耐放射線強化エレクトロニクス市場 : 2029年までの世界予測

出版:MarketsandMarkets(マーケッツアンドマーケッツ) 出版年月:2024年3月

Radiation Hardened Electronics Market – Global Forecast to 2029

耐放射線強化エレクトロニクス市場 : コンポーネント (ミックスドシグナル IC、プロセッサー&コントローラー、メモリー、電源管理)、製造技術 (RHBD、RHBP)、製品タイプ、用途&地域別 – 2029年までの世界予測
Radiation Hardened Electronics Market by Component (Mixed Signal ICs, Processors & Controllers, Memory, Power Management), Manufacturing Techniques (RHBD, RHBP), Product Type, Application and Geography – Global Forecast to 2029

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Report Overview

The radiation-hardened electronics market is expected to grow from USD 1.7 billion in 2024 to USD 2.1 billion by 2029, at a CAGR of 4.8% during the forecast period.

耐放射線強化エレクトロニクス市場は、予測期間中のCAGR 4.8%で、2024年の17億米ドルから2029年までに21億米ドルに成長すると予想されています。

The demand for radiation-hardened electronics is increasing due to space applications, government initiatives, and technological advancements.

耐放射線強化エレクトロニクス市場 : 2029年までの世界予測


“Memory component is expected to grow at higher CAGR from 2024 to 2029”.
Memory in the component segment is expected to grow at the fastest CAGR during the forecast period. A memory device is a hardware component that retains data, enabling communication or functionality. The memory products used for critical applications such as spacecraft and nuclear weapons need to be radiation-hardened to reduce the total ionizing dose (TID) received by the semiconductor components. Compute-intensive applications in the aerospace and space sector are increasingly demanding radiation-hardened memory solutions with high density and performance to handle large quantities of data obtained from various processor nodes and sensors.


“Space application is expected to grow with the largest market share during the forecast period”
Radiation-hardened electronics are specifically designed to weather the storm and ensure reliable operation across diverse space applications. From the beating heart of onboard computers managing satellites to the guidance systems steering rockets, these robust components power a remarkable range of tasks. They handle communication, fuel efficiency, scientific data collection, and even complex robotic maneuvers on distant planetary surfaces.


“Radiation hardened electronics market in North American region to register largest market size from 2024 to 2029.”
North America accounted for the largest share of the radiation-hardened electronics market in 2023. Factors such as continuous technological advancements in this field, the presence of various government-owned space organizations, and a majority of the key market players in the region are driving the growth potential for radiation-hardened electronics in the region. The US government is continuously making working on capabilities in the manufacture of radiation-hardened electronics.

Breakdown of primaries
In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key industry experts in the radiation-hardened electronics market space. The break-up of primary participants for the radiation hardened electronics market has been shown below:
• By Company Type: Tier 1 – 40%, Tier 2 – 30%, and Tier 3 – 30%
• By Designation: C-level Executives – 40%, Directors – 40%, and Others – 20%
• By Region: North America –40%, Europe – 30%, Asia Pacific– 20%, and Rest of the World – 10%

耐放射線強化エレクトロニクス市場 : 2029年までの世界予測 region


Key players in the radiation-hardened electronics market are Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland),  AMD (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor ( US).


Research Coverage:
The report describes detailed information regarding the key factors such as drivers, restraints, challenges, and opportunities influencing the growth of the radiation-hardened electronics market. It also includes informations like technology trends, trade data, and patent analysis. This research report categorizes the radiation-hardened electronics market based on components, manufacturing techniques, product type, and region. A detailed analysis of the major industry players was carried out to provide insights into their business overviews, products offered, major strategies adopted that include new product launches, deals (acquisitions, partnerships, agreements, and contracts), and others (expansions), and recession impact on the radiation-hardened electronics market.
Reasons to Buy This Report
The report will help the market leaders/new entrants in the market with information on the closest approximations of the revenue for the overall radiation-hardened electronics market and the subsegments. The report will help stakeholders understand the competitive landscape and gain more insight to position their business better and plan suitable go-to-market strategies. The report also helps stakeholders understand the market’s pulse and provides information on key drivers, restraints, opportunities, and challenges.


The report will provide insights into the following pointers:
• Analysis of key drivers (Increasing use of radiation-hardened electronics in space applications), restraints (Difficulty in creating real testing environment), opportunities (Favorable government initiatives and increasing space missions), and challenges (Customization required for high-end consumers)
• Product development /Innovation: Detailed insights on growing technologies, research and development activities, and new product and service launches in the radiation-hardened electronics market.
• Market Development: Comprehensive information about adjacent markets; the report analyses the radiation-hardened electronics market across various geographies.
• Market Diversification: Exhaustive information about new products and services, untapped geographies, recent developments, and investments in the radiation-hardened electronics market.
• Competitive Assessment: In-depth assessment of market share, growth strategies, and services, offering of leading players Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), among others in the radiation-hardened electronics market.

Table of Contents

1            INTRODUCTION            32

1.1         STUDY OBJECTIVES      32

1.2         MARKET DEFINITION   32

1.2.1      MARKETS COVERED     33

FIGURE 1           MARKET SEGMENTATION         33

1.3         REGIONAL SCOPE         33

1.3.1      YEARS CONSIDERED     34

1.3.2      INCLUSIONS AND EXCLUSIONS 34

1.4         CURRENCY        34

1.5         STAKEHOLDERS            35

1.6         SUMMARY OF CHANGES            35

1.7         LIMITATIONS   35

1.8         RECESSION IMPACT      35

2            RESEARCH METHODOLOGY     36

2.1         RESEARCH DATA           36

FIGURE 2           PROCESS FLOW: RADIATION-HARDENED ELECTRONICS MARKET ESTIMATION  36

FIGURE 3           RESEARCH DESIGN       37

2.1.1      SECONDARY AND PRIMARY RESEARCH 38

2.1.1.1   Key industry insights          39

2.1.2      SECONDARY DATA       39

2.1.2.1   List of key secondary sources           39

2.1.2.2   Key data from secondary sources     40

2.1.3      PRIMARY DATA 40

2.1.3.1   Breakdown of primaries     40

2.1.3.2   Key data from primary sources         41

2.2         MARKET SIZE ESTIMATION       41

2.2.1      BOTTOM-UP APPROACH           42

2.2.1.1   Approach to obtain market size using bottom-up analysis (demand side) 42

FIGURE 4           MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH       42

2.2.2      TOP-DOWN APPROACH             43

2.2.2.1   Approach to capture market size using top-down analysis          43

FIGURE 5           MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH       43

2.3         DATA TRIANGULATION             44

FIGURE 6           DATA TRIANGULATION             44

2.4         RESEARCH ASSUMPTIONS         45

2.5         LIMITATIONS   45

2.6         RISK ASSESSMENT         46

2.7         APPROACH TO ANALYZE IMPACT OF RECESSION ON RADIATION-HARDENED ELECTRONICS MARKET     46

3            EXECUTIVE SUMMARY 47

3.1         RADIATION-HARDENED ELECTRONICS MARKET: RECESSION IMPACT              47

FIGURE 7           RECESSION IMPACT ON RADIATION-HARDENED ELECTRONICS MARKET, 2020–2029 (USD MILLION)        47

FIGURE 8           POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE, BY COMPONENT, DURING FORECAST PERIOD            48

FIGURE 9           RADIATION-HARDENED BY DESIGN – FASTEST SEGMENT DURING FORECAST PERIOD     49

FIGURE 10         SPACE APPLICATION TO GROW AT HIGHEST CAGR IN RADIATION-HARDENED ELECTRONICS MARKET FROM 2024 TO 2029    49

FIGURE 11         NORTH AMERICA ACCOUNTED FOR LARGEST MARKET SHARE IN 2023 50

4            PREMIUM INSIGHTS      51

4.1         ATTRACTIVE GROWTH OPPORTUNITIES IN RADIATION-HARDENED ELECTRONICS MARKET             51

FIGURE 12         INCREASING DEMAND FOR RADIATION-HARDENED ELECTRONICS IN COMMERCIAL SATELLITES EXPECTED TO PROPEL MARKET GROWTH          51

4.2         RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT              52

FIGURE 13         POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE FROM 2024 TO 2029     52

4.3         RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE             52

FIGURE 14         RADIATION-HARDENED BY DESIGN SEGMENT TO DOMINATE MARKET FROM 2024 TO 2029     52

4.4         RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE              53

FIGURE 15         COTS SEGMENT TO LEAD MARKET WITH MAJOR SHARE THROUGH 2029 53

4.5         RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION              53

FIGURE 16         SPACE SEGMENT TO COMMAND LARGEST SHARE OF RADIATION-HARDENED ELECTRONICS MARKET IN 2024            53

4.6         RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY AND REGION             54

FIGURE 17         RADIATION-HARDENED ELECTRONICS MARKET IN CHINA TO GROW AT HIGHEST CAGR FROM 2024 TO2029   54

5            MARKET OVERVIEW     55

5.1         INTRODUCTION            55

5.2         EVOLUTION: RADIATION-HARDENED ELECTRONICS MARKET 55

FIGURE 18         EVOLUTION OF RADIATION-HARDENED ELECTRONICS TECHNOLOGY 56

5.3         MARKET DYNAMICS     56

FIGURE 19         DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: RADIATION-HARDENED ELECTRONICS MARKET           56

5.3.1      DRIVERS            57

FIGURE 20         DRIVERS FOR RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT   57

5.3.1.1   Rising intelligence, surveillance, and reconnaissance (ISR) activities        57

5.3.1.2   Technology advancements in multicore processors used for military and space applications         58

5.3.1.3   Increasing demand for use in commercial satellites      58

5.3.1.4   Proliferation of electronic systems that can withstand severe nuclear environments              59

5.3.2      RESTRAINTS     59

FIGURE 21         RESTRAINTS IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT   59

5.3.2.1   Difficulties in creating real testing environments         60

5.3.2.2   High costs associated with development of radiation-hardened products  60

5.3.3      OPPORTUNITIES           60

FIGURE 22         OPPORTUNITIES IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT   60

5.3.3.1   Increasing space missions globally   61

5.3.3.2   Demand for reconfigurable radiation-hardened electronics        61

5.3.3.3   Rising demand for commercial-off-the-shelf components in space satellites              62

5.3.4      CHALLENGES   62

FIGURE 23         CHALLENGES IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT   62

5.3.4.1   Customization requirements from high-end consumers              62

5.4         TRENDS/DISRUPTIONS IMPACTING CUSTOMERS          63

FIGURE 24         REVENUE SHIFT FOR RADIATION-HARDENED ELECTRONICS              63

5.5         PRICING ANALYSIS        64

5.5.1      AVERAGE SELLING PRICE OF POWER MANAGEMENT PRODUCTS              64

FIGURE 25         AVERAGE SELLING PRICE OF POWER MANAGEMENT PRODUCTS       64

5.5.2      POWER MANAGEMENT 64

TABLE 1             AVERAGE SELLING PRICE ANALYSIS OF KEY PLAYERS   65

5.5.3      MIXED SIGNAL ICS         65

TABLE 2             AVERAGE SELLING PRICE OF A/D & D/A CONVERTERS 65

5.5.4      PROCESSORS & CONTROLLERS 65

TABLE 3             AVERAGE SELLING PRICE OF PROCESSORS & CONTROLLERS              66

5.5.5      MEMORY           66

TABLE 4             AVERAGE SELLING PRICE OF MEMORY PRODUCTS       66

5.6         SUPPLY/VALUE CHAIN ANALYSIS          66

FIGURE 26         VALUE CHAIN ANALYSIS: MAJOR VALUE ADDED DURING MANUFACTURING, FABRICATION & PACKAGING AND INTERFACING & SOFTWARE DEVELOPMENT      67

5.7         ECOSYSTEM/MARKET MAP       69

FIGURE 27         RADIATION-HARDENED ELECTRONICS MARKET: ECOSYSTEM              69

TABLE 5             RADIATION-HARDENED ELECTRONICS MARKET: ECOSYSTEM              70

5.8         INVESTMENT AND FUNDING SCENARIO            71

FIGURE 28         FUNDS AUTHORIZED BY COMPANIES IN RADIATION-HARDENED ELECTRONICS MARKET     71

5.9         TECHNOLOGY ANALYSIS           71

5.9.1      DEVELOPMENT OF PLASTIC PACKAGING FOR SPACE-GRADE ELECTRONICS  71

5.9.2      SMART CHIPSETS FOR SATELLITES       71

5.9.3      ADVANCED PACKAGING OF SPACE ELECTRONICS        72

5.10       PORTER’S FIVE FORCES ANALYSIS         72

TABLE 6             RADIATION-HARDENED ELECTRONICS MARKET: PORTER’S FIVE FORCES ANALYSIS 72

5.10.1    INTENSITY OF COMPETITIVE RIVALRY 73

5.10.2    BARGAINING POWER OF SUPPLIERS     73

5.10.3    BARGAINING POWER OF BUYERS           73

5.10.4    THREAT OF SUBSTITUTES         73

5.10.5    THREAT OF NEW ENTRANTS    74

5.11       KEY STAKEHOLDERS & BUYING CRITERIA          74

5.11.1    KEY STAKEHOLDERS IN BUYING PROCESS         74

FIGURE 29         INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE INDUSTRIES           74

TABLE 7             INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE INDUSTRIES           74

5.11.2    BUYING CRITERIA         75

FIGURE 30         KEY BUYING CRITERIA FOR TOP THREE INDUSTRIES    75

TABLE 8             KEY BUYING CRITERIA FOR TOP THREE INDUSTRIES    75

5.12       CASE STUDY ANALYSIS 75

TABLE 9             ASSESSMENT OF 90 MM PROCESS HARDENING TECHNIQUE              76

TABLE 10           ASSESSMENT OF 4MBIT MRAM DEVICE IN SATELLITES 76

TABLE 11           ASSESSMENT OF RADIATION-HARDENED BY DESIGN MICROELECTRONICS   77

TABLE 12           ASSESSMENT OF ARM MCUS FOR SPACE CONDITIONS  77

TABLE 13           ASSESSMENT OF SSDS FOR LOW EARTH ORBIT SATELLITES              78

5.13       TRADE ANALYSIS          78

5.13.1    IMPORT SCENARIO       78

FIGURE 31         IMPORTS, BY KEY COUNTRY, 2019–2022 (USD THOUSAND)              78

5.13.2    EXPORT SCENARIO       79

FIGURE 32         EXPORTS, BY KEY COUNTRY, 2019–2022 (USD THOUSAND)              79

5.14       PATENT ANALYSIS        80

FIGURE 33         TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS          80

TABLE 14           TOP 20 PATENT OWNERS IN LAST 10 YEARS      80

FIGURE 34         NUMBER OF PATENTS GRANTED PER YEAR FROM 2013 TO 2023              81

TABLE 15           LIST OF MAJOR PATENTS          81

5.15       KEY CONFERENCES & EVENTS DURING 2024–2025          83

TABLE 16           RADIATION-HARDENED ELECTRONICS MARKET: CONFERENCES & EVENTS          83

5.16       REGULATORY LANDSCAPE       84

5.16.1    REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS          84

TABLE 17           NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS         85

TABLE 18           EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 85

TABLE 19           ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS         86

TABLE 20           REST OF THE WORLD: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS         86

5.16.2    STANDARDS AND REGULATIONS RELATED TO MARKET            86

5.16.2.1 North America     87

5.16.2.1.1            US         87

5.16.2.1.1.1         MIL-STD-750D  87

5.16.2.1.1.2         MIL-STD-750F   87

5.16.2.1.1.3         Radiation Hardness Assurance SSB1_005      87

5.16.2.1.1.4         MIL-STD-975M (NASA)  87

5.16.2.1.2            Canada  87

5.16.2.1.2.1         Radiation Emitting Devices Regulations (C.R.C., c. 1370)         87

5.16.2.2 Europe  88

5.16.2.2.1            ECSS-Q-60-01A 88

5.16.2.2.2            ECSS-Q-ST-60-15C          88

5.16.2.2.3            ECSS-Q-HB-60-02A         88

5.16.2.3 Asia Pacific          88

5.16.2.3.1            India      88

5.16.2.3.1.1         IS:1885  88

5.16.2.3.2            Japan     88

5.16.2.3.2.1         Japan Product Safety Compliance    88

5.16.2.3.2.2         JMR-001             88

6            MATERIAL SELECTION AND PACKAGING TYPES IN RADIATION-HARDENED ELECTRONICS MARKET     89

6.1         INTRODUCTION            89

6.2         MATERIAL SELECTION 89

6.2.1      SILICON             89

6.2.2      SILICON CARBIDE (SIC) 89

6.2.3      GALLIUM NITRIDE (GAN)          90

6.2.4      GALLIUM ARSENIDE (GAAS)     90

6.3         PACKAGING TYPES       91

6.3.1      FLIP-CHIP         91

6.3.2      CERAMIC PACKAGES    91

7            RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT              92

7.1         INTRODUCTION            93

FIGURE 35         POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD   93

TABLE 21           RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)           93

TABLE 22           RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)           93

7.2         MIXED SIGNAL ICS         94

TABLE 23           MIXED SIGNAL DEVICES: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (USD MILLION)     94

TABLE 24           MIXED SIGNAL DEVICES: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (USD MILLION)     94

TABLE 25           MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION)              95

TABLE 26           MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION)              95

TABLE 27           MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)            95

TABLE 28           MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)            95

7.2.1      RAD-HARD A/D AND D/A CONVERTERS             96

7.2.1.1   Increasing usage in space applications           96

7.2.2      MULTIPLEXERS & RESISTORS    96

7.2.2.1   High demand for multiplexers in data acquisition systems          96

7.3         PROCESSORS & CONTROLLERS 96

TABLE 29           PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (USD MILLION)     96

TABLE 30           PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (USD MILLION)     97

TABLE 31           PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (THOUSAND UNITS)          97

TABLE 32           PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (THOUSAND UNITS)          97

TABLE 33           PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION)          98

TABLE 34           PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION)          98

TABLE 35           PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)              98

TABLE 36           PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)              98

7.3.1      MICROPROCESSOR UNITS (MPUS)         99

7.3.1.1   Developments in multicore processors for space & defense applications   99

7.3.2      MICROCONTROLLER UNITS (MCUS)     99

7.3.2.1   Development of ARM-based microcontrollers for spacecraft subsystems  99

7.3.3      APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASICS)           100

7.3.3.1   Increasing demand for highly customized design          100

7.3.4      FPGAS  100

7.3.4.1   Help eliminate costs related to re-designing or manual updating 100

7.4         MEMORY           101

TABLE 37           MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (USD MILLION)       101

TABLE 38           MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (USD MILLION)       101

TABLE 39           MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)      101

TABLE 40           MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)      102

TABLE 41           MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION)  102

TABLE 42           MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION)  102

TABLE 43           MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)  102

TABLE 44           MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)  103

7.4.1      VOLATILE MEMORY     103

7.4.1.1   Dynamic Random-Access Memory (DRAM) 103

7.4.1.1.1 Low retention time expected to increase adoption in spacecraft 103

7.4.1.2   Static random-access memory (SRAM)         103

7.4.1.2.1 High adoption in image processing applications           103

7.4.2      NON-VOLATILE MEMORY         104

7.4.2.1   Magnetoresistive random-access memory (MRAM)    104

7.4.2.1.1 Increasing developments in MRAM technologies for space environment  104

7.4.2.2   Flash      104

7.4.2.2.1 Increasing requirement for NOR flash memory in processing applications              104

7.4.2.3   Others (ReRAM, EEPROM, NVRAM)          104

7.5         POWER MANAGEMENT 105

TABLE 45           POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)    105

TABLE 46           POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)    105

TABLE 47           POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION)          106

TABLE 48           POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION)          106

TABLE 49           POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)              106

TABLE 50           POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)              106

7.5.1      MOSFETS          107

7.5.1.1   Increasing adoption for outer space applications          107

7.5.2      DIODES             107

7.5.2.1   Integration of ceramic packaging technology to improve performance in space applications         107

7.5.3      THYRISTORS    107

7.5.3.1   Increasing adoption in aerospace & defense applications            107

7.5.4      IGBTS   108

7.5.4.1   High current density and low power dissipation drive adoption  108

7.6         OTHERS (QUALITATIVE)           108

8            RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE             109

8.1         INTRODUCTION            110

FIGURE 36         RHBD SEGMENT TO LEAD RADIATION-HARDENED ELECTRONICS MARKET DURING FORECAST PERIOD    110

TABLE 51           RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION)       111

TABLE 52           RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION)       111

8.2         RADIATION-HARDENING BY DESIGN (RHBD)   111

TABLE 53           RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)           112

TABLE 54           RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)           112

TABLE 55           RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION)     112

TABLE 56           RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION)     112

TABLE 57           RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION)            113

TABLE 58           RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION)            113

TABLE 59           RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION)     113

TABLE 60           RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION)     114

TABLE 61           RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION)         114

TABLE 62           RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION)         114

8.2.1      TOTAL IONIZING DOSE              115

8.2.1.1   Long-term ionizing damage could result in malfunctioning of electronic components         115

8.2.2      SINGLE EVENT EFFECT (SEE)    115

8.2.2.1   RHBD approach favored in space electronics 115

8.3         RADIATION-HARDENING BY PROCESS (RHBP) 115

TABLE 63           RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)           116

TABLE 64           RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)           116

TABLE 65           RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION)     116

TABLE 66           RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION)     117

TABLE 67           RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION)            117

TABLE 68           RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION)            117

TABLE 69           RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION)     117

TABLE 70           RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION)     118

TABLE 71           RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION)         118

TABLE 72           RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION)         118

8.3.1      SILICON ON INSULATOR (SOI)  119

8.3.1.1   Integration of SOI ICs in insulation layers provides benefits in high-radiation environments       119

8.3.2      SILICON ON SAPPHIRE (SOS)    119

8.3.2.1   High resistance to radiation increases demand in aerospace and military applications         119

8.4         RADIATION HARDENING BY SOFTWARE (RHBS) (QUALITATIVE)              119

9            RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE              120

9.1         INTRODUCTION            121

FIGURE 37         COTS SEGMENT TO HOLD LARGER SHARE AND REGISTER HIGHER CAGR DURING FORECAST PERIOD       121

TABLE 73           RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)       121

TABLE 74           RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)       122

9.2         COMMERCIAL-OFF-THE-SHELF (COTS) 122

9.2.1      INCREASING ADOPTION IN COMMERCIAL AND MILITARY SATELLITES DUE TO LOW-COST BENEFITS  122

TABLE 75           COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)           123

TABLE 76           COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)           123

TABLE 77           COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION)     123

TABLE 78           COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION)     123

TABLE 79           COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION)            124

TABLE 80           COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION)            124

TABLE 81           COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION)     124

TABLE 82           COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION)     124

TABLE 83           COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION)         125

TABLE 84           COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION)         125

9.3         CUSTOM-MADE             125

9.3.1      HIGH PREFERENCE IN DEFENSE MISSION-CRITICAL APPLICATIONS              125

TABLE 85           CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)  126

TABLE 86           CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)  126

TABLE 87           CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION)          126

TABLE 88           CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION)          126

TABLE 89           CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION)   127

TABLE 90           CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION)   127

TABLE 91           CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION)          127

TABLE 92           CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION)          127

TABLE 93           CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION) 128

TABLE 94           CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION) 128

10          RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION              129

10.1       INTRODUCTION            130

FIGURE 38         SPACE APPLICATION SEGMENT TO HOLD LARGEST SHARE AND REGISTER HIGHEST CAGR DURING FORECAST PERIOD     130

TABLE 95           RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020–2023 (USD MILLION)           131

TABLE 96           RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION)           131

10.2       SPACE  132

10.2.1    PROLIFERATION IN GLOBAL SPACE ECONOMY TO DRIVE GROWTH OPPORTUNITIES           132

TABLE 97           SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020–2023 (USD MILLION)           132

TABLE 98           SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION)           132

TABLE 99           SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)       133

TABLE 100         SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)       133

10.2.2    COMMERCIAL  134

10.2.2.1 Small satellites     134

10.2.2.2 New Space           135

10.2.2.3 Nanosatellites      135

10.2.3    MILITARY          135

10.3       AEROSPACE & DEFENSE             136

10.3.1    INCREASING FUNDING FOR MILITARY SECTOR IN EMERGING COUNTRIES TO DRIVE MARKET GROWTH         136

TABLE 101         AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020–2023 (USD MILLION)   136

TABLE 102         AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION)   136

TABLE 103         AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION) 137

TABLE 104         AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION) 137

10.3.2    WEAPONS AND MISSILES           137

10.3.3    VEHICLES/AVIONICS    138

10.4       NUCLEAR POWER PLANTS        138

10.4.1    RISE IN CONSTRUCTION OF NUCLEAR REACTORS FOR POWER GENERATION TO DRIVE MARKET GROWTH      138

TABLE 105         NUCLEAR POWER PLANTS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION) 138

TABLE 106         NUCLEAR POWER PLANTS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION) 139

10.5       MEDICAL          139

10.5.1    INTEGRATION OF EMI SHIELDING AND FILTERING IN IMPLANTABLE DEVICES TO BOOST GROWTH  139

10.5.2    IMPLANTABLE MEDICAL DEVICES        139

TABLE 107         MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION 2020–2023 (USD MILLION)      139

TABLE 108         MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION)     140

TABLE 109         MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)  140

TABLE 110         MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)  140

10.5.3    RADIOLOGY     141

10.6       OTHERS             141

TABLE 111         OTHER APPLICATIONS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION) 141

TABLE 112         OTHER APPLICATIONS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION) 141

11          REGIONAL ANALYSIS    142

11.1       INTRODUCTION            143

FIGURE 39         REGIONAL SNAPSHOT: CHINA EXPECTED TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD    143

FIGURE 40         RADIATION-HARDENED ELECTRONICS MARKET, BY REGION              144

TABLE 113         RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)          144

TABLE 114         RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)          144

11.2       NORTH AMERICA          145

FIGURE 41         NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT     145

TABLE 115         NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020–2023 (USD MILLION)         146

TABLE 116         NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)         146

11.2.1    US         146

11.2.1.1 Increase in space missions from government and private agencies to drive demand              146

11.2.2    CANADA            147

11.2.2.1 Ongoing developments in satellites expected to drive market     147

11.2.3    MEXICO             147

11.2.3.1 Growing economy and increasing urban mobility increase demand for satellites              147

11.2.4    IMPACT OF RECESSION ON MARKET IN NORTH AMERICA         148

11.3       EUROPE             148

FIGURE 42         EUROPE: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT        149

TABLE 117         EUROPE: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020–2023 (USD MILLION)    149

TABLE 118         EUROPE: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)    150

11.3.1    UK         150

11.3.1.1 Increasing initiatives by government and private entities in space sector to fuel market growth     150

11.3.2    GERMANY         151

11.3.2.1 Proliferation in national space programs to boost demand for radiation-hardened electronics           151

11.3.3    FRANCE             151

11.3.3.1 Increasing partnerships in space industry to increase competitiveness of France in European Union  151

11.3.4    REST OF EUROPE           152

11.3.5    IMPACT OF RECESSION ON MARKET IN EUROPE            152

11.4       ASIA PACIFIC    152

FIGURE 43         ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT     153

TABLE 119         ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020–2023 (USD MILLION)         153

TABLE 120         ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)         154

11.4.1    CHINA  154

11.4.1.1 Advancements in space missions expected to drive market         154

11.4.2    INDIA   155

11.4.2.1 Increasing developments by ISRO to drive market       155

11.4.3    JAPAN  155

11.4.3.1 Involvement of private space companies in government space programs to boost market   155

11.4.4    SOUTH KOREA 155

11.4.4.1 Private-public investments in infrastructure, industrial, commercial, military, space, and defense projects – key driver         155

11.4.5    REST OF ASIA PACIFIC  156

11.4.6    IMPACT OF RECESSION ON MARKET IN ASIA PACIFIC   156

11.5       REST OF THE WORLD (ROW)    156

TABLE 121         ROW: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)       156

TABLE 122         ROW: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)       157

11.5.1    GULF COOPERATION COUNCIL (GCC) 157

11.5.1.1 Proliferation of satellite operations to drive market      157

11.5.2    SOUTH AMERICA           157

11.5.2.1 Tie-ups with foreign agencies for space missions to propel market growth              157

11.5.3    REST OF MIDDLE EAST AND AFRICA     158

11.5.3.1 Increasing investments by governments to boost market growth 158

11.5.4    RECESSION IMPACT ON MARKET IN REST OF MIDDLE EAST AND AFRICA 158

12          COMPETITIVE LANDSCAPE       159

12.1       INTRODUCTION            159

12.2       KEY PLAYER STRATEGIES          159

TABLE 123         KEY PLAYER STRATEGIES          159

12.3       MARKET REVENUE ANALYSIS   161

FIGURE 44         RADIATION-HARDENED ELECTRONICS MARKET: REVENUE ANALYSIS OF TOP FIVE PLAYERS, 2020–2022      161

12.4       MARKET SHARE ANALYSIS         162

FIGURE 45         MARKET SHARE ANALYSIS, 2023             162

TABLE 124         DEGREE OF COMPETITION, RADIATION-HARDENED ELECTRONICS MARKET (2023)  162

TABLE 125         MARKET RANKING ANALYSIS   163

12.5       VALUATION AND FINANCIAL METRICS IN RADIATION-HARDENED ELECTRONICS MARKET             165

FIGURE 46         EV/EBITDA OF KEY VENDORS   165

12.6       BRAND/PRODUCT COMPARATIVE ANALYSIS    166

FIGURE 47         RADIATION-HARDENED ELECTRONICS MARKET: TOP TRENDING BRAND/PRODUCTS 166

12.7       COMPANY EVALUATION MATRIX          167

12.7.1    STARS  167

12.7.2    EMERGING LEADERS    167

12.7.3    PERVASIVE PLAYERS     167

12.7.4    PARTICIPANTS 167

FIGURE 48         RADIATION-HARDENED ELECTRONICS MARKET: TOP COMPANY EVALUATION QUADRANT, 2023        168

12.8       RADIATION-HARDENED ELECTRONICS MARKET: COMPANY FOOTPRINT (15 COMPANIES)   169

TABLE 126         COMPANY FOOTPRINT 169

TABLE 127         COMPANY COMPONENT FOOTPRINT (15 COMPANIES) 170

TABLE 128         COMPANY APPLICATION FOOTPRINT (15 COMPANIES)              171

TABLE 129         COMPANY REGION FOOTPRINT (15 COMPANIES)          172

TABLE 130         COMPANY PRODUCT TYPE FOOTPRINT (15 COMPANIES)              173

TABLE 131         COMPANY MANUFACTURING TECHNIQUE FOOTPRINT (15 COMPANIES)    173

12.9       STARTUP/SME EVALUATION QUADRANT, 2023 174

12.9.1    PROGRESSIVE COMPANIES       174

12.9.2    RESPONSIVE COMPANIES          174

12.9.3    DYNAMIC COMPANIES 174

12.9.4    STARTING BLOCKS       174

FIGURE 49         RADIATION-HARDENED ELECTRONICS MARKET, STARTUP/SME EVALUATION QUADRANT, 2023 175

12.10     COMPETITIVE BENCHMARKING            176

TABLE 132         RADIATION-HARDENED ELECTRONICS MARKET: KEY STARTUPS/SMES           176

TABLE 133         RADIATION-HARDENED ELECTRONICS MARKET: COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES         177

12.11     COMPETITIVE SCENARIOS AND TRENDS           178

12.11.1  PRODUCT LAUNCHES/DEVELOPMENTS            178

TABLE 134         RADIATION-HARDENED ELECTRONICS MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2021–2024             178

12.11.2  DEALS  179

TABLE 135         RADIATION-HARDENED ELECTRONICS MARKET: DEALS, 2021–2024      179

12.11.3  OTHERS             181

TABLE 136         RADIATION-HARDENED ELECTRONICS MARKET: OTHER DEALS, 2021–2024           181

13          COMPANY PROFILES    182

13.1       KEY PLAYERS   182

(Business Overview, Products/Solutions/Services Offered, Recent Developments, MnM view (Key strengths/Right to win, Strategic choices made, Weakness/competitive threats)*

13.1.1    MICROCHIP TECHNOLOGY INC.            182

TABLE 137         MICROCHIP TECHNOLOGY INC.: BUSINESS OVERVIEW 182

FIGURE 50         MICROCHIP TECHNOLOGY INC.: COMPANY SNAPSHOT              183

TABLE 138         MICROCHIP TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED   183

TABLE 139         MICROCHIP TECHNOLOGY INC.: PRODUCT LAUNCHES              185

TABLE 140         MICROCHIP TECHNOLOGY INC.: DEALS            187

TABLE 141         MICROCHIP TECHNOLOGY INC.: OTHERS         188

13.1.2    BAE SYSTEMS   190

TABLE 142         BAE SYSTEMS: BUSINESS OVERVIEW     190

FIGURE 51         BAE SYSTEMS: COMPANY SNAPSHOT   191

TABLE 143         BAE SYSTEMS: PRODUCTS/SOLUTIONS/SERVICES OFFERED              191

TABLE 144         BAE SYSTEMS: PRODUCT LAUNCHES    193

TABLE 145         BAE SYSTEMS: DEALS   193

TABLE 146         BAE SYSTEMS: OTHERS 194

13.1.3    RENESAS ELECTRONICS CORPORATION            196

TABLE 147         RENESAS ELECTRONICS CORPORATION: BUSINESS OVERVIEW              196

FIGURE 52         RENESAS ELECTRONICS CORPORATION: COMPANY SNAPSHOT        197

TABLE 148         RENESAS ELECTRONICS CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED   197

TABLE 149         RENESAS ELECTRONICS CORPORATION: PRODUCT LAUNCHES       199

TABLE 150         RENESAS ELECTRONICS CORPORATION: DEALS            200

TABLE 151         RENESAS ELECTRONICS CORPORATION: OTHERS         201

13.1.4    INFINEON TECHNOLOGIES AG 203

TABLE 152         INFINEON TECHNOLOGIES AG: BUSINESS OVERVIEW   203

FIGURE 53         INFINEON TECHNOLOGIES AG: COMPANY SNAPSHOT 204

TABLE 153         INFINEON TECHNOLOGIES AG: PRODUCTS/SOLUTIONS/SERVICES OFFERED   204

TABLE 154         INFINEON TECHNOLOGIES AG: PRODUCT LAUNCHES 206

TABLE 155         INFINEON TECHNOLOGIES AG: DEALS 207

TABLE 156         INFINEON TECHNOLOGIES AG: OTHERS            208

13.1.5    STMICROELECTRONICS             210

TABLE 157         STMICROELECTRONICS: BUSINESS OVERVIEW 210

FIGURE 54         STMICROELECTRONICS: COMPANY SNAPSHOT             211

TABLE 158         STMICROELECTRONICS: PRODUCTS/SOLUTIONS/SERVICES OFFERED          211

TABLE 159         STMICROELECTRONICS: PRODUCT LAUNCHES             213

TABLE 160         STMICROELECTRONICS: DEALS             214

13.1.6    ADVANCED MICRO DEVICES, INC (AMD)           216

TABLE 161         ADVANCED MICRO DEVICES, INC: BUSINESS OVERVIEW              216

FIGURE 55         ADVANCED MICRO DEVICES, INC: COMPANY SNAPSHOT              217

TABLE 162         ADVANCED MICRO DEVICES, INC: PRODUCTS/SOLUTIONS/SERVICES OFFERED   217

TABLE 163         ADVANCED MICRO DEVICES, INC: PRODUCT LAUNCHES              218

TABLE 164         ADVANCED MICRO DEVICES, INC: DEALS          218

13.1.7    TEXAS INSTRUMENTS INCORPORATED 219

TABLE 165         TEXAS INSTRUMENTS INCORPORATED: BUSINESS OVERVIEW              219

FIGURE 56         TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT              220

TABLE 166         TEXAS INSTRUMENTS INCORPORATED: PRODUCTS/SOLUTIONS/SERVICES OFFERED   220

TABLE 167         TEXAS INSTRUMENTS INCORPORATED: PRODUCT LAUNCHES              221

TABLE 168         TEXAS INSTRUMENTS INCORPORATED: DEALS 222

TABLE 169         TEXAS INSTRUMENTS INCORPORATED: DEALS 223

13.1.8    HONEYWELL INTERNATIONAL INC.      224

TABLE 170         HONEYWELL INTERNATIONAL INC.: BUSINESS OVERVIEW              224

FIGURE 57         HONEYWELL INTERNATIONAL INC.: COMPANY SNAPSHOT              225

TABLE 171         HONEYWELL INTERNATIONAL INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED   225

TABLE 172         HONEYWELL INTERNATIONAL INC.: PRODUCT LAUNCHES              227

TABLE 173         HONEYWELL INTERNATIONAL INC.: DEALS      227

TABLE 174         HONEYWELL INTERNATIONAL INC.: OTHERS   228

13.1.9    TELEDYNE TECHNOLOGIES INC.           229

TABLE 175         TELEDYNE TECHNOLOGIES INC.: BUSINESS OVERVIEW              229

FIGURE 58         TELEDYNE TECHNOLOGIES INC.: COMPANY SNAPSHOT              230

TABLE 176         TELEDYNE TECHNOLOGIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED   230

TABLE 177         TELEDYNE TECHNOLOGIES INC.: PRODUCT LAUNCHES              231

TABLE 178         TELEDYNE TECHNOLOGIES INC.: DEALS           232

TABLE 179         TELEDYNE TECHNOLOGIES INC.: OTHERS        232

13.1.10  TTM TECHNOLOGIES, INC.       233

TABLE 180         TTM TECHNOLOGIES, INC.: BUSINESS OVERVIEW         233

FIGURE 59         TTM TECHNOLOGIES, INC.: COMPANY SNAPSHOT        234

TABLE 181         TTM TECHNOLOGIES, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED   234

TABLE 182         TTM TECHNOLOGIES, INC.: OTHERS    235

13.2       OTHER PLAYERS           236

13.2.1    COBHAM LIMITED        236

13.2.2    ANALOG DEVICES, INC 238

13.2.3    DATA DEVICE CORPORATION  239

13.2.4    3D PLUS             241

13.2.5    MERCURY SYSTEMS, INC.           242

13.2.6    PCB PIEZOTRONICS, INC.           243

13.2.7    VORAGO TECHNOLOGIES         244

13.2.8    MICROPAC INDUSTRIES, INC.    245

13.2.9    GSI TECHNOLOGY, INC.             246

13.2.10  EVERSPIN TECHNOLOGIES INC 247

13.2.11  SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (ON SEMICONDUCTOR)       248

13.2.12  AITECH 249

13.2.13  MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION              250

13.2.14  SPACE MICRO INC         251

13.2.15  TRIAD SEMICONDUCTOR          252

*Details on Business Overview, Products/Solutions/Services Offered, Recent Developments, MnM view (Key strengths/Right to win, Strategic choices made, Weakness/competitive threats)* might not be captured in case of unlisted companies.

14          APPENDIX         253

14.1       DISCUSSION GUIDE      253

14.2       KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL             257

14.3       CUSTOMIZATION OPTIONS      259

14.4       RELATED REPORTS       259

14.5       AUTHOR DETAILS         260