ウエハレベル向け金属めっき薬品

出版:Techcet(テクセット)

ウエハレベル向け金属めっき薬品:半導体製造前工程(フロントエンド)とアドバンスドパッケージ向け市場 2021年

Wafer Level Metal Plating Chemicals

For Front End Semiconductor Manufacturing And Advanced Packaging Applications 2021

 

出版 Techcet(テクセット)
出版年月 2021年9月
ページ数 112
図表数 73
価格(サイトライセンス) US$8,599
種別 英文調査報告書

 

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Techcet「ウエハレベル向け金属めっき薬品:半導体製造前工程(フロントエンド)とアドバンスドパッケージ向け市場 2021年 – Wafer Level Metal Plating Chemicals: For Front End Semiconductor Manufacturing And Advanced Packaging Applications 2021」は半導体製造前工程(フロントエンド/基板工程)と半導体アドバンスドパッケージ製造の際に使用されるめっき薬品市場を詳細に調査・分析しています。

主な掲載内容

  • アドバンスパッケージング(ウエアレベル)と半導体デバイス製造(ダマシン工程)に適用される金属用化学品市場動向とサプライチェーンに関する情報
  • 銅めっきと添加剤の予測、市場シェア、技術的動向、サプライヤ情報

目次(抜粋)

  1. エグゼクティブサマリー
  2. 調査範囲、目的、メソドロジー
  3. 半導体産業市場展望
  4. セグメント別金属化学品市場
  5. 技術動向
  6. 競争環境
  7. アナリストの評価
  8. サプライヤ情報

Report Details

  • Provides focused information on metal chemicals market trends and supply-chain as it applied to advanced packaging (wafer level) and semiconductor device manufacturing (damascene process).
  • Covers information about forecasts for copper plating and additives, market shares, technical trends, and supplier profiles.

目次

1.1 EXECUTIVE SUMMARY 11

1.2 ADVANCED PACKAGING PER WAFER STARTS 12
1.3 DEVICE DEMAND DRIVERS – LOGIC 13
1.4 PLATING FORECAST FOR DAMASCENE (FE) AND ADVANCED PACKAGING 14
1.5 MARKET SHARES 15
1.6 SUPPLIER ACTIVITIES – VARIOUS ANNOUNCEMENTS 16
1.7 ANNOUNCEMENTS 17
1.8 RISK FACTORS 18
1.9 ANALYST ASSESSMENT 19

2 SCOPE, PURPOSE AND METHODOLOGY 20

2.1 SCOPE 21
2.2 PURPOSE 22
2.3 METHODOLOGY 23
2.4 OVERVIEW OF OTHER TECHCET CMR™ REPORTS 24

3 SEMICONDUCTOR INDUSTRY MARKET OUTLOOK 25

3.0 SEMICONDUCTOR INDUSTRY STATUS & OUTLOOK 26
3.1 SEMICONDUCTOR INDUSTRY TIED TO WORLDWIDE ECONOMY 27
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 29
3.1.2 SEMICONDUCTOR SALES GROWTH 30
3.1.3 TAIWAN MONTHLY SALES TRENDS 31
3.1.4 SEMICONDUCTOR UNITS AND WAFER SHIPMENT GROWTH FORECAST 32
3.2 ELECTRONIC GOODS MARKET 33
3.2.1 SMARTPHONES 34
3.2.2 PC UNIT SHIPMENTS 35
3.2.3 AUTOMOTIVE SALES 36
3.2.3.1 AUTOMOTIVE SALES AND IMPACT ON SEMICONDUCTOR SALES 37
3.2.3.2 ELECTRIC VEHICLE (EV) MARKET TRENDS 38
3.2.3.3 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 39
3.2.3.4 SEMICONDUCTOR CONTENT BY AUTOMOTIVE ELECTRONIC SYSTEM 40
3.2.4 SERVERS / IT 41
3.2.4.1 SERVERS / IT, CONTINUED – FORECASTS 42
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 43
3.3.1 EQUIPMENT SPENDING TRENDS 44
3.3.2 RECENT INVESTMENT AND FAB/PLANT EXPANSION ACTIVITY 46
3.4 POLICY & TRADE TRENDS AND IMPACT 48
3.4.1 POLICY AND TRADE ISSUES 49
3.4.2 U.S. CHIPS ACT 51
3.4.3 OTHER SEMICONDUCTOR FUNDING ACTIVITY 52
3.4.4 OVERALL CHINA MARKET TRENDS 53
3.5 SEMICONDUCTOR MATERIALS OUTLOOK 55
3.5.1 TECHCET WAFER START FORECAST 56
3.5.2 SEMICONDUCTOR – LEADING EDGE NODE GROWTH 57
3.5.3 WAFER STARTS OTHER DEVICES 58
3.5.4 SEMICONDUCTOR MATERIALS MARKET FORECAST 59

4 METAL CHEMICALS MARKET BY SEGMENT 60

4.1 DEFINITIONS 61
4.2 METAL CHEMS MARKET OVERVIEW 62
4.2.1 OVERIVEW – ADVANCED PACKAGING AND DAMASCENE METALLIZATION 63
4.2.2 OVERVIEW – PLATING MARKET TRANSITIONAL TRENDS 64
4.3 ADVANCED PACKAGING METALLIZATION – MARKET DRIVERS 65
4.3.1 ADVANCED PACKAGING – ADDITIVES FOR CU PLATING REVENUE 66
4.3.2 ADVANCED PACKAGING – COPPER CHEMICALS REVENUE 67
4.3.3 ADVANCED PACKAGING ADDITIVE VOLUMES 68
4.3.4 OTHER PLATING MATERIALS FOR ADVANCED PACKAGING 69
4.3.5 SN/SNAG PLATING 70
4.3.5.1 WW NI PLATING MARKET FORECAST 71
4.4 DAMASCENE GROWTH TRENDS 72
4.4.1 DAMASCENE GROWTH DRIVERS 73
4.4.2 DAMASCENE CU PLATTING REVENUES 74
4.4.3 DAMASCENE ADDITIVE VOLUMES 75

5 TECHNICAL TRENDS 76

5.0 TECHNOLOGY CHALLENGE 77
5.0.1 METAL CLEANINGS CHALLENGE 78
5.1 PACKAGING TECH TRENDS 79
5.1.1 KEY TRENDS IN ADVANCED PACKAGING 80
5.1.2 MARKET DYNAMICS 81
5.1.3 IDM—WAFER LEVEL PLATING 82
5.1.4 MARKET DRIVERS OF ADVANCED PACKAGING APPLICATIONS 83
5.1.5 TECH TRENDS – RDL 84
5.1.5.1 DAMASCENE-TYPE RDL 85
5.1.6 INTERPOSERS (NOT WLP)S 86
5.1.6.1 APPLE EXAMPLE INTERPOSERS (EPWORK CONFIDENTIAL) 87
5.1.7 TSV FILLING 2.5-3D 88
5.1.8 PACKAGING ELECTROPLATING REQUIREMENTS 89
5.1.8.1 PACKAGING ELECTROPLATING REQUIREMENTS – LISTING 90
5.2 DAMASCENE TECH TRENDS 91
5.2.1 MARKET DRIVES TECHNOLOGY TRENDS 92
5.2.1.2 TRENDS – MOL AND BEOL PERFORMANCE CHALLENGES 93
5.2.2 CU DAMASCENE QUALIFICATION REQUIREMENTS 94
5.2.3 LOGIC METALLIZATION ROADMAP 95
5.2.3.1 INTERCONNECT FOR ADVANCED LOGIC 96
5.2.4.1 GENERAL PROCESS FLOW ADVANCED DRAM 98
5.2.5 PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU 99
5.2.5.1 3D-NAND GENERATIONS 2020 -2025 100
5.2.6 EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD 101
5.2.7 TECHNICAL REQUIREMENTS SUMMARY ½ 102
5.2.7.1 TECHNICAL REQUIREMENTS SUMMARY 2/2 103

6 COMPETITIVE LANDSCAPE 104

6.1 TOTAL ADVANCED PACKAGING AND DAMASCENE MARKET SHARES 105
6.2 MARKET SHARE BY APPLICATION 106
6.3 MARKET SHARE BY APPLICATION 107
6.4 REGIONAL PLAYERS AND OTHERS 108
6.5 M&A ACTIVITY 109

7 ANALYST ASSESSMENT 110

7.1 ANALYST ASSESSMENT 111

8 SUPPLIER PROFILES 112

MACDERMID ENTHONE INDUSTRIAL SOLUTIONS
UYEMURA
ATOTECH
ISHIHARA CHEMICAL/UNICON
DUPONT
MOSES LAKE INDUSTRIES
JX NIPPON MINING AND METALS
INCHEON CHEMICAL COMPANY
MITSUYA
SHANGHAI SINYANG
BASF
SOULBRAIN

List of Figures

FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING AND
INTERCONNECT REVENUES ($M’S) 11
FIGURE 2: ADVANCED PACKAGING (AP) 12
FIGURE 3: ADVANCED LOGIC DEVICES GROWTH FORECAST 13
FIGURE 4: COPPER PLATING CHEMICALS REVENUES ($M’S) FOR
ADVANCED PACKAGING & FE/DAMASCENE 14
FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED PACKAGING
AND SEMICONDUCTOR DEVICE MFG 2021 15
FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2020) 28
FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES 30
FIGURE 8: WORLDWIDE SEMICONDUCTOR SALES
(TSMC, UMC, VIS, ASE, CHIPMOS, KYEC) 31
FIGURE 9: SEMICONDUCTOR WAFER AREA SHIPMENTS 32
FIGURE 10: SEMICONDUCTOR CHIP APPLICATIONS 33
FIGURE 11: MOBILE PHONE SHIPMENTS WW ESTIMATES 34
FIGURE 12: PC NOTEBOOK SHIPMENTS 35
FIGURE 13 : U.S. AUTOMOTIVE SALES 36
FIGURE 14: MONTHLY AUTOMOTIVE SALES TRENDS 37
FIGURE 15: GLOBAL EV TRENDS 38
FIGURE 16: SEMICONDUCTOR SPEND PER VEHICLE TYPE. 39
FIGURE 17: SEMICONDUCTOR CONTENT BY AUTOMOTIVE APPLICATION. 40
FIGURE 18: AMAZON SERVER FARM 41
FIGURE 19: SEMICONDUCTOR REVENUE GROWTH FORECASTS
(AS OF MARCH 2020) 43
FIGURE 20: CAPITAL SPENDING TRENDS BY TECHNOLOGY NODE. 44
FIGURE 21 OVERVIEW OF LOGIC ROADMAP TRENDS 45
FIGURE 22: CHINA IC MARKET AND PRODUCTION TRENDS 53
FIGURE 23: 300MM WAFER STARTS 57
FIGURE 24: >32NM NODE LOGIC DEVICES GROWTH FORECAST(200MM EQUIV.) 58
FIGURE 25: GLOBAL SEMICONDUCTOR MATERIALS HISTORY & FORECAST 59
FIGURE 26: PACKAGING METALLIZATION APPLICATIONS 61
FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING AND FE
INTERCONNECT REVENUES ($M’S). 62
FIGURE 28: CU PLATING CHEMICALS 5-YEAR FORECAST 63
FIGURE 29: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS 65
FIGURE 30: CU PLATING ADVANCED PACKAGING REVENUE FORECAST ESTIMATES 66
FIGURE 31: CU PILLAR/BUMP & CU RDL SEGMENTED FORECAST 67
FIGURE 32: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST 68
FIGURE 33: ADV. PACKAGING CU PLATING ADDITIVES VOLUME
DEMAND FORECAST 68
FIGURE 34: OTHER PLATING MATERIALS FOR ADVANCED PACKAGING 69
FIGURE 35: SN AND SNAG PLATING REVENUE 70
FIGURE 36: NICKEL PLATING REVENUE 71
FIGURE 37: ADVANCED LOGIC DEVICES GROWTH FORECAST 72
FIGURE 38: METAL PLATING WAFER PASSES 73
FIGURE 39: WW DAMASCENE REVENUE FORECAST ESTIMATES 74
FIGURE 40: DAMASCENE CU VMS VOLUME DEMAND FORECAST ESTIMATES 75
FIGURE 41: DAMASCENE CU PLATING ADDITIVES CHEMICAL VOLUME
DEMAND FORECAST 75
FIGURE 42: CLEANING COMPLEXITY 77
FIGURE 43: KEY TRENDS IN ADVANCED PACKAGING 80
FIGURE 44: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND 81
FIGURE 45: WAFER LEVEL PLATING 82
FIGURE 46: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS 83
FIGURE 47: COMPARISON WITH DAMASCENE- TYPE RDL 85
FIGURE 48: APPLE EXAMPLE INTERPOSERS 87
FIGURE 49: TSV PROCESS FLOW EXAMPLE 88
FIGURE 50: METAL LEVELS PER LOGIC NODE 92
FIGURE 51: METAL LEVELS PER LOGIC NODE 93
FIGURE 52: CU DAMASCENE QUALIFICATION 94
FIGURE 53: DRAM Structure 97
FIGURE 54: 3DNAND Structure 99
FIGURE 55: TOTAL PLATING FOR ADV. PACKAGING AND SEMICONDUCTOR
DEVICE MANUFACTURING 2021 101
FIGURE 56: PLATING EQUIPMENT OEM MARKET SHARES 2020 106
FIGURE 57: PLATING CHEMICAL SUPPLIER FOR DAMASCENE AND
ADVANCED PACKAGING APPLICATIONS 107

List of Tables

TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES* 27
TABLE 2: WORLD BANK ECONOMIC OUTLOOK* 28
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES
FORECAST 2021. 42
TABLE 4: DEVICE MAKER INVESTMENT ACTIVITY 46
TABLE 5: DEVICE MAKER INVESTMENT ACTIVITY, CONTINUED 47
TABLE 6: US CHIPS ACT PROVISIONS 51
TABLE 7: CU PACKAGING APPLICATIONS AND REQUIREMENTS 90
TABLE 8: LOGIC DEVICE ROADMAP FOR METALS 95
TABLE 9: METALS REQUIRED FOR DEVICE FEATURES 96
TABLE 10: DRAM USE OF MO OR RU PRESENT & FUTURE 97
TABLE 11: GENERAL PROCESS FLOW ADVANCED DRAM 98
TABLE 11: 3DNAND MATERIAL CHANGES PRESENT & FUTURE 99
TABLE 12: NUMBER OF STRINGS PER GENERATION OF 3DNAND 100
TABLE 13: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD 101
TABLE 14: TECHNICAL REQUIREMENTS SUMMARY 102
TABLE 15: TECHNICAL REQUIREMENTS SUMMARY 103
TABLE 16: REGIONAL PLAYERS – MARKET LEADER AND “OTHERS” 108

プレスリリース

[日本語訳(一部)]

いつまで続く?アドバンスドパッケージとフロントエンド(FE)/ダマシン用化学品における高いめっき需要

2022年には健全な成長、2023年は軟調化の予想

加州サンディエゴ、2021年9月23日

電子材料のビジネスおよび技術情報を提供するアドバイザリー会社のTECHCETは、あらゆるセクタにおけるチップへの大きな需要によりアドバンスドパッケージおよび前工程/ダマシンに使用されるめっき薬品の必要性が高まってきていることを発表しました。銅(Cu)、ニッケル(Ni)、スズ(Sn)、銀(Ag)向けのめっき薬品も含まれています。銅めっき薬品は合計で2021年に6憶6200ドル、成長率では14.2%に達し、アドバンスドパッケージはダマシンのほぼ2倍の増加となる見込みです。アドバンスドパッケージの用途にはCuピラー、再配線層(RDL)、Si貫通電極(TSV)などがあります。

(中略)

予測期間中に強い成長が見込まれているものの、テクセットではこの成長が2023年までに軟調に推移すると予想しています。「在庫調整により、今後2年間でデバイスの成長ペースは遅くなり、めっき薬品への需要も穏やかになるだろう」とテクセットのシニアディレクターDan Tracy氏は述べています。しかしながら、2025年までには再上昇することが予測されています。

[プレスリリース原文]

“How long will it last?” Heightened Demand for Plating in Advanced Packaging & Front-End (FE)/Damascene Chemicals

Healthy growth through 2022, but softening expected in 2023

San Diego, CA, September 23, 2021:  TECHCET—the electronic materials advisory firm providing business and technology information— announced a heightened need for plating chemistries consumed in advanced packaging & FE/damascene driven by huge growth in chips in all sectors. This includes plating chemicals for copper (Cu), nickel (Ni), tin (Sn), and silver (Ag). Total copper plating chemicals are expected to grow 14.2% in 2021 to total $662M, with advanced packaging rising almost double that of damascene. Advanced packaging applications include Cu pillar, Redistribution Layer (RDL), and Through Silicon Via (TSV).

Advanced logic is the main driver of growth for plating materials. Used for damascene, copper plating chemicals volume demand increases with each new logic generation. Although CVD or PVD Cobalt (Co) and Ruthenium (Ru) are starting to be used in M0-M4 layers, overall growth in advanced logic and the number of layers pushes up Cu plating revenues for advanced logic applications. Advanced logic nodes (<16nm) wafer starts are forecasted to increase 14.4% CAGR (2020-2025); however, the number of damascene steps required for all leading-edge device wafer starts is expected to increase by more than 50% annually.

Although strong growth is expected throughout the forecast period, TECHCET anticipates a slowing in growth by 2023. “In another couple of years, we anticipate an inventory correction which should slow the pace of growth in devices and moderate demand for plating chemicals,” stated Dan Tracy, Sr. Director of TECHCET. However, by 2025, another upturn is expected.

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