出版：TECHCET（テクセット） 出版年月：2023年3月
Silicon Carbide: A Unique Semiconductor Material For Challenging Applications
シリコンカーバイド 2023-2024年
| ページ数 | 84 |
| 図表数 | 67 |
| 価格（ベーシックライセンス） | USD 8,900 |
| 種別 | 英文調査報告書 |
TECHCET（テクセット）「シリコンカーバイド 2023-2024年 – Silicon Carbide: A Unique Semiconductor Material For Challenging Applications」は半導体デバイス製造に使用されるシリコンカーバイド（SiC）ウエハー市場を調査し、市場成長促進要因、ウエハー予測、ウエハー製造環境、サプライヤの活動等を分析・解説しています。
主な掲載内容
- エグゼクティブサマリー
- SiCウエハ市場概観
- シリコンカーバイド市場の促進要因
- その他のワイドバンドギャップ半導体（WBG半導体）材料
- サプライヤの活動
- 調査範囲、目的、メソドロジー
- SiCウエハ市場展望
- シリコンカーバイドのエンドユース用途市場の促進要因
- 半導体デバイス製造市場の促進要因
- SiC市場促進要因サマリー
- 有望ディスラプティブ技術 – 窒化ガリウム（GaN）、酸化ガリウム（Ga Oxide）
- シリコンカーバイド市場環境
- SiCウエハの製造コストと考察
- サプライチェーンと企業情報
Report Overview
TECHCET’s Special Report on Silicon Carbide (SiC) wafers used to make semiconductor devices includes market drivers, wafer forecast, wafer-making landscape, and supplier activities. This report also includes a comprehensive look at wafer making, including manufacturing costs and consumable and capital expenditures costs needed to build a wafer-making facility.
Who will benefit from this report?
Chip fabricators, SiC wafer makers, investors, and policymakers. This essential set of Information is needed to plan and deliver SiC devices and wafers to meet growing global demand.
ANALYST BIOGRAPHY
Robert Rhoades is the President and CTO of X-trinsic Inc. and a frequent contributor to TECHCET’s CMP Critical Consumables Reports. He earned a Ph.D. in Electrical Engineering from the University of Illinois in 1992. His background includes 2 years at Oak Ridge National Laboratory researching high density
plasma technology followed by 3 years at Motorola as a senior process engineer leading their efforts to bring CMP into silicon device manufacturing for the first time. In 1997, he joined a small slurry company, Solution Technology, Inc, which was later acquired by Rodel, Inc (now part of Dupont). During five years at Rodel, he led the global process engineering team and managed multiple applications labs in the USA and Asia. In 2002, Dr. Rhoades joined Entrepix as CTO and helped launch a new business model providing process and equipment services for customers using CMP for everything from R&D prototypes through volume production on virtually any material. In 2017, he joined Revasum, a polisher and grinder OEM based in San Luis Obispo, CA, where he served as CTO and led development efforts for advanced polishing and grinding equipment, particularly focused on ultrahard materials
such as silicon carbide. Dr. Rhoades is a named inventor on more than 12 patents or patent applications and has authored more than 140 technical publications and conference presentations.
Ian Currier is the Director of Process Technology for X-trinsic Inc. He has spent his career conducting research and developing processes for the fabrication of exceptionally hard materials including sapphire, silicon carbide, and diamond. While at II-VI, Inc., he initially worked on the transition from 3inch to 100 mm SiC wafers. Later, he spearheaded the efforts to develop the first fabrication methods to effectively produce large diamond optics for extreme ultra-violet lithography systems. In 2105, he joined Cree, Inc. (later Wolfspeed) and drove the development of the first single-wafer processes in preparation for 200 mm wafer production. This involved working in tandem with the original equipment manufacturers to modify their machines for the unique requirements of silicon carbide. It also required heavy coordination with consumable suppliers to optimize their products to enable cost-effective, high yielding wafer production.
Dan P. Tracy, Ph.D. – is TECHCET’s Sr. Director of Market Research, with a focus on sputtering targets, deposition and packaging materials. He has over 30 years of electronics market analysis experience covering semiconductor packaging, thin films, semiconductor process equipment, and semiconductor materials. He has particular expertise in analyzing dependencies between equipment and materials, and between the front- and back-end of the semiconductor industry, including insights pertaining to LEDs, MEMS, and sensors. Prior to TECHCET he led the Industry Research & Statistics group at SEMI as Sr. Director and worked for Rose Associates covering electronic materials as a Sr. Analyst. Additionally, Dan has a background in packaging
engineering from National Semiconductor He holds a Ph.D. in Materials Engineering from Rensselaer Polytechnic Institute, a M.S. in Materials Science & Engineering from Rochester Institute of Technology, and a B.S. in Chemistry from SUNY College of Environmental Science and Forestry.
目次
1 Executive Summary 9
1.1 SiC Wafer Market Overview 9
1.2 Silicon Carbide Market Drivers 10
1.3 Other Wide Bandgap (WBG) Semiconductor Materials 10
1.4 Supplier Activities 11
1.5 General Comments 11
2 Scope, Purpose and Methodology 13
2.1 Scope 13
2.2 Purpose 13
2.3 Methodology 13
2.4 Overview of Other TECHCET CMR™ Reports 14
3 SiC Wafer Market Outlook 15
3.1 Silicon Carbide End-Use Application Market Drivers 15
3.1.1 Market Driver: Electric Vehicles & Charging Stations 17
3.1.2 Market Driver: Data Centers and Power Devices 21
3.1.3 Market Driver: 5G Communications 25
3.2 Semiconductor Device Manufacturing Market Drivers 26
3.2.1 Inverter Modules 27
3.2.2 Power Devices Forecast (Diodes and MOSFETs). 27
3.2.3 Power Inverter Modules (for EV’s) 29
3.3 Summary of SiC Market Drivers 29
3.4 Potentially Disruptive Technologies – GaN, Ga Oxide 29
4 Silicon Carbide Market Landscape 31
4.1 Economic and Industry Trends 31
4.2 SiC Wafer Forecast 33
4.2.1 N-Type Wafer Forecast 34
4.2.2 Semi-Insulating Wafer Forecast 36
4.3 SiC Wafer Suppliers and Market Shares 37
4.4 Supplier Activities – M&A 39
4.5 Comments on Regional and Global Trends 39
5 SiC Wafer Manufacturing Costs and Considerations 41
5.1 Brief History of SiC as a Semiconductor Substrate 41
5.2 SiC Material Properties 44
5.3 SiC Wafering Process Flow 46
5.3.1 SiC Wafering Sequence 46
5.3.2 SiC Boule Growth 47
5.4 SiC Wafer Manufacturing Cost Breakdown 48
5.4.1 SiC Furnace Capacity Planning 51
5.4.2 SiC Crystal Growth Consumables 53
5.4.3 OD Grinding (and puck grinding if needed) 54
5.4.4 Wafer Slicing 57
5.4.5 Edge Grinding 61
5.4.6 Pre-Polishing 64
5.4.7 Polishing/CMP and Cleaning 69
5.4.8 Epitaxy 73
5.4.9 Comments regarding OEM landscape for process equipment 74
6 Supply Chain and Company Profiles 76
6.1 Raw Material Dependencies and Concerns 76
6.2 SiC Wafer Suppliers 77
6.3 SiC Device Manufacturers 78
6.4 Process Equipment Suppliers (OEM’s) 79
6.5 SiC Process Consumables 80
6.6 Company Profiles 81
7 Summary and closing comments 82
8 Appendices 84
【プレスリリース】
Silicon Carbide (SiC) Wafer Supply Gets Squeezed
Growing Demand Persists as Silicon Wafers Reach Its Limits
San Diego, CA, May 9, 2023: TECHCET— the electronic materials advisory firm providing business and technology information on semiconductor supply chains —is forecasting continued strong growth for silicon carbide (SiC) wafer through 2023, despite the slowdown in the general global economy and other semiconductor materials markets. In 2022, the SiC N-type Wafer Output Market grew ~15% over 2021, totaling 884k wafers (150 mm equivalent), as highlighted in TECHCET’s new Silicon Carbide Wafers Materials Report. This market is expected to grow even further in 2023, reaching 1072k wafers (just over 1 million 150 mm equivalent) growing ~22% over 2022, as shown below. The overall 2022-2027 CAGR is estimated to be approximately 17%.
High demand for SiC wafers comes as a result of silicon-based power devices approaching its physical limits, particularly for high-speed or high-power applications. Wide bandgap semiconductors represent the most promising of the current alternatives, and SiC is at the forefront in terms of both materials properties and supply chain maturity. Additionally, demand from electric vehicles, charging infrastructure, green energy production, and more efficient power devices in general is pushing demand higher for SiC.
While SiC is growing increasingly popular, chemical properties of the material have made it difficult to process boules into actual wafers. This has led to undersupply in the SiC wafer market. In an effort to increase boule supply over the past several years, a significant number of companies entered into or announced major expansions in SiC boule growth capacity, but very few companies have actually entered the wafering services market.
Some of this gap is being addressed by the vertically integrated SiC device companies, such as Wolfspeed, ON Semiconductor, and ST Microelectronics, who are able to balance their own production capacities internally. Other companies are attempting to address the gap by offering process services, such as X-trinsic and Halo Industries.
For more details on the Silicon Carbide (SiC) Wafer market segment and growth trajectory, go to: https://techcet.com/product/silicon-carbide-wafers/
ABOUT TECHCET: TECHCET CA LLC is an advisory services firm expert in market and supply-chain analysis of electronic materials for the semiconductor, display, solar/PV, and LED industries. TECHCET offers consulting, subscription service, and reports, including the Critical Materials Council (CMC) of semiconductor fabricators and Data Subscription Service (DSS).