ウエハレベル向け金属めっき薬品 2022年

出版:Techcet(テクセット) 出版年月:2022年9月

Wafer Level Metal Plating Chemicals For Frontend Semiconductor Manufacturing and Advanced Packaging Applications 2022: 2022 Critical Materials Report™
ウエハレベル向け金属めっき薬品:半導体製造前工程(フロントエンド)とアドバンスドパッケージ向け市場 2022年

ページ数 153
図表数 75
価格(サイトライセンス) USD8,900
種別 英文調査報告書

レポート目次  お問合せ・ご注文  価格・納期について

無料サンプル

Techcet「ウエハレベル向け金属めっき薬品:半導体製造前工程(フロントエンド)とアドバンスドパッケージ向け市場 2022年 – Wafer Level Metal Plating Chemicals For Frontend Semiconductor Manufacturing and Advanced Packaging Applications 2022」は半導体製造前工程(フロントエンド/基板工程)と半導体アドバンスドパッケージ製造の際に使用されるめっき薬品市場を詳細に調査・分析しています。

主な掲載内容

  • アドバンスパッケージング(ウエアレベル)と半導体デバイス製造(ダマシン工程)に適用される金属用化学品市場動向とサプライチェーンに関する情報
  • 銅めっきと添加剤の予測、市場シェア、技術的動向、サプライヤ情報

目次(抜粋)

  1. エグゼクティブサマリー
  2. 調査範囲、目的、メソドロジー
  3. 半導体産業市場展望
    1. 世界経済
    2. 電子製品市場
    3. 半導体製造の成長と拡大
    4. 政策&貿易動向と影響
    5. 半導体材料展望
  4. セグメント別金属化学品市場
    1. 定義
    2. 金属めっき薬品市場概観
    3. 先進実装のメタライゼーション – 市場成長促進要因
    4. ダマシンの成長動向
  5. 技術動向
    1. 実装技術動向
    2. 技術動向
  6. 競争環境
  7. アナリストの評価
  8. サプライヤ情報

Report Details

  • Provides focused information on metal chemicals market trends and supply-chain as it applied to advanced packaging (wafer level) and semiconductor device manufacturing (damascene process).
  • Covers information about forecasts for copper plating and additives, market shares, technical trends, and supplier profiles.

目次

1 EXECUTIVE SUMMARY

1.1 EXECUTIVE SUMMARY
1.2 ADVANCED PACKAGING PER WAFER STARTS
1.3 DEVICE DEMAND DRIVERS – LOGIC
1.4 CU PLATING FORECAST FOR DAMASCENE (FE) AND ADVANCED PACKAGING
1.5 MARKET SHARES
1.6 SUPPLIER ACTIVITIES – VARIOUS ANNOUNCEMENTS
1.7 RISK FACTORS
1.8 ANALYST ASSESSMENT

2 SCOPE, PURPOSE AND METHODOLOGY

2.1 SCOPE
2.2 PURPOSE
2.3 METHODOLOGY
2.4 OVERVIEW OF OTHER TECHCET CMR™ REPORTS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1 WORLDWIDE ECONOMY

3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
3.1.2 SEMICONDUCTOR SALES GROWTH
3.1.3 TAIWAN MONTHLY SALES TRENDS
3.1.4 UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023 – SLOWER TO NEGATIVE SEMI REVENUE GROWTH EXPECTED

3.2 ELECTRONIC GOODS MARKET

3.2.1 SMARTPHONES
3.2.2 PC UNIT SHIPMENTS
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
3.2.3 SERVERS / IT MARKET

3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION

3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY
3.3.2 WW FAB EXPANSION DRIVING GROWTH
3.3.3 EQUIPMENT SPENDING TRENDS
3.3.4 TECHNOLOGY ROADMAPS
3.3.5 FAB INVESTMENT ASSESSMENT

3.4 POLICY & TRADE TRENDS AND IMPACT

3.4.1 POLICY AND TRADE ISSUES

3.5 SEMICONDUCTOR MATERIALS OUTLOOK

3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
3.5.2 CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD
3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2026
3.5.3.1 TECHCET WAFER START MODELING METHODOLOGY
3.5.4 TECHCET’S MATERIAL FORECAST

4 METAL CHEMICALS MARKET BY SEGMENT

4.1 DEFINITIONS

4.1.1 DEFINITIONS, CONTINUED

4.2 METAL PLATING CHEMICALS MARKET OVERVIEW

4.2.1 OVERVIEW – ADVANCED PACKAGING AND DAMASCENE METALLIZATION
4.2.2 OVERVIEW – PLATING MARKET TRANSITIONAL TRENDS

4.3 ADVANCED PACKAGING METALLIZATION – MARKET DRIVERS

4.3.1 ADVANCED PACKAGING – ADDITIVES FOR CU PLATING REVENUE
4.3.2 ADVANCED PACKAGING – COPPER CHEMICALS REVENUE
4.3.3 ADVANCED PACKAGING ADDITIVE VOLUMES
4.3.4 OTHER PLATING MATERIALS FOR ADVANCED PACKAGING
4.3.5 SN / SNAG PLATING
4.3.5.1 WW NI PLATING MARKET FORECAST

4.4 DAMASCENE GROWTH TRENDS

4.4.1 DAMASCENE GROWTH DRIVERS
4.4.2 DAMASCENE CU PLATING REVENUES
4.4.3 DAMASCENE ADDITIVE VOLUMES

5 TECHNICAL TRENDS

5.1 PACKAGING TECH TRENDS

5.1.1 PACKAGING TECHNICAL CHALLENGES

5.2 TECH TRENDS

5.2.1 MARKET DRIVES TECHNOLOGY TRENDS
5.2.2 ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION
5.2.2.1 TRENDS – MOL AND BEOL IRDS ROADMAP
5.2.3 CU DAMASCENE QUALIFICATION REQUIREMENTS
5.2.4 LOGIC METALLIZATION ROADMAP
5.2.4.1 INTERCONNECT FOR ADVANCED LOGIC
5.2.5 ADV LOGIC BURIED POWER RAIL
5.2.6 TECHNOLOGY ROADMAP: DRAM WITH MO OR RU
5.2.6.1 GENERAL PROCESS FLOW ADVANCED DRAM
5.2.7 PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU
5.2.7.1 3D-NAND GENERATIONS 2020 -2025
5.2.8 EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD
5.2.8 TECHNICAL REQUIREMENTS SUMMARY 1/2
5.2.8.1 TECHNICAL REQUIREMENTS SUMMARY 2/2

6 COMPETITIVE LANDSCAPE

6.1 TOTAL ADVANCED PACKAGING AND DAMASCENE MARKET SHARES
6.2 OEM MARKET SHARE– PLATING EQUIPMENT
6.3 MARKET SHARE BY APPLICATION – CU PLATING FOR ADVANCED PACKAGING
6.4 REGIONAL PLAYERS AND OTHERS
6.5 M&A ACTIVITY

7 ANALYST ASSESSMENT

7.1 ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT

8 SUPPLIER PROFILES

BASF
DUPONT
CHANG CHUN GROUP
And more..

9 APPENDIX A: PACKAGING TECH TRENDS

FIGURES & TABLES

FIGURES

FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M’S)
FIGURE 2: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
FIGURE 3: ADVANCED LOGIC DEVICES GROWTH FORECAST
FIGURE 4: COPPER PLATING CHEMICALS REVENUES $M’S) FOR ADVANCED PACKAGING & FE/DAMASCENE
FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED PACKAGING AND SEMICONDUCTOR DEVICE MFG. 2022
FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2021)
FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 8: TECHCET’ TAIWAN SEMICONDUCTOR INDUSTRY INDEX*
FIGURE 9: 2022 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
FIGURE 10: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
FIGURE 11: SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 12: MOBILE PHONE SHIPMENTS WW ESTIMATES
FIGURE 13: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3
FIGURE 14: GLOBAL EV TRENDS
FIGURE 15: SEMICONDUCTOR SPEND PER VEHICLE TYPE
FIGURE 16: TSMC CONSTRUCTION SITE IN ARIZONA
FIGURE 17: CHIP EXPANSIONS 2021-2026 > US$460 B
FIGURE 18: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 19: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS
FIGURE 20: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP
FIGURE 21: EUROPE CHIP EXPANSION UPSIDE
FIGURE 22: TECHCET WAFER START FORECAST BY NODE
FIGURE 23: TECHCET MATERIALS FORECAST
FIGURE 24: PACKAGING METALLIZATION APPLICATIONS
FIGURE 25: USE OF SILICON INTERPOSER
FIGURE 26: VERSIONS OF TSV & PROCESS FLOW EXAMPLE
FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M’S)
FIGURE 28: CU PLATING CHEMICALS 5-YEAR FORECAST
FIGURE 29: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
FIGURE 30: CU PLATING ADVANCED PACKAGING REVENUE FORECAST ESTIMATES
FIGURE 31: CU PILLAR & CU RDL SEGMENTED FORECAST
FIGURE 32: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST
FIGURE 33: ADV. PACKAGING CU PLATING ADDITIVES VOLUME DEMAND FORECAST
FIGURE 34: MATERIALS STACK USING CU PILLAR (< 40 UM PITCH)
FIGURE 35: SN AND SNAG PLATING REVENUE
FIGURE 36: NICKEL PLATING REVENUE
FIGURE 37: ADVANCED LOGIC DEVICES GROWTH FORECAST
FIGURE 38: ADV LOGIC METAL PLATING WAFER PASSES
FIGURE 39: WW DAMASCENE REVENUE FORECAST ESTIMATES
FIGURE 40: DAMASCENE CU VMS VOLUME DEMAND FORECAST ESTIMATES
FIGURE 41: DAMASCENE CU PLATING ADDITIVES CHEMICAL VOLUME DEMAND FORECAST
FIGURE 42: KEY TRENDS IN ADVANCED PACKAGING
FIGURE 43: CHALLENGES OF ELECTROPLATING VIA FILL
FIGURE 44: METAL LEVELS PER LOGIC NODE
FIGURE 45: INTERCONNECT METAL COMPARISON BY RESISTIVITY
FIGURE 46: CU DAMASCENE QUALIFICATION
FIGURE 47: LEADING EDGE LOGIC POWER RAIL SCHEMES
FIGURE 48: DRAM STRUCTURE
FIGURE 49: 3D NAND STRUCTURE
FIGURE 50: TOTAL PLATING FOR ADV. PACKAGING AND SEMICONDUCTOR DEVICE MANUFACTURING 2022
FIGURE 51: PLATING EQUIPMENT OEM MARKET SHARES 2020
FIGURE 52: PLATING CHEMICAL SUPPLIER FOR DAMASCENE AND ADVANCED PACKAGING APPLICATIONS
FIGURE 53: CLEANING COMPLEXITY
FIGURE 54: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND
FIGURE 55: WAFER LEVEL PLATING
FIGURE 56: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS
FIGURE 57: COMPARISON WITH DAMASCENE- TYPE RDL
FIGURE 58: USE OF SILICON INTERPOSER
FIGURE 59: APPLE EXAMPLE INTERPOSERS
FIGURE 60: TSV PROCESS FLOW EXAMPLE

TABLES

TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
TABLE 2: IMF ECONOMIC OUTLOOK*
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES FORECAST 2021
TABLE 4: IRDS 2022 LOGIC CORE INTERCONNECT ROADMAP
TABLE 5: LOGIC DEVICE ROADMAP FOR METALS
TABLE 6: METALS REQUIRED FOR DEVICE FEATURES
TABLE 7: DRAM USE OF MO OR RU PRESENT & FUTURE
TABLE 8: GENERAL PROCESS FLOW ADVANCED DRAM
TABLE 9: 3D NAND MATERIAL CHANGES PRESENT & FUTURE
TABLE 10: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF 3DNAND
TABLE 11: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD
TABLE 12: TECHNICAL REQUIREMENTS SUMMARY 1/2
TABLE 13: TECHNICAL REQUIREMENTS SUMMARY 2/2
TABLE 14: REGIONAL PLAYERS – MARKET LEADER AND “OTHERS”
TABLE 15: CU PACKAGING APPLICATIONS AND REQUIREMENTS


プレスリリース

Electroplating Materials – Any Slowdown in Sight?

San Diego, CA, September 13, 2022:  TECHCET—the electronic materials advisory firm providing business and technology information to chip fabricators and material suppliers — forecasts the total 2022 IC electroplating (Metal Chemicals) revenues to grow 8.1% to reach US$1,019 million. “A key growth driver for the electroplating market includes increases in interconnect layers in next generation advanced logic device nodes,” states Karey Holland, Ph.D., TECHCET’s Chief Strategist and Sr. Analyst. This is soon to be followed with buried power rails and backside copper wiring, increased use of advanced packaging for redistribution layers and copper pillar structures, and general overall strong demand for all semiconductor devices requiring copper interconnects.

The recently published Critical Materials Market Report on Metal Chemicals CMR™ highlights advanced Logic devices at < 14 nm as key drivers of growth, and expected show a CAGR of 7.4% through 2026. While chemical vapor deposition (CVD) or atomic layer deposition (ALD) are used to deposit metal interconnects at the lower device levels, the upper layers will continue to be electroplated copper as the bulk interconnect wiring. Thus, overall growth in advanced logic and number of layers continues to push up copper plating revenues for logic devices.

Copper metal electroplating is the largest segment of the IC electroplating segment and will top US$710 million in 2022. The forecasted 2021 to 2026 Compound Annual Growth Rate (CAGR) for this segment is 8.6%.

While smaller of the two copper plating chemical segments, advanced packaging applications are soaring in terms of use. The 2021 to 2026 CAGR for advanced packaging wafer starts is approaching 10%. The fastest growing segment is Fan-Out WLP which boosts application of RDL plating. Plating chemical volume consumption is increasing; however, TECHCET expects downward price pressure on CuSO4 as emerging suppliers in Asia are hungry to get a piece of the action.

 

[日本語訳(一部)]

いつまで続く?アドバンスドパッケージとフロントエンド(FE)/ダマシン用化学品における高いめっき需要

2022年には健全な成長、2023年は軟調化の予想

加州サンディエゴ、2021年9月23日

電子材料のビジネスおよび技術情報を提供するアドバイザリー会社のTECHCETは、あらゆるセクタにおけるチップへの大きな需要によりアドバンスドパッケージおよび前工程/ダマシンに使用されるめっき薬品の必要性が高まってきていることを発表しました。銅(Cu)、ニッケル(Ni)、スズ(Sn)、銀(Ag)向けのめっき薬品も含まれています。銅めっき薬品は合計で2021年に6憶6200ドル、成長率では14.2%に達し、アドバンスドパッケージはダマシンのほぼ2倍の増加となる見込みです。アドバンスドパッケージの用途にはCuピラー、再配線層(RDL)、Si貫通電極(TSV)などがあります。

(中略)

予測期間中に強い成長が見込まれているものの、テクセットではこの成長が2023年までに軟調に推移すると予想しています。「在庫調整により、今後2年間でデバイスの成長ペースは遅くなり、めっき薬品への需要も穏やかになるだろう」とテクセットのシニアディレクターDan Tracy氏は述べています。しかしながら、2025年までには再上昇することが予測されています。

[プレスリリース原文]

“How long will it last?” Heightened Demand for Plating in Advanced Packaging & Front-End (FE)/Damascene Chemicals

Healthy growth through 2022, but softening expected in 2023

San Diego, CA, September 23, 2021:  TECHCET—the electronic materials advisory firm providing business and technology information— announced a heightened need for plating chemistries consumed in advanced packaging & FE/damascene driven by huge growth in chips in all sectors. This includes plating chemicals for copper (Cu), nickel (Ni), tin (Sn), and silver (Ag). Total copper plating chemicals are expected to grow 14.2% in 2021 to total $662M, with advanced packaging rising almost double that of damascene. Advanced packaging applications include Cu pillar, Redistribution Layer (RDL), and Through Silicon Via (TSV).

Advanced logic is the main driver of growth for plating materials. Used for damascene, copper plating chemicals volume demand increases with each new logic generation. Although CVD or PVD Cobalt (Co) and Ruthenium (Ru) are starting to be used in M0-M4 layers, overall growth in advanced logic and the number of layers pushes up Cu plating revenues for advanced logic applications. Advanced logic nodes (<16nm) wafer starts are forecasted to increase 14.4% CAGR (2020-2025); however, the number of damascene steps required for all leading-edge device wafer starts is expected to increase by more than 50% annually.

Although strong growth is expected throughout the forecast period, TECHCET anticipates a slowing in growth by 2023. “In another couple of years, we anticipate an inventory correction which should slow the pace of growth in devices and moderate demand for plating chemicals,” stated Dan Tracy, Sr. Director of TECHCET. However, by 2025, another upturn is expected.

    お問合せフォーム

    • レポートのタイトルは自動で入ります。
    • *のある項目は必須項目です。

    お名前*

    会社名*

    部署名

    メールアドレス*

    電話番号

    当ウェブサイトを知った経緯を教えてください。

    お問合せ内容

    株式会社SEMABIZ・ChosaReport.com プライバシーポリシー

    Eメールでのお問合せもお受けしております。
    下記アドレスへ“(at)”を“@”に変えてお送りください。通常1営業日以内にご返信いたします。
    crinquiry(at)chosareport.com