スパッタリングターゲット　2023-2024年

TECHCET（テクセット）「スパッタリングターゲット　2023-2024年：サプライチェーン＆市場分析 – SPUTTERING TARGETS: SUPPLY-CHAIN & MARKET ANALYSIS」は半導体デバイス製造に使用されるスパッタリングターゲット市場を詳細に調査・分析しています。

レポートの特長

• 半導体デバイス製造に使用されるスパッタリングターゲット市場とサプライチェーンに関する詳細な調査・分析
• 原材料のサプライチェーンのダイナミクスと企業情報、ターゲット材製造コスト考察、価格動向
• サプライチェーン管理者、プロセス統合および研究開発管理者、事業展開および金融アナリスト向きの専門情報
• 主要スパッタリングターゲットサプライヤ―情報、電子材料のサプライチェーンにおける課題／動向、サプライヤ市場シェア見込み、電子材料市場予測

主な掲載内容

1. エグゼクティブサマリー
2. 調査範囲、目的、メソドロジー
3. 半導体産業市場状況＆展望
   1. 世界経済と展望
   2. 電子製品タイプ別チップ売上
   3. 半導体製造の成長と拡大
   4. 政策＆貿易動向と影響
   5. 半導体材料展望
4. スパッタリングターゲット市場状況と予測
5. サブティアサプライチェーン
   • 銅（Cu）金属- 原材料
   • タンタル（Ta） – 原材料
   • アルミニウム（Al）－ ボーキサイト＆アルミナ採鉱
   • チタン（Ti）金属 – チタン精鉱
   • タングステン（W）金属 – 採鉱
   • コバルト（Co）金属 – 採鉱
   • モリブデン（Mo） – 採鉱
   • 貴金属 – 銀（Au)の鉱業生産
   • スパッタリングターゲットの市場規模と予測
   • サブティアサプライチェーン：ディスラプション
   • サブティアサプライチェーンのM&A活動
6. 技術的促進要因／材料の変化と変遷
7. サプライヤ情報

Report Overview

• Provides a detailed look and analysis of the sputter targets market and supply chain
  as applied to semiconductor device manufacturing
• Included are raw material supply chain dynamics and companies, target manufacturing cost considerations, pricing trends and more
• Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
• Covers information about key sputter target suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronic material segments
• Single User License – provides 1 portal access login to techcet.com for one person, using 2FA (two-factor authentication). The 1 user has freedom to use any of the data in the purchased report for internal or external presentations, with proper copyright attribution.*

ANALYST BIOGRAPHY

Dan Tracy, Ph.D
Sr. Director of Market Research

• Sr. Director of Market Research, TECHCET
• Covers silicon wafers, packaging materials, sputtering
  targets and deposition materials,Has over 20 years of experience in the electronics
  industry covering supply-chain topics related to semiconductor packaging, thin films, semiconductor process equipment, and semiconductor materials.
• Previously was the senior director of the Industry Research & Statistics group at SEMI.
• Worked for Rose Associates covering electronic materials, and for National Semiconductor as a Packaging Engineer.
• Holds a Ph.D. in Materials Engineering from Rensselaer Polytechnic Institute.

August 10, 2023

Semiconductor Sputtering Targets & Metal Markets Status

Supply chain contraction will persist before rebounding in 2024

San Diego, CA, August 10, 2023:  TECHCET — the electronic materials advisory firm providing business and technology information on semiconductor supply chains — states that the Semiconductor Sputtering Target market will contract to US$1.29 billion in 2023 due to the industry-wide slowdown and lower wafer starts. This decline comes after a strong year in 2022, which grew 8% over 2021 to reach US$1.34 billion. TECHCET is forecasting increased wafer starts in 2024, which will grow the targets market to US$1.39 billion, as described in TECHCET’s new Sputtering Targets Critical Materials Report™.

“The metal ore supply chain for targets is reported to be stable, though it must adapt to higher costs for metal and other process materials,” states Dan Tracy, Sr. Director at TECHCET. In addition, higher energy costs globally continue to impact the mining, smelting, and refining segments of metal supply chains. Many key metals and raw materials also have a critical reliance on sources in China, which has resulted in geopolitical concerns when it comes to supply chain management and planning for metals. With the expected ramp of new fabs in the US, target suppliers are expressing interest in alternative high-purity metal sources from within the US.

In the mid and longer term, “green energy” and “zero emission” objectives will greatly increase demand for Copper, Silver, Tungsten, Cobalt, and other metals. New mines will need to come online to meet this forecasted metal demand, with timelines being 10 years or more for mining exploration to production. Given restrictions and regulations for mining in the West, new mines will likely be located and developed in nations with less stringent mining regulations. This could thwart efforts in the semiconductor supply chain to achieve sustainability targets. Recycle, reclaim, and reuse will also be critical components of future metal supply chains to meet goals for sustainability and zero-emissions.

On the application side for targets, multiple processing layers associated with advanced node logic devices and 3D memory will accelerate PVD target demand with upper layers. Alternative interconnect metallization is expected for 7 nm and below, with increased use of non-PVD (ex. CVD/ALD) for M4 and below. Though, 3D interconnect techniques at advanced logic nodes will result in metallization requirements for back-side Power Distribution Network. This network delivers power by Through Silicon Vias (TSV) to buried power rails based on copper metallization. Growth will also rise for power devices, including SiC device technology, leading to demand for Al, Ti, and backside metallization target applications.

For more details on the Semiconductor Sputtering Target markets & supply chains, including profiles on companies such as Honeywell Electronics Materials, Grikin, JX Metals Corporation, KFMI, Linde, Materion, Tosoh SMD, and more, go to: https://techcet.com/product/sputter-targets/.

ABOUT TECHCET: TECHCET CA LLC is an advisory services firm expert in market and supply-chain analysis of electronic materials for the semiconductor, display, solar/PV, and LED industries. TECHCET offers consulting, subscription services, and reports, including the Critical Materials Council (CMC) of semiconductor fabricators and Data Subscription Service (DSS). 

Table of Contents

1 EXECUTIVE SUMMARY 11
1.1 TARGET BUSINESS – MARKET OVERVIEW 12
1.2 TARGET MARKET TRENDS IMPACTING 2023 OUTLOOK 13
1.3 TECHNOLOGY TRENDS 14
1.4 TARGET MARKET FORECAST 15
1.5 COMPETITIVE LANDSCAPE 16
1.6 EHS ISSUES/CONCERNS 18
1.7 TARGET MARKET ASSESSMENT 19

2 SCOPE, PURPOSE AND METHODOLOGY 21
2.1 SCOPE 22
2.2 PURPOSE 23
2.3 METHODOLOGY 24
2.4 OVERVIEW OF OTHER TECHCET CMR™ REPORTS 25

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK 26
3.1 WORLDWIDE ECONOMY AND OUTLOOK 27
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 29
3.1.2 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS 30
3.1.3 SEMICONDUCTOR SALES GROWTH 31
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 32
3.2.1 SMARTPHONES 33
3.2.2 PC UNIT SHIPMENTS 33
3.2.3 SERVERS / IT MARKET 37
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 38
3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY 39
3.3.2 WW FAB EXPANSION DRIVING GROWTH 41
3.3.3 EQUIPMENT SPENDING TRENDS 42
3.3.4 TECHNOLOGY ROADMAPS 43
3.3.5 FAB INVESTMENT ASSESSMENT 44
3.4 POLICY & TRADE TRENDS AND IMPACT 45
3.5 SEMICONDUCTOR MATERIALS OVERVIEW 46
3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION
SCHEDULES? 47
3.5.2 LOGISTICS ISSUES EASED DOWN 48
3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2027 49
3.5.4 TECHCET’S MATERIAL FORECAST 50

4 SPUTTERING TARGET MARKET LANDSCAPE AND FORECAST 51
4.1 CY2023 MARKET LANDSCAPE HIGHLIGHTS 52
4.2 MARKET STATISTICS & FORECASTS 53
4.3 FORECAST METHODOLOGY 54
4.3.1 TARGET MARKET FORECAST 55
4.3.2 2023 TARGET MARKET SIZE BY TYPE 56
4.3.3 ESTIMATE FOR PRECIOUS METAL TARGET MARKET 57
4.3.4 TOTAL SPUTTERING TARGET MARKET FORECAST 58
4.3.5 COPPER MARKET FORECAST 59
4.3.6 TANTALUM MARKET FORECAST 62
4.3.7 ALUMINUM MARKET FORECAST 63
4.3.8 TITANIUM MARKET FORECAST 64
4.3.9 NIV, AL, AG, AU, TI TARGETS USED IN POWER DEVICES –
WIDE BAND GAP DEVICES 65
4.3.10 TARGET METAL FORECAST BY POWER DEVICE TYPE 67
4.3.11 TARGET METAL FORECAST FOR SIC AND GAN
POWER DEVICES 68
4.4 SUPPLIER MARKET SHARE AND ACTIVITY 69
4.4.1 TARGET SUPPLIER UPDATES – 1 OF 3 70
4.4.2 TARGET COMPANY UPDATES – 2 OF 3 71
4.4.3 RUTHENIUM TARGET SUPPLIERS 72
4.5 COMMENT ON REGIONAL TRENDS/DRIVERS 73
4.5.1 REGIONAL TRENDS AND ISSUES 74
4.5.2 SPUTTERING TARGET PRODUCTION LOCATIONS–
REGIONAL TRENDS 75
4.5.3 REGIONAL MARKET SIZE AND TRENDS 76
4.6 METAL TARGET COST STRUCTURE 77
4.7 EHS/SUSTAINABILITY, REGULATIONS, AND LOGISTIC ISSUES 78
4.8 M&A ACTIVITY AND PARTNERSHIPS 79
4.9 PLANT CLOSURES – NONE 80
4.10 NEW ENTRANTS- NONE 81
4.11 RISKS & DISCONTINUATIONS 82
4.12 TECHCET ANALYST ASSESSMENT OF TARGET SUPPLIERS
AND MARKET 83

5 SUB-TIER SUPPLY-CHAINS 84
5.1 COPPER (CU) METAL- RAW MATERIAL 85
5.1.1 CU METAL- RAW MATERIAL SUPPLY CHAIN 86
5.1.2 CU METAL- MARKET DEMAND 87
5.1.3 CU DEMAND IN VEHICLES 88
5.1.4 LME CU METAL PRICING 89
5.2 TANTALUM (TA)- RAW MATERIAL 90
5.2.1 TA METAL- MINING SUPPLY CHAIN TRENDS 91
5.2.2 TA METAL- GLOBAL DEMAND 92
5.2.3 TA METAL- CLOSED MARKET ECONOMICS 93
5.3 ALUMINUM (AL) METAL- BAUXITE AND ALUMINA MINING 94
5.3.1 AL METAL- SMELTING 95
5.3.2 AL METAL- GLOBAL DEMAND 96
5.3.3 LME AL METAL PRICING 97
5.4 TITANIUM (TI) METAL- TI MINERAL CONCENTRATE 98
5.4.1 TI MINERAL CONCENTRATE PRICING 99
5.4.2 TI METAL- MILL PRODUCT DEMAND 100
5.4.3 TI METAL-SPONGE PRODUCTION AND CAPACITY 101
5.4.4 TI METAL-SPONGE PRODUCTION AND CAPACITY 102
5.4.5 TI METAL MARKET TRENDS- RUSSIA/UKRAINE CONFLICT 103
5.4.6 TI METAL- TI SPONGE FOR SEMICONDUCTOR 104
5.4.7 TI METAL- TI SPONGE PRODUCTION ACTIVITY IN CHINA 105
5.5 TUNGSTEN (W) METAL- MINING 106
5.5.1 W METAL- GLOBAL DEMAND 107
5.5.2 W SUPPLY CHAIN AND CHINA 108
5.5.3 W METAL- HIGH PURITY W POWDER SUPPLIERS 109
5.5.4 W METAL PRICING 110
5.6 COBALT (CO) METAL- MINING 111
5.6.1 CO METAL- DEMAND 112
5.6.2 CO METAL PRICING 113
5.7 MOLYBDENUM (MO) METAL- MINING 114
5.7.1 GENERALIZATION OF MO SUPPLY CHAIN 115
5.7.2 MO APPLICATIONS 116
5.8 PRECIOUS METALS- GOLD (AU) MINING PRODUCTION 117
5.8.1 PRECIOUS METALS- SILVER (AG) MINING 118
5.8.2 PRECIOUS METALS CONSUMPTION BY APPLICATIONS 119
5.8.3 PRECIOUS METAL SUPPLY/DEMAND TRENDS 120
5.8.4 PRECIOUS METAL PRICING 121
5.8.5 PRECIOUS METAL PRICING 122
5.8.6 HIGH-PURITY MANGANESE (MN) 124
5.9 SUB-TIER SUPPLY-CHAIN: DISRUPTIONS 125
5.10 SUB-TIER SUPPLY-CHAIN M&A ACTIVITY 126
5.11 SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES 127
5.12 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT 128
5.12.1 SPUTTER TARGETS SUB-TIER MARKET ASSESSMENT 129

6 TECHNICAL DRIVERS/MATERIAL CHANGES AND TRANSITIONS 130
6.1 300 MM TARGET MARKET SEGMENT DRIVERS DEVICES 131
6.1.1 200 MM TARGET MARKET SEGMENT DRIVERS 132
6.1.2 LOGIC – GENERAL PROCESS FLOW LOGIC PVD 10 NM & BELOW 133
6.1.3 GENERAL PROCESS FLOW ADVANCED DRAM 135
6.2 NEW DEVELOPMENTS IN THE TECHNOLOGY OR MARKETS:
UNIVERSITY AND SUPPLIER R&D IN 5-7 YEARS 136
6.2.1 POWER RAIL 137
6.2.2 SPECIALTY (STT MRAM, FE RAM, OTHER) MEMORY
PVD MATERIALS 138
6.2.3 PIEZOELECTRIC MATERIALS – PZT 142

7 SUPPLIER PROFILES 144
FURUYA METAL CO
GO ELEMENT
GRIKIN
HONEYWELL
HUIZHOU TOP METAL MATERIAL (TOPM)
…and 15+ more

8 APPENDICES 145

TABLE OF FIGURES

FIGURE 1: TOTAL SPUTTERING TARGET MARKET REVENUES 12
FIGURE 2: SEMICONDUCTOR TARGET MARKET FORECAST 15
FIGURE 3 : GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY
CHAIN (2022) 29
FIGURE 4: 3- MONTH AVERAGE MONTHLY SALES FROM TAIWAN
(TSMC, UMC, VIS, ASE GLOBAL, CHIPMOS, KYEC) 30
FIGURE 5: WORLDWIDE SEMICONDUCTOR SALES 31
FIGURE 6: 2022 SEMICONDUCTOR CHIP APPLICATIONS 32
FIGURE 7: MOBILE PHONE SHIPMENTS WW ESTIMATES 33
FIGURE 8: WORLDWIDE PC AND TABLET FORECAST 34
FIGURE 9: ELECTRIFICATION TREND BY WORLD REGION 35
FIGURE 10: SEMICONDUCTOR AUTOMOTIVE PRODUCTION 36
FIGURE 11: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40B 37
FIGURE 12: CHIP EXPANSIONS 2022-2027 US $366B 39
FIGURE 13: SEMICONDUCTOR CHIP MANUFACTURING
REGIONS OF THE WORLD 41
FIGURE 14: GLOBAL TOTAL EQUIPMENT SPENDING
BY SEGMENT (US$ B) 42
FIGURE 15: OVERVIEW OF ADVANCED LOGIC DEVICE
TECHNOLOGY ROADMAP 43
FIGURE 16: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST
RENDERING (ON BOTTOM) 44
FIGURE 17: EUROPE CHIP EXPANSION UPSIDE 47
FIGURE 18: PORT OF LA 48
FIGURE 19: TECHCET WAFER START FORECAST BY NODE 49
FIGURE 20: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK 50
FIGURE 21: SPUTTERING TARGET MARKET FORECAST 55
FIGURE 22: ESTIMATED 2023 SPUTTERING TARGET MARKET SIZE BY
MATERIAL SEGMENT (IN US$ MILLIONS) 56
FIGURE 23: PRECIOUS METAL TARGET FORECAST (AFTER PRECIOUS
METAL VALUE PASS THROUGH) 57
FIGURE 24: TOTAL METAL TARGET FORECAST (AFTER PRECIOUS
METAL VALUE PASS THROUGH 58
FIGURE 25: SPUTTERING TARGET MARKET FORECAST 59
FIGURE 26: ESTIMATE OF 2022 CU TARGET SALE BY TYPE 60
FIGURE 27: ESTIMATE CU AND TA TARGETS SALES BY LOGIC NODE 61
FIGURE 28: TA SPUTTERING TARGET MARKET FORECAST 62
FIGURE 29: AL SPUTTERING TARGET MARKET FORECAST 63
FIGURE 30: TI SPUTTERING TARGET MARKET FORECAST 64
FIGURE 31: 2022 POWER DEVICE TARGET MARKET SIZE 67
FIGURE 32: 2027 FORECASTED POWER DEVICE MARKET SIZE 67
FIGURE 33: 2022 TARGET MARKET SIZE FOR SIC AND GAN
POWER DEVICES 68
FIGURE 34: 2027 FORECASTED TARGET MARKET SIZE FOR SIC AND
GAN POWER DEVICES 68
FIGURE 35: EST. 2022 SUPPLIER MARKET SHARE(EXCLUDING
PRECIOUS METALS) 69
FIGURE 36: 2022 REGIONAL SHARE (AS A % OF TOTAL TARGET
DEMAND BY USD) 73
FIGURE 37: 2021 EST. GLOBAL CU MINE PRODUCTION 21 MILLION MT 85
FIGURE 38: 2022 EST. GLOBAL REFINED CU CONSUMPTION
25 MILLION MT 87
FIGURE 39: ESTIMATE COPPER CONSUMPTION BY VEHICLE TYPE
(KG PER VEHICLE) 88
FIGURE 40: LME CU PRICE CHART 89
FIGURE 41: 2022 EST. TANTALUM MINE PRODUCTION 2000 MT 90
FIGURE 42: 2021 TANTALUM APPLICATION (~2,200 T) 92
FIGURE 43: EST. WORLD BAUXITE MINING PRODUCTION
2022 380 MILLION MT 94
FIGURE 44: EST. WORLD ALUMINUM SMELTING PRODUCTION
2022 69 MILLION MT 95
FIGURE 45: EST. 2022 GLOBAL AL DEMAND 96 MILLION MT 96
FIGURE 46: LME AL PRICE CHART 97
FIGURE 47: EST. GLOBAL TI CONCENTRATE MINING PRODUCTION
-2022 9,500 MILLION MT 98
FIGURE 48: TI MINERAL CONCENTRATE PRICING 99
FIGURE 49: EST. GLOBAL 2020 TI MILL PRODUCT OUTPUT,
~175,000 MT 100
FIGURE 50: EST. GLOBAL TI SPONGE PRODUCTION-2022
260,000 THOUSAND MT 101
FIGURE 51: EST. GLOBAL TI SPONGE CAPACITY-2022
350,000 THOUSAND MT 101
FIGURE 52: EST. 2022 W MINE PRODUCTION 84,000 T 106
FIGURE 53: W PRICE CHART 110
FIGURE 54: EST. 2022 CO MINE PRODUCTION 190,000 MT 111
FIGURE 55: EST. 2020 GLOBAL CO DEMAND 175,000 MT 112
FIGURE 56: LME CO METAL PRICE CHART 113
FIGURE 57: EST. 2021 MOLYBDENUM MINING PRODUCTION,
300,000 METRIC TONS 114
FIGURE 58: GENERALIZATION OF MO SUPPLY CHAIN 115
FIGURE 59: EST 2020 MOLYBDENUM USE BY APPLICATION 116
FIGURE 60: 2022 AU MINING PRODUCTION 3,100 MT 117
FIGURE 61: 2022 AG MINING PRODUCTION ~26,000 MT 118
FIGURE 62: GOLD METAL PRICE CHARTS 121
FIGURE 63: SILVER METAL PRICE CHARTS 121
FIGURE 64: PALLADIUM METAL PRICE CHARTS 122
FIGURE 65: PLATINUM METAL PRICE CHARTS 123
FIGURE 66: 3DNAND 134
FIGURE 67: BURIED POWER RAIL STRUCTURE 137
FIGURE 68: MRAM DEVICE STRUCTURE 138
FIGURE 69: CHALCOGENIDE MEMORY ROADMAP (SK HYNIX) 140

TABLES
TABLE 1: CHINA’S INTERESTS IN MINING AND REFINING
THAT RELATE TO SEMICONDUCTOR SPUTTER TARGET METALS 17
TABLE 2: GLOBAL GDP AND SEMICONDUCTOR REVENUES* 26
TABLE 3: IMF ECONOMIC OUTLOOK* 28
TABLE 4: DATA CENTER SYSTEMS AND COMMUNICATION
SERVICES MARKET SPENDING 2022 37
TABLE 5: WIDE BAND GAP (WBG) SEGMENT REVENUES AND CAGRS 65
TABLE 6: ESTIMATED NUMBER OF TARGETS BY POWER DEVICE TYPE
2022 (# OF 200 MM TARGETS, WITH SIC EXPRESSED AS 150MM) 66
TABLE 7: RUTHENIUM TARGET SUPPLIERS 72
TABLE 8: SPUTTERING TARGET SUPPLIER MANUFACTURING LOCATIONS 75
TABLE 9: REGIONAL SPUTTERING MARKETS 76
TABLE 10: ESTIMATED TARGET COST STRUCTURE
(FOR REFERENCE ONLY) 77
TABLE 11: PRECIOUS METAL CONSUMPTION BY APPLICATION 119
TABLE 12: LOGIC PVD APPLICATIONS 133
TABLE 13: 3DNAND PVD APPLICATIONS 134
TABLE 14: DRAM PVD APPLICATIONS 135
TABLE 15: PHASE CHANGE MATERIAL TARGET SUPPLIERS 146
TABLE 16: MRAM TARGET SUPPLIERS 146