CVD、ALD、SOD誘電体前駆体 2025-2026年

CVD, ALD And SOD Dielectric Precursors 2025-2026

CVD、ALD、SOD誘電体前駆体のサプライチェーンと市場分析 2025-2026年
2025-2026 CMR™ CVD, ALD And SOD Dielectric Precursors Supply-Chain & Market Analysis A Critical Materials Report™

商品番号:SMB-3017
出版社TECHCET
出版年月2025年6月
ページ数128
図表数76
価格タイプベーシックライセンス
価格USD 8,900
種別英文調査報告書
Chapter 7(Supplier Profiles)のページ数は含まれていません。

TECHCET(テクセット)「CVD、ALD、SOD誘電体前駆体のサプライチェーンと市場分析 2025-2026年 – CVD, ALD And SOD Dielectric Precursors Supply-Chain & Market 2025-2026」は半導体デバイス製造に使用されている前駆体(プリカーサー)、特に化学気相成長(CVD)/原子層堆積法(ALD)/SOD(Spin-on-Dielectric)前駆体市場を調査し、市場状況とサプライチェーンを調査しています。また材料サプライチェーンにおける課題や動向、サプライヤの市場シェアについての評価、材料セグメント予測など、誘電体前駆体関連の主要サプライヤ情報を提供しています。

当レポートの特長

  • 無機前駆体(無機プリカーサー)および有機前駆体(有機プリカーサー)関連市場および技術動向に関する情報を提供。ILDs&Low-k絶縁体、ハードマスク、側壁スペーサ、エッチストップ層を含むCVD、ALD、SOD用途についても解説。
  • サプライチェーンマネージャー、生産統合、R&D管理者、事業開発、財務アナリストに関する情報
  • 主要サプライヤ、材料供給における問題/動向、サプライヤの市場シェア評価、材料市場予測

主な掲載内容

  • エグゼクティブサマリー
  • 範囲、目的、調査手法
  • 半導体産業の市場状況と展望
    • 世界経済と展望
    • 電子製品セグメント別チップ売上
    • 半導体製造の成長と拡大
    • 政策&貿易動向と影響
    • 半導体材料展望
  • 材料市場動向
    • CVD、ALD金属&High-K、高度誘電体前駆体市場動向
    • 価格動向
    • 技術動向/技術的促進要因 – 概略
    • EHSおよび貿易/物流問題 – 金属、High-K、誘電体
    • 誘電体市場動向:アナリストによる評価
  • 供給サイドの市場での活動
    • 主要サプライヤ:活動と公表収益
    • 事業分離、M&A、提携
    • 工場閉鎖
    • 新規参入企業:報告なし
    • 継続の危機にあるサプライヤーまたは部品/製品ライン:なし
    • TECHCETアナリストによるプリカーサーサプライア評価
  • サブティア材料サプライチェーン:材料
    • サブティアのサプライチェーン:原料と市場概観
    • サブティアのサプライチェーン:プリカーサーの主要製造元
    • ALD/CVD装置OEMサブティアのM&A
    • 産業用と半導体グレードの比較:ティア1とサブティアの品質比較
    • サブティアのサプライチェーン:サブティアのプリカーサー市場ランキング
    • サブティアサプライチェーンにおける現地投資へのシフト
    • サブティアサプライチェーンのEHSと物流問題
    • サブティアサプライチェーンにおける工場閉鎖:報告なし
  • サプライヤ情報

Report Overview

This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.

  • Provides market and technical trend information on organic and inorganic precursors, addressing CVD, ALD, and SOD applications including ILDs & low-κ dielectrics, hard masks, sidewall spacers and etch stop layers
  • Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
  • Covers information about key dielectric precursor suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the electronics material segments
  • Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analyst

Analyst

Jonas Sundqvist, Ph.D., Senior Technology Analyst

Senior Analyst for CVD, ALD Dielectric Precursors and Deposition and Etch Equipment

Jonas Sundqvist is an accomplished professional with a background in inorganic chemistry and semiconductor wafer processing. He received his PhD from Uppsala University and has made significant contributions in the field of thin film deposition processes. Dr. Sundqvist’s expertise spans research, development, and practical applications in the semiconductor industry, including Etch, Epi, ALD and CVD processes, market insights, and co-founding AlixLabs, a company focused on innovative Atomic Layer Etch technology solutions

In 2003, he joined Infineon Memory Development Centre (MDC) as a process engineer, focusing on high-k and metal nitride ALD processes. Later, at Qimonda (2006), he was part of the Materials Management team, responsible for precursor procurement and acquisition, with a specific emphasis on ALD precursors for DRAM development and production. In 2009, Dr. Sundqvist joined Fraunhofer CNT as a group leader and expert in thin film deposition, emphasizing high-k dielectrics and electrode materials for Memory and CMOS. CEO of AlixLabs since 2020.

Degree in electrical engineering (Lars Kagg, Sweden), Master in Inorganic Chemistry & PhD in Inorganic Chemistry (Uppsala University, Sweden), Adjunct Associate Professor in Inorganic Chemistry (Linköping University, Sweden)


Table of Contents

1 EXECUTIVE SUMMARY

1.1 PRECURSORS MARKET TRENDS
1.2 MARKET TRENDS IMPACTING 2025 OUTLOOK
1.3 DIELECTRIC PRECURSORS 5-YEAR REVENUE FORECAST BY SEGMENT
1.4 PRECURSOR SEGMENT TRENDS
1.5 TECHNOLOGY TRENDS
1.6 DIELECTRIC PRECURSORS PRODUCTION CAPACITY OF TOP SUPPLIERS
1.7 CURRENT QUARTER TOP-5 PRECURSOR SUPPLIERS’ ACTIVITIES & REPORTED REVENUES
1.8 EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS
1.9 ANALYST ASSESSMENT OF METAL, HIGH-K & DIELECTRIC PRECURSORS MATERIALS

2 SCOPE, PURPOSE AND METHODOLOGY

2.1 SCOPE, PURPOSE & METHODOLOGY
2.2 OVERVIEW OF OTHER TECHCET CMR™ OFFERINGS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1 WORLDWIDE ECONOMY AND OUTLOOK
3.2 WORLDWIDE ECONOMY AND OVERVIEW
3.2.1 WORLDWIDE ECONOMY AND SEMICONDUCTOR MARKET OVERVIEW
3.2.2 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
3.2.3 SEMICONDUCTOR SALES GROWTH
3.2.4 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.3 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
3.3.1 FACTORS IMPACTING ELECTRONIC SYSTEMS OUTLOOK
3.3.2 PC OUTLOOK
3.3.3 SMARTPHONE OUTLOOK
3.3.4 AUTOMOTIVE INDUSTRY OUTLOOK
3.3.5 SERVERS / IT MARKET
3.4 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
3.4.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
3.4.2 PUBLIC FUNDS STIMULATING PRIVATE INVESTMENTS IN EXPANSION ACROSS THE GLOBE
3.4.3 SEMICONDUCTOR SUPPLY CHAIN ANNOUNCED EXPANSIONS IN THE US
3.4.4 EQUIPMENT SPENDING TRENDS
3.4.5 TECHNOLOGY ROADMAPS
3.5 POLICY & TRADE TRENDS AND IMPACT
3.6 SEMICONDUCTOR PRODUCTION (WAFER STARTS*) AND MATERIALS OVERVIEW
3.6.1 TECHCET WAFER STARTS FORECAST THROUGH 2029
3.6.2 TECHCET ELECTRONIC MATERIALS MARKET FORECAST THROUGH 2028

4 PRECURSOR MARKETTRENDS

4.1 PRECURSORS MARKET TRENDS
4.1.1 PRECURSOR MARKET OUTLOOK
4.1.2 2023 PRECURSOR MARKET LEADING INTO 2024
4.2 MARKET DRIVERS FROM LOGIC DEVICE GROWTH
4.2.1 LOGIC MARKET OUTLOOK
4.3 MARKET DRIVERS FROM DRAM DEVICE GROWTH
4.3.1 DRAM MARKET OUTLOOK
4.4 MARKET DRIVERS FROM 3DNAND DEVICE GROWTH
4.4.1 3DNAND MARKET OUTLOOK
4.5 MARKET STATISTICS – DIELECTRIC PRECURSORS 5-YEAR REVENUE FORECAST BY SEGMENT
4.5.1 DIELECTRIC PRECURSORS SUPPLIER MARKET SHARES
4.5.2 DIELECTRIC PRECURSOR REVENUE BY REGION
4.6 PRECURSOR PRODUCTION CAPACITY EXPANSIONS
4.6.1 INVESTMENT ANNOUNCEMENTS OVERVIEW
4.6.2 INVESTMENT ACTIVITY ADDITIONAL COMMENTS
4.7 PRICING TRENDS
4.8 TECHNOLOGY TRENDS/TECHNICAL DRIVERS – OUTLINE
4.8.1 DRAM TECHNOLOGY TRENDS
4.8.2 3DNAND TECHNOLOGY TRENDS
4.8.3 LOGIC TECHNOLOGY TRENDS
4.8.4 LOGIC TECHNOLOGY ROADMAP
4.9 DIELECTRIC PRECURSOR TECHNOLOGY TRENDS AND DEVELOPMENTS
4.9.1 DIELECTRIC PRECURSOR GENERAL TECHNOLOGY OVERVIEW
4.9.2 RECENT TRENDS ADVANCES IN DIELECTRIC ALD SIO2 AND SIN
4.9.3 RECENT TRENDS IN BIS(DIISOPROPYLAMINO)DISILANE (BDIPADS) FOR LOW TEMPERATURE ALD OF SIO2
4.9.4 PATENT FILING FOR BDIPADS
4.9.5 BDIPADS, TIER 2 SUPPLIERS
4.9.6 PATENT FILING FOR DIODOSILANE
4.9.7 PATENT FILING FOR DIODOSILANE – ASM, TOPOLOGICAL SELECTIVE DEPOSITION
4.9.8 PATENT FILING FOR DIODOSILANE – ASM, TOPOLOGICAL & MATERIAL SELECTIVE DEPOSITION 84
4.9.9 RECENT PROGRESS IN SPIN ON DIELECTRICS – INDUSTRY TREND
4.9.10 RECENT PROGRESS IN SPIN ON DIELECTRICS – DRAM
4.10 IP FILING CVD AND ALD SINCE 2001
4.11 REGIONAL CONSIDERATIONS – IP FILING IN CVD AND ALD
4.11.1 REGIONAL ASPECTS AND DRIVERS
4.12 EHS AND TRADE/LOGISTIC ISSUES
4.12.1 EHS ISSUES
4.12.2 TRADE/LOGISTICS ISSUES
4.13 ANALYST ASSESSMENT OF PRECURSOR MARKET TRENDS

5 SUPPLY-SIDE MARKET ACTIVITY

5.1 LEADING SUPPLIERS – ACTIVITIES & REPORTED REVENUES
5.1.1 CURRENT QUARTER ACTIVITY – AIR LIQUIDE Q1/2025
5.1.2 CURRENT QUARTER ACTIVITY – MERCK (EMD) Q1/2025
5.1.3 CURRENT QUARTER ACTIVITY – ADEKA Q4/2024
5.1.4 CURRENT QUARTER ACTIVITY – DUPONT Q1/2025
5.2 DIVESTITURES, M&A AND PARTNERSHIPS
5.2.1 DIVESTITURES, M&A AND PARTNERSHIPS – QNITY
5.2.2 DIVESTITURES, M&A AND PARTNERSHIPS – HONEYWELL
5.2.3 DIVESTITURES, M&A AND PARTNERSHIPS – KOREAN SUPPLIERS
5.2.4 DIVESTITURES, M&A AND PARTNERSHIPS – JSR
5.2.5 DIVESTITURES, M&A AND PARTNERSHIPS – NAGASE
5.3 PLANT CLOSURES
5.4 NEW ENTRANTS – NONE TO REPORT
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS – NONE
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS

6 SUB-TIER SUPPLY CHAIN, MATERIAL

6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW
6.2 SUB-TIER SUPPLY CHAIN: KEY MANUFACTURING SOURCES OF PRECURSORS
6.3 ALD/CVD EQUIPMENT M&A OF THE OEM SUB-TIER
6.4 INDUSTRIAL VS. SEMICONDUCTOR-GRADE – TIER-1 VS. SUB-TIER QUALITY
6.5 SUB-TIER SUPPLY CHAIN: SUB-TIER PRECURSOR MARKET RANKING
6.5.1 RAW MATERIALS CAPACITY EXPANSIONS
6.6 SHIFT TO LOCAL INVESTMENT IN THE SUB-TIER SUPPLY-CHAIN
6.7 SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
6.7.1 SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES – LISTED MATERIAL TYPE
6.8 SUB-TIER SUPPLY-CHAIN PLANT CLOSURES – NONE TO DATE

7 SUPPLIER PROFILES

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
AND MORE …

FIGURES

FIGURE 1.1: DIELECTRIC PRECURSORS REVENUE FORECAST BY SEGMENT (US $M’S)
FIGURE 1.2: WW MARKET SHARE – DIELECTRIC PRECURSORS 2024 (U$ 815 M)
FIGURE 1.3: TOP-5 PUBLIC PRECURSOR MAKERS’ QUARTERLY COMBINED SALES
FIGURE 3.1: HISTORICAL AND FORECASTED GDP GROWTH (2000 – 2029)
FIGURE 3.2: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2024)
FIGURE 3.3: WORLDWIDE SEMICONDUCTOR SALES ($B)
FIGURE 3.4: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI) MOMENTUM TRACKER
FIGURE 3.5: 2024 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.6: SMARTPHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.7: GLOBAL LIGHT VEHICLE PRODUCTION FORECAST (IN MILLIONS OF UNITS)
FIGURE 3.8: US EV RETAIL SHARE FORECAST
FIGURE 3.9: AUTOMOTIVE SEMICONDUCTOR REVENUES HISTORY AND FORECAST (ESTIMATED, B$’S USD)
FIGURE 3.10: AI VALUE FORECAST ($B’S USD)
FIGURE 3.11: SCALE OF TODAY’S AI-CENTRIC DATA CENTERS
FIGURE 3.12: TSMC PHOENIX FAB INVESTMENT TO EXCEED US $65B
FIGURE 3.13: ESTIMATED GLOBAL FAB INVESTMENT 2024-2029 ($858.6B)
FIGURE 3.14: ANNOUNCED PUBLIC STIMULUS AND RESPECTIVE SEMICONDUCTOR CHIP MANUFACTURING REGIONS
FIGURE 3.15: SEMICONDUCTOR SUPPLY CHAIN EXPANSIONS WITHIN THE US
FIGURE 3.16: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M)
FIGURE 3.17: TSMC LOGIC ROADMAP BY NODE
FIGURE 3.18: TECHCET WAFER START FORECAST BY NODE SEGMENTS MILLIONS OF 200MM EQUIVALENTS PER YEAR
FIGURE 3.19: TECHCET WORLDWIDE ELECTRONIC MATERIALS FORECAST ($M USD)
FIGURE 4.1: LOGIC WAFER STARTS, SUB 65 NM
FIGURE 4.2: INCREASED ALD AND EPI SAM WITH MOVE TO GAA
FIGURE 4.3: LOGIC WAFER STARTS, GAA-FET NODES
FIGURE 4.4: DRAM WAFER STARTS
FIGURE 4.5: HBM STACKING CONFIGURATIONS
FIGURE 4.6: NAND WAFER STARTS
FIGURE 4.7: LAM RESEARCH’S ALTUS® HALO
FIGURE 4.8: DIELECTRIC PRECURSORS REVENUE FORECAST BY SEGMENT (US$ M’S)
FIGURE 4.9: WW MARKET SHARE – DIELECTRIC PRECURSORS 2024 (U$ 815 M) 62
FIGURE 4.10: DIELECTRIC PRECURSOR REVENUE BY REGION
FIGURE 4.11: ADVANCED DEVICE TECHNOLOGY DRIVE DEMAND FOR MORE ALD PRECURSORS
FIGURE 4.12: ADVANCED DEVICE TECHNOLOGY ROADMAP – HVM DRAM, INCLUDING RISK STARTS
FIGURE 4.13: ADVANCED DEVICE TECHNOLOGY ROADMAP OVERVIEW – HVM 3D NAND, INCLUDING RISK STARTS
FIGURE 4.14: ADVANCED DEVICE TECHNOLOGY ROADMAP OVERVIEW – HVM LOGIC/FOUNDRY, INCLUDING RISK STARTS
FIGURE 4.15: SEMS OF LOGIC GATE STRUCTURES 2009 TO BEYOND 2025
FIGURE 4.16: ADVANCED 3DNAND STAIRSTEPS
FIGURE 4.17: LOW TEMPERATURE GROWTH OF HIGH QUALITY SIO2 FILMS
FIGURE 4.18: PATENT FAMILIES AND APPLICATIONS FOR BDIPADS
FIGURE 4.19: BDIPADS PATENT CITATION VELOCITY
FIGURE 4.20: PATENT FAMILIES AND APPLICATIONS FOR DIS
FIGURE 4.21: DIELECTRIC SELECTIVE DEPOSITION SEQUENCE BY ASM
FIGURE 4.22: ASD OF DIELECTRIC ON METAL (DOM)
FIGURE 4.23: THE INDUSTRY TREND FOR SPIN-ON DIELECTRICS (SOD)
FIGURE 4.24: THE APPLICATION OF SOD IN VARIOUS REGIONS OF A DRAM STRUCTURES
FIGURE 4.25: PHPS (PERHYDRO-POLYSILAZANE)
FIGURE 4.26: PHPS (PERHYDRO-POLYSILAZANE)
FIGURE 4.27: CVD AND ALD PATENT FILING SINCE 2001 BY COMPANY
FIGURE 4.28: NUMBER OF CVD AND ALD PATENT FILING SINCE 2001
FIGURE 4.29: MAPPING LOCATION OF CVD AND ALD PATENT FILING SINCE 2001
FIGURE 4.30: ENVIRONMENTAL FOOTPRINT OF MOORES LAW – CO2 EMISSIONS (ENERGY CONSUMPTION RAMP OF LEADING EDGE NODES)
FIGURE 4.31: IMPACT OF EUV – ELECTRICAL ENERGY CONSUMPTION
FIGURE 4.32: INTEL AND TSMC SUSTAINABILITY GOALS
FIGURE 5.1: TOP-5 PUBLIC PRECURSOR MAKERS’ QUARTERLY COMBINED SALES
FIGURE 5.2: AIR LIQUIDE CURRENT QUARTER FINANCIALS
FIGURE 5.3: MERCK CURRENT QUARTER FINANCIALS
FIGURE 5.4: ADEKA CURRENT QUARTER FINANCIALS
FIGURE 5.5: DUPONT CURRENT QUARTER FINANCIALS
FIGURE 6.1: CHIP FAB MANUFACTURING CAPACITY OF ASIA VS. US 1990-2023
FIGURE 6.2: REE REFINING PROCESS FLOW (I.E., COBALT)

TABLES

TABLE 1.1: REVENUE FORECASTS
TABLE 1.2: ESTIMATED MARKET SHARE BY SUPPLIER
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
TABLE 3.2: INITIALLY ANNOUNCED* US RECIPROCAL TARIFF SCHEDULE
TABLE 3.3: WORLDWIDE PC FORECAST BY SEGMENT
TABLE 3.4: IT MARKET SPENDING FORECAST, 2025
TABLE 4.1: REVENUE FORECASTS
TABLE 4.2: ESTIMATED MARKET SHARE BY SUPPLIER – DIELECTRIC PRECURSORS
TABLE 4.3: OVERVIEW OF ANNOUNCED 2024/2025 PRECURSOR SUPPLIER INVESTMENTS
TABLE 4.4: DIELECTRIC FILMS AND PROCESS APPLICATIONS
TABLE 4.5: BDIPADS SUPPLIERS TIER 2, OVERVIEW
TABLE 4.6: DESCRIPTIONS OF PRECURSOR MARKET DYNAMICS BY REGION
TABLE 4.7: ESG REPORTING BY INDUSTRY LEADERS IN SEMICONDUCTOR MANUFACTURING
TABLE 6.1: SUB-TIER PRECURSOR DEMAND SEMICONDUCTOR VS. ELECTRONIC VS. INDUSTRIAL
TABLE 6.2: 2024 EXCLUSIVE SUB-TIER PRECURSOR SUPPLIERS RANKING OF THE TOP 3

プレスリリース

TECHCET Predicts Semiconductor ALD/CVD Precursor Market Outlook Highlights Growth

San Diego, CA, June 18, 2025: TECHCET — the electronic materials advisory firm providing semiconductor materials supply chain information— forecasts the global semiconductor precursor market will maintain solid growth through 2025 and beyond, with a projected 10.4% CAGR in revenues through 2029. This trend is supported by advancements in sub-3nm logic, and the increasing demand for AI, HPC, and regional fab expansions in the US, EU, and Asia technologies according to TECHCET’s 2025 Critical Materials Report™ on ALD/CVD Precursors.

ALD/CVD Dielectric Precursors Market - TECHCET

In 2024, the market rebounded to $1.7 billion following a downturn in 2023, driven by activity in 2nm/3nm logic, GAA-FET adoption, and a partial recovery in NAND and DRAM wafer starts. The broader semiconductor materials market reached $66.3 billion, and innovations in dry resist, molybdenum-based metallization, and low-k dielectrics are expected to contribute to further growth over the next five years.

The semiconductor precursor market is growing due to scaling in sub-3nm logic, the adoption of gate-all-around (GAA) transistors, and increasing DRAM and 3DNAND complexity. However, ongoing trade tensions, such as US tariffs on Chinese tungsten and China’s December 2024 germanium export ban, are creating uncertainty and material shortages. Heavy reliance on imports for critical materials like cobalt, tungsten, and rare earths from high-risk regions (e.g., China, Congo) exposes the supply chain to geopolitical instability and trade policy shifts. Regionalization efforts are underway in the US, EU, and Japan to reduce dependency on Chinese and other high-risk sources.

“Sustainability is becoming a procurement priority, pushing suppliers to improve EHS compliance and invest in cleaner chemistries and more recycling,” stated Lita Shon-Roy, CEO/President of TECHCET. Challenges that need to be overcome include high-temperature processing and hazardous waste handling which present barriers to recycling efficiency, especially where radioactive or corrosive byproducts are involved.

For more details on TECHCET Critical Materials Reports™ on ALD/CVD Precursors, associated suppliers such as Air Liquide, Adeka, EMD / Merck, Entegris, DuPont, Umicore, Nata and others, or to request a sample report, visit https://chosareport.com/techcet-dielectric-precursor/


※下記は2024年版のプレスリリースです。

Semiconductor ALD/CVD Precursors Driven by Advanced Applications

Mo, WF6, and Co precursors to see significant growth

 San Diego, CA, August 1, 2024: TECHCET— the electronic materials advisory firm providing business and technology information —is forecasting semiconductor metal and oxide precursors to reach US$1.7 B in revenues in 2024, rising 15% over 2023. This is the highest growth rate among all front process materials segments. Metal/Metal-oxide precursors occupy the majority of the market with expected revenues at $972 M, while Dielectric Precursors are expected to total US$742 M. The precursor market is forecasted to increase at a 9% CAGR from 2023-2028. More information on market forecasting and trends is included in TECHCET’s new Critical Materials Reports™ on ALD/CVD Precursors.

Significant investments are being made in advanced process technologies such as GAA FETs, EUV lithography, and high-k/metal gate transistors, all of which are crucial for next-generation Logic, DRAM, and 3D NAND devices. Recovery of precursor revenue growth is being driven by AI and advanced technology applications. Additionally, metallization for backside power delivery at 2nm logic nodes and beyond is also pushing up growth for metal precursors.

Molybdenum (Mo) precursors, specifically MoO2Cl2, are projected to experience high growth due to their favorable electrical properties and application in next-generation devices. Other precursors strongly tied to advanced device nodes include Cobalt precursors (CoCOCp and CCTBA) and Tungsten Hexafluoride (WF6).

The shift towards more sustainable and efficient production methods is influencing the development of new precursors, with a focus on reducing environmental impact and improving manufacturing efficiency.

Major industry players are expanding their production capacities in order to meet growing demand. Companies such as Air Liquide, Merck, and Gelest/Mitsubishi Chemical Group are making significant investments in production facilities in key regions like Taiwan, South Korea, and the US.

The newly released TECHCET Critical Materials Reports™ on ALD/CVD Precursors contains details on market and technology trends and supplier profiles.