出版：MarketsandMarkets（マーケッツアンドマーケッツ） 出版年月：2023年10月
Chiplet Market – Global Forecast to 2028
チップレット市場 : プロセッサ [フィールドプログラマブルゲートアレイ (FPGA)、中央処理装置 (CPU)、グラフィックスプロセッシングユニット (GPU)、APU、AI ASIC Co-Processor]、パッケージングテクノロジ (SiP、FCCSP、FCBGA、2.5D/3D、WLCSP、ファンアウト) – 2028年までの世界予測
Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), APU, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA, 2.5D/3D, WLCSP, Fan-Out) – Global Forecast to 2028
| ページ数 | 242 |
| 図表数 | 182 |
| 価格 | |
| シングルユーザライセンス | USD 4,950 |
| マルチユーザライセンス（5名） | USD 6,650 |
| コーポレート（サイト）ライセンス | USD 8,150 |
| エンタープライズライセンス | USD 10,000 |
| 種別 | 英文調査報告書 |
チップレットの市場規模は2023年中に65億ドル、2028年までに1,480億ドルに達し、2023年から2028年までに年平均成長率（CAGR）86.7％で成長すると予測されています。
MarketsandMarkets（マーケッツアンドマーケッツ）「チップレット市場 : プロセッサ [フィールドプログラマブルゲートアレイ (FPGA)、中央処理装置 (CPU)、グラフィックスプロセッシングユニット (GPU)、APU、AI ASIC Co-Processor]、パッケージングテクノロジ (SiP、FCCSP、FCBGA、2.5D/3D、WLCSP、ファンアウト) – 2028年までの世界予測 – Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), APU, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA, 2.5D/3D, WLCSP, Fan-Out) – Global Forecast to 2028」は世界のチップレット市場を調査し、主要セグメント毎の分析・予測結果を提供します。
主な掲載内容
- 市場概観
- 市場力学
- 技術分析
- バリューチェーン分析
- エコシステムマッピング
- 顧客ビジネスに影響を与える動向／ディスラプション
- ファイブフォース分析
- 価格分析
- ケーススタディ分析
- 貿易分析
- 関税分析
- 特許分析
- 主要会議＆
- 主要会議＆イベント 2023-2024年
- 規格＆法規制環境
- 主要ステークホルダーと購入基準
- プロセッサ別チップレット市場
- FPGA
- GPU
- CPU
- APU
- AI ASIC
- 実装技術別チップレット市場
- SiP（System in Package）
- フリップチップCSP（fcCSP）
- フリップチップBGA（FCBGA）
- 2.5次元／3次元
- ウエハレベルチップサイズパッケージ（WL-CSP）
- FO（Fan Out）
- エンドユース用途別チップレット市場
- 企業用電子機器
- 家庭用電化製品
- 自動車
- 産業の自動化（インダストリアルオートメーション）
- ヘルスケア
- 軍事＆防衛
- その他
- 地域別チップレット市場
- 北米
- 米国
- カナダ
- メキシコ
- 欧州
- ドイツ
- 英国
- フランス
- その他の欧州
- アジア太平洋地域
- 中国
- 韓国
- その他のアジア太平洋地域
- 南米
- 中東＆アフリカ
- 北米
- 競合環境
- 主要プレイヤの戦略
- 収益分析 2020-2022年
- 市場シェア分析
- 主要企業の評価マトリクス
- スタートアップ／中小企業の企業（SME）の評価マトリクス
- スタートアップ／中小企業の企業一覧
- 競合ベンチマーキング
- 競合シナリオおよび動向
- 企業情報
- 付録
Report Overview
The chiplet market is projected to grow from USD 6.5 billion in 2023 and is projected to reach USD 148.0 billion by 2028; it is expected to grow at a CAGR of 86.7% from 2023 to 2028.
Adoption of chiplets in AI and edge computing applications, proliferation of data centers worldwide, and adoption of advanced packaging technologies are the factors expected to fuel the growth of the chiplet market.
“AI ASIC coprocessor segment of the chiplet market to witness high growth during the forecast period.”
The artificial intelligence application-specific integrated circuit (AI ASIC) coprocessor segment of the chiplet market to grow at high CAGR during the forecast period. The growth is attributed to the growing demand for user-specific customized solutions tailored for artificial intelligence (AI) applications. The shift toward AI-driven decision-making processes across industries is a driving force behind this trend. In addition, the pursuit of energy efficiency and optimized performance is steering companies toward AI ASIC coprocessors to bolster their AI capabilities. This convergence of technological advancements, strategic alliances, and a burgeoning demand for AI-driven solutions underscores the tremendous growth potential of the AI ASIC coprocessor segment within the chiplet market, cementing its role in the evolving landscape of AI-focused computing.
“Enterprise electronics segment to witness significant growth for chiplet market during the forecast period.”
Enterprise electronics segment to grow at high CAGR during the forecast period. Data centers are crucial for enterprise operations as it rapidly adopts chiplets to enhance processing power while reducing energy consumption. The appeal of chiplets lies in their modular design, providing scalability aligned with evolving enterprise needs. They are revolutionizing server architectures by reducing latency and optimizing power consumption, offering a promising solution for data-centric enterprises. Its key applications include AI accelerators, memory chiplets, and network processors, providing efficient and flexible solutions for data center infrastructures.
“Asia Pacific to hold a major market share of the chiplet market during the forecast period” Asia Pacific is expected to hold a major market share for chiplet market during the forecast period. The emergence of advanced technologies, such as AI, IoT, and Big Data has paved the way for the implementation of large-scale data centers in the region. Global giants such as Alibaba (China), Facebook (US), Amazon (US), Microsoft (US), Google (US), and Baidu (China) have already established their data centers in the Asian territory and are planning to expand their dominance in other regions. In Asia Pacific, the market is currently driven by Chinese and Indian consumers because of their increasing adoption rate of high-speed broadband services and mobile devices. The increasing telecommunication and data center networking infrastructure expansion is expected to drive the Asia Pacific chiplet market over the forecast period.
Extensive primary interviews were conducted with key industry experts in the chiplet market space to determine and verify the market size for various segments and subsegments gathered through secondary research. The break-up of primary participants for the report has been shown below:
The break-up of the profile of primary participants in the chiplet market:
• By Company Type: Tier 1 – 50%, Tier 2 – 30%, and Tier 3 – 20%
• By Designation: C Level – 20%, Director Level – 50%, Others-30%
• By Region: North America – 30%, Europe – 20%, Asia Pacific – 40%, ROW- 10%
The report profiles key players in the chiplet market with their respective market ranking analysis. Prominent players profiled in this report are Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), Marvell (US), MediaTek Inc. (Taiwan), NVIDIA Corporation (us), Achronix Semiconductor Corporation (US), Ranovus (Canada), and ASE Technology Holding Co., Ltd. (Taiwan).
Apart from this, Netronome (US), Cadence Design Systems, Inc. (US), and Synopsys, Inc. (US), SiFive, Inc. (US), ALPHAWAVE SEMI (UK), Eliyan (US), Ayar Labs, Inc. (US), Tachyum (US), X-Celeprint (Ireland), Kandou Bus SA (Switzerland), NHanced Semiconductors (US), Tenstorrent (Canada), Chipuller (China) and Rain Neuromorphics (US) are among a few emerging companies in the chiplet market.
Research Coverage: This research report categorizes the chiplet market on the basis of processor, packaging technology, end-use application, and region. The report describes the major drivers, restraints, challenges, and opportunities pertaining to the chiplet market and forecasts the same till 2028. Apart from these, the report also consists of leadership mapping and analysis of all the companies included in the chiplet ecosystem.
Key Benefits of Buying the Report The report will help the market leaders/new entrants in this market with information on the closest approximations of the revenue numbers for the overall chiplet market and the subsegments. This report will help stakeholders understand the competitive landscape and gain more insights to position their businesses better and to plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.
The report provides insights on the following pointers:
• Analysis of key drivers (adoption of high-performance computing (HPC) servers in various sectors, proliferation of data centers worldwide, adoption of advanced packaging technologies), restraints (heat management issues, lack of industry-wide interoperability standards), opportunities (development of quantum chiplets, rapid expansion of 5G infrastructure, rising incorporation of high-performance and power-efficient chiplets in medical devices, adoption of chiplets in AI and edge computing applications, increasing investments in autonomous vehicles) and challenges (challenges related to intellectual property (IP) protection and licensing, cybersecurity and vulnerability issues associated with chiplet-based systems) influencing the growth of the chiplet market.
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product & service launches in the chiplet market.
• Market Development: Comprehensive information about lucrative markets – the report analysis the chiplet market across varied regions
• Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the chiplet market
• Competitive Assessment: In-depth assessment of market shares, growth strategies and service offerings of leading players like Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), Marvell (US), among others in the chiplet market.
Table of Contents
1 INTRODUCTION 25
1.1 STUDY OBJECTIVES 25
1.2 MARKET DEFINITION 25
1.3 STUDY SCOPE 26
1.3.1 MARKETS COVERED 26
FIGURE 1 CHIPLET MARKET SEGMENTATION 26
1.3.2 REGIONAL SCOPE 26
1.3.3 INCLUSIONS AND EXCLUSIONS 27
1.3.4 YEARS CONSIDERED 27
1.3.5 CURRENCY CONSIDERED 28
1.4 LIMITATIONS 28
1.5 STAKEHOLDERS 28
1.6 RECESSION IMPACT 29
FIGURE 2 GDP GROWTH PROJECTION UNTIL 2023 FOR MAJOR ECONOMIES 29
2 RESEARCH METHODOLOGY 31
2.1 RESEARCH DATA 31
FIGURE 3 CHIPLET MARKET: RESEARCH DESIGN 31
2.1.1 SECONDARY DATA 32
2.1.1.1 Major secondary sources 32
2.1.1.2 Key data from secondary sources 32
2.1.2 PRIMARY DATA 33
2.1.2.1 Participants and key opinion leaders for primary interviews 33
2.1.2.2 Breakdown of primaries 33
2.1.2.3 Key data from primary sources 34
2.1.3 SECONDARY AND PRIMARY RESEARCH 35
2.1.3.1 Key industry insights 35
2.2 MARKET SIZE ESTIMATION 36
FIGURE 4 RESEARCH FLOW FOR MARKET SIZE ESTIMATION 36
2.2.1 BOTTOM-UP APPROACH 36
2.2.1.1 Approach to derive market size using bottom-up analysis (demand side) 36
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 37
2.2.2 TOP-DOWN APPROACH 37
2.2.2.1 Approach to derive market size using top-down analysis (supply side) 37
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 38
2.2.2.2 Supply-side analysis 38
FIGURE 7 MARKET SIZE ESTIMATION METHODOLOGY: SUPPLY-SIDE ANALYSIS 38
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 39
FIGURE 8 DATA TRIANGULATION 39
2.4 RESEARCH ASSUMPTIONS 40
FIGURE 9 ASSUMPTIONS 40
2.5 APPROACH TO ANALYZE IMPACT OF RECESSION ON CHIPLET MARKET 41
2.6 RISK ASSESSMENT 41
TABLE 1 RISK ASSESSMENT 41
2.7 RESEARCH LIMITATIONS 41
3 EXECUTIVE SUMMARY 42
3.1 GROWTH RATE ASSUMPTIONS/FORECAST 42
FIGURE 10 CPU SEGMENT TO HOLD LARGEST MARKET SHARE IN 2028 43
FIGURE 11 2.5D/3D SEGMENT TO HOLD LARGEST MARKET SHARE IN 2028 44
FIGURE 12 ENTERPRISE ELECTRONICS SEGMENT TO HOLD LARGEST MARKET SHARE IN 2028 44
FIGURE 13 ASIA PACIFIC HELD LARGEST SHARE OF CHIPLET MARKET IN 2022 45
4 PREMIUM INSIGHTS 46
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN CHIPLET MARKET 46
FIGURE 14 RISING NUMBER OF DATA CENTERS WORLDWIDE 46
4.2 CHIPLET MARKET, BY PROCESSOR 46
FIGURE 15 CPU SEGMENT TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD 46
4.3 CHIPLET MARKET, BY PACKAGING TECHNOLOGY AND END-USE APPLICATION 47
FIGURE 16 2.5D/3D AND ENTERPRISE ELECTRONICS SEGMENTS TO HOLD LARGEST MARKET SHARES IN 2023 47
4.4 CHIPLET MARKET, BY REGION 47
FIGURE 17 ASIA PACIFIC TO HOLD LARGEST MARKET SHARE IN 2023 47
4.5 CHIPLET MARKET, BY COUNTRY 48
FIGURE 18 CHINA TO REGISTER HIGHEST CAGR IN CHIPLET MARKET FROM 2023 TO 2028 48
5 MARKET OVERVIEW 49
5.1 INTRODUCTION 49
5.2 MARKET DYNAMICS 49
FIGURE 19 CHIPLET MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES 49
5.2.1 DRIVERS 50
5.2.1.1 Adoption of high-performance computing (HPC) servers in various sectors 50
5.2.1.2 Proliferation of data centers worldwide 50
FIGURE 20 NUMBER OF DATA CENTERS WORLDWIDE 51
5.2.1.3 Adoption of advanced packaging technologies 51
FIGURE 21 ANALYSIS OF IMPACT OF DRIVERS ON CHIPLET MARKET 52
5.2.2 RESTRAINTS 52
5.2.2.1 Heat management issues 52
5.2.2.2 Lack of industry-wide interoperability standards 52
FIGURE 22 ANALYSIS OF IMPACT OF RESTRAINTS ON CHIPLET MARKET 53
5.2.3 OPPORTUNITIES 53
5.2.3.1 Development of quantum chiplets 53
5.2.3.2 Rapid expansion of 5G infrastructure 53
5.2.3.3 Rising incorporation of high-performance and power-efficient chiplets into medical devices 54
5.2.3.4 Adoption of chiplets in AI and edge computing applications 54
5.2.3.5 Increasing investments in autonomous vehicles 55
FIGURE 23 ANALYSIS OF IMPACT OF OPPORTUNITIES ON CHIPLET MARKET 56
5.2.4 CHALLENGES 56
5.2.4.1 Challenges related to intellectual property (IP) protection and licensing 56
5.2.4.2 Cybersecurity and vulnerability issues associated with chiplet-based systems 57
FIGURE 24 ANALYSIS OF IMPACT OF OPPORTUNITIES ON CHIPLET MARKET 57
5.3 TECHNOLOGY ANALYSIS 57
5.4 VALUE CHAIN ANALYSIS 59
FIGURE 25 CHIPLET MARKET: VALUE CHAIN ANALYSIS 59
5.5 ECOSYSTEM MAPPING 62
TABLE 2 CHIPLET MARKET: ROLE OF KEY PLAYERS IN ECOSYSTEM 62
FIGURE 26 KEY PLAYERS IN CHIPLET ECOSYSTEM 64
5.6 TRENDS AND DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 65
FIGURE 27 REVENUE SHIFTS AND NEW REVENUE POCKETS FOR PLAYERS IN CHIPLET MARKET 65
5.7 PORTER’S FIVE FORCES ANALYSIS 65
TABLE 3 CHIPLET MARKET: PORTER’S FIVE FORCES ANALYSIS 65
FIGURE 28 PORTER’S FIVE FORCES ANALYSIS 66
5.7.1 THREAT OF NEW ENTRANTS 66
5.7.2 THREAT OF SUBSTITUTES 67
5.7.3 BARGAINING POWER OF SUPPLIERS 67
5.7.4 BARGAINING POWER OF BUYERS 67
5.7.5 INTENSITY OF COMPETITIVE RIVALRY 68
5.8 PRICING ANALYSIS 68
5.8.1 INDICATIVE PRICING ANALYSIS FOR CHIPLET SOLUTIONS 68
TABLE 4 INDICATIVE PRICING ANALYSIS, BY KEY PLAYER (USD) 68
TABLE 5 INDICATIVE PRICING ANALYSIS, BY PROCESSOR (USD) 69
TABLE 6 INDICATIVE PRICING ANALYSIS, BY APPLICATION (USD) 69
5.9 CASE STUDY ANALYSIS 70
5.9.1 INTEL AND SIEMENS HEALTHINEERS DEVELOPED STATE-OF-THE-ART AI-POWERED IMAGING SOLUTIONS USING CHIPLETS 70
5.9.2 ACHRONIX’S EMBEDDED FPGAS (EFPGAS) EMPOWERED HETEROGENEOUS CHIPLET INTEGRATION 70
5.9.3 ELIYAN PARTNERED WITH TMSC TO ADVANCE CHIPLET INTEGRATION 71
5.10 TRADE ANALYSIS 71
FIGURE 29 IMPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 854231, BY COUNTRY, 2018–2022 (USD MILLION) 72
FIGURE 30 EXPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 854231, BY COUNTRY, 2018–2022 (USD MILLION) 72
5.11 TARIFF ANALYSIS 73
TABLE 7 MFN TARIFF FOR HS CODE 854231-COMPLIANT PRODUCTS EXPORTED BY CHINA 73
TABLE 8 MFN TARIFF FOR HS CODE 854231-COMPLIANT PRODUCTS EXPORTED BY US 73
TABLE 9 MFN TARIFF FOR HS CODE 854231-COMPLIANT PRODUCTS EXPORTED BY GERMANY 73
5.12 PATENT ANALYSIS 74
FIGURE 31 NUMBER OF PATENTS GRANTED RELATED TO CHIPLETS PUBLISHED FROM 2012 TO 2023 74
FIGURE 32 TOP 10 PATENT APPLICANTS, 2012–2023 74
TABLE 10 TOP 20 PATENT OWNERS, 2012–2023 75
TABLE 11 PATENT REGISTRATIONS, 2019–2023 76
5.13 KEY CONFERENCES AND EVENTS, 2023–2024 80
TABLE 12 CHIPLET MARKET: KEY CONFERENCES AND EVENTS, 2023–2024 80
5.14 STANDARDS AND REGULATORY LANDSCAPE 82
5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 82
TABLE 13 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 82
TABLE 14 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 84
TABLE 15 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 85
TABLE 16 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 87
5.14.2 STANDARDS 88
5.14.3 GOVERNMENT REGULATIONS 88
5.15 KEY STAKEHOLDERS AND BUYING CRITERIA 89
5.15.1 KEY STAKEHOLDERS IN BUYING PROCESS 89
FIGURE 33 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USE APPLICATIONS 89
TABLE 17 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USE APPLICATIONS (%) 90
5.15.2 BUYING CRITERIA 90
FIGURE 34 KEY BUYING CRITERIA FOR TOP 3 END-USE APPLICATIONS 90
TABLE 18 KEY BUYING CRITERIA FOR TOP 3 END-USE APPLICATIONS 90
6 CHIPLET MARKET, BY PROCESSOR 91
6.1 INTRODUCTION 92
FIGURE 35 CPU SEGMENT TO HOLD LARGEST SHARE OF CHIPLET MARKET IN 2028 92
TABLE 19 CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 93
TABLE 20 CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 93
6.2 FIELD PROGRAMMABLE GATE ARRAY (FPGA) 93
6.2.1 RE-PROGRAMMABILITY, FLEXIBILITY, SCALABILITY, IMPROVED PERFORMANCE, AND POWER EFFICIENCY FEATURES TO FUEL DEMAND 93
TABLE 21 FPGA: CHIPLET MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION) 94
TABLE 22 FPGA: CHIPLET MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION) 95
TABLE 23 FPGA: CHIPLET MARKET, BY REGION, 2019–2022 (USD MILLION) 95
TABLE 24 FPGA: CHIPLET MARKET, BY REGION, 2023–2028 (USD MILLION) 95
6.3 GRAPHICS PROCESSING UNIT (GPU) 96
6.3.1 HIGHER BANDWIDTH THAN CPUS AND EXPANDING AI, MACHINE LEARNING, AND DATA CENTER MARKETS TO DRIVE DEMAND 96
TABLE 25 GPU: CHIPLET MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION) 96
TABLE 26 GPU: CHIPLET MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION) 97
TABLE 27 GPU: CHIPLET MARKET, BY REGION, 2019–2022 (USD MILLION) 97
TABLE 28 GPU: CHIPLET MARKET, BY REGION, 2023–2028 (USD MILLION) 97
6.4 CENTRAL PROCESSING UNIT (CPU) 98
6.4.1 COST-EFFECTIVENESS AND ABILITY TO HANDLE CERTAIN AI ALGORITHMS TO FUEL DEMAND 98
TABLE 29 CPU: CHIPLET MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION) 98
TABLE 30 CPU: CHIPLET MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION) 99
TABLE 31 CPU: CHIPLET MARKET, BY REGION, 2019–2022 (USD MILLION) 99
TABLE 32 CPU: CHIPLET MARKET, BY REGION, 2023–2028 (USD MILLION) 99
6.5 APPLICATION PROCESSING UNIT (APU) 100
6.5.1 EXCELLENT PERFORMANCE AND EFFICIENT THERMAL MANAGEMENT FEATURES TO DRIVE DEMAND 100
TABLE 33 APU: CHIPLET MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION) 101
TABLE 34 APU: CHIPLET MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION) 101
TABLE 35 APU: CHIPLET MARKET, BY REGION, 2019–2022 (USD MILLION) 101
TABLE 36 APU: CHIPLET MARKET, BY REGION, 2023–2028 (USD MILLION) 102
6.6 ARTIFICIAL INTELLIGENCE APPLICATION-SPECIFIC INTEGRATED CIRCUIT (AI ASIC) COPROCESSOR 102
6.6.1 GROWING NEED FOR USER-SPECIFIC CUSTOMIZED SOLUTIONS TO DRIVE MARKET 102
TABLE 37 AI ASIC COPROCESSOR: CHIPLET MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION) 103
TABLE 38 AI ASIC COPROCESSOR: CHIPLET MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION) 103
TABLE 39 AI ASIC COPROCESSOR: CHIPLET MARKET, BY REGION, 2019–2022 (USD MILLION) 103
TABLE 40 AI ASIC COPROCESSOR: CHIPLET MARKET, BY REGION, 2023–2028 (USD MILLION) 104
7 CHIPLET MARKET, BY PACKAGING TECHNOLOGY 105
7.1 INTRODUCTION 106
FIGURE 36 2.5D/3D PACKAGING SEGMENT TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD 106
TABLE 41 CHIPLET MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 106
TABLE 42 CHIPLET MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 107
7.2 SYSTEM-IN-PACKAGE (SIP) 107
7.2.1 ABILITY OF SYSTEM-IN-PACKAGE (SIP) TECHNOLOGY TO SEAMLESSLY INTEGRATE MULTIPLE HETEROGENEOUS CHIPLETS INTO SINGLE, COMPACT MODULE TO FUEL DEMAND 107
7.3 FLIP CHIP CHIP SCALE PACKAGE (FCCSP) 108
7.3.1 EXCEPTIONAL ELECTRICAL PERFORMANCE OF FLIP CHIP CHIP SCALE PACKAGE (FCCSP) TECHNOLOGY TO FUEL DEMAND 108
7.4 FLIP CHIP BALL GRID ARRAY (FCBGA) 108
7.4.1 STRONG ELECTRICAL CONNECTION AND EFFICIENT HEAT DISSIPATION FEATURES OF FLIP CHIP BALL GRID ARRAY (FCBGA) TECHNOLOGY TO DRIVE MARKET 108
7.5 2.5D/3D 109
7.5.1 ABILITY OF 2.5D/3D PACKAGING TECHNOLOGY TO DELIVER SUPERIOR PERFORMANCE AND HIGH BANDWIDTH THROUGH VERTICAL STACKING TO PROPEL DEMAND 109
7.6 WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) 110
7.6.1 CAPABILITY OF WAFER-LEVEL CHIP SCALE PACKAGING (WLCSP) TECHNOLOGY TO ELIMINATE NEED FOR TRADITIONAL PACKAGING SUBSTRATES AND COMPATIBILITY WITH HIGH-VOLUME MANUFACTURING PROCESSES TO SUPPORT MARKET GROWTH 110
7.7 FAN-OUT (FO) 110
7.7.1 POTENTIALITY OF FAN-OUT (FO) PACKAGING TECHNOLOGY TO SUPPORT DIFFERENT CHIPLET CONFIGURATIONS TO FUEL ADOPTION 110
8 CHIPLET MARKET, BY END-USE APPLICATION 111
8.1 INTRODUCTION 112
FIGURE 37 ENTERPRISE ELECTRONICS SEGMENT TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD 112
TABLE 43 CHIPLET MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION) 112
TABLE 44 CHIPLET MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION) 113
8.2 ENTERPRISE ELECTRONICS 113
8.2.1 INCREASING DEMAND FOR ENERGY EFFICIENCY IN ORGANIZATIONAL OPERATIONS TO DRIVE SEGMENTAL GROWTH 113
TABLE 45 ENTERPRISE ELECTRONICS: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 114
TABLE 46 ENTERPRISE ELECTRONICS: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 114
8.3 CONSUMER ELECTRONICS 114
8.3.1 TECHNOLOGICAL ADVANCEMENTS IN CONSUMER ELECTRONICS TO FUEL ADOPTION OF MICROPROCESSORS FOR FAST DATA PROCESSING 114
TABLE 47 CONSUMER ELECTRONICS: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 115
TABLE 48 CONSUMER ELECTRONICS: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 115
8.4 AUTOMOTIVE 116
8.4.1 ADVANCEMENTS IN ADAS AND AUTONOMOUS DRIVING TECHNOLOGIES TO SUPPORT SEGMENTAL GROWTH 116
TABLE 49 AUTOMOTIVE: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 116
TABLE 50 AUTOMOTIVE: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 117
8.5 INDUSTRIAL AUTOMATION 117
8.5.1 INCREASING DEPLOYMENT OF ROBOTICS AND AUTOMATION ACROSS INDUSTRIAL PLANTS AND FACILITIES TO DRIVE DEMAND 117
TABLE 51 INDUSTRIAL AUTOMATION: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 118
TABLE 52 INDUSTRIAL AUTOMATION: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 118
8.6 HEALTHCARE 118
8.6.1 RISING NEED FOR WEARABLES AND IMPLANTABLE DEVICES TO FUEL MARKET GROWTH 118
TABLE 53 HEALTHCARE: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 119
TABLE 54 HEALTHCARE: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 119
8.7 MILITARY & AEROSPACE 119
8.7.1 GROWING NEED FOR RELIABILITY AND EXCEPTIONAL PERFORMANCE IN MILITARY & AEROSPACE SECTOR TO BOOST ADOPTION 119
TABLE 55 MILITARY & AEROSPACE: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 120
TABLE 56 MILITARY & AEROSPACE: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 120
8.8 OTHERS 120
TABLE 57 OTHERS: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 121
TABLE 58 OTHERS: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 121
9 CHIPLET MARKET, BY REGION 122
9.1 INTRODUCTION 123
FIGURE 38 ASIA PACIFIC TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD 123
TABLE 59 CHIPLET MARKET, BY REGION, 2019–2022 (USD MILLION) 124
TABLE 60 CHIPLET MARKET, BY REGION, 2023–2028 (USD MILLION) 124
9.2 NORTH AMERICA 124
9.2.1 NORTH AMERICA: RECESSION IMPACT 125
FIGURE 39 NORTH AMERICA: CHIPLET MARKET SNAPSHOT 125
FIGURE 40 US TO DOMINATE NORTH AMERICAN CHIPLET MARKET DURING FORECAST PERIOD 126
TABLE 61 NORTH AMERICA: CHIPLET MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 126
TABLE 62 NORTH AMERICA: CHIPLET MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 126
TABLE 63 NORTH AMERICA: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 127
TABLE 64 NORTH AMERICA: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 127
9.2.2 US 127
9.2.2.1 Rising demand for chiplets in data centers and presence of stringent environmental policies to fuel market growth 127
9.2.3 CANADA 128
9.2.3.1 Government-led initiatives for boosting domestic semiconductor industry to drive demand 128
9.2.4 MEXICO 129
9.2.4.1 Growing automotive industry to fuel market growth 129
9.3 EUROPE 129
9.3.1 EUROPE: RECESSION IMPACT 130
FIGURE 41 EUROPE: CHIPLET MARKET SNAPSHOT 131
FIGURE 42 GERMANY TO DOMINATE EUROPEAN CHIPLET MARKET DURING FORECAST PERIOD 132
TABLE 65 EUROPE: CHIPLET MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 132
TABLE 66 EUROPE: CHIPLET MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 132
TABLE 67 EUROPE: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 133
TABLE 68 EUROPE: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 133
9.3.2 GERMANY 133
9.3.2.1 Government-led investments in semiconductor industry to fuel market growth 133
9.3.3 UK 134
9.3.3.1 Government-led focus on developing telecommunications industry to drive demand 134
9.3.4 FRANCE 135
9.3.4.1 Strategic investments in semiconductor manufacturing to support market growth 135
9.3.5 REST OF EUROPE 135
9.4 ASIA PACIFIC 136
9.4.1 ASIA PACIFIC: RECESSION IMPACT 136
FIGURE 43 ASIA PACIFIC: CHIPLET MARKET SNAPSHOT 137
FIGURE 44 CHINA TO DOMINATE ASIA PACIFIC CHIPLET MARKET DURING FORECAST PERIOD 138
TABLE 69 ASIA PACIFIC: CHIPLET MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 138
TABLE 70 ASIA PACIFIC: CHIPLET MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 138
TABLE 71 ASIA PACIFIC: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 139
TABLE 72 ASIA PACIFIC: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 139
9.4.2 CHINA 139
9.4.2.1 Government-led efforts for enhancing semiconductor capabilities to drive demand 139
9.4.3 JAPAN 140
9.4.3.1 Technological advancements in automotive sector to accelerate market growth 140
9.4.4 SOUTH KOREA 140
9.4.4.1 Booming consumer electronics industry to drive demand 140
9.4.5 REST OF ASIA PACIFIC 141
9.5 ROW 142
9.5.1 ROW: RECESSION IMPACT 142
TABLE 73 ROW: CHIPLET MARKET, BY REGION, 2019–2022 (USD MILLION) 143
TABLE 74 ROW: CHIPLET MARKET, BY REGION, 2023–2028 (USD MILLION) 143
TABLE 75 ROW: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION) 143
TABLE 76 ROW: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION) 144
9.5.2 SOUTH AMERICA 144
9.5.2.1 Increased need for data centers to drive market growth 144
9.5.3 MIDDLE EAST & AFRICA 145
9.5.3.1 Government funding for development of healthcare infrastructure to boost market growth 145
10 COMPETITIVE LANDSCAPE 146
10.1 OVERVIEW 146
10.2 KEY STRATEGIES ADOPTED BY MAJOR PLAYERS 146
TABLE 77 CHIPLET MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS 146
10.3 REVENUE ANALYSIS, 2020–2022 148
FIGURE 45 REVENUE ANALYSIS OF TOP FIVE MARKET PLAYERS, 2020–2022 148
10.4 MARKET SHARE ANALYSIS, 2022 148
FIGURE 46 CHIPLET MARKET SHARE ANALYSIS, 2022 148
TABLE 78 CHIPLET MARKET SHARE ANALYSIS, 2022 149
10.5 EVALUATION MATRIX OF KEY COMPANIES, 2022 151
10.5.1 STARS 151
10.5.2 EMERGING LEADERS 151
10.5.3 PERVASIVE PLAYERS 151
10.5.4 PARTICIPANTS 152
FIGURE 47 CHIPLET MARKET: EVALUATION MATRIX OF KEY COMPANIES, 2022 152
10.6 EVALUATION MATRIX OF STARTUPS/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES), 2022 153
10.6.1 PROGRESSIVE COMPANIES 153
10.6.2 RESPONSIVE COMPANIES 153
10.6.3 DYNAMIC COMPANIES 153
10.6.4 STARTING BLOCKS 153
FIGURE 48 CHIPLET MARKET: EVALUATION MATRIX OF STARTUPS/SMES, 2022 154
10.7 LIST OF STARTUPS/SMES 155
TABLE 79 CHIPLET MARKET: LIST OF KEY STARTUPS/SMES 155
10.8 COMPETITIVE BENCHMARKING 156
TABLE 80 STARTUP/SME: COMPANY FOOTPRINT 156
TABLE 81 OVERALL COMPANY FOOTPRINT 157
TABLE 82 PROCESSOR: COMPANY FOOTPRINT 158
TABLE 83 END-USE APPLICATION: COMPANY FOOTPRINT 159
TABLE 84 REGION: COMPANY FOOTPRINT 160
10.9 COMPETITIVE SCENARIOS AND TRENDS 161
10.9.1 PRODUCT LAUNCHES 161
TABLE 85 CHIPLET MARKET: PRODUCT LAUNCHES, 2019–2023 161
10.9.2 DEALS 167
TABLE 86 CHIPLET MARKET: DEALS, 2019–2023 167
11 COMPANY PROFILES 176
(Business overview, Products/Solutions/Services offered, Recent Developments, MNM view)*
11.1 KEY PLAYERS 176
11.1.1 INTEL CORPORATION 176
TABLE 87 INTEL CORPORATION: COMPANY OVERVIEW 176
FIGURE 49 INTEL CORPORATION: COMPANY SNAPSHOT 177
TABLE 88 INTEL CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 177
TABLE 89 INTEL CORPORATION: PRODUCT LAUNCHES 179
TABLE 90 INTEL CORPORATION: DEALS 180
11.1.2 ADVANCED MICRO DEVICES, INC. 183
TABLE 91 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW 183
FIGURE 50 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT 184
TABLE 92 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 184
TABLE 93 ADVANCED MICRO DEVICES, INC.: PRODUCT LAUNCHES 186
TABLE 94 ADVANCED MICRO DEVICES, INC.: DEALS 188
11.1.3 APPLE INC. 191
TABLE 95 APPLE INC.: COMPANY OVERVIEW 191
FIGURE 51 APPLE INC.: COMPANY SNAPSHOT 192
TABLE 96 APPLE INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 192
TABLE 97 APPLE INC.: PRODUCT LAUNCHES 193
TABLE 98 APPLE INC.: DEALS 193
11.1.4 IBM 195
TABLE 99 IBM: COMPANY OVERVIEW 195
FIGURE 52 IBM: COMPANY SNAPSHOT 196
TABLE 100 IBM: PRODUCTS/SOLUTIONS/SERVICES OFFERED 196
TABLE 101 IBM: PRODUCT LAUNCHES 198
TABLE 102 IBM: DEALS 198
11.1.5 MARVELL 201
TABLE 103 MARVELL: COMPANY OVERVIEW 201
FIGURE 53 MARVELL: COMPANY SNAPSHOT 202
TABLE 104 MARVELL: PRODUCTS/SOLUTIONS/SERVICES OFFERED 202
TABLE 105 MARVELL: PRODUCT LAUNCHES 203
TABLE 106 MARVELL: DEALS 203
11.1.6 MEDIATEK INC. 207
TABLE 107 MEDIATEK INC.: COMPANY OVERVIEW 207
FIGURE 54 MEDIATEK INC.: COMPANY SNAPSHOT 208
TABLE 108 MEDIATEK, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 208
TABLE 109 MEDIATEK, INC.: PRODUCT LAUNCHES 209
TABLE 110 MEDIATEK, INC.: DEALS 210
11.1.7 NVIDIA CORPORATION 211
TABLE 111 NVIDIA CORPORATION: COMPANY OVERVIEW 211
FIGURE 55 NVIDIA CORPORATION: COMPANY SNAPSHOT 212
TABLE 112 NVIDIA CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 212
TABLE 113 NVIDIA CORPORATION: PRODUCT LAUNCHES 213
TABLE 114 NVIDIA CORPORATION: DEALS 214
11.1.8 ACHRONIX SEMICONDUCTOR CORPORATION 215
TABLE 115 ACHRONIX SEMICONDUCTOR CORPORATION: COMPANY OVERVIEW 215
TABLE 116 ACHRONIX SEMICONDUCTOR CORPORATION: PRODUCTS/SOLUTIONS/ SERVICES OFFERED 215
TABLE 117 ACHRONIX SEMICONDUCTOR CORPORATION: PRODUCT LAUNCHES 216
TABLE 118 ACHRONIX SEMICONDUCTOR CORPORATION: DEALS 216
11.1.9 RANOVUS 219
TABLE 119 RANOVUS: COMPANY OVERVIEW 219
TABLE 120 RANOVUS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 219
TABLE 121 RANOVUS: PRODUCT LAUNCHES 220
TABLE 122 RANOVUS: DEALS 220
11.1.10 ASE 221
TABLE 123 ASE: COMPANY OVERVIEW 221
FIGURE 56 ASE: COMPANY SNAPSHOT 222
TABLE 124 ASE: PRODUCTS/SOLUTIONS/SERVICES OFFERED 222
TABLE 125 ASE: PRODUCT LAUNCHES 223
TABLE 126 ASE: DEALS 224
11.2 OTHER PLAYERS 225
11.2.1 CADENCE DESIGN SYSTEMS, INC. 225
11.2.2 SYNOPSYS, INC. 226
11.2.3 ALPHAWAVE SEMI 227
11.2.4 ELIYAN 228
11.2.5 NETRONOME 229
11.2.6 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 230
11.2.7 NHANCED SEMICONDUCTORS 231
11.2.8 CHIPULLER 232
11.2.9 SIFIVE, INC. 233
11.2.10 RAMBUS 234
11.2.11 AYAR LABS, INC. 235
11.2.12 TACHYUM 236
11.2.13 X-CELEPRINT 237
11.2.14 KANDOU BUS SA 238
11.2.15 RAIN NEUROMORPHICS 238
11.2.16 TENSTORRENT 239
*Details on Business overview, Products/Solutions/Services offered, Recent Developments, MNM view might not be captured in case of unlisted companies.
12 APPENDIX 240
12.1 DISCUSSION GUIDE 240
12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 244
12.3 CUSTOMIZATION OPTIONS 246
12.4 RELATED REPORTS 246
12.5 AUTHOR DETAILS 247