3Dスタッキング市場 : 2028年までの世界予測

Report Overview

The 3D stacking market is projected to reach USD 3.1 billion by 2028 from USD 1.2 billion in 2023, at a CAGR of 20.4% from 2023 to 2028. The major opportunities that are expected to drive the market growth of the 3D stacking market include growing adoption of high-bandwidth memory (HBM) devices and integration of advanced electronics within the automotive industry
Increasing demand for high-performance computing and energy-efficient Logics ICs
Logic Integrated Circuits (ICs) are an integral component of digital electronics, facilitating computational operations and decision-making processes within electronic devices. In 3D stacking, Logic ICs play a crucial role in enhancing computational efficiency and reducing footprint. The increasing demand for high-performance computing and energy-efficient devices has fueled the growth of 3D stacking in logic ICs. As consumer expectations for faster and more reliable electronic devices continue to rise, 3D stacking enables a significant increase in computational capabilities within a smaller physical footprint.

Need for enhanced performance and miniaturization in electronic applications to drive market growth for hybrid bonding
The process of hybrid bonding involves several key steps, starting with the preparation and creation of pre-bonding layers. These layers are crucial to ensuring a successful bond. The bonding process itself, characterized by the fusion of semiconductor wafers, is followed by a post-bond annealing step to enhance the bond’s strength and reliability. Throughout these processes, rigorous inspection and metrology measures are in place to guarantee the quality and integrity of the bonded structures.

Rising need for advanced and compact packaging solutions in high-performance computing applications to drive market growth for wafer-to-wafer 3D Stacking
Wafer-on-Wafer (WoW) is a 3D integration method that involves bonding and stacking two or more complete wafers, each containing semiconductor devices or chips, to create a vertically integrated structure. This method facilitates the integration of different functionalities from separate wafers, enabling enhanced performance, reduced interconnect lengths, and increased system density.

North America is expected to account for the second largest market share during the forecast period
Being home to some of the leading semiconductor companies, such as Intel Corporation (US), Texas Instruments Inc. (US), Qualcomm Incorporated (US), and Advanced Micro Devices, Inc. (US), makes the region technologically advanced. Semiconductor organizations such as Global Semiconductor Alliance (GSA) (US) and International Microelectronics and Packaging Society (IMAPS) (US) are dedicated associations for the advancement and growth of microelectronics and packaging in North America.

The break-up of profile of primary participants in the 3D stacking market-
• By Company Type: Tier 1 – 38%, Tier 2 – 28%, Tier 3 – 34%
• By Designation Type: C Level – 40%, Director Level – 30% , Others – 30%
• By Region Type: North America – 35%, Europe – 20%, Asia Pacific – 35%, Rest of the World – 10%

The major players of 3D stacking market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US) among others.

Research Coverage
The report segments the 3D stacking market and forecasts its size based on method, interconnecting technology, device type, end user and region. The report also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing the market growth. The report also covers qualitative aspects in addition to the quantitative aspects of the market.

Reasons to buy the report:
The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall 3D stacking market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.

The report provides insights on the following pointers:
• Analysis of key drivers (Increasing focus on miniaturization and efficient space utilization in electronic devices; Cost advantage offered by 3D stacking technology is increasing its adoption; Growing demand for consumer electronics and gaming devices; Heterogeneous integration and component optimization to improve manufacturing of electronic components; 3D stacking technology to provide shorter interconnect and reduced power consumption boosting its adoption), restraints (High cost of 3D stacking technology to limit adoption; Lack of standardization governing 3D stacking technology), opportunities (Growing adoption of high-bandwidth memory (HBM) devices; Rapid expansion of semiconductor applications across various industries; The integration of advanced electronics within the automotive industry), and challenges (Growing adoption of high-bandwidth memory (HBM) devices; Rapid expansion of semiconductor applications across various industries).
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the 3D stacking market
• Market Development: Comprehensive information about lucrative markets – the report analyses the 3D stacking market across varied regions
• Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the 3D stacking market
• Competitive Assessment: In-depth assessment of market shares, growth strategies and product offerings of leading players like Intel Corporation (US), Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), Amkor Technology (US) and ASE Technology Holding Co., Ltd. (Taiwan).

Table of Contents

1            INTRODUCTION            31

1.1         STUDY OBJECTIVES      31

1.2         MARKET DEFINITION   31

1.2.1      INCLUSIONS AND EXCLUSIONS 32

1.3         STUDY SCOPE  32

FIGURE 1           3D STACKING MARKET: MARKET SEGMENTATION        32

1.3.1      REGIONAL SCOPE         33

1.3.2      YEARS CONSIDERED     33

1.4         CURRENCY CONSIDERED          33

1.5         LIMITATIONS   34

1.6         STAKEHOLDERS            34

1.7         RECESSION IMPACT      34

2            RESEARCH METHODOLOGY     35

2.1         RESEARCH DATA           35

FIGURE 2           3D STACKING MARKET: RESEARCH DESIGN      35

2.1.1      SECONDARY & PRIMARY RESEARCH      37

2.1.2      SECONDARY DATA       38

2.1.2.1   Major secondary sources    38

2.1.2.2   Secondary sources             38

2.1.3      PRIMARY DATA 39

2.1.4      BREAKDOWN OF PRIMARIES     39

2.1.4.1   Key data from primary sources         40

2.2         MARKET SIZE ESTIMATION       41

FIGURE 3           PROCESS FLOW OF MARKET SIZE ESTIMATION 41

2.2.1      BOTTOM-UP APPROACH           41

2.2.1.1   Approach to estimate market share by bottom-up analysis (demand side) 42

FIGURE 4           MARKET SIZE ESTIMATION: BOTTOM-UP APPROACH  42

2.2.2      TOP-DOWN APPROACH             42

2.2.2.1   Approach to estimate market share by top-down analysis  (supply side)  42

FIGURE 5           MARKET SIZE ESTIMATION: TOP-DOWN APPROACH    43

FIGURE 6           MARKET SIZE ESTIMATION: TOP-DOWN APPROACH (SUPPLY SIDE)—REVENUE GENERATED FROM 3D STACKING SOLUTIONS AND SERVICES          43

2.3         DATA TRIANGULATION             44

FIGURE 7           DATA TRIANGULATION             44

2.4         RESEARCH ASSUMPTIONS         45

TABLE 1             RESEARCH ASSUMPTIONS         45

2.5         RISK ASSESSMENT         45

2.6         RECESSION IMPACT ANALYSIS: PARAMETERS CONSIDERED      45

3            EXECUTIVE SUMMARY 46

FIGURE 8           CONSUMER ELECTRONICS SEGMENT TO CAPTURE LARGEST SHARE OF 3D STACKING MARKET IN 2028          47

FIGURE 9           MEMORY DEVICES SEGMENT TO HOLD LARGEST SHARE OF 3D STACKING MARKET IN 2028 47

FIGURE 10         3D TSV SEGMENT TO LEAD 3D STACKING MARKET DURING FORECAST PERIOD       48

FIGURE 11         3D STACKING MARKET TO EXHIBIT HIGHEST CAGR IN ASIA PACIFIC DURING FORECAST PERIOD    48

4            PREMIUM INSIGHTS      50

4.1         ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN 3D STACKING MARKET            50

FIGURE 12         INCREASING FOCUS ON MINIATURIZATION AND EFFICIENT SPACE UTILIZATION IN ELECTRONIC DEVICES TO BOOST MARKET GROWTH              50

4.2         3D STACKING MARKET, BY METHOD    50

FIGURE 13         DIE-TO-DIE SEGMENT TO HOLD LARGEST SHARE OF 3D STACKING MARKET IN 2028       50

4.3         3D STACKING MARKET, BY END USER   51

FIGURE 14         AUTOMOTIVE SEGMENT TO REGISTER HIGHEST CAGR FROM 2023 TO 2028     51

4.4         3D STACKING MARKET, BY PACKAGING TECHNOLOGY 51

FIGURE 15         3D TSV SEGMENT TO ACCOUNT FOR LARGEST SHARE OF 3D STACKING MARKET FROM 2023 TO 2028             51

4.5         3D STACKING MARKET, BY DEVICE TYPE           52

FIGURE 16         MEMORY DEVICES SEGMENT TO HOLD LARGEST SHARE OF 3D STACKING MARKET FROM 2023 TO 2028       52

4.6         ASIA PACIFIC: 3D STACKING MARKET, BY END USER AND COUNTRY              52

FIGURE 17         CONSUMER ELECTRONICS SEGMENT AND CHINA HELD LARGEST SHARE OF 3D STACKING MARKET IN ASIA PACIFIC IN 2022     52

4.7         3D STACKING MARKET, BY COUNTRY   53

FIGURE 18         TAIWAN TO BE FASTEST-GROWING COUNTRY-LEVEL MARKET FOR 3D STACKING DURING FORECAST PERIOD           53

5            MARKET OVERVIEW     54

5.1         INTRODUCTION            54

5.2         MARKET DYNAMICS     54

FIGURE 19         3D STACKING MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES    54

5.2.1      DRIVERS            55

FIGURE 20         ANALYSIS OF IMPACT OF DRIVERS ON 3D STACKING MARKET              55

5.2.1.1   Increasing focus on miniaturization and efficient space utilization in electronic devices   55

5.2.1.2   Cost advantage offered by 3D stacking technology       56

5.2.1.3   Growing demand for consumer electronics and gaming devices 56

FIGURE 21         NUMBER OF SMARTPHONE AND MOBILE PHONE USERS GLOBALLY,  2020–2025 57

5.2.1.4   Unparalleled flexibility and customization benefits offered by 3D stacking in electronic component manufacturing             57

5.2.1.5   Reduced power consumption and operational costs over 2D stacking       57

5.2.2      RESTRAINTS     58

FIGURE 22         ANALYSIS OF IMPACT OF RESTRAINTS ON 3D STACKING MARKET            58

5.2.2.1   Need for substantial upfront investment        58

5.2.2.2   Lack of standardization governing 3D stacking technology        58

5.2.3      OPPORTUNITIES           59

FIGURE 23         ANALYSIS OF IMPACT OF OPPORTUNITIES ON 3D STACKING MARKET            59

5.2.3.1   Growing adoption of high-bandwidth memory (HBM) devices  59

5.2.3.2   Rapid expansion of semiconductor applications across various industries 60

5.2.3.3   Integration of advanced electronics into automobiles   60

5.2.4      CHALLENGES   61

FIGURE 24         ANALYSIS OF IMPACT OF CHALLENGES ON 3D STACKING MARKET            61

5.2.4.1   Maintaining effective supply chain in 3D stacking        61

5.2.4.2   Designing complexities associated with 3D stacking technology 61

5.3         SUPPLY CHAIN ANALYSIS          62

FIGURE 25         3D STACKING MARKET: SUPPLY CHAIN ANALYSIS         62

5.4         ECOSYSTEM MAPPING 64

FIGURE 26         3D STACKING ECOSYSTEM        64

5.5         TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS       64

FIGURE 27         REVENUE SHIFTS AND NEW REVENUE POCKETS FOR PLAYERS IN 3D STACKING MARKET         65

5.6         PRICING ANALYSIS        65

TABLE 2             AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2022 (USD)        65

5.6.1      AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS OFFERED BY KEY PLAYERS            66

FIGURE 28         AVERAGE SELLING PRICE OF 12-INCH WAFERS EQUIVALENT OFFERED BY KEY PLAYERS        66

5.6.2      AVERAGE SELLING PRICE TREND          66

TABLE 3             AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS,  2018–2022 (USD/THOUSAND UNITS)      66

FIGURE 29         AVERAGE SELLING PRICE OF WAFERS, 2018–2022            66

5.7         TECHNOLOGY TRENDS             67

5.7.1      FAN-OUT WAFER-LEVEL PACKAGING   67

5.7.2      FAN-OUT PANEL-LEVEL PACKAGING   67

5.7.3      ADVANCED MATERIALS             68

5.7.4      MONOLITHIC 3D INTEGRATION            68

5.8         PORTER’S FIVE FORCES ANALYSIS         68

TABLE 4             3D STACKING MARKET: PORTER’S FIVE FORCES ANALYSIS              69

FIGURE 30         PORTER’S FIVE FORCES ANALYSIS         69

5.8.1      THREAT OF NEW ENTRANTS    70

5.8.2      THREAT OF SUBSTITUTES         70

5.8.3      BARGAINING POWER OF SUPPLIERS     70

5.8.4      BARGAINING POWER OF BUYERS           70

5.8.5      INTENSITY OF COMPETITIVE RIVALRY 71

5.9         KEY STAKEHOLDERS AND BUYING CRITERIA    71

5.9.1      KEY STAKEHOLDERS IN BUYING PROCESS         71

FIGURE 31         INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE END USERS             71

TABLE 5             INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY END USER (%)           71

5.9.2      BUYING CRITERIA         72

FIGURE 32         KEY BUYING CRITERIA FOR TOP THREE END USERS      72

TABLE 6             KEY BUYING CRITERIA, BY END USER    72

5.10       CASE STUDY ANALYSIS 72

5.10.1    SEMICONDUCTOR WAFER PRODUCER REDUCED WAFER REJECTIONS THROUGH CLOSED-LOOP MONITORING          72

5.10.2    SPTS’S DRIE TECHNOLOGY STRENGTHENED IMEC’S SILICON ETCH PLATFORM       73

5.11       TRADE ANALYSIS          73

5.11.1    IMPORT SCENARIO       73

TABLE 7             IMPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 381800, BY COUNTRY,  2018–2022 (USD MILLION)          74

5.11.2    EXPORT SCENARIO       74

TABLE 8             EXPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 381800, BY COUNTRY,  2018–2022 (USD MILLION)          74

5.12       PATENT ANALYSIS        75

TABLE 9             PATENTS RELATED TO 3D STACKING MARKET, 2020–2023              75

FIGURE 33         NUMBER OF PATENTS GRANTED PER YEAR FROM 2013 TO 2022              77

TABLE 10           NUMBER OF PATENTS RELATED TO 3D STACKING REGISTERED IN LAST 10 YEARS 77

FIGURE 34         TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS          78

5.13       KEY CONFERENCES AND EVENTS, 2023–2025     78

TABLE 11           3D STACKING MARKET: DETAILED LIST OF CONFERENCES AND EVENTS    78

5.14       STANDARDS AND REGULATORY LANDSCAPE   79

5.14.1    REGULATORY BODIES, GOVERNMENT AGENCIES,  AND OTHER ORGANIZATIONS          79

TABLE 12           NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES,  AND OTHER ORGANIZATIONS      79

TABLE 13           EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 80

TABLE 14           ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES,  AND OTHER ORGANIZATIONS      80

5.14.2    KEY REGULATIONS AND STANDARDS  81

5.14.2.1 Regulations          82

5.14.2.2 Standards            82

6            3D STACKING MARKET, BY PACKAGING METHODOLOGY          84

6.1         INTRODUCTION            84

6.2         3D PACKAGE-ON-PACKAGE (POP)         84

6.2.1      GROWING DEMAND FOR COMPACT AND FEATURE-RICH ELECTRONIC DEVICES TO PROPEL SEGMENTAL GROWTH        84

6.3         3D SYSTEM-IN-PACKAGE (SIP)  84

6.3.1      NEED FOR MINIATURIZED AND POWER-EFFICIENT DEVICES ACROSS DIVERSE APPLICATIONS TO DRIVE SEGMENT  84

6.4         3D CHIP-ON-CHIP (COC)           85

6.4.1      NEED FOR COMPACT SOLUTIONS IN HIGH-PERFORMANCE COMPUTING APPLICATIONS TO FUEL SEGMENTAL GROWTH  85

6.5         WAFER LEVEL CHIP SCALE PACKAGING (WLCSP)           85

6.5.1      NEED TO REDUCE CONSUMPTION OF PACKAGING MATERIAL TO PROPEL ADOPTION OF WLCSP TECHNOLOGY 85

7            3D STACKING MARKET, BY METHOD    86

7.1         INTRODUCTION            87

FIGURE 35         WAFER-TO-CHIP SEGMENT TO REGISTER HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD     87

TABLE 15           3D STACKING MARKET, BY METHOD, 2019–2022 (USD MILLION)          87

TABLE 16           3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION)          88

7.2         DIE-TO-DIE      88

7.2.1      RISING NEED FOR COMPACT AND EFFICIENT DEVICE STRUCTURES TO BOOST ADOPTION OF DIE-TO-DIE STACKING         88

TABLE 17           DIE-TO-DIE: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY,  2019–2022 (USD MILLION)       88

TABLE 18           DIE-TO-DIE: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY,  2023–2028 (USD MILLION)       89

7.3         DIE-TO-WAFER 89

7.3.1      INCREASING FOCUS ON DEVICE PERFORMANCE ENHANCEMENT TO FUEL ADOPTION OF DIE-TO-WAFER INTEGRATION IN 3D STACKING   89

TABLE 19           DIE-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY,  2019–2022 (USD MILLION)           89

TABLE 20           DIE-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY,  2023–2028 (USD MILLION)           90

7.4         WAFER-TO-WAFER        90

7.4.1      GROWING DEMAND FOR ADVANCED COMPACT PACKAGING SOLUTIONS TO FUEL SEGMENTAL GROWTH    90

TABLE 21           WAFER-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY,  2019–2022 (USD MILLION)           90

TABLE 22           WAFER-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY,  2023–2028 (USD MILLION)           91

7.5         WAFER-TO-CHIP           91

7.5.1      RISING NEED FOR COMPACT AND EFFICIENT PACKAGING SOLUTIONS IN AUTOMOTIVE ELECTRONICS TO DRIVE SEGMENT        91

TABLE 23           WAFER-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY,  2019–2022 (USD MILLION)           91

TABLE 24           WAFER-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY,  2023–2028 (USD MILLION)           92

7.6         CHIP-TO-CHIP 92

7.6.1      GROWING NEED FOR HIGH-PERFORMANCE AND POWER-EFFICIENT ELECTRONIC DEVICES TO PROPEL SEGMENTAL GROWTH        92

TABLE 25           CHIP-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY,  2019–2022 (USD MILLION)           92

TABLE 26           CHIP-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY,  2023–2028 (USD MILLION)           92

8            3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY              93

8.1         INTRODUCTION            94

FIGURE 36         3D TSV SEGMENT TO CAPTURE LARGEST SHARE OF 3D STACKING MARKET DURING FORECAST PERIOD           94

TABLE 27           3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)          94

TABLE 28           3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)          95

8.2         3D HYBRID BONDING   95

8.2.1      ADOPTION OF 3D HYBRID BONDING IN HIGH-PERFORMANCE COMPUTING AND DATA-INTENSIVE APPLICATIONS TO DRIVE MARKET              95

TABLE 29           3D HYBRID BONDING: 3D STACKING MARKET, BY METHOD, 2019–2022 (USD MILLION)          96

TABLE 30           3D HYBRID BONDING: 3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION)          96

8.3         3D THROUGH-SILICON VIA (TSV)          96

TABLE 31           3D TSV: 3D STACKING MARKET, BY METHOD,  2019–2022 (USD MILLION)          97

TABLE 32           3D TSV: 3D STACKING MARKET, BY METHOD,  2023–2028 (USD MILLION)          97

8.3.1      VIA-FIRST TSV  97

8.3.1.1   Increasing adoption of via-first TSV in applications requiring early-stage integration to drive market 97

8.3.2      VIA-MIDDLE TSV           98

8.3.2.1   Need for flexibility in vertical connections in semiconductor design to increase demand for via-middle TSV technology         98

8.3.3      VIA-LAST TSV   98

8.3.3.1   Growing adoption of via-last TSV technology in applications requiring late-stage interconnection to drive market       98

8.3.4      HYBRID TSV      98

8.3.4.1   Ability to meet specific design and performance requirements to fuel adoption of hybrid TSV          98

8.3.5      DEEP TRENCH TSV        98

8.3.5.1   Rising demand for enhanced electrical performance in advanced microprocessors and memory devices to drive market 98

8.3.6      MICROBUMP TSV          99

8.3.6.1   Rising demand for miniaturized and densely interconnected semiconductor devices to fuel market growth           99

8.3.7      THROUGH GLASS VIA (TGV)     99

8.3.7.1   Rising adoption of TGV technique in applications requiring transparent and hermetic packaging to drive market 99

8.4         MONOLITHIC 3D           99

8.4.1      ABILITY TO ADDRESS LIMITATIONS OF ADVANCED CMOS SCALING TO FUEL DEMAND FOR MONOLITHIC 3D INTEGRATION           99

TABLE 33           MONOLITHIC 3D INTEGRATION: 3D STACKING MARKET, BY METHOD,  2019–2022 (USD MILLION)  100

TABLE 34           MONOLITHIC 3D INTEGRATION: 3D STACKING MARKET, BY METHOD,  2023–2028 (USD MILLION)  100

9            3D STACKING MARKET, BY DEVICE TYPE           101

9.1         INTRODUCTION            102

FIGURE 37         MEMS/SENSORS SEGMENT TO REGISTER HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD     102

TABLE 35           3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)          103

TABLE 36           3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)          103

9.2         LOGIC ICS         103

9.2.1      RISING NEED FOR HIGH COMPUTATIONAL EFFICIENCY TO INDUCE DEMAND FOR LOGIC ICS           103

TABLE 37           LOGIC ICS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 104

TABLE 38           LOGIC ICS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 104

9.3         IMAGING & OPTOELECTRONICS            104

9.3.1      POTENTIAL TO IMPROVE IMAGE PROCESSING AND OPTICAL FUNCTIONALITIES TO SPUR ADOPTION OF 3D STACKING        104

TABLE 39           IMAGING & OPTOELECTRONICS: 3D STACKING MARKET, BY END USER,  2019–2022 (USD MILLION) 105

TABLE 40           IMAGING & OPTOELECTRONICS: 3D STACKING MARKET, BY END USER,  2023–2028 (USD MILLION) 105

9.4         MEMORY DEVICES        106

9.4.1      SURGING DEMAND FOR HIGH-BANDWIDTH MEMORY TO FOSTER MARKET GROWTH        106

TABLE 41           MEMORY DEVICES: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)          106

TABLE 42           MEMORY DEVICES: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)          107

9.5         MEMS/SENSORS             107

9.5.1      GROWING REQUIREMENT FOR COMPACT AND ACCURATE SENSING TECHNOLOGIES TO FUEL UPTAKE OF 3D STACKING    107

TABLE 43           MEMS/SENSORS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)     108

TABLE 44           MEMS/SENSORS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)     108

9.6         LIGHT EMITTING DIODES (LEDS)         108

9.6.1      RISING DEMAND FOR INNOVATIVE DESIGNS AND IMPROVED LUMINOSITY IN LEDS TO FUEL SEGMENTAL GROWTH 108

TABLE 45           LEDS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)          109

TABLE 46           LEDS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)          109

9.7         OTHERS             109

TABLE 47           OTHERS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 110

TABLE 48           OTHERS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 110

10          3D STACKING MARKET, BY END USER   111

10.1       INTRODUCTION            112

FIGURE 38         AUTOMOTIVE SEGMENT TO RECORD HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD           112

TABLE 49           3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)          112

TABLE 50           3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)          113

10.2       CONSUMER ELECTRONICS        113

10.2.1    INCREASING TECHNOLOGICAL ADVANCEMENTS IN CONSUMER ELECTRONICS TO DRIVE ADOPTION OF 3D STACKING 113

TABLE 51           CONSUMER ELECTRONICS: 3D STACKING MARKET, BY DEVICE TYPE,  2019–2022 (USD MILLION)         114

TABLE 52           CONSUMER ELECTRONICS: 3D STACKING MARKET, BY DEVICE TYPE,  2023–2028 (USD MILLION)         114

TABLE 53           CONSUMER ELECTRONICS: 3D STACKING MARKET, BY REGION,  2019–2022 (USD MILLION)     115

TABLE 54           CONSUMER ELECTRONICS: 3D STACKING MARKET, BY REGION,  2023–2028 (USD MILLION)     115

10.3       MANUFACTURING        115

10.3.1    INCREASING SHIFT TOWARD SMART FACTORIES AND INDUSTRY 4.0 TO FUEL ADOPTION OF 3D STACKING 115

TABLE 55           MANUFACTURING: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)          116

TABLE 56           MANUFACTURING: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)          116

TABLE 57           MANUFACTURING: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)     116

TABLE 58           MANUFACTURING: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)     117

10.4       COMMUNICATIONS      117

10.4.1    INTEGRATION OF ADVANCED FUNCTIONALITIES IN HIGH-PERFORMANCE COMPUTING APPLICATIONS TO DRIVE MARKET          117

TABLE 59           COMMUNICATIONS: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)          118

TABLE 60           COMMUNICATIONS: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)          118

TABLE 61           COMMUNICATIONS: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)     118

TABLE 62           COMMUNICATIONS: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)     119

10.5       AUTOMOTIVE  119

10.5.1    RISING DEMAND FOR COMPACT AND POWERFUL AUTOMOTIVE ELECTRONIC SYSTEMS TO PROPEL MARKET GROWTH 119

TABLE 63           AUTOMOTIVE: 3D STACKING MARKET, BY DEVICE TYPE,  2019–2022 (USD MILLION)          119

TABLE 64           AUTOMOTIVE: 3D STACKING MARKET, BY DEVICE TYPE,  2023–2028 (USD MILLION)          120

TABLE 65           AUTOMOTIVE: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION) 120

TABLE 66           AUTOMOTIVE: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION) 120

10.6       HEALTHCARE  121

10.6.1    SURGING DEMAND FOR ADVANCED MEDICAL EQUIPMENT FOR HIGH PERFORMANCE AND EFFICIENCY TO FUEL MARKET GROWTH 121

TABLE 67           HEALTHCARE: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)     121

TABLE 68           HEALTHCARE: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)     121

TABLE 69           HEALTHCARE: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION) 122

TABLE 70           HEALTHCARE: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION) 122

10.7       OTHERS             122

TABLE 71           OTHERS: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION) 123

TABLE 72           OTHERS: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION) 123

TABLE 73           OTHERS: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)          123

TABLE 74           OTHERS: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)          124

11          3D STACKING MARKET, BY REGION       125

11.1       INTRODUCTION            126

FIGURE 39         ASIA PACIFIC TO RECORD HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD   126

TABLE 75           3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)              127

TABLE 76           3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)              127

11.2       NORTH AMERICA          127

FIGURE 40         NORTH AMERICA: 3D STACKING MARKET SNAPSHOT  128

TABLE 77           NORTH AMERICA: 3D STACKING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)     129

TABLE 78           NORTH AMERICA: 3D STACKING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)     129

TABLE 79           NORTH AMERICA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)     129

TABLE 80           NORTH AMERICA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)     130

11.2.1    US         130

11.2.1.1 Presence of fabrication business giants to support market growth            130

TABLE 81           US: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)          131

TABLE 82           US: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)          131

11.2.2    CANADA            131

11.2.2.1 Increasing focus on innovation and technological advancements to foster market growth   131

TABLE 83           CANADA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 133

TABLE 84           CANADA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 133

11.2.3    MEXICO             133

11.2.3.1 Government-led initiatives to develop semiconductor industry to fuel market growth   133

TABLE 85           MEXICO: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 134

TABLE 86           MEXICO: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 134

11.2.4    NORTH AMERICA: RECESSION IMPACT 135

11.3       EUROPE             135

FIGURE 41         EUROPE: 3D STACKING MARKET SNAPSHOT     136

TABLE 87           EUROPE: 3D STACKING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 136

TABLE 88           EUROPE: 3D STACKING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 137

TABLE 89           EUROPE: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 137

TABLE 90           EUROPE: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 137

11.3.1    GERMANY         138

11.3.1.1 Growing production of automobiles to create demand for 3D stacking     138

TABLE 91           GERMANY: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 138

TABLE 92           GERMANY: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 139

11.3.2    FRANCE             139

11.3.2.1 Increasing R&D in 3D stacking to drive market           139

TABLE 93           FRANCE: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)          139

TABLE 94           FRANCE: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)          140

11.3.3    UK         140

11.3.3.1 5G implementation to create conducive environment for market growth  140

TABLE 95           UK: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)          140

TABLE 96           UK: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)          141

11.3.4    REST OF EUROPE           141

TABLE 97           REST OF EUROPE: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)     141

TABLE 98           REST OF EUROPE: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)     142

11.3.5    EUROPE: RECESSION IMPACT   142

11.4       ASIA PACIFIC    142

FIGURE 42         ASIA PACIFIC: 3D STACKING MARKET SNAPSHOT          143

TABLE 99           ASIA PACIFIC: 3D STACKING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 144

TABLE 100         ASIA PACIFIC: 3D STACKING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 144

TABLE 101         ASIA PACIFIC: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 144

TABLE 102         ASIA PACIFIC: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 145

11.4.1    CHINA  145

11.4.1.1 Increasing investments in semiconductor industry to drive market           145

TABLE 103         CHINA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)          145

TABLE 104         CHINA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)          146

11.4.2    JAPAN  146

11.4.2.1 Increasing focus on precision engineering to boost adoption of 3D stacking              146

TABLE 105         JAPAN: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)          146

TABLE 106         JAPAN: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)          147

11.4.3    SOUTH KOREA 147

11.4.3.1 Growing focus on innovation and research to contribute to market growth              147

TABLE 107         SOUTH KOREA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)     147

TABLE 108         SOUTH KOREA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)     148

11.4.4    TAIWAN             148

11.4.4.1 Rising demand for compact, efficient, and high-performing chips to support market growth     148

TABLE 109         TAIWAN: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 149

TABLE 110         TAIWAN: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 149

11.4.5    REST OF ASIA PACIFIC  149

TABLE 111         REST OF ASIA PACIFIC: 3D STACKING MARKET, BY END USER,  2019–2022 (USD MILLION)          150

TABLE 112         REST OF ASIA PACIFIC: 3D STACKING MARKET, BY END USER,  2023–2028 (USD MILLION)          150

11.4.6    ASIA PACIFIC: RECESSION IMPACT        150

11.5       REST OF THE WORLD (ROW)    151

TABLE 113         ROW: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)          151

TABLE 114         ROW: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)          151

TABLE 115         ROW: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)          151

TABLE 116         ROW: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)          152

11.5.1    MIDDLE EAST & AFRICA             152

11.5.1.1 Government initiatives to strengthen semiconductor industry to favor market growth   152

TABLE 117         MIDDLE EAST & AFRICA: 3D STACKING MARKET, BY END USER,  2019–2022 (USD MILLION)          152

TABLE 118         MIDDLE EAST & AFRICA: 3D STACKING MARKET, BY END USER,  2023–2028 (USD MILLION)          153

11.5.2    SOUTH AMERICA           153

11.5.2.1 Growing demand for advanced architecture and high-end computing to contribute to market growth 153

TABLE 119         SOUTH AMERICA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)     153

TABLE 120         SOUTH AMERICA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)     154

11.5.3    ROW: RECESSION IMPACT         154

12          COMPETITIVE LANDSCAPE       155

12.1       INTRODUCTION            155

12.2       STRATEGIES ADOPTED BY KEY PLAYERS           155

TABLE 121         OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS IN 3D STACKING MARKET      155

12.2.1    PRODUCT PORTFOLIO 156

12.2.2    REGIONAL FOCUS         156

12.2.3    ORGANIC/INORGANIC GROWTH STRATEGIES  156

12.3       MARKET SHARE ANALYSIS, 2022             157

TABLE 122         3D STACKING MARKET: MARKET SHARE ANALYSIS, 2022              157

12.4       REVENUE ANALYSIS OF KEY PLAYERS IN 3D STACKING MARKET              159

FIGURE 43         FIVE-YEAR REVENUE ANALYSIS OF KEY PLAYERS IN 3D STACKING MARKET      159

12.5       KEY COMPANY EVALUATION MATRIX, 2022       159

12.5.1    STARS  159

12.5.2    PERVASIVE PLAYERS     159

12.5.3    EMERGING LEADERS    160

12.5.4    PARTICIPANTS 160

FIGURE 44         3D STACKING MARKET (GLOBAL): KEY COMPANY EVALUATION MATRIX, 2022      160

12.6       COMPETITIVE BENCHMARKING            161

12.6.1    COMPANY FOOTPRINT, BY INTERCONNECTING METHOD        161

12.6.2    COMPANY FOOTPRINT, BY DEVICE TYPE          162

12.6.3    COMPANY FOOTPRINT, BY END USER  163

12.6.4    COMPANY FOOTPRINT, BY REGION      164

12.6.5    OVERALL COMPANY FOOTPRINT          165

12.7       STARTUPS/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION MATRIX, 2022      166

TABLE 123         3D STACKING MARKET: DETAILED LIST OF KEY STARTUPS/SMES           166

12.7.1    COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES         166

TABLE 124         COMPANY FOOTPRINT, BY INTERCONNECTING METHODS              166

TABLE 125         COMPANY FOOTPRINT, BY DEVICE TYPE          167

TABLE 126         COMPANY FOOTPRINT, BY END USER INDUSTRY          167

TABLE 127         COMPANY FOOTPRINT, BY REGION      167

12.7.2    PROGRESSIVE COMPANIES       168

12.7.3    RESPONSIVE COMPANIES          168

12.7.4    DYNAMIC COMPANIES 168

12.7.5    STARTING BLOCKS       168

FIGURE 45         3D STACKING MARKET (GLOBAL): STARTUPS/SMES EVALUATION MATRIX, 2022      168

12.8       COMPETITIVE SCENARIOS AND TRENDS           169

12.8.1    PRODUCT LAUNCHES & DEVELOPMENTS         169

TABLE 128         3D STACKING MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2020–2023             169

12.8.2    DEALS  171

TABLE 129         3D STACKING MARKET: DEALS, 2020–2023          171

13          COMPANY PROFILES    175

13.1       INTRODUCTION            175

13.2       KEY PLAYERS   175

(Business overview, Products/Solutions/Services offered, Recent developments, Product launches, Deals, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses/Competitive threats)*

13.2.1    TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED              175

TABLE 130         TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW            176

FIGURE 46         TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD: COMPANY SNAPSHOT  176

TABLE 131         TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED             177

TABLE 132         TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES            177

TABLE 133         TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS            178

TABLE 134         TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: OTHERS         178

13.2.2    SAMSUNG         180

TABLE 135         SAMSUNG: COMPANY OVERVIEW          180

FIGURE 47         SAMSUNG: COMPANY SNAPSHOT          181

TABLE 136         SAMSUNG: PRODUCTS/SERVICES/SOLUTIONS OFFERED              181

TABLE 137         SAMSUNG: PRODUCT LAUNCHES          182

TABLE 138         SAMSUNG: DEALS         182

13.2.3    INTEL CORPORATION  183

TABLE 139         INTEL CORPORATION: COMPANY OVERVIEW  183

FIGURE 48         INTEL CORPORATION: COMPANY SNAPSHOT  184

TABLE 140         INTEL CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED          184

13.2.4    SK HYNIX INC.   186

TABLE 141         SK HYNIX INC.: COMPANY OVERVIEW   186

FIGURE 49         SK HYNIX INC.: COMPANY SNAPSHOT  187

TABLE 142         SK HYNIX INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED              187

TABLE 143         SK HYNIX INC.: DEALS  188

13.2.5    ADVANCED MICRO DEVICES, INC.         190

TABLE 144         ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW              190

FIGURE 50         ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT              191

TABLE 145         ADVANCED MICRO DEVICES, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED   191

TABLE 146         ADVANCED MICRO DEVICES, INC.: DEALS         192

13.2.6    ASE TECHNOLOGY HOLDING CO., LTD.             193

TABLE 147         ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW              193

FIGURE 51         ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY SNAPSHOT        194

TABLE 148         ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SERVICES/SOLUTIONS OFFERED   194

TABLE 149         ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES              195

13.2.7    AMKOR TECHNOLOGY 197

TABLE 150         AMKOR TECHNOLOGY: COMPANY OVERVIEW 197

FIGURE 52         AMKOR TECHNOLOGY: COMPANY SNAPSHOT 198

TABLE 151         AMKOR TECHNOLOGY: PRODUCTS/SERVICES/SOLUTIONS OFFERED          198

TABLE 152         AMKOR TECHNOLOGY: DEALS 199

13.2.8    JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.             201

TABLE 153         JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: COMPANY OVERVIEW        201

FIGURE 53         JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT        201

TABLE 154         JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: PRODUCTS/SERVICES/SOLUTIONS OFFERED   202

TABLE 155         JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: PRODUCT LAUNCHES       202

TABLE 156         JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: DEALS              202

13.2.9    TEXAS INSTRUMENTS INCORPORATED 203

TABLE 157         TEXAS INSTRUMENTS INCORPORATED: COMPANY OVERVIEW              203

FIGURE 54         TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT              204

TABLE 158         TEXAS INSTRUMENTS INCORPORATED: PRODUCTS/SERVICES/SOLUTIONS OFFERED   204

TABLE 159         TEXAS INSTRUMENTS INCORPORATED: DEALS 205

13.2.10  UNITED MICROELECTRONICS CORPORATION 206

TABLE 160         UNITED MICROELECTRONICS CORPORATION: COMPANY OVERVIEW        206

FIGURE 55         UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT        207

TABLE 161         UNITED MICROELECTRONICS CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED   207

TABLE 162         UNITED MICROELECTRONICS CORPORATION: DEALS 208

13.2.11  POWERTECH TECHNOLOGY INC           209

TABLE 163         POWERTECH TECHNOLOGY INC: COMPANY OVERVIEW              209

FIGURE 56         POWERTECH TECHNOLOGY INC: COMPANY SNAPSHOT              210

TABLE 164         POWERTECH TECHNOLOGY INC: PRODUCTS/SERVICES/SOLUTIONS OFFERED   210

13.2.12  CADENCE DESIGN SYSTEMS, INC.          211

TABLE 165         CADENCE DESIGN SYSTEMS, INC.: COMPANY OVERVIEW              211

FIGURE 57         CADENCE DESIGN SYSTEMS, INC.: COMPANY SNAPSHOT              212

TABLE 166         CADENCE DESIGN SYSTEMS, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED   212

TABLE 167         CADENCE DESIGN SYSTEMS, INC.: DEALS          213

13.2.13  BROADCOM      214

TABLE 168         BROADCOM: COMPANY OVERVIEW      214

FIGURE 58         BROADCOM: COMPANY SNAPSHOT      215

TABLE 169         BROADCOM: PRODUCTS/SERVICES/SOLUTIONS OFFERED              215

TABLE 170         BROADCOM: DEALS      216

13.2.14  TOWER SEMICONDUCTOR        217

TABLE 171         TOWER SEMICONDUCTOR: COMPANY OVERVIEW        217

FIGURE 59         TOWER SEMICONDUCTOR: COMPANY SNAPSHOT        217

TABLE 172         TOWER SEMICONDUCTOR: PRODUCTS/SERVICES/SOLUTIONS OFFERED   218

TABLE 173         TOWER SEMICONDUCTOR: DEALS        218

13.2.15  IBM       219

TABLE 174         IBM: COMPANY OVERVIEW       219

FIGURE 60         IBM: COMPANY SNAPSHOT       220

TABLE 175         IBM: PRODUCTS/SERVICES/SOLUTIONS OFFERED        220

TABLE 176         IBM: PRODUCT LAUNCHES       221

13.2.16  TOKYO ELECTRON LIMITED    222

TABLE 177         TOKYO ELECTRON LIMITED: COMPANY OVERVIEW     222

FIGURE 61         TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT     223

TABLE 178         TOKYO ELECTRON LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED   223

TABLE 179         TOKYO ELECTRON LIMITED: PRODUCT LAUNCHES     224

13.2.17  CEA-LETI          225

TABLE 180         CEA-LETI: COMPANY OVERVIEW           225

TABLE 181         CEA-LETI: PRODUCTS/SERVICES/SOLUTIONS OFFERED              225

*Details on Business overview, Products/Solutions/Services offered, Recent developments, Product launches, Deals, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses/Competitive threats might not be captured in case of unlisted companies.

13.3       OTHER PLAYERS           226

13.3.1    SILICONWARE PRECISION INDUSTRIES CO., LTD.          226

13.3.2    GLOBALFOUNDRIES INC.           227

13.3.3    NHANCED SEMICONDUCTORS 228

13.3.4    DECA TECHNOLOGIES 229

13.3.5    TEZZARON       230

13.3.6    TELEDYNE TECHNOLOGIES INCORPORATED   230

13.3.7    HUAWEI TECHNOLOGIES CO. LTD.       231

13.3.8    QUALCOMM TECHNOLOGIES, INC.       232

13.3.9    3M         233

13.3.10  AYAR LABS, INC.             234

13.3.11  APPLIED MATERIALS, INC.         235

13.3.12  MONOLITHIC 3D INC.   236

13.3.13  MOLDEX3D       236

13.3.14  CEREBRAS         237

13.3.15  XPERI INC.         237

14          APPENDIX         238

14.1       DISCUSSION GUIDE      238

14.2       KNOWLEDGESTORE: MARKETSANDMARKETS’  SUBSCRIPTION PORTAL             241

14.3       CUSTOMIZATION OPTIONS      243

14.4       RELATED REPORTS       243

14.5       AUTHOR DETAILS         244