Lithography Materials Market Report 2025-2026
商品番号:SMB-2989
出版社 | TECHCET |
出版年月 | 2025年5月下旬出版予定 |
価格タイプ | ベーシックライセンス |
価格 | USD 8,900.00 |
種別 | 英文調査報告書 |
※ | 最新の出版スケジュールはお問合せください。 |
フォトリソグラフィは半導体デバイスの製造に欠かせない技術の一つです。TECHCET(テクセット)「リソグラフィ材料市場レポート 2025-2026年:サプライチェーン&市場分析 – Lithography Materials Market Report 2025-2026」はフォトリソグラフィの関連市場を調査し、特にフォトレジスト、付属品(アンシラリー)、拡張材料の技術および市場を詳細に分析・解説しています。
主な掲載内容(仮)
- エグゼクティブサマリー
- 調査範囲、目的、メソドロジー
- 半導体産業市場展望
- 世界経済と展望
- 電子製品セグメント別チップ売上
- 半導体製造の成長と拡大
- 政策&貿易動向と影響
- 半導体材料展望
- フォトレジストのセグメント別市場動向
- フォトレジストのセグメント別市場動向
- 供給容量と需要、投資
- 価格動向
- 技術動向/技術的促進要因
- 地域別考察
- アナリストによるフォトレジストのセグメント別市場動向評価
- フォトリソグラフィの付属品と拡張市場動向
- 付属品と拡張市場動向
- 付属品と拡張材料市場環境と投資
- 技術動向/技術的促進要因
- 付属品と拡張材料のEHS(環境・労働安全衛生)と貿易/物流問題
- フォトリソグラフィ材料市場のサプライヤ環境
- フォトレジスト材料市場シェア
- M&Aと提携関係 – 報告なし
- 工場閉鎖 – 報告なし
- 新規参入企業
- サプライヤのディスラプション
- その他の考察
- TECHCEアナリストによるフォトリソグラフィ材料サプライヤ評価
- サブティアサプライチェーン、フォトリソグラフィ材料
- ティアサプライチェーン:フォトレジストコンポーネント
- フォトレジスト樹脂
- フォトレジスト溶媒
- その他のフォトレジストコンポーネント
- フォトレジストコンポーネントの参考情報&情報源
- サプライヤー情報
Overview
This report covers the market and supply-chain for Photolithography Materials used in semiconductor device fabrication. The report contains data and analysis from TECHCET’s data base and Sr. Analyst experience, as well as that developed from primary and secondary market research.
- Focuses on the markets for lithography materials, covering photoresists, extension, and ancillary materials
- Provides focused information for electronics supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
- Covers information about key lithography materials suppliers, issues/trends in the lithography materials supply chain, estimates on supplier market share, and lithography materials market forecasting
- Technological trend analysis, details on the supply-chain for these specialized lithography materials are discussed
- Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analystAnalyst Biography
Karey Holland, Ph.D. is Chief Strategist and Co-Founder of TECHCET. Dr. Holland has specialized in advanced semiconductor transistor fabrication, including photolithography, CMP, ALD & CVD, metrology, and interconnect technologies for over 30 years. She was CTO of Revasum, Strategic Technical Marketing Manager at Edwards Vacuum, VP Process Technology at MegaFluid Systems, CTO of start-up NexPlanar, strategic marketing senior manager at FEI, on the Board of Directors at Nova Measuring Instruments, VP of technology at CMP pad supplier
Thomas West, and CTO and VP of process technology at CMP OEM IPEC/SpeedFam-IPEC.
Prior to IPEC, Dr. Holland was manager of manufacturing planning for Motorola’s Microprocessor and Memory Technology Group. Her career began in process engineering at IBM. There, she was the manager of the first DUV-248nm lithography technology development team. Dr. Holland also worked on interconnect integration for 4 and 16 Mb DRAMs, which were the first chips in the world to use tungsten plugs and CMP for interconnect dielectrics. She holds a Ph.D. in analytical chemistry from Pennsylvania State University, a M.S. in analytical chemistry
from Purdue University, and a B.A. in chemistry from Albion College.
Table of Contents
※暫定目次です。
1 EXECUTIVE SUMMARY 10
1.1 PHOTOLITHOGRAPHY MARKET OVERVIEW 11
1.2 PHOTOLITHOGRAPHY MATERIALS BUSINESS – MARKET OVERVIEW 12
1.2.1 PHOTOLITHOGRAPHY MATERIALS BUSINESS – MARKET OVERVIEW 13
1.3 INTERNATIONAL TRENDS IMPACTING PHOTOLITHOGRAPHY 2024 OUTLOOK 15
1.4 PHOTOLITHOGRAPHY APPLICATIONS EFFECTING MARKET TRENDS 16
1.5 PHOTORESIST MATERIALS 5-YEAR VOLUME FORECAST BY SEGMENT 17
1.6 PHOTORESIST MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT 18
1.7 TECHNOLOGY TRENDS 19
1.8 PHOTOLITHOGRAPHY COMPETITIVE LANDSCAPE 23
1.9 EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS 25
1.10 ANALYST ASSESSMENT OF PHOTOLITHOGRAPHY MATERIALS 26
2 SCOPE, PURPOSE AND METHODOLOGY 28
2.1 SCOPE 29
2.2 PURPOSE 30
2.3 METHODOLOGY 31
2.4 OVERVIEW OF OTHER TECHCET CMR™ OFFERINGS 32
3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK 33
3.1 WORLDWIDE ECONOMY AND OUTLOOK 34
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 36
3.1.2 SEMICONDUCTOR SALES GROWTH 37
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS 38
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 39
3.2.1 ELECTRONICS OUTLOOK 40
3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK 41
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 42
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 43
3.2.3 SMARTPHONE OUTLOOK 44
3.2.4 PC OUTLOOK 45
3.2.5 SERVERS / IT MARKET 46
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 47
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS 48
3.3.2 NEW FABS IN THE US 49
3.3.3 WW FAB EXPANSION DRIVING GROWTH 50
3.3.4 EQUIPMENT SPENDING TRENDS 51
3.3.4.1 ADVANCED LOGIC TECHNOLOGY ROADMAPS 52
3.3.4.2 DRAM TECHNOLOGY ROADMAPS 53
3.3.4.3 3D NAND TECHNOLOGY ROADMAPS 54
3.3.5 FAB INVESTMENT ASSESSMENT 55
3.4 POLICY & TRADE TRENDS AND IMPACT 56
3.5 SEMICONDUCTOR MATERIALS OVERVIEW 57
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028 58
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028 59
4 PHOTORESIST SEGMENT MARKET TRENDS 60
4.1 PHOTORESIST SEGMENT MARKET TRENDS – OUTLINE 61
4.1.1 2023 PHOTORESIST SEGMENT MARKET LEADING INTO 2024 62
4.1.2 PHOTORESIST SEGMENT MARKET OUTLOOK 64
4.1.3 PHOTORESIST MATERIALS 5-YEAR VOLUME FORECAST BY SEGMENT 66
4.1.3.1 EUV PHOTORESIST MATERIALS 5-YEAR VOLUME FORECAST BY SEGMENT 67
4.1.3.2 ARF (193NM) AND ARFI PHOTORESIST MATERIALS 5-YEAR VOLUME FORECAST BY SEGMENT 68
4.1.3.3 KRF, I & G-LINE PHOTORESIST MATERIALS 5-YEAR VOLUME FORECAST BY SEGMENT 69
4.1.4 PHOTORESIST MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT 70
4.1.4.1 EUV PHOTORESIST MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT 71
4.1.4.2 ARF (193NM) AND ARFI PHOTORESIST MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT 72
4.1.4.3 KRF, I & G-LINE PHOTORESIST MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT 73
4.2 SUPPLY CAPACITY AND DEMAND, INVESTMENTS – OUTLINE 74
4.2.1 PHOTORESIST MATERIALS PRODUCTION CAPACITY OF TOP SUPPLIERS 75
4.2.2 PHOTORESIST MATERIALS PRODUCTION BY REGION 76
4.2.3 PHOTORESIST PRODUCTION CAPACITY EXPANSIONS 77
4.2.3.1 CANON PRODUCTION CAPACITY EXPANSIONS 78
4.2.3.2 DUPONT PRODUCTION CAPACITY EXPANSIONS 79
4.2.3.3 DONGJIN PRODUCTION CAPACITY EXPANSIONS 80
4.2.3.4 FUJIFILM PRODUCTION CAPACITY EXPANSIONS 81
4.2.3.5 JSR PRODUCTION CAPACITY EXPANSIONS 82
4.2.3.6 MERCK KGAA, EMD ELECTRONICS PRODUCTION CAPACITY EXPANSIONS 83
4.2.3.7 SHIN-ETSU PRODUCTION CAPACITY EXPANSIONS 84
4.2.3.8 SUMITOMO PRODUCTION CAPACITY EXPANSIONS 85
4.2.3.9 TOK PRODUCTION CAPACITY EXPANSIONS 86
4.2.4 INVESTMENT ANNOUNCEMENTS OVERVIEW 87
4.3 PRICING TRENDS 88
4.4 TECHNOLOGY TRENDS/TECHNICAL DRIVERS – OUTLINE 89
4.4.1.1 PHOTORESIST MATERIALS GENERAL TECHNOLOGY OVERVIEW 90
4.4.1.2 PATTERNING TECHNOLOGY TRENDS 91
4.4.1.3 PRODUCTION LAYERS BY LITHOGRAPHIC EXPOSURE TYPE 97
4.4.1.4 3D NAND TRENDS 98
4.4.2 PHOTORESIST TECHNOLOGY TRENDS 99
4.4.3 SPECIALTY/EMERGING PHOTORESIST MATERIALS/RELATED 101
4.5 REGIONAL CONSIDERATIONS 102
4.5.1 REGIONAL ASPECTS AND DRIVERS 103
4.5.2 EHS ISSUES 105
4.7 ANALYST ASSESSMENT OF PHOTORESIST SEGMENT MARKET TRENDS 108
5 PHOTOLITHOGRAPHY ANCILLARIES & EXTENSIONS SEGMENT MARKET TRENDS 111
5.1 ANCILLARIES AND EXTENSIONS SEGMENT MARKET TRENDS – OUTLINE 112
5.1.1 ANCILLARIES AND EXTENSION SEGMENT MARKET OUTLOOK 113
5.1.2 ANCILLARIES MATERIALS 5-YEAR VOLUME FORECAST BY SEGMENT 114
5.1.2.1 ANCILLARIES MATERIALS (EBR AND PREWET) 5-YEAR VOLUME FORECAST BY SEGMENT 115
5.1.2.2 ANCILLARIES MATERIALS (NTD AND RINSE) 5-YEAR VOLUME FORECAST BY SEGMENT 116
5.1.2.3 ANCILLARIES MATERIALS (PTD) 5-YEAR VOLUME FORECAST BY SEGMENT 117
5.1.3 ANCILLARIES MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT 118
5.1.3.1 ANCILLARIES MATERIALS (EBR AND PREWET) 5-YEAR REVENUE FORECAST BY SEGMENT 119
5.1.3.2 ANCILLARIES MATERIALS (NTD AND RINSE) 5-YEAR REVENUE FORECAST BY SEGMENT 120
5.1.3.3 ANCILLARIES MATERIALS (PTD) 5-YEAR REVENUE FORECAST BY SEGMENT 121
5.1.4 EXTENSIONS MATERIALS 5-YEAR VOLUME FORECAST BY SEGMENT 122
5.1.4.1 EXTENSIONS (KRF BARC) 5-YEAR VOLUME FORECAST BY SEGMENT 123
5.1.4.2 EXTENSIONS (ARF BARC) 5-YEAR VOLUME FORECAST BY SEGMENT 124
5.1.4.3 EXTENSIONS (SOC) 5-YEAR VOLUME FORECAST BY SEGMENT 125
5.1.4.4 EXTENSIONS (SI BARC) 5-YEAR VOLUME FORECAST BY SEGMENT 126
5.1.5 EXTENSIONS MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT 127
5.1.5.1 EXTENSIONS (KRF BARC) 5-YEAR REVENUE FORECAST BY SEGMENT 128
5.1.5.2 EXTENSIONS (ARF BARC) 5-YEAR REVENUE FORECAST BY SEGMENT 129
5.1.5.3 EXTENSIONS (SOC) 5-YEAR REVENUE FORECAST BY SEGMENT 130
5.1.5.4 EXTENSIONS (SI BARC) 5-YEAR REVENUE FORECAST BY SEGMENT 131
5.2 ANCILLARIES AND EXTENSIONS MATERIALS MARKET LANDSCAPE AND INVESTMENTS – OUTLINE 132
5.2.1 MARKET LANDSCAPE / KEY SUPPLIERS OF ANCILLARIES 133
5.2.2 MARKET LANDSCAPE / KEY SUPPLIERS OF ANCILLARIES (NON-PHOTORESIST MAKERS) 134
5.2.3 MARKET LANDSCAPE / KEY SUPPLIERS OF EXTENSION MATERIALS 135
5.2.4 INVESTMENT ANNOUNCEMENTS OVERVIEW 136
5.3 TECHNOLOGY TRENDS/TECHNICAL DRIVERS – OUTLINE 137
5.3.1 PHOTOLITHOGRAPHY ANCILLARIES & EXTENSION MATERIALS GENERAL TECHNOLOGY OVERVIEW 138
5.3.2 PHOTOLITHOGRAPHY ANCILLARIES & EXTENSION MATERIALS TECHNOLOGY TRENDS 139
5.4 EHS AND TRADE/LOGISTIC ISSUES FOR ANCILLARIES AND EXTENSION MATERIALS 142
5.5.1 ANALYST ASSESSMENT OF ANCILLARIES SEGMENT MARKET TRENDS 143
5.5.2 ANALYST ASSESSMENT OF EXTENSIONS SEGMENT MARKET TRENDS 144
6 PHOTOLITHOGRAPHY MATERIALS MARKET SUPPLIER LANDSCAPE 145
6.1 PHOTORESIST MATERIALS MARKET SHARE 146
6.2.1 CURRENT QUARTER – REPORTED REVENUES & SUPPLIERS’ ACTIVITIES 147
6.3 M&A ACTIVITY AND PARTNERSHIPS – NON REPORTED 149
6.4 PLANT CLOSURES – NONE REPORTED 150
6.5 NEW ENTRANTS 151
6.6 SUPPLIER DISRUPTIONS 155
6.6.1 SUPPLIERS OR PARTS/PRODUCT LINES AT RISK OF DISCONTINUATION – NONE REPORTED 156
6.7 OTHER THOUGHTS 157
6.8 TECHCET ANALYST ASSESSMENT OF PHOTOLITHOGRAPHIC MATERIALS
7 SUB-TIER SUPPLY-CHAIN, PHOTOLITHOGRAPHY MATERIALS 159
7.1 SUB-TIER SUPPLY CHAIN: PHOTORESISTS COMPONENTS 160
7.2 PHOTORESIST RESINS 161
7.2.1 PHOTORESIST RESINS 162
7.3 PHOTORESIST SOLVENTS 7.4 PHOTORESIST OTHER COMPONENTS 164
7.5 PHOTORESIST COMPONENTS REFERENCES & SOURCES 165
8 SUPPLIER PROFILES 166
AUECC
AVANTOR
ALLRESIST GESELLSCHAFT FÜR CHEMISCHE
BASF
BREWER SCIENCE
…and 20+ more
9 APPENDIX 167
SELECT EXTENSION AND ANCILLARY SUPPLIERS* 168
LIST OF FIGURES
FIGURE 1.1: A HISTORY OF PHOTOLITHOGRAPHY ADVANCEMENT 13
FIGURE 1.2: PHOTOLITHOGRAPHY MATERIALS VOLUME FORECAST BY SEGMENT 17
FIGURE 1.3: PHOTOLITHOGRAPHY MATERIALS REVENUE FORECAST BY SEGMENT 18
FIGURE 1.4: TRADE OFFS WITH EUV 21
FIGURE 1.5: BOTTOM ANTI-REFLECTIVE COATING (BARC) 22
FIGURE 1.6: 2023 MARKET SHARE ESTIMATES OF TOP 3 PHOTORESIST COMPANIES 23
FIGURE 1.7: ASML HIGH NA EUV SYSTEM 26
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023) 36
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES 37
FIGURE 3.3: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI) 38
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS 39
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS) 41
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION 42
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION 43
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES 44
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST 45
FIGURE 3.10: TSMC PHOENIX INVESTMENT ESTIMATED TO BE US $40 B 47
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2022-2027 48
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US 49
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD 50
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE 51
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW 52
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW 53
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW 54
FIGURE 3.18: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM) 55
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS 58
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD) 59
FIGURE 4.1: PHOTORESIST VOLUME FORECAST BY SEGMENT 66
FIGURE 4.2: EUV PHOTORESIST VOLUME FORECAST BY SEGMENT 67
FIGURE 4.3: ARF AND ARFI PHOTORESIST VOLUME FORECAST BY SEGMENT 68
FIGURE 4.4: KRF, I & G-LINE PHOTORESIST VOLUME FORECAST BY SEGMENT 69
FIGURE 4.5: PHOTORESIST REVENUE FORECAST BY SEGMENT 70
FIGURE 4.6: EUV PHOTORESIST REVENUE FORECAST BY SEGMENT 71
FIGURE 4.7: ARF AND ARFI PHOTORESIST REVENUE FORECAST BY SEGMENT 72
FIGURE 4.8: KRF, I & G-LINE PHOTORESIST REVENUE FORECAST BY SEGMENT 73
FIGURE 4.9: MARKET SHARES OF TOP PHOTORESIST COMPANIES IN 2023 75
FIGURE 4.10: OVERVIEW AND EVOLUTION OF PHOTORESIST CHEMISTRY 90
FIGURE 4.11: SCANNER TECHNOLOGY TRENDS ARF TO EUV 92
FIGURE 4.12: EUV RESIST RECTIFICATION 93
FIGURE 4.13: SELECTIVE DSA EXAMPLE 94
FIGURE 4.14. RECTIFICATION FLOW USING DSA 95
FIGURE 4.15: NANOIMPRINT LITHOGRAPHY 96
FIGURE 4.16: GENERAL SCHEMATIC OF LITHO EXPOSURES BY DEVICE TYPE 97
FIGURE 4.17: EXAMPLE OF 3D NAND SCALING BY STACKS/TIERS 98
FIGURE 4.18: CHINESE VERSION OF EUV LITHOGRAPHY TOOL IN DEVELOPMENT 101
FIGURE 4.19: 2023 ESTIMATED PHOTORESIST REVENUE SHARE BY REGION 102
FIGURE 5.1: ANCILLARIES VOLUME FORECAST BY SEGMENT 114
FIGURE 5.2: EBR AND PREWET VOLUME FORECAST BY SEGMENT 115
FIGURE 5.3: NTD CHEMICALS VOLUME FORECAST BY SEGMENT 116
FIGURE 5.4: PTD VOLUME FORECAST BY SEGMENT 117
FIGURE 5.5: ANCILLARIES REVENUE FORECAST BY SEGMENT 118
FIGURE 5.6: EBR AND PREWET REVENUE FORECAST BY SEGMENT 119
FIGURE 5.7: NTD CHEMICALS REVENUE FORECAST BY SEGMENT 120
FIGURE 5.8: PTD REVENUE FORECAST BY SEGMENT 121
FIGURE 5.9: EXTENSIONS VOLUME FORECAST BY SEGMENT 122
FIGURE 5.10: KRF BARC VOLUME FORECAST BY SEGMENT 123
FIGURE 5.11: ARF BARC VOLUME FORECAST BY SEGMENT 124
FIGURE 5.12: SOC VOLUME FORECAST BY SEGMENT 125
FIGURE 5.13: SI BARC VOLUME FORECAST BY SEGMENT 126
FIGURE 5.14: EXTENSIONS REVENUE FORECAST BY SEGMENT 127
FIGURE 5.15: KRF BARC REVENUE FORECAST BY SEGMENT 128
FIGURE 5.16: ARF BARC REVENUE FORECAST BY SEGMENT 129
FIGURE 5.17: SOC REVENUE FORECAST BY SEGMENT 130
FIGURE 5.18: SI BARC REVENUE FORECAST BY SEGMENT 131
FIGURE 5.19: DEVELOPER TRANSITION 140
FIGURE 5.20: SOLVENT IMPACT FOR POSITIVE VS. NEGATIVE PHOTORESIST 141
FIGURE 6.1: LAM RESEARCH DRY RESIST 153
LIST OF TABLES
TABLE 1.1: PHOTOLITHOGRAPHY MATERIALS GROWTH OVERVIEW 11
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES 34
TABLE 3.2: WORLD BANK ECONOMIC OUTLOOK (JANUARY 2024) 35
TABLE 3.3: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS 42
TABLE 3.4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023 46
TABLE 4.1: MATERIAL SUPPLIER MANUFACTURING LOCATIONS 76
TABLE 4.2: OVERVIEW OF ANNOUNCED 2023/2024 PHOTORESIST MATERIALS SUPPLIER INVESTMENTS 87
TABLE 4.3: REGIONAL PHOTOLITHOGRAPHY MATERIALS TRENDS 103
TABLE 4.4: REGIONAL LITHOGRAPHY MATERIALS SUPPLIER EXPANSION SUMMARY 104
TABLE 4.5: COMPARISON OF PERFORMANCE OF PAGS VERSUS ALTERNATIVES 107
TABLE 5.1: SOLVENT SUPPLIERS 133
TABLE 5.2: ANCILLARY SUPPLIER LANDSCAPE 134
TABLE 5.3: KEY SUPPLIERS OF EXTENSION MATERIALS 135
TABLE 5.4: OVERVIEW OF ANNOUNCED 2023/2024 ANCILLARY & EXTENSION MATERIALS SUPPLIER INVESTMENTS 136
TABLE 6.1: ESTIMATED TOTAL PHOTORESIST MARKET SHARE BY SUPPLIER 146
TABLE 6.2: MOST RECENT REPORTED QUARTERLY LITHO MATERIAL SUPPLIER SALES 147
プレスリリース
[抄訳]リソグラフィ材料市場は大きく発展 – TECHCET予測
2025年5月6日、カリフォルニア州サンディエゴ
フォトリソグラフィ材料収益は半導体市場の復調が後押しし、2025年末までに50億6,000万ドルに達し、7%の成長になるとTECHCETでは予測しています。この成長は先端フォトレジスト、特にEUVの著しい需要増加が促進要因となり、前年比30%の成長が期待されています。付属品と拡張材料もロジックおよびDRAMチップセグメントにおける先端ノードデバイスにおいて特にチップ製造量の増加に従い、成長の加速が予想されます。さらにTECHCETではリソグラフィ材料市場が2029年までには年平均成長率(CAGR)6%で成長するとも予測しています。
[原文] TECHCET Projects Big Development for Lithography Materials
San Diego, CA, May 06, 2025 – TECHCET is forecasting a 7% increase in photolithography materials revenue in 2025, reaching $5.06 billion, driven by a recovery in the semiconductor market. This growth will be led by a significant rise in the demand for advanced photoresists, particularly EUV, which is expected to see a 30% growth YoY. Ancillary and extension materials will also experience robust growth as chip production volumes rise especially for advanced nodes devices in the logic and DRAM chip segments. Looking even further ahead, the lithography materials market is projected to grow at a 6% CAGR through 2029 according to TECHCET’s 2025 Critical Materials Report™ on Lithography Materials.
In 2024, photolithography materials saw a modest 1.6% revenue growth, reaching $4.74 billion. Photoresists grew by 1%, with EUV showing the largest increase at 20% YoY. Ancillaries and extensions performed well, growing by 2% each, respectively. The demand for photoresists, particularly EUV, has been steadily increasing due to the growth in advanced node processes, while traditional photoresists such as KrF and ArF increased use for 3D NAND also contributed to the market’s positive performance.
Moving forward, photolithography market growth will be influenced by supply chain localization, with new facilities being built in the U.S., South Korea, Taiwan, and China. Geopolitical tensions, particularly restrictions on advanced materials and China’s development of advanced lithography technologies, will impact material availability. Innovations like dry photoresist deposition and nanoimprint lithography will also be crucial in meeting the demand for advanced nodes, while the industry adapts to challenges such as the shift away from PFAS-related chemicals. At least one large photoresist company has developed a good performing non-PFAS KrF resist.
For more details on Lithography market segments and growth trajectory, including profiles on JSR, DuPont/Qnity, Fujifilm, EMD/Merck, Dongjin, Brewer Science, Kehua Microelectronics and more, go to: https://chosareport.com/techcet-photolithography/
ABOUT: TECHCET CA LLC is an advisory services firm expert in market analysis and business development of electronic markets and supply-chains for the semiconductor, display, solar, and LED markets. TECHCET offers consulting, reports, and the Critical Materials Council and DSS subscription services.
リソグラフィ材料は成長傾向へ
PFASの排除努力によりフォトレジストの代替品への移行が進む見込み
2024年8月8日、カリフォルニア州サンディエゴ
電子部品のアドバイザリー企業としてビジネス情報および技術情報を提供するTECHCETでは半導体用フォトレジストの収益の増加が2024年中に11%近くになると予測しています。2024年は半導体市場全体の復調も期待されており、特に2024年下半期にはあらゆるレジストに対する需要が増加すると期待されています。また、フォトレジスト付属品についても10%前後の増加と9%前後の拡張が予想されています。
「従来の利用方法[i線、g線、248nm (KrF)]が従来型デバイス、3D NAND、そして”最小ではない”特徴を持った先進機器向けに使用されていることがリソグラフィ材料の促進要因になっていると言えます。」(TECHCET技術部門最高戦略責任者Karey Holland博士)フォトリソグラフィ材料の数量はチップ製造業界全体の投入ウエハー(Wafer Start)が決め手となっています。「先端リソグラフィ[(193nm (ArF) and EUV]についても、先進ロジックとDRAMの微細化に向けた工程段階に進むために成長を続けています。」
欧州と米国におけるPFAS関連化学品排除に向けた最近の動きにより、今後のフォトレジスト材料化合物への影響が徐々に進んでいくと予想されてます。光酸発生剤(PAG)化合物を使用するフォトレジストは、代替品への転換という課題を持ちつつも、認可の下、長年に渡り使用されてきました。数多くの企業や大学が非PFAS関連光酸発生剤(PAG)の開発に取り組んでいますが、全ての要件に合う結果はまだ出ていません。そのため、完全にPFASを含まないPAG代替品と効率的な移行には5-10年がかかると予想されています。
Lithography Materials Headed for Upwards Growth
PFAS elimination efforts expected to drive migration to photoresist alternatives
San Diego, CA, August 8, 2024: TECHCET— the electronic materials advisory firm providing business and technology information —is forecasting semiconductor photoresist revenues to increase by nearly 11% in 2024. Overall semiconductor market recovery is expected in 2024, particularly in the second half, which should drive increased demand for all resists. In parallel, photoresist ancillaries are expected to increase by around 10%, and extensions by around 9%. More details on photoresist volume and revenue forecast by material can be found in TECHCET’s new Lithography Materials Critical Materials Report™.
“Lithographic Materials are driven by legacy uses (I-Line, G-Line, 248nm (KrF)), as these are used for legacy devices, 3D NAND, and for the “not smallest” features of the advancing devices,” stated Dr. Karey Holland, TECHCET’s Chief Technology Strategist. Thus, volumes of these photolithography materials are driven by overall chip manufacturing industry wafer starts. “Advanced lithography (193nm (ArF) and EUV) is also growing with more process steps for smaller features in advanced logic and DRAM.”
Recent pushes in the EU and US to eliminate PFAS-related chemicals are expected to gradually impact future photoresist material compounds. Photoresists that use photoacid generating (PAG) compounds have been qualified and used for many years, making it challenging to switch away to alternatives. While numerous companies and universities are working to develop non-PFAS-related PAGs, current performance is not yet meeting all process requirements. Consequently, defining suitable non-PFAS PAG alternatives and transitioning effectively is expected to take 5-10 years.
TECHCET(テクセット)の半導体材料市場調査レポートは半導体製造に欠かせない半導体材料市場についての詳細な調査・分析結果を提供しています。また半導体および半導体材料市場における関連サプライヤー情報も豊富に掲載されています。
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