出版：Paumanok IMR（ポーマノックIMR） 出版年月：2024年4月
Electrodes and Terminations: World Markets, Technologies and Opportunities: 2024-2027
| ページ数 | 180 |
| 図表数 | 80 |
| 価格 | |
| ベーシックライセンス | USD 3,750 |
| 種別 | 英文調査報告書 |
Report Description
A study of global markets for electrode and termination materials for multilayered stacked ceramic components; covering ores, powders and pastes in Palladium, Nickel, Copper and Silver With Value, Volume and Pricing Forecasts to 2027.Paumanok Publications, Inc., Saxapahaw, NC USA has published “Electrodes and Terminations: World Markets, Technologies and Opportunities: 2024-2027 ISBN# 1-89-3211-38-X,” which is a detailed deep dive analysis of four metals markets feeding into the global stacked ceramic component markets as electrodes and terminations- considered cornerstone to all electronic circuits worldwide. This detailed analysis is produced with an eye on creating transparency from raw materials costs to produce ceramic chip components. Metals in the form of ores, powders and pastes are consumed by the multilayered ceramic chip component markets with emphasis on two base metals and two precious metals; this market study traces their detailed supply chains to the paste and ink processors, the nano-technology powder producers and the ore miners that support the global high-tech economy.Paumanok Industrial Market Research employs a vertical research model that has data input resources at each level of the supply chain- mining, materials production, component manufacturing; component distribution, component consumption and materials recycling. This creates a legacy of data, whereby each segment of the supply chain is a set of checks and balances for data coming from the components markets. This methodology also provides the best short-term and long-term forecasting model for Paumanok IMR predictive analytics. This article focuses on four metals that are consumed as electrodes and terminations in passive electronic components and includes two precious metals and two base metals. We use this data to monitor the variable costs structure for producing passive electronic components. Electrodes and terminations and fundamental to the construction of passive electronic components, with emphasis upon stacked ceramic solutions for capacitance, resistance, inductance and sensing in electronic circuits.In an effort to achieve higher operating functionality, electronic components adopted a stacking method for ceramic dielectric materials almost 70 years ago. This stacking capability has evolved over time to handle increasingly thinner layers; which in turn has fostered in an age of increased volumetric efficiency in portable electronics. The specific product lines that benefited from increased functionality through stacking includes multilayered ceramic chip Multilayered Ceramic components (MLC); multilayered chip varistors; ceramic chip coil inductors; PTC thermistors, NTC thermistors and various types of EMC, EMI and RFI filters. A cornerstone material supply chain for multilayered chip components is the precious and base metals used for electrodes and terminations and matched with the ceramic stacks. This study sheds light on the metals ecosystems that feed into mass produced electronic components.The Stacking Method for Electronic components creates opportunities for base and precious metals in the form of metal electrodes and metal terminations. These metals represent a significant cost for component manufacturers and also involves ecosystems and expertise outside of the direct control of the component manufacturers.“Electrodes and Terminations: World Markets, Technologies and Opportunities: 2024-2027 ISBN# 1-89-3211-38-X,” is a study of global markets for electrode and termination materials for multilayered stacked ceramic components; covering ores, powders and pastes in Palladium, Nickel, Copper and Silver With Value, Volume and Pricing Forecasts to 2027.Table of Contents
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Figure 1: Paumanok Methodology for Studying Electrode and Termination Materials for Electronic Components: 1988-2024 16Figure 2: Electrode and Termination Metal Ecosystems for Passive Electronic Components 17Figure 3: Passive Component Raw Material Pricing Trend: 2012-2024 by Month 22Figure 4: Palladium Price Trend by Month: 2012-2024 24Figure 5: Nickel Price Trend by Month: 2012-2024 26Figure 6: Copper Price Trend by Month: 2012-2024 28Figure 7: Silver Price Trend By Month: 2012-2024 30Figure 8: Paumanok Provenance and Utility in Dielectric Material Supply Chains and Ecosystems: 1988-2024 32Figure 9: Paumanok Scope of Coverage in Electronic Components and Supporting Materials 33Figure 10: The Passive Electronic Component Supply Chain 35Figure 11: The Technical Economic Maxims Associated with Passive Electronic Components 40Figure 12: Currency Translations Used In This Report: FY 2013-2024 (Yen, NT$ and Won Currencies To The United States Dollar Quarterly Exchange) 43Figure 13: Fixed Stacked chip component Market Breakdown by Sub-Category: FY 2024 45Figure 14: Fixed Linear Resistor Market Breakdown by Sub-Category: FY 2024 46Figure 15: Discrete Inductor Market Breakdown by Sub-Category: FY 2024 47Figure 16: Feedstocks, Engineering Steps, Dielectric Development and End-Market Pull 49Figure 17: PGM Electrode and Termination: Complete Supply Chain: Ore To Powder To Paste To MLCC 57Figure 18: Base Metal Electrode Supply To The Global MLCC Markets: Ore, Powder and Paste for Copper and Nickel 60Figure 19: Overall Metal Paste Consumption in Ceramic Stack Electronic Components: FY 2024 66Figure 20: Multilayered Ceramic Diagram of Materials 69Figure 21: Nickel: A Changing Supply Chain For Stacked Chip 71Figure 22: Nickel Ore Mining Output By Country: 2024 73Figure 23: Nickel Ore Output By Mining Company: 2024 75Figure 24: Global Market Overview For Nickel Electrode Powder for Multilayered Ceramic: 2024 79Figure 25: Development of the Nickel Electrode Powder for Multilayered Ceramic Consumption Volume (Tons): 1997-2024; 2024-2027 FORECAST 80Figure 26: Development of the Nickel Electrode Powder for Multilayered Ceramic Consumption Value (Millions of USD): 1997-2024; 2024-2027 81Figure 27: Nickel Electrode Powder for Multilayered Ceramic (Price per Kilogram): 1997-2024; 2024-2027 FORECAST 83Figure 29: Multilayered Ceramic Nickel Electrode Powder Market by Particle Size: 2024 86Figure 30: Nickel Electrode Powder Vendors to the Global Multilayered Ceramic Market: 2024 Estimated Sales and Market Shares 88Figure 31: Nickel Electrode Powder Sales by Key Customer in Key Countries 91Figure 32: Nickel Paste Vendors To Multilayered Ceramic: 2024 Estimated Market Shares 94Figure 33: New Nickel Paste Development: 2024 Breakthrough in Japan 96Figure 34: Ni Electrode Thickness/Multilayered Ceramic Capacitance- 98Figure 35: Multilayered Ceramic Manufacturers: 2024 Competition by Multilayered Ceramic Capacitance Value 100Figure 36: Maximum Voltage at Maximum Capacitance by Case Size in Stacked Chip 102Figure 37: Multilayered Ceramic Nickel Powder Forecasts: FY 2024-2027 (In Tons) 103Figure 38: Multilayered Ceramic Nickel Powder Market Value Forecasts (Worldwide): FY 2024-2027 (In Millions of US Dollars) 104Figure 39: Multilayered Ceramic Nickel Powder Market Value Forecasts (Worldwide): FY 2024-2027 (In Millions of US Dollars) 105Figure 40: Copper Ore Mining Operations by Country: 2024 109Figure 41: Copper Ore Output By Mine Location: 2024 110Figure 42: Top Mining Companies in Copper Based On Dollar Sales: 2024 111Figure 43: Multilayered Ceramic Copper Termination Powder Volume Markets in High Capacitance Multilayered Ceramic 115Figure 44: Multilayered Ceramic Copper Termination Powder Market Value in High Capacitance Multilayered Ceramic 116Figure 45: Multilayered Ceramic Copper Termination Powder Pricing Trend 117Figure 46: Global Sales & Market Shares in Copper Termination Powder & Flake Supply to the Multilayered Ceramic Industry: 2024 121Figure 47: Multilayered Ceramic Copper Termination Paste Vendors: 2024 Market Shares 123Figure 48: Supplier/Customer Relationships in Copper Termination Powder and Paste in the Global Multilayered Ceramic Industry 125Figure 49: Stacked Chip Copper Termination Powder Consumption Forecasts: 2024-2027 126Figure 50: Copper Termination Powder Market Volume Forecast: 2024-2027 128Figure 51: Copper Termination Powder Market Value Forecast: 2024-2027 129Figure 52: Copper Termination Powder ASP Forecast: 2024-2027 130Figure 53: Copper Termination Paste Market Volume Forecast: 2024-2027 131Figure 54: Copper Termination Paste Market Value Forecast: 2024-2027 132Figure 55: Multilayered Ceramic Copper Termination Paste ASP Forecast: 2024-2027 133Figure 56: Sources for Palladium Ore- Key Producing Mining Operations by Country: FY 2024 136Figure 57: Sources for Silver Ore- Key Producing Mining Operations by Country: FY 2024 137Figure 58: Global Market Value of Consumption for PGM Inks/Pastes Consumed in Ceramic Chip Components: 2019-2024 139Figure 59: Palladium Consumption Volume in Stacked Ceramic Electrodes: 2024 143Figure 60: Palladium Consumption Value in Ceramic Chip Electrodes: 2024 145Figure 61: Global Palladium Price Trend: 2019-2024 146Figure 62: Silver Powder Consumption Volume in Ceramic Chip Components (Annualized): 2019-2024 148Figure 63: Silver (AG) Powder Consumption Value in Ceramic Chip Components (Value) 149Figure 64: Silver Price (Annualized) 150Figure 65: Palladium + Silver Electrode Powder: Global Volume of Consumption: 2019-2024 151Figure 66: Palladium + Silver Electrode Powder: Global Value of Consumption: 2019-2024 152Figure 67: Palladium + Silver Electrode Powder: Pricing and Trend: 2019-2024 153Figure 68: Palladium + Silver Electrode Paste: Volume and Trend: 2019-2024 154Figure 69: Palladium + Silver Electrode Paste: Value and Trend: 2019-2024 155Figure 70: Palladium + Silver Electrode Paste: ASP and Trend: 2019-2024 156Figure 71: Palladium and Silver Powder and Paste Vendors to The Ceramic Chip Component Markets: FY 2024 158Figure 72: Forecasts- Palladium in Electrodes (Volume In Troy Ounces) 159Figure 73: Forecasts- Palladium Price Forecast (US Dollars per Troy Ounces) 160Figure 74: Forecasts- Palladium in Electrodes (Value in USD) 161Figure 75: Forecasts- Silver in Electrodes (Volume In Troy Ounces) 162Figure 76: Forecasts- Silver in Electrodes (US Dollars [per Troy Ounces) 163Figure 77: Forecasts- Silver in Electrodes (Value in USD) 164Figure 78: Forecasts- Palladium + Silver Ink/Paste (Volume in Troy Ounces) 165Figure 79: Forecasts- Palladium + Silver Ink/Paste (Price per Troy Ounce in USD) 166Figure 80: Forecasts- Palladium + Silver Ink/Paste (Value Forecasts in Millions of US Dollars) 167
