FE＆先端パッケージング向け金属工業用化学品市場レポート　2022年

出版：Techcet（テクセット）　出版年月：2022年9月

Metal Chemicals for FE & Advanced Packaging Market Report: For Front End Semiconductor Manufacturing And Advanced Packaging Applications 2022
FE＆先端パッケージング向け金属工業用化学品市場レポート　2022年：基板工程（フロントエンド半導体製造）および先端パッケージング向け化学品

旧タイトル：ウエハレベル向け金属めっき薬品：半導体製造前工程（フロントエンド）とアドバンスドパッケージ向け市場　2022年 – Wafer Level Metal Plating Chemicals For Frontend Semiconductor Manufacturing and Advanced Packaging Applications 2022

レポート目次　　お問合せ・ご注文　　価格・納期について

レポートについて

TECHCET（テクセット）「FE＆先端パッケージング向け金属工業用化学品市場レポート　2022年：基板工程（フロントエンド半導体製造）および先端パッケージング向け化学品 – Metal Chemicals for FE & Advanced Packaging Market Report: For Front End Semiconductor Manufacturing And Advanced Packaging Applications 2022」は先端パッケージングと半導体デバイス製造用途を含む半導体製造向け金属めっき化学品市場を調査・分析しています。

主な特長

• 先端パッケージング（ウエハーレベル）と半導体デバイス製造（ダマシン工程）用途を含む半導体製造向け金属めっき化学品市場およびサプライチェーンを分析。
• 銅めっきと添加物市場予測、市場シェア、技術動向、サプライヤ情報を掲載。

目次（抜粋）

1. エグゼクティブサマリー
2. 調査範囲、目的、メソドロジー
3. 半導体産業市場展望
   1. 世界経済
   2. 電子製品市場
   3. 半導体製造の成長と拡大
   4. 政策＆貿易動向と影響
   5. 半導体材料展望
4. セグメント別金属化学品市場
   1. 定義
   2. 金属めっき薬品市場概観
   3. 先進実装のメタライゼーション – 市場成長促進要因
   4. ダマシンの成長動向
5. 技術動向
   1. 実装技術動向
   2. 技術動向
6. 競争環境
7. アナリストの評価
8. サプライヤ情報

Report Details

• Provides focused information on metal chemicals market trends and supply-chain as it applied to advanced packaging (wafer level) and semiconductor device manufacturing (damascene process).
• Covers information about forecasts for copper plating and additives, market shares, technical trends, and supplier profiles.

目次

1 EXECUTIVE SUMMARY

1.1 EXECUTIVE SUMMARY
1.2 ADVANCED PACKAGING PER WAFER STARTS
1.3 DEVICE DEMAND DRIVERS – LOGIC
1.4 CU PLATING FORECAST FOR DAMASCENE (FE) AND ADVANCED PACKAGING
1.5 MARKET SHARES
1.6 SUPPLIER ACTIVITIES – VARIOUS ANNOUNCEMENTS
1.7 RISK FACTORS
1.8 ANALYST ASSESSMENT

2 SCOPE, PURPOSE AND METHODOLOGY

2.1 SCOPE
2.2 PURPOSE
2.3 METHODOLOGY
2.4 OVERVIEW OF OTHER TECHCET CMR™ REPORTS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1 WORLDWIDE ECONOMY

3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
3.1.2 SEMICONDUCTOR SALES GROWTH
3.1.3 TAIWAN MONTHLY SALES TRENDS
3.1.4 UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023 – SLOWER TO NEGATIVE SEMI REVENUE GROWTH EXPECTED

3.2 ELECTRONIC GOODS MARKET

3.2.1 SMARTPHONES
3.2.2 PC UNIT SHIPMENTS
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
3.2.3 SERVERS / IT MARKET

3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION

3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY
3.3.2 WW FAB EXPANSION DRIVING GROWTH
3.3.3 EQUIPMENT SPENDING TRENDS
3.3.4 TECHNOLOGY ROADMAPS
3.3.5 FAB INVESTMENT ASSESSMENT

3.4 POLICY & TRADE TRENDS AND IMPACT

3.4.1 POLICY AND TRADE ISSUES

3.5 SEMICONDUCTOR MATERIALS OUTLOOK

3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
3.5.2 CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD
3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2026
3.5.3.1 TECHCET WAFER START MODELING METHODOLOGY
3.5.4 TECHCET’S MATERIAL FORECAST

4 METAL CHEMICALS MARKET BY SEGMENT

4.1 DEFINITIONS

4.1.1 DEFINITIONS, CONTINUED

4.2 METAL PLATING CHEMICALS MARKET OVERVIEW

4.2.1 OVERVIEW – ADVANCED PACKAGING AND DAMASCENE METALLIZATION
4.2.2 OVERVIEW – PLATING MARKET TRANSITIONAL TRENDS

4.3 ADVANCED PACKAGING METALLIZATION – MARKET DRIVERS

4.3.1 ADVANCED PACKAGING – ADDITIVES FOR CU PLATING REVENUE
4.3.2 ADVANCED PACKAGING – COPPER CHEMICALS REVENUE
4.3.3 ADVANCED PACKAGING ADDITIVE VOLUMES
4.3.4 OTHER PLATING MATERIALS FOR ADVANCED PACKAGING
4.3.5 SN / SNAG PLATING
4.3.5.1 WW NI PLATING MARKET FORECAST

4.4 DAMASCENE GROWTH TRENDS

4.4.1 DAMASCENE GROWTH DRIVERS
4.4.2 DAMASCENE CU PLATING REVENUES
4.4.3 DAMASCENE ADDITIVE VOLUMES

5 TECHNICAL TRENDS

5.1 PACKAGING TECH TRENDS

5.1.1 PACKAGING TECHNICAL CHALLENGES

5.2 TECH TRENDS

5.2.1 MARKET DRIVES TECHNOLOGY TRENDS
5.2.2 ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION
5.2.2.1 TRENDS – MOL AND BEOL IRDS ROADMAP
5.2.3 CU DAMASCENE QUALIFICATION REQUIREMENTS
5.2.4 LOGIC METALLIZATION ROADMAP
5.2.4.1 INTERCONNECT FOR ADVANCED LOGIC
5.2.5 ADV LOGIC BURIED POWER RAIL
5.2.6 TECHNOLOGY ROADMAP: DRAM WITH MO OR RU
5.2.6.1 GENERAL PROCESS FLOW ADVANCED DRAM
5.2.7 PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU
5.2.7.1 3D-NAND GENERATIONS 2020 -2025
5.2.8 EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD
5.2.8 TECHNICAL REQUIREMENTS SUMMARY 1/2
5.2.8.1 TECHNICAL REQUIREMENTS SUMMARY 2/2

6 COMPETITIVE LANDSCAPE

6.1 TOTAL ADVANCED PACKAGING AND DAMASCENE MARKET SHARES
6.2 OEM MARKET SHARE– PLATING EQUIPMENT
6.3 MARKET SHARE BY APPLICATION – CU PLATING FOR ADVANCED PACKAGING
6.4 REGIONAL PLAYERS AND OTHERS
6.5 M&A ACTIVITY

7 ANALYST ASSESSMENT

7.1 ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT

8 SUPPLIER PROFILES

BASF
DUPONT
CHANG CHUN GROUP
And more..

9 APPENDIX A: PACKAGING TECH TRENDS

FIGURES & TABLES

FIGURES

FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M’S)
FIGURE 2: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
FIGURE 3: ADVANCED LOGIC DEVICES GROWTH FORECAST
FIGURE 4: COPPER PLATING CHEMICALS REVENUES $M’S) FOR ADVANCED PACKAGING & FE/DAMASCENE
FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED PACKAGING AND SEMICONDUCTOR DEVICE MFG. 2022
FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2021)
FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 8: TECHCET’ TAIWAN SEMICONDUCTOR INDUSTRY INDEX*
FIGURE 9: 2022 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
FIGURE 10: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
FIGURE 11: SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 12: MOBILE PHONE SHIPMENTS WW ESTIMATES
FIGURE 13: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3
FIGURE 14: GLOBAL EV TRENDS
FIGURE 15: SEMICONDUCTOR SPEND PER VEHICLE TYPE
FIGURE 16: TSMC CONSTRUCTION SITE IN ARIZONA
FIGURE 17: CHIP EXPANSIONS 2021-2026 > US$460 B
FIGURE 18: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 19: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS
FIGURE 20: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP
FIGURE 21: EUROPE CHIP EXPANSION UPSIDE
FIGURE 22: TECHCET WAFER START FORECAST BY NODE
FIGURE 23: TECHCET MATERIALS FORECAST
FIGURE 24: PACKAGING METALLIZATION APPLICATIONS
FIGURE 25: USE OF SILICON INTERPOSER
FIGURE 26: VERSIONS OF TSV & PROCESS FLOW EXAMPLE
FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M’S)
FIGURE 28: CU PLATING CHEMICALS 5-YEAR FORECAST
FIGURE 29: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
FIGURE 30: CU PLATING ADVANCED PACKAGING REVENUE FORECAST ESTIMATES
FIGURE 31: CU PILLAR & CU RDL SEGMENTED FORECAST
FIGURE 32: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST
FIGURE 33: ADV. PACKAGING CU PLATING ADDITIVES VOLUME DEMAND FORECAST
FIGURE 34: MATERIALS STACK USING CU PILLAR (< 40 UM PITCH)
FIGURE 35: SN AND SNAG PLATING REVENUE
FIGURE 36: NICKEL PLATING REVENUE
FIGURE 37: ADVANCED LOGIC DEVICES GROWTH FORECAST
FIGURE 38: ADV LOGIC METAL PLATING WAFER PASSES
FIGURE 39: WW DAMASCENE REVENUE FORECAST ESTIMATES
FIGURE 40: DAMASCENE CU VMS VOLUME DEMAND FORECAST ESTIMATES
FIGURE 41: DAMASCENE CU PLATING ADDITIVES CHEMICAL VOLUME DEMAND FORECAST
FIGURE 42: KEY TRENDS IN ADVANCED PACKAGING
FIGURE 43: CHALLENGES OF ELECTROPLATING VIA FILL
FIGURE 44: METAL LEVELS PER LOGIC NODE
FIGURE 45: INTERCONNECT METAL COMPARISON BY RESISTIVITY
FIGURE 46: CU DAMASCENE QUALIFICATION
FIGURE 47: LEADING EDGE LOGIC POWER RAIL SCHEMES
FIGURE 48: DRAM STRUCTURE
FIGURE 49: 3D NAND STRUCTURE
FIGURE 50: TOTAL PLATING FOR ADV. PACKAGING AND SEMICONDUCTOR DEVICE MANUFACTURING 2022
FIGURE 51: PLATING EQUIPMENT OEM MARKET SHARES 2020
FIGURE 52: PLATING CHEMICAL SUPPLIER FOR DAMASCENE AND ADVANCED PACKAGING APPLICATIONS
FIGURE 53: CLEANING COMPLEXITY
FIGURE 54: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND
FIGURE 55: WAFER LEVEL PLATING
FIGURE 56: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS
FIGURE 57: COMPARISON WITH DAMASCENE- TYPE RDL
FIGURE 58: USE OF SILICON INTERPOSER
FIGURE 59: APPLE EXAMPLE INTERPOSERS
FIGURE 60: TSV PROCESS FLOW EXAMPLE

TABLES

TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
TABLE 2: IMF ECONOMIC OUTLOOK*
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES FORECAST 2021
TABLE 4: IRDS 2022 LOGIC CORE INTERCONNECT ROADMAP
TABLE 5: LOGIC DEVICE ROADMAP FOR METALS
TABLE 6: METALS REQUIRED FOR DEVICE FEATURES
TABLE 7: DRAM USE OF MO OR RU PRESENT & FUTURE
TABLE 8: GENERAL PROCESS FLOW ADVANCED DRAM
TABLE 9: 3D NAND MATERIAL CHANGES PRESENT & FUTURE
TABLE 10: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF 3DNAND
TABLE 11: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD
TABLE 12: TECHNICAL REQUIREMENTS SUMMARY 1/2
TABLE 13: TECHNICAL REQUIREMENTS SUMMARY 2/2
TABLE 14: REGIONAL PLAYERS – MARKET LEADER AND “OTHERS”
TABLE 15: CU PACKAGING APPLICATIONS AND REQUIREMENTS

プレスリリース

June 27, 2023

Semiconductor Metal Plating Chemicals Revenues Slowing in 2023
Increases in Interconnect Layers and Advanced Packaging Use to Revamp Growth
San Diego, CA, June 27, 2023: TECHCET — the electronic materials advisory firm providing business and technology information on semiconductor supply chains — is estimating that the market for Semiconductor Metal Plating Chemicals will reach US$987M in 2023, a 2% decrease from 2022. The decrease in the 2023 forecast is due to lower expectations for the amount of overall wafer starts. Additionally, the decline may be influenced by the overbuying of materials in 2020-2021 and subsequent inventory corrections within the market. The largest revenue within the 2023 metal plating chemicals segment is forecasted for copper, with $373M for copper advanced packaging wiring, and $614M for interconnect copper plating. Despite the current slowdown, the overall 2022-2027 CAGR is expected to be a positive 3.7% for advanced packaging and 3.3% for interconnect metal chemicals, as highlighted in TECHCET’s new Quarterly Update to the Metal Chemicals Critical Material Report™.

.
Current economic environments will likely cause overall semiconductor device production to be reduced until at least the end of 2Q 2023. However, demand for more devices used for electric cars, faster charging stations, stronger data storage, and more applications, are expected to produce higher density and lower power devices in the coming years. Simultaneously, the US Chips Act and similar investments by Europe and China will push these developments along. This will drive increases in metal interconnect layers and advanced packaging use, which should revamp growth in the metal chemical plating market.

TECHCET is following new technologies for metal deposition, such as the introduction of Ruthenium (Ru) or Molybdenum (Mo) (or Vanadium (V) or Iridium (Ir)) to possibly displace the Tantalum (Ta) & Cobalt (Co) barrier layers at the smallest interconnect dimensions for the GAA nodes. Ru or Mo (ALD or CVD, not plating) will possibly fill the interconnects & vias between M0 to M2 metal layers for Advanced Logic. Possible wafer backside connections to the backside power rail will add Copper (Cu) plating to possibly match or exceed the Cu plating lost at the M8-M14 layers.

For more details on Metal Deposition market trends, supply-chain issues and supplier profiles like Dupont, Chang Chun Group, JX Nippon, Moses Lake Industries, MacDermid and more, go to: https://techcet.com/product/metal-chemicals-for-fe-advanced-packaging/ or https://techcet.com/product/sputter-targets/.

ABOUT TECHCET: TECHCET CA LLC is an advisory services firm expert in market and supply-chain analysis of electronic materials for the semiconductor, display, solar/PV, and LED industries. TECHCET offers consulting, subscription service, and reports, including the Critical Materials Council (CMC) of semiconductor fabricators and Data Subscription Service (DSS).

January 4, 2023

2023 Semiconductor Plating for Device and Packaging Expecting Slowdown as Global Economic Conditions Weaken

New Technologies such as Ruthenium and Molybdenum in Barrier Layers May Also Replace Old Plating Standards

San Diego, CA, January 4, 2023: TECHCET—the advisory firm providing business and technology information on the semiconductor materials supply chain — announced that the revenue growth for the 2023 Semiconductor Plating Market is expected to rise only 2% above 2022. This is a significant decline compared to the 8.3% growth seen in the 2022 market from 2021. One main reason for this forecasted slowdown is the slower economic conditions that are expected to impact the 2023 semiconductor market, at least through the first half of the year. TECHCET now forecasts plating chemical revenues to grow to US$1.02B in 2022, and then to US$1.04B in 2023 (Source: TECHCET’s newly released CMR™ on Metal Plating).

Stronger growth rebounds are expected in 2024 as demand for more devices for numerous applications (electric cars, more fast charging stations, more data storage, etc.) are expected to produce higher density and lower power devices. In addition, the US Chips Act and similar investments by Europe and China are expected to contribute towards market growth. Both these factors will drive more metal interconnect layers and more advanced packaging.

TECHCET’s Sr. Director, Dan Tracy, states, “Advanced Packaging requirements continue to be driven by increases in Wafer Level Packaging (WLP), and by consumption in the high-performance devices that utilize Redistribution Layers (RDL), interposers and Through Silicon Via (TSV) technologies.” Heterogenous integration, EMIB, Chiplets, and the power devices are expected to challenge the plating requirements in terms of quality of material being deposited.

Logic Gate All-Around (GAA) transitions node is planning to use backside power rails which appear to add at least four metal interconnect layers to the backside of the wafers.

TECHCET is following the introduction of Ruthenium or Molybdenum to possibly displace the Tantalum and Cobalt barrier layer at the GAA nodes. Ruthenium or Molybdenum (ALD or CVD, not plating) will possibly fill the interconnects and vias between M0 to M3 metal layers for Advanced Logic. Possible wafer backside connections to the backside power rail will add Copper plating to possibly match lost the loss of Copper plating at the M0-M3 layers.

For more details on the semiconductor Electroplating Chemicals market, supply-chain and growth trajectory, including supplier profiles on BASF, Dupont, Chang Chun Group, Ishihara Chemical/Unicon, and more, go to “Metal Chemicals for FE & Advanced Packaging Market Report: For Front End Semiconductor Manufacturing And Advanced Packaging Applications 2022″.

ABOUT TECHCET: TECHCET CA LLC is an advisory research firm focused on analyzing the electronics materials supply chains for the global semiconductor, display, solar/PV, and LED industries. TECHCET offers consulting, supply chain analysis reports, and subscription services, including the Critical Materials Council (CMC) of semiconductor fabricators and CM Data subscription services.

[日本語訳（一部）]

世界経済の弱体化により、半導体デバイスおよびパッケージング向けめっき市場も2023年は減速へ

めっきのスタンダードが従来型からバリヤー層におけるルテニウムやモリブデン活用などの新技術へ代替わりする可能性も

加州サンディエゴ、2023年1月4日

電子材料のビジネスおよび技術情報を提供するアドバイザリー会社のTECHCETは、2023年の半導体向けめっき市場の2022年からの収益増加率は2％にとどまる可能性があることを発表しました。これでは2021年から2022年までの増加が8.3%だったことを考えると著しい減退と言えます。このような減速が予測される大きな原因の一つは、2023年中、あるいは最短でも2023年上半期に予想されている経済の鈍化による半導体市場への影響が挙げられます。現在TECHCETではめっき化学品の収益は2022年の10億2,000USドルから2023年には10億4,000USドルになると予測しています。

Electroplating Materials – Any Slowdown in Sight?

San Diego, CA, September 13, 2022:  TECHCET—the electronic materials advisory firm providing business and technology information to chip fabricators and material suppliers — forecasts the total 2022 IC electroplating (Metal Chemicals) revenues to grow 8.1% to reach US$1,019 million. “A key growth driver for the electroplating market includes increases in interconnect layers in next generation advanced logic device nodes,” states Karey Holland, Ph.D., TECHCET’s Chief Strategist and Sr. Analyst. This is soon to be followed with buried power rails and backside copper wiring, increased use of advanced packaging for redistribution layers and copper pillar structures, and general overall strong demand for all semiconductor devices requiring copper interconnects.

The recently published Critical Materials Market Report on Metal Chemicals CMR™ highlights advanced Logic devices at < 14 nm as key drivers of growth, and expected show a CAGR of 7.4% through 2026. While chemical vapor deposition (CVD) or atomic layer deposition (ALD) are used to deposit metal interconnects at the lower device levels, the upper layers will continue to be electroplated copper as the bulk interconnect wiring. Thus, overall growth in advanced logic and number of layers continues to push up copper plating revenues for logic devices.

Copper metal electroplating is the largest segment of the IC electroplating segment and will top US$710 million in 2022. The forecasted 2021 to 2026 Compound Annual Growth Rate (CAGR) for this segment is 8.6%.

While smaller of the two copper plating chemical segments, advanced packaging applications are soaring in terms of use. The 2021 to 2026 CAGR for advanced packaging wafer starts is approaching 10%. The fastest growing segment is Fan-Out WLP which boosts application of RDL plating. Plating chemical volume consumption is increasing; however, TECHCET expects downward price pressure on CuSO4 as emerging suppliers in Asia are hungry to get a piece of the action.

[日本語訳（一部）]

いつまで続く？アドバンスドパッケージとフロントエンド（FE）/ダマシン用化学品における高いめっき需要

2022年には健全な成長、2023年は軟調化の予想

加州サンディエゴ、2021年9月23日

電子材料のビジネスおよび技術情報を提供するアドバイザリー会社のTECHCETは、あらゆるセクタにおけるチップへの大きな需要によりアドバンスドパッケージおよび前工程／ダマシンに使用されるめっき薬品の必要性が高まってきていることを発表しました。銅（Cu）、ニッケル（Ni）、スズ（Sn）、銀（Ag）向けのめっき薬品も含まれています。銅めっき薬品は合計で2021年に6憶6200ドル、成長率では14.2％に達し、アドバンスドパッケージはダマシンのほぼ2倍の増加となる見込みです。アドバンスドパッケージの用途にはCuピラー、再配線層（RDL)、Si貫通電極（TSV）などがあります。

（中略）

予測期間中に強い成長が見込まれているものの、テクセットではこの成長が2023年までに軟調に推移すると予想しています。「在庫調整により、今後2年間でデバイスの成長ペースは遅くなり、めっき薬品への需要も穏やかになるだろう」とテクセットのシニアディレクターDan Tracy氏は述べています。しかしながら、2025年までには再上昇することが予測されています。

“How long will it last?” Heightened Demand for Plating in Advanced Packaging & Front-End (FE)/Damascene Chemicals

Healthy growth through 2022, but softening expected in 2023

San Diego, CA, September 23, 2021:  TECHCET—the electronic materials advisory firm providing business and technology information— announced a heightened need for plating chemistries consumed in advanced packaging & FE/damascene driven by huge growth in chips in all sectors. This includes plating chemicals for copper (Cu), nickel (Ni), tin (Sn), and silver (Ag). Total copper plating chemicals are expected to grow 14.2% in 2021 to total $662M, with advanced packaging rising almost double that of damascene. Advanced packaging applications include Cu pillar, Redistribution Layer (RDL), and Through Silicon Via (TSV).

Advanced logic is the main driver of growth for plating materials. Used for damascene, copper plating chemicals volume demand increases with each new logic generation. Although CVD or PVD Cobalt (Co) and Ruthenium (Ru) are starting to be used in M0-M4 layers, overall growth in advanced logic and the number of layers pushes up Cu plating revenues for advanced logic applications. Advanced logic nodes (<16nm) wafer starts are forecasted to increase 14.4% CAGR (2020-2025); however, the number of damascene steps required for all leading-edge device wafer starts is expected to increase by more than 50% annually.