ウェーハ接合装置の世界市場 : 2031年までの予測

Report Overview

The global Wafer Bonding Equipment market is projected to grow from US$ 344.00 million in 2025 to US$ 444.33 million by 2031, at a Compound Annual Growth Rate (CAGR) of 4.36% during the forecast period.

世界のウェーハ接合装置市場は、予測期間中に年平均成長率 (CAGR) 4.36% で成長し、2025 年の 3 億 4,400 万米ドルから 2031 年には 4 億 4,433 万米ドルに成長すると予測されています。

The global key manufacturers of Wafer Bonding Equipment include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, and Hutem, etc. In 2024, the global top five players had a share approximately 84% in terms of revenue.

In terms of production side, this report researches the Wafer Bonding Equipment production, growth rate, market share by manufacturers and by region (region level and country level), from 2020 to 2025, and forecast to 2031.

In terms of consumption side, this report focuses on the sales of Wafer Bonding Equipment by region (region level and country level), by company, by Type and by Application. from 2020 to 2025 and forecast to 2031.

Report Includes:

This report presents an overview of global market for Wafer Bonding Equipment, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2020 – 2024, estimates for 2025, and projections of CAGR through 2031.

This report researches the key producers of Wafer Bonding Equipment, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Wafer Bonding Equipment, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.

This report focuses on the Wafer Bonding Equipment sales, revenue, market share and industry ranking of main manufacturers, data from 2020 to 2025. Identification of the major stakeholders in the global Wafer Bonding Equipment market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2020 to 2031. Evaluation and forecast the market size for Wafer Bonding Equipment sales, projected growth trends, production technology, application and end-user industry.

Descriptive company profiles of the major global players, including EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, and Hutem, etc.

By Company

•                 EV Group
•                 SUSS MicroTec
•                 Tokyo Electron
•                 Applied Microengineering
•                 Nidec Machine Tool
•                 Ayumi Industry
•                 Shanghai Micro Electronics
•                 U-Precision Tech
•                 Hutem
•                 Canon
•                 Bondtech
•                 TAZMO
•                 Aimechatec

Segment by Type

•                 Fully Automatic
•                 Semi Automatic

Segment by Application

•                 MEMS
•                 Advanced Packaging
•                 CIS
•                 Others

Sales by Region

North America

•                 U.S.
•                 Canada
•                 Mexico

Asia Pacific

•                 Japan
•                 China
•                 South Korea
•                 India
•                 Southeast Asia
•                 Others

Europe

•                 Germany
•                 France
•                 U.K.
•                 Italy
•                 Russia
•                 Others

South America

•                 Brazil
•                 Others

Middle East, Africa

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Sales (consumption), revenue of Wafer Bonding Equipment in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.

Chapter 3: Detailed analysis of Wafer Bonding Equipment manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6-10: Region by Type, by Application and by country, sales, and revenue for each segment.

Chapter 11: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Wafer Bonding Equipment sales, revenue, price, gross margin, and recent development, etc.

Chapter 12-14: Analysis of industrial chain, sales channel, key raw materials, distributors and customers. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 15: The main points and conclusions of the report.

Table of Contents

1 Study Coverage  1

1.1 Wafer Bonding Equipment Product Introduction    1

1.2 Market by Type              2

1.2.1 Global Wafer Bonding Equipment Market Size by Type, 2020 VS 2024 VS 2031        2

1.2.2 Market by Type           3

1.3 Market by Application  6

1.3.1 Global Wafer Bonding Equipment Market Size by Application, 2020 VS 2024 VS 2031  6

1.3.2 Market by Application                7

1.4 Assumptions and Limitations       8

1.5 Study Objectives            9

1.6 Years Considered           9

2 Executive Summary           10

2.1 Global Wafer Bonding Equipment Revenue Estimates and Forecasts 2020-2031              10

2.2 Global Wafer Bonding Equipment Revenue by Region           11

2.2.1 Global Wafer Bonding Equipment Revenue by Region: 2020 VS 2024 VS 2031  11

2.2.2 Global Wafer Bonding Equipment Revenue by Region (2020-2025)                 12

2.2.3 Global Wafer Bonding Equipment Revenue by Region (2026-2031)                 13

2.2.4 Global Wafer Bonding Equipment Revenue Market Share by Region (2020-2031)           13

2.3 Global Wafer Bonding Equipment Sales Estimates and Forecasts 2020-2031        14

2.4 Global Wafer Bonding Equipment Sales by Region 15

2.4.1 Global Wafer Bonding Equipment Sales by Region: 2020 VS 2024 VS 2031        15

2.4.2 Global Wafer Bonding Equipment Sales by Region (2020-2025)                 16

2.4.3 Global Wafer Bonding Equipment Sales by Region (2026-2031)                 16

2.4.4 Global Wafer Bonding Equipment Sales Market Share by Region (2020-2031)           16

2.5 North America                18

2.6 Europe             20

2.7 Asia Pacific     22

2.8 South America                24

2.9 Middle East, Africa        26

3 Competition by Manufacturers       28

3.1 Global Wafer Bonding Equipment Sales by Manufacturers    28

3.1.1 Global Wafer Bonding Equipment Sales by Manufacturers (2021-2024)      28

3.1.2 Global Wafer Bonding Equipment Sales Market Share by Manufacturers (2021-2024)                29

3.2 Global Wafer Bonding Equipment Revenue by Manufacturers                 30

3.2.1 Global Wafer Bonding Equipment Revenue by Manufacturers (2021-2024)      30

3.2.2 Global Wafer Bonding Equipment Revenue Market Share by Manufacturers (2021-2024)                31

3.3 Global Wafer Bonding Equipment Sales Price by Manufacturers (2021-2024)           31

3.4 Analysis of Competitive Landscape             32

3.4.1 Manufacturers Market Concentration Ratio           32

3.4.2 Global Wafer Bonding Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3) 33

3.5 Global Key Manufacturers of Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters      34

3.6 Mergers & Acquisitions, Expansion Plans 34

4 Market Size by Type         37

4.1 Global Wafer Bonding Equipment Sales by Type     37

4.1.1 Global Wafer Bonding Equipment Historical Sales by Type (2020-2025)      37

4.1.2 Global Wafer Bonding Equipment Forecasted Sales by Type (2026-2031)      37

4.1.3 Global Wafer Bonding Equipment Sales Market Share by Type (2020-2031)           38

4.2 Global Wafer Bonding Equipment Revenue by Type               39

4.2.1 Global Wafer Bonding Equipment Historical Revenue by Type (2020-2025)           39

4.2.2 Global Wafer Bonding Equipment Forecasted Revenue by Type (2026-2031)           39

4.2.3 Global Wafer Bonding Equipment Revenue Market Share by Type (2020-2031)           39

4.3 Global Wafer Bonding Equipment Price by Type    40

4.3.1 Global Wafer Bonding Equipment Price by Type (2020-2025)                 40

4.3.2 Global Wafer Bonding Equipment Price Forecast by Type (2026-2031)      41

5 Market Size by Application              42

5.1 Global Wafer Bonding Equipment Sales by Application         42

5.1.1 Global Wafer Bonding Equipment Historical Sales by Application (2020-2025)           42

5.1.2 Global Wafer Bonding Equipment Forecasted Sales by Application (2026-2031)           42

5.1.3 Global Wafer Bonding Equipment Sales Market Share by Application (2020-2031)           43

5.2 Global Wafer Bonding Equipment Revenue by Application   44

5.2.1 Global Wafer Bonding Equipment Historical Revenue by Application (2020-2025)           44

5.2.2 Global Wafer Bonding Equipment Forecasted Revenue by Application (2026-2031)     45

5.2.3 Global Wafer Bonding Equipment Revenue Market Share by Application (2020-2031)     45

5.3 Global Wafer Bonding Equipment Price by Application         46

5.3.1 Global Wafer Bonding Equipment Price by Application (2020-2025)                 46

5.3.2 Global Wafer Bonding Equipment Price Forecast by Application (2026-2031)           47

6 North America   48

6.1 North America Wafer Bonding Equipment Market Size by Type                 48

6.1.1 North America Wafer Bonding Equipment Sales by Type (2020-2031)      48

6.1.2 North America Wafer Bonding Equipment Revenue by Type (2020-2031)      49

6.2 North America Wafer Bonding Equipment Market Size by Application                 50

6.2.1 North America Wafer Bonding Equipment Sales by Application (2020-2031)           50

6.2.2 North America Wafer Bonding Equipment Revenue by Application (2020-2031)           52

6.3 North America Wafer Bonding Equipment Market Size by Country                 53

6.3.1 North America Wafer Bonding Equipment Revenue by Country (2020-2031)           53

6.3.2 North America Wafer Bonding Equipment Sales by Country (2020-2031)      54

6.3.3 US 56

6.3.4 Canada          57

6.3.5 Mexico          58

7 Europe 59

7.1 Europe Wafer Bonding Equipment Market Size by Type        59

7.1.1 Europe Wafer Bonding Equipment Sales by Type (2020-2031)                 59

7.1.2 Europe Wafer Bonding Equipment Revenue by Type (2020-2031)                 60

7.2 Europe Wafer Bonding Equipment Market Size by Application                 61

7.2.1 Europe Wafer Bonding Equipment Sales by Application (2020-2031)                 61

7.2.2 Europe Wafer Bonding Equipment Revenue by Application (2020-2031)      62

7.3 Europe Wafer Bonding Equipment Market Size by Country  64

7.3.1 Europe Wafer Bonding Equipment Revenue by Country (2020-2031)      64

7.3.2 Europe Wafer Bonding Equipment Sales by Country (2020-2031)                 65

7.3.3 Germany      67

7.3.4 France           68

7.3.5 U.K.               69

7.3.6 Italy               70

7.3.7 Russia           71

8 Asia Pacific         72

8.1 Asia Pacific Wafer Bonding Equipment Market Size by Type                 72

8.1.1 Asia Pacific Wafer Bonding Equipment Sales by Type (2020-2031)                 72

8.1.2 Asia Pacific Wafer Bonding Equipment Revenue by Type (2020-2031)      73

8.2 Asia Pacific Wafer Bonding Equipment Market Size by Application                 74

8.2.1 Asia Pacific Wafer Bonding Equipment Sales by Application (2020-2031)      74

8.2.2 Asia Pacific Wafer Bonding Equipment Revenue by Application (2020-2031)           76

8.3 Asia Pacific Wafer Bonding Equipment Market Size by Region                 77

8.3.1 Asia Pacific Wafer Bonding Equipment Revenue by Region (2020-2031)      77

8.3.2 Asia Pacific Wafer Bonding Equipment Sales by Region (2020-2031)                 79

8.3.3 China            81

8.3.4 Japan             82

8.3.5 South Korea 83

8.3.6 India              84

8.3.7 Southeast Asia             85

9 South America   86

9.1 South America Wafer Bonding Equipment Market Size by Type                 86

9.1.1 South America Wafer Bonding Equipment Sales by Type (2020-2031)      86

9.1.2 South America Wafer Bonding Equipment Revenue by Type (2020-2031)      87

9.2 South America Wafer Bonding Equipment Market Size by Application                 88

9.2.1 South America Wafer Bonding Equipment Sales by Application (2020-2031)           88

9.2.2 South America Wafer Bonding Equipment Revenue by Application (2020-2031)           90

9.3 South America Wafer Bonding Equipment Market Size by Country                 91

9.3.1 South America Wafer Bonding Equipment Revenue by Country (2020-2031)           91

9.3.2 South America Wafer Bonding Equipment Sales by Country (2020-2031)      92

9.3.3 Brazil            94

10 Middle East and Africa  95

10.1 Middle East and Africa Wafer Bonding Equipment Market Size by Type       95

10.1.1 Middle East and Africa Wafer Bonding Equipment Sales by Type (2020-2031)           95

10.1.2 Middle East and Africa Wafer Bonding Equipment Revenue by Type (2020-2031)                 96

10.2 Middle East and Africa Wafer Bonding Equipment Market Size by Application            97

10.2.1 Middle East and Africa Wafer Bonding Equipment Sales by Application (2020-2031)     97

10.2.2 Middle East and Africa Wafer Bonding Equipment Revenue by Application (2020-2031)     99

10.3 Middle East and Africa Wafer Bonding Equipment Market Size by Country  100

10.3.1 Middle East and Africa Wafer Bonding Equipment Revenue by Country (2020-2031)           100

10.3.2 Middle East and Africa Wafer Bonding Equipment Sales by Country (2020-2031)           101

11 Key Players Profiles        102

11.1 EV Group      102

11.1.1 EV Group Company Details   102

11.1.2 Company and Business Overview          102

11.1.3 Wafer Bonding Equipment Introduction              103

11.1.4 EV Group Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     104

11.2 SUSS MicroTec            104

11.2.1 SUSS MicroTec Company Details         104

11.2.2 Company and Business Overview          105

11.2.3 Wafer Bonding Equipment Introduction              106

11.2.4 SUSS MicroTec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     107

11.3 Tokyo Electron             107

11.3.1 Tokyo Electron Company Details          107

11.3.2 Company and Business Overview          108

11.3.3 Wafer Bonding Equipment Introduction              108

11.3.4 Tokyo Electron Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     109

11.4 Applied Microengineering          109

11.4.1 Applied Microengineering Company Details       109

11.4.2 Company and Business Overview          110

11.4.3 Wafer Bonding Equipment Introduction              110

11.4.4 Applied Microengineering Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     111

11.5 Nidec Machine Tool    112

11.5.1 Nidec Machine Tool Company Details 112

11.5.2 Company and Business Overview          112

11.5.3 Wafer Bonding Equipment Introduction              113

11.5.4 Nidec Machine Tool Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)          114

11.6 Ayumi Industry            114

11.6.1 Ayumi Industry Company Details          114

11.6.2 Company and Business Overview          115

11.6.3 Wafer Bonding Equipment Introduction              115

11.6.4 Ayumi Industry Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     116

11.7 Shanghai Micro Electronics       117

11.7.1 Shanghai Micro Electronics Company Details    117

11.7.2 Company and Business Overview          117

11.7.3 Wafer Bonding Equipment Introduction              118

11.7.4 Shanghai Micro Electronics Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     118

11.8 U-Precision Tech         119

11.8.1 U-Precision Tech Company Details      119

11.8.2 Company and Business Overview          119

11.8.3 Wafer Bonding Equipment Introduction              120

11.8.4 U-Precision Tech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     120

11.9 Hutem            121

11.9.1 Hutem Company Details         121

11.9.2 Company and Business Overview          121

11.9.3 Wafer Bonding Equipment Introduction              122

11.9.4 Hutem Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)      123

11.10 Canon          123

11.10.1 Canon Company Details       123

11.10.2 Company and Business Overview        124

11.10.3 Wafer Bonding Equipment Introduction            124

11.10.4 Canon Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)      125

11.11 Bondtech    125

11.11.1 Bondtech Company Details 125

11.11.2 Company and Business Overview        126

11.11.3 Wafer Bonding Equipment Introduction            126

11.11.4 Bondtech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     127

11.12 TAZMO      127

11.12.1 TAZMO Company Details   127

11.12.2 Company and Business Overview        128

11.12.3 Wafer Bonding Equipment Introduction            128

11.12.4 TAZMO Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     129

11.13 Aimechatec 129

11.13.1 Aimechatec Company Details              129

11.13.2 Company and Business Overview        130

11.13.3 Wafer Bonding Equipment Introduction            130

11.13.4 Aimechatec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     131

12 Wafer Bonding Equipment Manufacturing Cost Analysis       132

12.1 Wafer Bonding Equipment Key Raw Materials Analysis       132

12.1.1 Key Raw Materials   132

12.1.2 Key Raw Materials Price Trend              133

12.2 Key Raw Materials Steel SFE Price Trend (Yuan/MT)         133

12.3 Key Raw Materials Aluminum LME Price Trend (USD/Tonne)                 134

12.4 Key Raw Materials Copper LME Price Trend (USD/LBs)  135

12.5 Proportion of Manufacturing Cost Structure          136

12.5.1 Raw Materials            136

12.5.2 Labor Cost 136

12.5.3 Manufacturing Expenses         136

12.6 Manufacturing Process Analysis of Wafer Bonding Equipment                 137

13 Sales Channel, Distributors, Traders and Dealers     138

13.1 Sales Channel                138

13.1.1 Direct Channel          138

13.1.2 Indirect Channel       139

13.2 Marketing Channels Status of Wafer Bonding Equipment   140

13.3 Market Positioning      141

13.3.1 Pricing Strategy        141

13.3.2 Brand Strategy          142

13.4 Wafer Bonding Equipment Distributors 143

13.5 Wafer Bonding Equipment Customers    143

14 Market Dynamics            144

14.1 Market Trends              144

14.2 Challenges    145

14.3 Market Favorable Factors and Unfavorable Factors               145

14.4 Market Risks 145

14.5 Industry Enters Major Barriers 146

14.6 Porter’s Five Forces Analysis     146

15 Key Findings in the Global Wafer Bonding Equipment Study 148

16 Appendix          150

16.1 Research Methodology                150

16.1.1 Methodology/Research Approach         150

16.1.2 Data Source               153

16.2 Author Details              156

16.3 Disclaimer    158

Tables and Figures

Table 1. Global Wafer Bonding Equipment Market Size Growth Rate by Type, 2020 VS 2024 VS 2031 (US$ Million)   2

Table 2. Market by Type     3

Table 3. Global Wafer Bonding Equipment Market Size Growth Rate by Application, 2020 VS 2024 VS 2031 (US$ Million)        6

Table 4. Market by Application          7

Table 5. Global Wafer Bonding Equipment Revenue Grow Rate (CAGR) by Region: 2020 VS 2024 VS 2031 (US$ Million)          11

Table 6. Global Wafer Bonding Equipment Revenue by Region (2020-2025) & (US$ Million)        12

Table 7. Global Wafer Bonding Equipment Revenue by Region (2026-2031) & (US$ Million)        13

Table 8. Global Wafer Bonding Equipment Revenue Market Share by Region (2020-2025)             13

Table 9. Global Wafer Bonding Equipment Revenue Market Share by Region (2026-2031)             13

Table 10. Global Wafer Bonding Equipment Sales Grow Rate (CAGR) by Region: 2020 VS 2024 VS 2031 (Units)           15

Table 11. Global Wafer Bonding Equipment Sales by Region (2020-2025) & (Units)                16

Table 12. Global Wafer Bonding Equipment Sales by Region (2026-2031) & (Units)                16

Table 13. Global Wafer Bonding Equipment Sales Market Share by Region (2020-2025)           16

Table 14. Global Wafer Bonding Equipment Sales Market Share by Region (2026-2031)           17

Table 15. Global Wafer Bonding Equipment Sales by Manufacturers (2021-2024) & (Units)        28

Table 16. Global Wafer Bonding Equipment Sales Share by Manufacturers (2021-2024)           29

Table 17. Global Wafer Bonding Equipment Revenue by Manufacturers (2021-2024) & (US$ Million)            30

Table 18. Global Wafer Bonding Equipment Revenue Market Share by Manufacturers (2021-2024)                31

Table 19. Wafer Bonding Equipment Price by Manufacturers (2021-2024) & (K USD/Unit)  31

Table 20. Global Wafer Bonding Equipment Manufacturers Market Concentration Ratio (CR5)                 33

Table 21. Global Wafer Bonding Equipment by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bonding Equipment as of 2024)             33

Table 22. Global Key Manufacturers of Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters      34

Table 23. Mergers & Acquisitions, Expansion Plans      34

Table 24. Global Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)   37

Table 25. Global Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)   37

Table 26. Global Wafer Bonding Equipment Sales Share by Type (2020-2025)      38

Table 27. Global Wafer Bonding Equipment Sales Share by Type (2026-2031)      38

Table 28. Global Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)        39

Table 29. Global Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)        39

Table 30. Global Wafer Bonding Equipment Revenue Share by Type (2020-2025)           39

Table 31. Global Wafer Bonding Equipment Revenue Share by Type (2026-2031)           40

Table 32. Wafer Bonding Equipment Price by Type (2020-2025) & (K USD/Unit)            40

Table 33. Global Wafer Bonding Equipment Price Forecast by Type (2026-2031) & (K USD/Unit)           41

Table 34. Global Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)    42

Table 35. Global Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)    42

Table 36. Global Wafer Bonding Equipment Sales Share by Application (2020-2025)           43

Table 37. Global Wafer Bonding Equipment Sales Share by Application (2026-2031)           43

Table 38. Global Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)            44

Table 39. Global Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)            45

Table 40. Global Wafer Bonding Equipment Revenue Share by Application (2020-2025)           45

Table 41. Global Wafer Bonding Equipment Revenue Share by Application (2026-2031)           45

Table 42. Wafer Bonding Equipment Price by Application (2020-2025) & (K USD/Unit)      46

Table 43. Global Wafer Bonding Equipment Price Forecast by Application (2026-2031) & (K USD/Unit)           47

Table 44. North America Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)    48

Table 45. North America Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)    48

Table 46. North America Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)            49

Table 47. North America Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)            49

Table 48. North America Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)        50

Table 49. North America Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)        51

Table 50. North America Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)       52

Table 51. North America Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)       52

Table 52. North America Wafer Bonding Equipment Revenue by Country (2020-2025) & (US$ Million)            53

Table 53. North America Wafer Bonding Equipment Revenue by Country (2026-2031) & (US$ Million)            54

Table 54. North America Wafer Bonding Equipment Sales by Country (2020-2025) & (Units)        54

Table 55. North America Wafer Bonding Equipment Sales by Country (2026-2031) & (Units)        55

Table 56. Europe Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)                59

Table 57. Europe Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)                59

Table 58. Europe Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)        60

Table 59. Europe Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)        60

Table 60. Europe Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)    61

Table 61. Europe Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)    61

Table 62. Europe Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)            62

Table 63. Europe Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)            63

Table 64. Europe Wafer Bonding Equipment Revenue by Country (2020-2025) & (US$ Million)        64

Table 65. Europe Wafer Bonding Equipment Revenue by Country (2026-2031) & (US$ Million)        64

Table 66. Europe Wafer Bonding Equipment Sales by Country (2020-2025) & (Units)    65

Table 67. Europe Wafer Bonding Equipment Sales by Country (2026-2031) & (Units)    65

Table 68. Asia Pacific Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)    72

Table 69. Asia Pacific Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)    72

Table 70. Asia Pacific Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)        73

Table 71. Asia Pacific Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)        73

Table 72. Asia Pacific Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)        74

Table 73. Asia Pacific Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)        75

Table 74. Asia Pacific Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)            76

Table 75. Asia Pacific Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)            76

Table 76. Asia Pacific Wafer Bonding Equipment Revenue by Region (2020-2025) & (US$ Million)            77

Table 77. Asia Pacific Wafer Bonding Equipment Revenue by Region (2026-2031) & (US$ Million)            78

Table 78. Asia Pacific Wafer Bonding Equipment Sales by Region (2020-2025) & (Units)    79

Table 79. Asia Pacific Wafer Bonding Equipment Sales by Region (2026-2031) & (Units)    79

Table 80. South America Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)    86

Table 81. South America Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)    86

Table 82. South America Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)            87

Table 83. South America Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)            87

Table 84. South America Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)        88

Table 85. South America Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)        89

Table 86. South America Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)       90

Table 87. South America Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)       90

Table 88. South America Wafer Bonding Equipment Revenue by Country (2020-2025) & (US$ Million)            91

Table 89. South America Wafer Bonding Equipment Revenue by Country (2026-2031) & (US$ Million)            92

Table 90. South America Wafer Bonding Equipment Sales by Country (2020-2025) & (Units)        92

Table 91. South America Wafer Bonding Equipment Sales by Country (2026-2031) & (Units)        93

Table 92. Middle East and Africa Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)        95

Table 93. Middle East and Africa Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)        95

Table 94. Middle East and Africa Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)  96

Table 95. Middle East and Africa Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)  96

Table 96. Middle East and Africa Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)  97

Table 97. Middle East and Africa Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)  98

Table 98. Middle East and Africa Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)       99

Table 99. Middle East and Africa Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)       99

Table 100. Middle East and Africa Wafer Bonding Equipment Revenue by Country (2020-2025) & (US$ Million)             100

Table 101. Middle East and Africa Wafer Bonding Equipment Revenue by Country (2026-2031) & (US$ Million)             101

Table 102. Middle East and Africa Wafer Bonding Equipment Sales by Country (2020-2025) & (Units)        101

Table 103. Middle East and Africa Wafer Bonding Equipment Sales by Country (2026-2031) & (Units)        101

Table 104. EV Group Company Details           102

Table 105. Company and Business Overview  102

Table 106. EV Group Wafer Bonding Equipment Introduction   103

Table 107. EV Group Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     104

Table 108. SUSS MicroTec Company Details 104

Table 109. Company and Business Overview  105

Table 110. SUSS MicroTec Wafer Bonding Equipment Introduction                 106

Table 111. SUSS MicroTec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)          107

Table 112. Tokyo Electron Company Details  107

Table 113. Company and Business Overview  108

Table 114. Tokyo Electron Wafer Bonding Equipment Introduction                 108

Table 115. Tokyo Electron Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)          109

Table 116. Applied Microengineering Company Details               109

Table 117. Company and Business Overview  110

Table 118. Applied Microengineering Wafer Bonding Equipment Introduction          110

Table 119. Applied Microengineering Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)       111

Table 120. Nidec Machine Tool Company Details         112

Table 121. Company and Business Overview  112

Table 122. Nidec Machine Tool Wafer Bonding Equipment Introduction                 113

Table 123. Nidec Machine Tool Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     114

Table 124. Ayumi Industry Company Details 114

Table 125. Company and Business Overview  115

Table 126. Ayumi Industry Wafer Bonding Equipment Introduction                 115

Table 127. Ayumi Industry Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)          116

Table 128. Shanghai Micro Electronics Company Details             117

Table 129. Company and Business Overview  117

Table 130. Shanghai Micro Electronics Wafer Bonding Equipment Introduction          118

Table 131. Shanghai Micro Electronics Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)       118

Table 132. U-Precision Tech Company Details              119

Table 133. Company and Business Overview  119

Table 134. U-Precision Tech Wafer Bonding Equipment Introduction                 120

Table 135. U-Precision Tech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)          120

Table 136. Hutem Company Details 121

Table 137. Company and Business Overview  121

Table 138. Hutem Wafer Bonding Equipment Introduction         122

Table 139. Hutem Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     123

Table 140. Canon Company Details 123

Table 141. Company and Business Overview  124

Table 142. Canon Wafer Bonding Equipment Introduction         124

Table 143. Canon Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     125

Table 144. Bondtech Company Details            125

Table 145. Company and Business Overview  126

Table 146. Bondtech Wafer Bonding Equipment Introduction    126

Table 147. Bondtech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     127

Table 148. TAZMO Company Details              127

Table 149. Company and Business Overview  128

Table 150. TAZMO Wafer Bonding Equipment Introduction     128

Table 151. TAZMO Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     129

Table 152. Aimechatec Company Details        129

Table 153. Company and Business Overview  130

Table 154. Aimechatec Wafer Bonding Equipment Introduction                 130

Table 155. Aimechatec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)     131

Table 156. Key Raw Materials            132

Table 157. Wafer Bonding Equipment Distributors List               143

Table 158. Wafer Bonding Equipment Customers List 143

Table 159. Market Key Trends           144

Table 160. Key Challenges 145

Table 161. Market Favorable Factors and Unfavorable Factors   145

Table 162. Market Risks     145

Table 163. Industry Enters Major Barriers      146

Table 164. Research Programs/Design for This Report                 150

Table 165. Key Data Information from Secondary Sources           154

Table 166. Key Data Information from Primary Sources               155

Table 167. QYR Business Unit and Senior & Team Lead Analysts                 156

List of Figures

Figure 1. Wafer Bonding Equipment Product Picture   1

Figure 2. Global Wafer Bonding Equipment Market Share by Type: 2024                 3

Figure 3. Global Wafer Bonding Equipment Market Share by Application in 2024   7

Figure 4. Global Wafer Bonding Equipment Revenue 2020-2031 (US$ Million)        10

Figure 5. Global Wafer Bonding Equipment Revenue Market Share by Region in Percentage: 2024                 12

Figure 6. Global Wafer Bonding Equipment Revenue Market Share by Region 2024           14

Figure 7. Global Wafer Bonding Equipment Sales 2020-2031 (Units)                 15

Figure 8. Global Wafer Bonding Equipment Sales Market Share by Region 2024        17

Figure 9. North America Wafer Bonding Equipment Sales YoY (2020-2031) & (Units)    18

Figure 10. North America Wafer Bonding Equipment Revenue YoY (2020-2031) & (US$ Million)        19

Figure 11. Europe Wafer Bonding Equipment Sales YoY (2020-2031) & (Units)   20

Figure 12. Europe Wafer Bonding Equipment Revenue YoY (2020-2031) & (US$ Million)   21

Figure 13. Asia Pacific Wafer Bonding Equipment Sales YoY (2020-2031) & (Units)                22

Figure 14. Asia Pacific Wafer Bonding Equipment Revenue YoY (2020-2031) & (US$ Million)        23

Figure 15. South America Wafer Bonding Equipment Sales YoY (2020-2031) & (Units)    24

Figure 16. South America Wafer Bonding Equipment Revenue YoY (2020-2031) & (US$ Million)        25

Figure 17. Middle East, Africa Wafer Bonding Equipment Sales YoY (2020-2031) & (Units)        26

Figure 18. Middle East, Africa Wafer Bonding Equipment Revenue YoY (2020-2031) & (US$ Million)            27

Figure 19. Global Wafer Bonding Equipment Sales Market Share by Type 2024        38

Figure 20. Global Wafer Bonding Equipment Revenue Market Share by Type 2024              40

Figure 21. Global Wafer Bonding Equipment Sales Market Share by Application 2024  44

Figure 22. Global Wafer Bonding Equipment Revenue Market Share by Application 2024  46

Figure 23. North America Wafer Bonding Equipment Sales Market Share by Type 2024         49

Figure 24. North America Wafer Bonding Equipment Revenue Market Share by Type 2024              50

Figure 25. North America Wafer Bonding Equipment Sales Market Share by Application 2024              51

Figure 26. North America Wafer Bonding Equipment Revenue Market Share by Application 2024  53

Figure 27. North America Wafer Bonding Equipment Revenue Share by Country 2024        54

Figure 28. North America Wafer Bonding Equipment Sales Share by Country 2024        55

Figure 29. US Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        56

Figure 30. Canada Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        57

Figure 31. Mexico Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        58

Figure 32. Europe Wafer Bonding Equipment Sales Market Share by Type 2024        60

Figure 33. Europe Wafer Bonding Equipment Revenue Market Share by Type 2024              61

Figure 34. Europe Wafer Bonding Equipment Sales Market Share by Application 2024  62

Figure 35. Europe Wafer Bonding Equipment Revenue Market Share by Application 2024  63

Figure 36. Europe Wafer Bonding Equipment Revenue Share by Country 2024        65

Figure 37. Europe Wafer Bonding Equipment Sales Share by Country 2024                 66

Figure 38. Germany Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        67

Figure 39. France Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        68

Figure 40. U.K. Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        69

Figure 41. Italy Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        70

Figure 42. Russia Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        71

Figure 43. Asia Pacific Wafer Bonding Equipment Sales Market Share by Type 2024              73

Figure 44. Asia Pacific Wafer Bonding Equipment Revenue Market Share by Type 2024         74

Figure 45. Asia Pacific Wafer Bonding Equipment Sales Market Share by Application 2024  75

Figure 46. Asia Pacific Wafer Bonding Equipment Revenue Market Share by Application 2024              77

Figure 47. Asia Pacific Wafer Bonding Equipment Revenue Share by Region 2024           78

Figure 48. Asia Pacific Wafer Bonding Equipment Sales Share by Region 2024        80

Figure 49. China Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        81

Figure 50. Japan Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        82

Figure 51. South Korea Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)   83

Figure 52. India Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        84

Figure 53. Southeast Asia Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        85

Figure 54. South America Wafer Bonding Equipment Sales Market Share by Type 2024         87

Figure 55. South America Wafer Bonding Equipment Revenue Market Share by Type 2024              88

Figure 56. South America Wafer Bonding Equipment Sales Market Share by Application 2024              89

Figure 57. South America Wafer Bonding Equipment Revenue Market Share by Application 2024  91

Figure 58. South America Wafer Bonding Equipment Revenue Share by Country 2024        92

Figure 59. South America Wafer Bonding Equipment Sales Share by Country 2024        93

Figure 60. Brazil Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)        94

Figure 61. Middle East and Africa Wafer Bonding Equipment Sales Market Share by Type 2024              96

Figure 62. Middle East and Africa Wafer Bonding Equipment Revenue Market Share by Type 2024                97

Figure 63. Middle East and Africa Wafer Bonding Equipment Sales Market Share by Application 2024  98

Figure 64. Middle East and Africa Wafer Bonding Equipment Revenue Market Share by Application 2024     100

Figure 65. Figure Manufacturing Cost Structure of Wafer Bonding Equipment             136

Figure 66. Sales Channel: Direct Channel vs Indirect Channel    138

Figure 67. Direct Channel Pros & Cons           139

Figure 68. Indirect Channel Pros & Cons         140

Figure 69. Marketing Channels of Wafer Bonding Equipment by Method                 141

Figure 70. Porter’s Five Forces Analysis           147

Figure 71. Bottom-up and Top-down Approaches for This Report                 152

Figure 72. Data Triangulation            153

Figure 73. Key Executives Interviewed              155

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