203
14.1 KEY PLAYERS 203
14.1.1 SHIN-ETSU CHEMICAL CO., LTD. 203
14.1.1.1 Business overview 203
14.1.1.2 Products/Solutions/Services offered 204
14.1.1.3 Recent developments 205
14.1.1.3.1 Expansions 205
14.1.1.4 MnM view 206
14.1.1.4.1 Key strengths/Right to win 206
14.1.1.4.2 Strategic choices 206
14.1.1.4.3 Weaknesses/Competitive threats 206
14.1.2 KYOCERA CORPORATION 207
14.1.2.1 Business overview 207
14.1.2.2 Products/Solutions/Services offered 208
14.1.2.3 Recent developments 209
14.1.2.3.1 Deals 209
14.1.2.4 MnM view 210
14.1.2.4.1 Key strengths/Right to win 210
14.1.2.4.2 Strategic choices 210
14.1.2.4.3 Weaknesses/Competitive threats 210
14.1.3 AGC INC. 211
14.1.3.1 Business overview 211
14.1.3.2 Products/Solutions/Services offered 212
14.1.3.3 Recent developments 213
14.1.3.3.1 Deals 213
14.1.3.4 MnM view 213
14.1.3.4.1 Key strengths/Right to win 213
14.1.3.4.2 Strategic choices 214
14.1.3.4.3 Weaknesses/Competitive threats 214
14.1.4 SUMCO CORPORATION 215
14.1.4.1 Business overview 215
14.1.4.2 Products/Solutions/Services offered 216
14.1.4.3 MnM view 217
14.1.4.3.1 Key strengths/Right to win 217
14.1.4.3.2 Strategic choices 217
14.1.4.3.3 Weaknesses/Competitive threats 217
14.1.5 GLOBALWAFERS 218
14.1.5.1 Business overview 218
14.1.5.2 Products/Solutions/Services offered 219
14.1.5.3 Recent developments 220
14.1.5.3.1 Expansions 220
14.1.5.4 MnM view 220
14.1.5.4.1 Key strengths/Right to win 220
14.1.5.4.2 Strategic choices 220
14.1.5.4.3 Weaknesses/Competitive threats 220
14.1.6 COORSTEK INC. 221
14.1.6.1 Business overview 221
14.1.6.2 Products/Solutions/Services offered 222
14.1.6.3 Recent developments 222
14.1.6.3.1 Deals 222
14.1.7 CERAMTEC GMBH 223
14.1.7.1 Business overview 223
14.1.7.2 Products/Solutions/Services offered 224
14.1.7.3 Recent developments 225
14.1.7.3.1 Product launches 225
14.1.8 PLANOPTIK AG 226
14.1.8.1 Business overview 226
14.1.8.2 Products/Solutions/Services offered 227
14.1.8.3 Recent developments 228
14.1.8.3.1 Deals 228
14.1.9 WAFERPRO 229
14.1.9.1 Business overview 229
14.1.9.2 Products/Solutions/Services offered 229
14.1.10 SCHOTT 232
14.1.10.1 Business overview 232
14.1.10.2 Products/Solutions/Services offered 233
14.1.10.3 Recent developments 234
14.1.10.3.1 Deals 234
14.1.11 OKMETIC 235
14.1.11.1 Business overview 235
14.1.11.2 Products/Solutions/Services offered 236
14.1.12 HONGRUIXING (HUBEI) ELECTRONICS CO., LTD. 237
14.1.12.1 Business overview 237
14.1.12.2 Products/Solutions/Services offered 237
14.2 OTHER PLAYERS 239
14.2.1 NIKKO COMPANY 239
14.2.2 KOA CORPORATION 240
14.2.3 SHINKO ELECTRIC INDUSTRIES CO., LTD. 241
14.2.4 NTK CERAMIC CO., LTD. 242
14.2.5 SOITEC 243
14.2.6 ICEMOS TECHNOLOGY LTD. 244
14.2.7 TECNISCO, LTD. 245
14.2.8 NIPPON CARBIDE INDUSTRIES CO., INC. 246
14.2.9 RENA TECHNOLOGIES GMBH 247
14.2.10 SILICON VALLEY MICROELECTRONICS, INC. 248
14.2.11 VALLEY DESIGN CORP. 249
14.2.12 HERAEUS ELECTRONICS 250
14.2.13 OHARA INC. 251
14.2.14 ROGERS CORPORATION 252
15 RESEARCH METHODOLOGY 253
15.1 RESEARCH DATA 253
15.2 SECONDARY AND PRIMARY RESEARCH 254
15.2.1 SECONDARY DATA 255
15.2.1.1 List of key secondary sources 256
15.2.1.2 Key data from secondary sources 256
15.2.2 PRIMARY DATA 257
15.2.2.1 List of primary interview participants 257
15.2.2.2 Breakdown of primaries 257
15.2.2.3 Key data from primary sources 258
15.2.2.4 Key industry insights 258
15.3 MARKET SIZE ESTIMATION 259
15.3.1 BOTTOM-UP APPROACH 260
15.3.2 TOP-DOWN APPROACH 260
15.3.3 BASE NUMBER CALCULATION 261
15.4 MARKET FORECAST APPROACH 261
15.4.1 SUPPLY SIDE 261
15.4.2 DEMAND SIDE 262
15.5 DATA TRIANGULATION 262
15.6 FACTOR ANALYSIS 263
15.7 RESEARCH ASSUMPTIONS 264
15.8 RESEARCH LIMITATIONS 264
15.9 RISK ANALYSIS 265
16 APPENDIX 266
16.1 DISCUSSION GUIDE 266
16.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 269
16.3 CUSTOMIZATION OPTIONS 271
16.4 RELATED REPORTS 271
16.5 AUTHOR DETAILS 272
LIST OF TABLES
TABLE 1 MEMS PACKAGING SUBSTRATES MARKET: INCLUSIONS AND EXCLUSIONS 29
TABLE 2 MEMS PACKAGING SUBSTRATES MARKET: LIMITATIONS 30
TABLE 3 INTERCONNECTED MARKETS AND MNM COVERAGE 48
TABLE 4 STRATEGIC FOCUS OF TIER 1/2/3 PLAYERS 49
TABLE 5 IMPACT OF PORTER’S FIVE FORCES ANALYSIS 51
TABLE 6 GDP CHANGE, BY KEY COUNTRY, 2021–2030 (%) 53
TABLE 7 ROLE OF COMPANIES IN MEMS PACKAGING SUBSTRATES ECOSYSTEM 59
TABLE 8 PRICING RANGE OF MEMS PACKAGING SUBSTRATES,
BY SUBSTRATE TYPE, 2024 (USD) 60
TABLE 9 PRICING RANGE OF MEMS PACKAGING SUBSTRATES, BY KEY PLAYER, 2024 (USD) 60
TABLE 10 AVERAGE SELLING PRICE TREND OF SILICON SUBSTRATES, BY REGION,
2021–2024 (USD PER SQUARE INCH) 61
TABLE 11 IMPORT DATA FOR HS CODE 902690-COMPLIANT PRODUCTS, BY COUNTRY, 2020–2024 (USD THOUSAND) 62
TABLE 12 EXPORT DATA FOR HS CODE 902690-COMPLIANT PRODUCTS, BY COUNTRY, 2019–2023 (USD THOUSAND) 63
TABLE 13 MEMS PACKAGING SUBSTRATES MARKET: LIST OF CONFERENCES
AND EVENTS, 2025–2027 64
TABLE 14 US-ADJUSTED RECIPROCAL TARIFF RATES 68
TABLE 15 PATENT APPLIED AND GRANTED, 2024–2025 75
TABLE 16 TOP USE CASES OF AI/GEN AI AND MARKET POTENTIAL 82
TABLE 17 BEST PRACTICES: COMPANIES IMPLEMENTING AI TECHNOLOGY 82
TABLE 18 CASE STUDIES RELATED TO AI IMPLEMENTATION 83
TABLE 19 INTERCONNECTED ADJACENT ECOSYSTEM AND IMPACT ON MARKET PLAYERS 83
TABLE 20 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES,
AND OTHER ORGANIZATIONS 85
TABLE 21 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES,
AND OTHER ORGANIZATIONS 86
TABLE 22 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES,
AND OTHER ORGANIZATIONS 87
TABLE 23 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 88
TABLE 24 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP
THREE VERTICALS (%) 94
TABLE 25 KEY BUYING CRITERIA FOR TOP THREE VERTICALS 94
TABLE 26 UNMET NEEDS IN MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL 96
TABLE 27 MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE,
2021–2024 (USD MILLION) 98
TABLE 28 MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE,
2025–2030 (USD MILLION) 98
TABLE 29 MEMS PACKAGING SUBSTRATES MARKET, 2021–2024 (VALUE AND VOLUME) 99
TABLE 30 MEMS PACKAGING SUBSTRATES MARKET, 2025–2030 (VALUE AND VOLUME) 99
TABLE 31 SILICON: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 100
TABLE 32 SILICON: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 100
TABLE 33 GLASS: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 101
TABLE 34 GLASS: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 101
TABLE 35 CERAMIC: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 102
TABLE 36 CERAMIC: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 102
TABLE 37 ORGANIC: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 103
TABLE 38 ORGANIC: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 103
TABLE 39 MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 105
TABLE 40 MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2025–2030 (USD MILLION) 106
TABLE 41 SENSORS: MEMS PACKAGING SUBSTRATES MARKET, BY TYPE,
2021–2024 (USD MILLION) 106
TABLE 42 SENSORS: MEMS PACKAGING SUBSTRATES MARKET, BY TYPE,
2025–2030 (USD MILLION) 107
TABLE 43 SENSORS: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 107
TABLE 44 SENSORS: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 107
TABLE 45 INERTIAL SENSORS: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 108
TABLE 46 INERTIAL SENSORS: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2025–2030 (USD MILLION) 109
TABLE 47 PRESSURE SENSORS: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 110
TABLE 48 PRESSURE SENSORS: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2025–2030 (USD MILLION) 110
TABLE 49 MICROPHONES: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 111
TABLE 50 MICROPHONES: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 111
TABLE 51 ENVIRONMENTAL SENSORS: MEMS PACKAGING SUBSTRATES MARKET,
BY VERTICAL, 2021–2024 (USD MILLION) 112
TABLE 52 ENVIRONMENTAL SENSORS: MEMS PACKAGING SUBSTRATES MARKET,
BY VERTICAL, 2025–2030 (USD MILLION) 113
TABLE 53 OPTICAL SENSORS: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 114
TABLE 54 OPTICAL SENSORS: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2025–2030 (USD MILLION) 114
TABLE 55 OTHER SENSOR TYPES: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 115
TABLE 56 OTHER SENSOR TYPES: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2025–2030 (USD MILLION) 115
TABLE 57 ACTUATORS: MEMS PACKAGING SUBSTRATES MARKET, BY TYPE,
2021–2024 (USD MILLION) 116
TABLE 58 ACTUATORS: MEMS PACKAGING SUBSTRATES MARKET, BY TYPE,
2025–2030 (USD MILLION) 117
TABLE 59 ACTUATORS: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 117
TABLE 60 ACTUATORS: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 117
TABLE 61 OPTICAL: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 118
TABLE 62 OPTICAL: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 119
TABLE 63 MICROSPEAKER: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 120
TABLE 64 MICROSPEAKER: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 120
TABLE 65 MICROFLUIDIC: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 121
TABLE 66 MICROFLUIDIC: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 121
TABLE 67 INKJET HEAD: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 121
TABLE 68 INKJET HEAD: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 122
TABLE 69 RADIO FREQUENCY: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 123
TABLE 70 RADIO FREQUENCY: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2025–2030 (USD MILLION) 123
TABLE 71 MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 125
TABLE 72 MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 126
TABLE 73 AUTOMOTIVE: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 126
TABLE 74 AUTOMOTIVE: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2025–2030 (USD MILLION) 127
TABLE 75 AUTOMOTIVE: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2021–2024 (USD MILLION) 127
TABLE 76 AUTOMOTIVE: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2025–2030 (USD MILLION) 127
TABLE 77 AUTOMOTIVE: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS,
BY TYPE, 2021–2024 (USD MILLION) 128
TABLE 78 AUTOMOTIVE: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS,
BY TYPE, 2025–2030 (USD MILLION) 128
TABLE 79 AUTOMOTIVE: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 128
TABLE 80 AUTOMOTIVE: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 129
TABLE 81 CONSUMER ELECTRONICS: MEMS PACKAGING SUBSTRATES MARKET,
BY APPLICATION, 2021–2024 (USD MILLION) 130
TABLE 82 CONSUMER ELECTRONICS: MEMS PACKAGING SUBSTRATES MARKET,
BY APPLICATION, 2025–2030 (USD MILLION) 130
TABLE 83 CONSUMER ELECTRONICS: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2021–2024 (USD MILLION) 130
TABLE 84 CONSUMER ELECTRONICS: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2025–2030 (USD MILLION) 131
TABLE 85 CONSUMER ELECTRONICS: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS, BY TYPE, 2021–2024 (USD MILLION) 131
TABLE 86 CONSUMER ELECTRONICS: MEMS PACKAGING SUBSTRATES MARKET
FOR ACTUATORS, BY TYPE, 2025–2030 (USD MILLION) 131
TABLE 87 CONSUMER ELECTRONICS: MEMS PACKAGING SUBSTRATES MARKET,
BY REGION, 2021–2024 (USD MILLION) 132
TABLE 88 CONSUMER ELECTRONICS: MEMS PACKAGING SUBSTRATES MARKET,
BY REGION, 2025–2030 (USD MILLION) 132
TABLE 89 DEFENSE: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 133
TABLE 90 DEFENSE: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2025–2030 (USD MILLION) 133
TABLE 91 DEFENSE: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2021–2024 (USD MILLION) 133
TABLE 92 DEFENSE: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2025–2030 (USD MILLION) 134
TABLE 93 DEFENSE: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS, BY TYPE, 2021–2024 (USD MILLION) 134
TABLE 94 DEFENSE: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS, BY TYPE, 2025–2030 (USD MILLION) 134
TABLE 95 DEFENSE: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 134
TABLE 96 DEFENSE: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 135
TABLE 97 AEROSPACE: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 136
TABLE 98 AEROSPACE: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2025–2030 (USD MILLION) 136
TABLE 99 AEROSPACE: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2021–2024 (USD MILLION) 136
TABLE 100 AEROSPACE: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2025–2030 (USD MILLION) 137
TABLE 101 AEROSPACE: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS, BY TYPE, 2021–2024 (USD MILLION) 137
TABLE 102 AEROSPACE: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS, BY TYPE, 2025–2030 (USD MILLION) 137
TABLE 103 AEROSPACE: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 138
TABLE 104 AEROSPACE: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 138
TABLE 105 INDUSTRIAL: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 139
TABLE 106 INDUSTRIAL: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2025–2030 (USD MILLION) 139
TABLE 107 INDUSTRIAL: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2021–2024 (USD MILLION) 139
TABLE 108 INDUSTRIAL: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2025–2030 (USD MILLION) 140
TABLE 109 INDUSTRIAL: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS, BY TYPE, 2021–2024 (USD MILLION) 140
TABLE 110 INDUSTRIAL: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS, BY TYPE, 2025–2030 (USD MILLION) 140
TABLE 111 INDUSTRIAL: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 141
TABLE 112 INDUSTRIAL: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 141
TABLE 113 HEALTHCARE: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 142
TABLE 114 HEALTHCARE: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2025–2030 (USD MILLION) 142
TABLE 115 HEALTHCARE: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2021–2024 (USD MILLION) 143
TABLE 116 HEALTHCARE: MEMS PACKAGING SUBSTRATES MARKET FOR SENSORS, BY TYPE, 2025–2030 (USD MILLION) 143
TABLE 117 HEALTHCARE: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS,
BY TYPE, 2021–2024 (USD MILLION) 143
TABLE 118 HEALTHCARE: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS,
BY TYPE, 2025–2030 (USD MILLION) 144
TABLE 119 HEALTHCARE: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 144
TABLE 120 HEALTHCARE: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 144
TABLE 121 TELECOM: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 145
TABLE 122 TELECOM: MEMS PACKAGING SUBSTRATES MARKET, BY APPLICATION,
2025–2030 (USD MILLION) 145
TABLE 123 TELECOM: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS, BY TYPE, 2021–2024 (USD MILLION) 146
TABLE 124 TELECOM: MEMS PACKAGING SUBSTRATES MARKET FOR ACTUATORS, BY TYPE, 2025–2030 (USD MILLION) 146
TABLE 125 TELECOM: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 146
TABLE 126 TELECOM: MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 146
TABLE 127 MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2021–2024 (USD MILLION) 149
TABLE 128 MEMS PACKAGING SUBSTRATES MARKET, BY REGION,
2025–2030 (USD MILLION) 150
TABLE 129 NORTH AMERICA: MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY,
2021–2024 (USD MILLION) 151
TABLE 130 NORTH AMERICA: MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY,
2025–2030 (USD MILLION) 151
TABLE 131 NORTH AMERICA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 152
TABLE 132 NORTH AMERICA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 152
TABLE 133 NORTH AMERICA: MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE, 2021–2024 (USD MILLION) 152
TABLE 134 NORTH AMERICA: MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE, 2025–2030 (USD MILLION) 153
TABLE 135 US: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 154
TABLE 136 US: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 154
TABLE 137 CANADA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 155
TABLE 138 CANADA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 155
TABLE 139 MEXICO: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 156
TABLE 140 MEXICO: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 156
TABLE 141 EUROPE: MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY,
2021–2024 (USD MILLION) 158
TABLE 142 EUROPE: MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY,
2025–2030 (USD MILLION) 159
TABLE 143 EUROPE: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 159
TABLE 144 EUROPE: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 159
TABLE 145 EUROPE: MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE,
2021–2024 (USD MILLION) 160
TABLE 146 EUROPE: MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE,
2025–2030 (USD MILLION) 160
TABLE 147 GERMANY: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 161
TABLE 148 GERMANY: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 162
TABLE 149 FRANCE: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 163
TABLE 150 FRANCE: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 163
TABLE 151 UK: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 164
TABLE 152 UK: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 164
TABLE 153 ITALY: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 165
TABLE 154 ITALY: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 165
TABLE 155 REST OF EUROPE: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 166
TABLE 156 REST OF EUROPE: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 167
TABLE 157 ASIA PACIFIC: MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY,
2021–2024 (USD MILLION) 168
TABLE 158 ASIA PACIFIC: MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY,
2025–2030 (USD MILLION) 169
TABLE 159 ASIA PACIFIC: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 169
TABLE 160 ASIA PACIFIC: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 169
TABLE 161 ASIA PACIFIC: MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE, 2021–2024 (USD MILLION) 170
TABLE 162 ASIA PACIFIC: MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE, 2025–2030 (USD MILLION) 170
TABLE 163 CHINA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 171
TABLE 164 CHINA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 171
TABLE 165 JAPAN: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 172
TABLE 166 JAPAN: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 173
TABLE 167 SOUTH KOREA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 174
TABLE 168 SOUTH KOREA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 174
TABLE 169 INDIA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 175
TABLE 170 INDIA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 175
TABLE 171 REST OF ASIA PACIFIC: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 176
TABLE 172 REST OF ASIA PACIFIC: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2025–2030 (USD MILLION) 177
TABLE 173 ROW: MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY,
2021–2024 (USD MILLION) 178
TABLE 174 ROW: MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY,
2025–2030 (USD MILLION) 178
TABLE 175 ROW: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 179
TABLE 176 ROW: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 179
TABLE 177 ROW: MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE,
2021–2024 (USD MILLION) 179
TABLE 178 ROW: MEMS PACKAGING SUBSTRATES MARKET, BY SUBSTRATE TYPE,
2025–2030 (USD MILLION) 180
TABLE 179 MIDDLE EAST & AFRICA: MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY, 2021–2024 (USD MILLION) 180
TABLE 180 MIDDLE EAST & AFRICA: MEMS PACKAGING SUBSTRATES MARKET, BY COUNTRY, 2025–2030 (USD MILLION) 181
TABLE 181 MIDDLE EAST & AFRICA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 181
TABLE 182 MIDDLE EAST & AFRICA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL, 2025–2030 (USD MILLION) 181
TABLE 183 SOUTH AMERICA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 183
TABLE 184 SOUTH AMERICA: MEMS PACKAGING SUBSTRATES MARKET, BY VERTICAL,
2025–2030 (USD MILLION) 183
TABLE 185 MEMS PACKAGING SUBSTRATES MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, JANUARY 2021–OCTOBER 2025 184
TABLE 186 MEMS PACKAGING SUBSTRATES MARKET: DEGREE OF COMPETITION, 2024 186
TABLE 187 MEMS PACKAGING SUBSTRATES MARKET: REGION FOOTPRINT 192
TABLE 188 MEMS PACKAGING SUBSTRATES MARKET: SUBSTRATE TYPE FOOTPRINT 193
TABLE 189 MEMS PACKAGING SUBSTRATES MARKET: APPLICATION FOOTPRINT 194
TABLE 190 MEMS PACKAGING SUBSTRATES MARKET: VERTICAL FOOTPRINT 195
TABLE 191 MEMS PACKAGING SUBSTRATES MARKET: DETAILED LIST
OF KEY STARTUPS/SMES 198
TABLE 192 MEMS PACKAGING SUBSTRATES MARKET: COMPETITIVE BENCHMARKING
OF KEY STARTUPS/SMES, 2024 199
TABLE 193 MEMS PACKAGING SUBSTRATES MARKET: PRODUCT LAUNCHES,
JANUARY 2021–OCTOBER 2025 200
TABLE 194 MEMS PACKAGING SUBSTRATES MARKET: DEALS,
JANUARY 2021–OCTOBER 2025 201
TABLE 195 MEMS PACKAGING SUBSTRATES MARKET: EXPANSIONS,
JANUARY 2021–OCTOBER 2025 202
TABLE 196 SHIN-ETSU CHEMICAL CO., LTD.: COMPANY OVERVIEW 203
TABLE 197 SHIN-ETSU CHEMICAL CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 204
TABLE 198 SHIN-ETSU CHEMICAL CO., LTD.: EXPANSIONS 205
TABLE 199 KYOCERA CORPORATION: COMPANY OVERVIEW 207
TABLE 200 KYOCERA CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 208
TABLE 201 KYOCERA CORPORATION: DEALS 209
TABLE 202 AGC INC.: COMPANY OVERVIEW 211
TABLE 203 AGC INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 212
TABLE 204 AGC INC.: DEALS 213
TABLE 205 SUMCO CORPORATION: COMPANY OVERVIEW 215
TABLE 206 SUMCO CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 216
TABLE 207 GLOBALWAFERS: COMPANY OVERVIEW 218
TABLE 208 GLOBALWAFERS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 219
TABLE 209 GLOBALWAFERS: EXPANSIONS 220
TABLE 210 COORSTEK INC.: COMPANY OVERVIEW 221
TABLE 211 COORSTEK INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 222
TABLE 212 COORSTEK INC.: DEALS 222
TABLE 213 CERAMTEC GMBH: COMPANY OVERVIEW 223
TABLE 214 CERAMTEC GMBH: PRODUCTS/SOLUTIONS/SERVICES OFFERED 224
TABLE 215 CERAMTEC GMBH: PRODUCT LAUNCHES 225
TABLE 216 PLANOPTIK AG: COMPANY OVERVIEW 226
TABLE 217 PLANOPTIK AG: PRODUCTS/SOLUTIONS/SERVICES OFFERED 227
TABLE 218 PLANOPTIK AG: DEALS 228
TABLE 219 WAFERPRO: COMPANY OVERVIEW 229
TABLE 220 WAFERPRO: PRODUCTS/SOLUTIONS/SERVICES OFFERED 229
TABLE 221 SCHOTT: COMPANY OVERVIEW 232
TABLE 222 SCHOTT: PRODUCTS/SOLUTIONS/SERVICES OFFERED 233
TABLE 223 SCHOTT: DEALS 234
TABLE 224 OKMETIC: COMPANY OVERVIEW 235
TABLE 225 OKMETIC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 236
TABLE 226 HONGRUIXING (HUBEI) ELECTRONICS CO., LTD.: COMPANY OVERVIEW 237
TABLE 227 HONGRUIXING (HUBEI) ELECTRONICS CO., LTD.: PRODUCTS/SOLUTIONS/ SERVICES OFFERED 237
TABLE 228 NIKKO COMPANY: COMPANY OVERVIEW 239
TABLE 229 KOA CORPORATION: COMPANY OVERVIEW 240
TABLE 230 SHINKO ELECTRIC INDUSTRIES CO., LTD.: COMPANY OVERVIEW 241
TABLE 231 NTK CERAMIC CO., LTD.: COMPANY OVERVIEW 242
TABLE 232 SOITEC: COMPANY OVERVIEW 243
TABLE 233 ICEMOS TECHNOLOGY LTD.: COMPANY OVERVIEW 244
TABLE 234 TECNISCO LTD.: COMPANY OVERVIEW 245
TABLE 235 NIPPON CARBIDE INDUSTRIES CO., INC.: COMPANY OVERVIEW 246
TABLE 236 RENA TECHNOLOGIES GMBH: COMPANY OVERVIEW 247
TABLE 237 SILICON VALLEY MICROELECTRONICS, INC.: COMPANY OVERVIEW 248
TABLE 238 VALLEY DESIGN CORP.: COMPANY OVERVIEW 249
TABLE 239 HERAEUS ELECTRONICS: COMPANY OVERVIEW 250
TABLE 240 OHARA INC.: COMPANY OVERVIEW 251
TABLE 241 ROGERS CORPORATION: COMPANY OVERVIEW 252
TABLE 242 MAJOR SECONDARY SOURCES 256
TABLE 243 PRIMARY INTERVIEW PARTICIPANTS 257
TABLE 244 MEMS PACKAGING SUBSTRATES MARKET: RESEARCH ASSUMPTIONS 264
TABLE 245 MEMS PACKAGING SUBSTRATES MARKET: RISK ANALYSIS 265
LIST OF FIGURES
FIGURE 1 MEMS PACKAGING SUBSTRATES MARKET SEGMENTATION AND REGIONAL SCOPE 28
FIGURE 2 MEMS PACKAGING SUBSTRATES MARKET: DURATION COVERED 29
FIGURE 3 MARKET SCENARIO 31
FIGURE 4 GLOBAL MEMS PACKAGING SUBSTRATES MARKET, 2021–2030 32
FIGURE 5 MAJOR STRATEGIES ADOPTED BY KEY PLAYERS IN MEMS PACKAGING SUBSTRATES MARKET, 2021–2025 32
FIGURE 6 DISRUPTIONS INFLUENCING MEMS PACKAGING SUBSTRATES MARKET GROWTH 33
FIGURE 7 HIGH-GROWTH SEGMENTS IN MEMS PACKAGING SUBSTRATES MARKET, 2024 34
FIGURE 8 ASIA PACIFIC TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD 35
FIGURE 9 RISING ADOPTION OF MINIATURIZED SENSORS AND ADVANCEMENTS IN WAFER-LEVEL PACKAGING TO DRIVE MEMS PACKAGING SUBSTRATES MARKET 36
FIGURE 10 SILICON SEGMENT TO DOMINATE MARKET FROM 2025 TO 2030 36
FIGURE 11 SENSORS SEGMENT TO EXHIBIT HIGHEST CAGR DURING FORECAST PERIOD 37
FIGURE 12 CONSUMER ELECTRONICS SEGMENT TO ACCOUNT FOR LARGEST
MARKET SHARE IN 2030 37
FIGURE 13 CONSUMER ELECTRONICS SEGMENT AND CHINA TO HOLD LARGEST SHARES
OF ASIA PACIFIC MEMS PACKAGING SUBSTRATES MARKET IN 2030 38
FIGURE 14 INDIA TO RECORD HIGHEST CAGR IN GLOBAL MEMS PACKAGING
SUBSTRATES MARKET FROM 2025 TO 2030 39
FIGURE 15 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES 40
FIGURE 16 IMPACT ANALYSIS: DRIVERS 43
FIGURE 17 IMPACT ANALYSIS: RESTRAINTS 45
FIGURE 18 IMPACT ANALYSIS: OPPORTUNITIES 47
FIGURE 19 IMPACT ANALYSIS: CHALLENGES 48
FIGURE 20 PORTER’S FIVE FORCES ANALYSIS 51
FIGURE 21 MEMS PACKAGING SUBSTRATES VALUE CHAIN 57
FIGURE 22 MEMS PACKAGING SUBSTRATES ECOSYSTEM 58
FIGURE 23 AVERAGE SELLING PRICE TREND OF SILICON SUBSTRATES IN DIFFERENT REGIONS, 2021–2024 61
FIGURE 24 IMPORT DATA FOR HS CODE 902690-COMPLIANT PRODUCTS FOR
TOP FIVE COUNTRIES, 2020–2024 62
FIGURE 25 EXPORT DATA FOR HS CODE 902690 -COMPLIANT PRODUCTS FOR
TOP FIVE COUNTRIES, 2020–2024 63
FIGURE 26 TRENDS/DISRUPTIONS INFLUENCING CUSTOMER BUSINESS 65
FIGURE 27 PATENT ANALYSIS, 2016–2025 74
FIGURE 28 MEMS PACKAGING SUBSTRATES MARKET: DECISION-MAKING FACTORS 93
FIGURE 29 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE VERTICALS 93
FIGURE 30 KEY BUYING CRITERIA FOR TOP THREE VERTICALS 94
FIGURE 31 ADOPTION BARRIERS AND INTERNAL CHALLENGES 95
FIGURE 32 SILICON SUBSTRATES SEGMENT TO DOMINATE MARKET DURING
FORECAST PERIOD 99
FIGURE 33 SENSORS SEGMENT TO HOLD LARGER MARKET SHARE IN 2025 AND 2030 105
FIGURE 34 CONSUMER ELECTRONICS SEGMENT TO DOMINATE MEMS PACKAGING SUBSTRATES MARKET BETWEEN 2025 AND 2030 125
FIGURE 35 ASIA PACIFIC TO EXHIBIT HIGHEST CAGR DURING FORECAST PERIOD 149
FIGURE 36 NORTH AMERICA: MEMS PACKAGING SUBSTRATES MARKET SNAPSHOT 151
FIGURE 37 EUROPE: MEMS PACKAGING SUBSTRATES MARKET SNAPSHOT 158
FIGURE 38 ASIA PACIFIC: MEMS PACKAGING SUBSTRATES MARKET SNAPSHOT 168
FIGURE 39 ROW: MEMS PACKAGING SUBSTRATES MARKET SNAPSHOT 178
FIGURE 40 MARKET SHARE ANALYSIS OF COMPANIES OFFERING MEMS PACKAGING SUBSTRATES, 2024 186
FIGURE 41 MEMS PACKAGING SUBSTRATES MARKET: REVENUE ANALYSIS OF
TOP FIVE PLAYERS, 2021–2024 187
FIGURE 42 COMPANY VALUATION 188
FIGURE 43 FINANCIAL METRICS (EV/EBITDA) 188
FIGURE 44 PRODUCT COMPARISON 189
FIGURE 45 MEMS PACKAGING SUBSTRATES MARKET: COMPANY EVALUATION
MATRIX (KEY PLAYERS), 2024 190
FIGURE 46 MEMS PACKAGING SUBSTRATES MARKET: COMPANY FOOTPRINT 191
FIGURE 47 MEMS PACKAGING SUBSTRATES MARKET: COMPANY EVALUATION
MATRIX (STARTUPS/SMES), 2024 197
FIGURE 48 SHIN-ETSU CHEMICAL CO., LTD.: COMPANY SNAPSHOT 204
FIGURE 49 KYOCERA CORPORATION: COMPANY SNAPSHOT 208
FIGURE 50 AGC INC.: COMPANY SNAPSHOT 212
FIGURE 51 SUMCO CORPORATION: COMPANY SNAPSHOT 216
FIGURE 52 GLOBALWAFERS: COMPANY SNAPSHOT 219
FIGURE 53 PLANOPTIK AG: COMPANY SNAPSHOT 227
FIGURE 54 SCHOTT: COMPANY SNAPSHOT 233
FIGURE 55 MEMS PACKAGING SUBSTRATES MARKET: RESEARCH DESIGN 253
FIGURE 56 MEMS PACKAGING SUBSTRATES MARKET: RESEARCH APPROACH 255
FIGURE 57 DATA CAPTURED FROM SECONDARY SOURCES 256
FIGURE 58 BREAKDOWN OF PRIMARY INTERVIEWS, BY COMPANY TYPE,
DESIGNATION, AND REGION 257
FIGURE 59 DATA CAPTURED FROM PRIMARY SOURCES 258
FIGURE 60 CORE FINDINGS FROM INDUSTRY EXPERTS 258
FIGURE 61 MEMS PACKAGING SUBSTRATES MARKET SIZE ESTIMATION: RESEARCH FLOW 259
FIGURE 62 MEMS PACKAGING SUBSTRATES MARKET: BOTTOM-UP APPROACH 260
FIGURE 63 MEMS PACKAGING SUBSTRATES MARKET: TOP-DOWN APPROACH 260
FIGURE 64 MEMS PACKAGING SUBSTRATES MARKET SIZE ESTIMATION (SUPPLY SIDE) 261
FIGURE 65 MEMS PACKAGING SUBSTRATES MARKET: DATA TRIANGULATION 263
FIGURE 66 MEMS PACKAGING SUBSTRATES MARKET: RESEARCH LIMITATIONS 264
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