Hybrid Bonding Market - Global Forecast To 2032
商品番号 : SMB-91593
| 出版社 | MarketsandMarkets |
| 出版年月 | 2025年12月 |
| ページ数 | 286 |
| 図表数 | 316 |
| 価格タイプ | シングルユーザライセンス |
| 価格 | USD 4,950 |
| 種別 | 英文調査報告書 |
ハイブリッドボンディング市場 – ウェーハ・ツー・ウェーハ（W2W）、ダイ・ツー・ウェーハ（D2W）、ダイ・ツー・ダイ（D2D）、ウェーハボンダー、表面処理ツール、検査・計測ツール、洗浄・CMPシステム、2.5Dパッケージング、3DスタックIC – 2032年までの世界予測
世界のハイブリッドボンディング市場は、2025年には1億6,470万米ドル、2032年には6億3,390万米ドルに達し、2025年から2032年にかけて21.2%のCAGR（年平均成長率）を記録すると予測されています。半導体メーカーがスケーリングの限界を克服し、より広い帯域幅、より低いレイテンシ、そしてより良い電力効率を実現するために3Dインテグレーションに移行するにつれ、ハイブリッドボンディングの世界的な採用は加速しています。AI、HPC、そして高度なロジックデバイスにおけるチップレットベースのアーキテクチャの台頭により、ハイブリッドボンディングによって実現される超微細ピッチ相互接続の必要性がさらに高まっています。大手ファウンドリやIDMによる高度なパッケージング能力への継続的な投資と、小型で高性能な電子機器に対する需要の高まりが相まって、世界中で市場の勢いがさらに強まっています。
調査対象範囲：
本調査レポートでは、ハイブリッドボンディング市場を、パッケージングアーキテクチャ（ウェーハ・ツー・ウェーハ（W2W）、ダイ・ツー・ウェーハ（D2W）、ダイ・ツー・ダイ（D2D））、プロセスフロー（フロントエンドおよびバックエンド）、装置タイプ（ウェーハボンダー、洗浄・CMPシステム、表面処理ツール、検査・計測ツール）、ボンディングタイプ（銅・銅（Cu-Cu）、銅・パッド／金属・パッド、その他のボンディングタイプ）、集積レベル（ハイブリッドボンディングによる2.5Dパッケージング、3DスタックIC、ヘテロジニアスインテグレーション）、アプリケーション（コンピューティング＆ロジック、メモリ＆ストレージ、センシング＆インターフェース、コネクティビティ＆コミュニケーション、その他のアプリケーション）、垂直市場（IT＆テレコミュニケーション、コンシューマーエレクトロニクス、自動車、航空宇宙＆防衛、ヘルスケア＆医療、産業オートメーション、その他の垂直市場）、および地域（北米、欧州、アジア太平洋、その他の地域）に基づいて分類しています。このレポートでは、ハイブリッドボンディング市場に関連する主要な推進要因、制約、課題、機会について説明し、2030年までの予測を示します。これに加えて、このレポートには、ハイブリッドボンディングエコシステムに含まれるすべての企業のリーダーシップマッピングと分析も含まれています。
レポート購入の主なメリット
本レポートは、ハイブリッドボンディング市場全体および各サブセグメントの収益数値の近似値に関する情報を提供することで、市場リーダー企業および新規参入企業を支援します。本レポートは、関係者が競争環境を理解し、事業のポジショニングを改善し、適切な市場開拓戦略を策定するための洞察を深めるのに役立ちます。また、市場の動向を把握し、主要な市場牽引要因、制約要因、課題、そして機会に関する情報を提供することで、関係者のビジネスの成長を支援します。
本レポートでは、以下の点について洞察を提供しています。
ハイブリッドボンディング市場の成長に影響を与える主要な推進要因（AI、HPC、ロジックメモリシステムにおける高帯域幅・低レイテンシのインターコネクト需要の高まり、200層超の3Dメモリへの電力供給における先進的なハイブリッドボンディングへの依存度の高まり、レチクルの限界を克服しシステム消費電力を削減するためのチップレットベースのアーキテクチャへの移行、脆弱な材料、先進的なBEOLスタック、次世代デバイスをサポートするための低温ボンディングのニーズの高まり）、制約要因（多額の先行投資と厳格な環境および表面品質要件）、機会（AI/MLアクセラレータにおける超高密度ロジック-メモリ接続の需要の高まり、SNRとピクセル密度を向上させるためのCISおよびAR/VRセンサーにおけるハイブリッドボンディングの導入）、および課題（ウェーハ全体にわたる超低欠陥率の維持における課題、ダイフォーマット、パッド構造、表面前処理フローの標準化の欠如）の分析
- 製品開発／イノベーション：ハイブリッドボンディング市場における今後の技術、研究開発活動、新製品投入に関する詳細な洞察
- 市場開発：有望な市場に関する包括的な情報（本レポートでは、様々な地域におけるハイブリッドボンディング市場を分析しています）
- 市場多様化：ハイブリッドボンディング市場における新製品、未開拓地域、最近の開発状況、投資に関する網羅的な情報
- 競合評価：ハイブリッドボンディング市場における主要企業（EV Group (EVG) (オーストリア)、Applied Materials, Inc. (米国)、SUSS MicroTec SE (ドイツ)、Besi (オランダ)、Kulicke & Soffa Industries, Inc. (シンガポール)、東京エレクトロン(TEL) (日本)、ASMPT (シンガポール)、Lam Research Corporation (米国)、芝浦メカトロニクス株式会社 (日本)）の市場シェア、成長戦略、製品ラインナップに関する詳細な評価
Report Description
The global hybrid bonding market is expected to reach USD 164.7 million in 2025 and USD 633.9 million by 2032, recording a CAGR of 21.2% from 2025 to 2032. Global hybrid bonding adoption is accelerating as semiconductor manufacturers transition to 3D integration to overcome scaling limitations and achieve higher bandwidth, lower latency, and improved power efficiency. The rise of chiplet-based architectures in AI, HPC, and advanced logic devices further strengthens the need for ultra-fine-pitch interconnects that hybrid bonding enables. Continued investments in advanced packaging capacity by leading foundries and IDMs, combined with increasing requirements for compact, high-performance electronics, are reinforcing strong market momentum worldwide.
“Wafer-to-wafer (W2W) segment accounted for the largest market share in 2024.”
The wafer-to-wafer (W2W) segment held the largest share of the hybrid bonding market in 2024 as it provides the highest level of process uniformity, alignment accuracy, and throughput, making it ideal for large-scale production environments. Major memory manufacturers and foundries rely heavily on W2W processes for 3D NAND, DRAM stacking, and CIS manufacturing, where consistent wafer-level bonding is essential to achieving high yields. Its capability to support extremely fine-pitch interconnects across full wafers also reduces overall manufacturing complexity compared to die-level approaches. As leading semiconductor fabs continue expanding 3D integration capacity, W2W remains the foundation of most high-volume hybrid bonding deployments.
“Computing & logic segment is projected to witness the highest CAGR in the hybrid bonding market from 2025 to 2032.”
Computing & logic applications are expected to grow the fastest during the forecast period due to the demand for high-performance AI accelerators, HPC processors, data-center workloads, and advanced edge computing systems. Hybrid bonding enables the ultra-dense vertical interconnects these devices require to achieve higher bandwidth, improved energy efficiency, and tighter logic-to-memory integration. The rapid industry shift toward chiplet-based designs further boosts adoption, as hybrid bonding helps overcome reticle-size limits and enhances scalability. With continuous investments in next-generation logic architectures and multi-die packaging, the computing and logic segment is positioned for the strongest growth trajectory.
“India is expected to record the highest CAGR in the Asia Pacific hybrid bonding market from 2025 to 2032.”
India is expected to exhibit the highest CAGR in Asia Pacific during the forecast period due to its rapid expansion of semiconductor manufacturing and advanced packaging initiatives supported by strong government incentives and policy frameworks. Large-scale investments under national semiconductor missions accelerate the development of new fabs, OSAT facilities, and research centers focused on 3D integration and hybrid bonding–related capabilities. The country also witnesses the rising demand for high-performance electronics across telecom, automotive, and data-center sectors, which drives the need for advanced packaging technologies. Combined with increasing collaboration with global equipment suppliers and technology partners, the country is positioned for the fastest growth in hybrid bonding adoption in the region.
Extensive primary interviews were conducted with key industry experts in the hybrid bonding market space to determine and verify the market size for various segments and subsegments gathered through secondary research. The breakdown of primary participants for the report is shown below:
The study contains insights from various industry experts, from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:
- By Company Type: Tier 1 – 35%, Tier 2 – 45%, and Tier 3 – 20%
- By Designation: C-level Executives – 40%, Managers – 30%, and Others – 30%
- By Region: North America – 40%, Europe – 30%, Asia Pacific – 20%, and RoW – 10%
Daifuku Co., Ltd. (Japan), MURATA MACHINERY, LTD. (Japan), Exyte Group (Germany), DuPont (US), and Thermo Fisher Scientific Inc. (US) are some key players in the hybrid bonding market.
Research Coverage:
This research report categorizes the hybrid bonding market based on Packaging Architecture [Wafer-to-Wafer (W2W), Die-to-Wafer (D2W), and Die-to-Die (D2D)], Process Flow (Front-end and Back-end), Equipment Type (Wafer Bonders, Cleaning & CMP Systems, Surface Prep Tools, and Inspection & Metrology Tools), Bonding Type [Copper-to-copper (Cu-Cu), Copper-to-pad/metal-to-pad, and Other Bonding Types], Integration Level (2.5D Packaging with Hybrid Bonding, 3D Stacked ICs, and Heterogeneous Integration), Application (Computing & Logic, Memory & Storage, Sensing & Interface, Connectivity & Communications, and Other Applications) Vertical (IT & Telecommunications, Consumer Electronics, Automotive, Aerospace & Defense, Healthcare & Medical, Industrial Automation, and Other Verticals), and Region (North America, Europe, Asia Pacific, and RoW). The report describes the major drivers, restraints, challenges, and opportunities pertaining to the hybrid bonding market and forecasts the same till 2030. Apart from this, the report also consists of leadership mapping and analysis of all the companies included in the hybrid bonding ecosystem.
Key Benefits of Buying the Report
The report will help the market leaders/new entrants in this market by providing information on the closest approximations of the revenue numbers for the overall hybrid bonding market and the subsegments. This report will help stakeholders to understand the competitive landscape and gain more insights to position their businesses better and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.
The report provides insights into the following pointers:
- Analysis of key drivers (Rising demand for high-bandwidth, low-latency interconnects in AI, HPC, and logic-memory systems, Increasing reliance on advanced hybrid bonding to power >200-layer 3D memory, Shift toward chiplet-based architectures to overcome reticle limits and reduce system power, Growing need for low-temperature bonding to support fragile materials, advanced BEOL stacks, and next-gen devices), restraints (Substantial upfront capital investment and Stringent environment and surface quality requirements), opportunities (Rising need for ultra-dense logic-to-memory connectivity in AI/ML accelerators and Deployment of hybrid bonding in CIS and AR/VR sensors to improve SNR and pixel density), and challenges (Issues in maintaining ultra-low defectivity across wafers and Lack of standardization in die formats, pad structures, and surface pre-treatment flows) influencing the growth of the hybrid bonding market
- Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the hybrid bonding market
- Market Development: Comprehensive information about lucrative markets–the report analyzes the hybrid bonding market across varied regions
- Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the hybrid bonding market
- Competitive Assessment: In-depth assessment of market shares, growth strategies, and product offerings of leading players, including EV Group (EVG) (Austria), Applied Materials, Inc. (US), SUSS MicroTec SE (Germany), Besi (Netherlands), Kulicke & Soffa Industries, Inc. (Singapore), Tokyo Electron (TEL) (Japan), ASMPT (Singapore), Lam Research Corporation (US), and SHIBAURA MECHATRONICS CORPORATION (Japan), in the hybrid bonding market
Table of Contents
1 INTRODUCTION 27
1.1 STUDY OBJECTIVES 27
1.2 MARKET DEFINITION 27
1.3 STUDY SCOPE 28
1.3.1 MARKET SEGMENTATION AND REGIONAL SCOPE 28
1.3.2 INCLUSIONS AND EXCLUSIONS 29
1.3.3 YEARS CONSIDERED 29
1.4 CURRENCY CONSIDERED 30
1.5 UNIT CONSIDERED 30
1.6 LIMITATIONS 30
1.7 STAKEHOLDERS 30
2 EXECUTIVE SUMMARY 31
2.1 MARKET HIGHLIGHTS AND KEY INSIGHTS 31
2.2 KEY MARKET PARTICIPANTS: MAPPING OF STRATEGIC DEVELOPMENTS 33
2.3 DISRUPTIVE TRENDS IN HYBRID BONDING MARKET 33
2.4 HIGH-GROWTH SEGMENTS 34
2.5 REGIONAL SNAPSHOT: MARKET SIZE, GROWTH RATE, AND FORECAST 35
3 PREMIUM INSIGHTS 36
3.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN HYBRID BONDING MARKET 36
3.2 HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE 36
3.3 HYBRID BONDING MARKET, BY PROCESS FLOW 37
3.4 HYBRID BONDING MARKET, BY APPLICATION 37
3.5 HYBRID BONDING MARKET, BY VERTICAL 38
3.6 HYBRID BONDING MARKET, BY REGION 38
4 MARKET OVERVIEW 39
4.1 INTRODUCTION 39
4.2 MARKET DYNAMICS 39
4.2.1 DRIVERS 40
4.2.1.1 Rising demand for high-bandwidth, low-latency interconnects in AI, HPC, and logic-memory systems 40
4.2.1.2 Increasing reliance on advanced hybrid bonding to power >200-layer 3D memory 40
4.2.1.3 Shift toward chiplet-based architectures to overcome reticle limits and reduce system power 41
4.2.1.4 Growing need for low-temperature bonding to support fragile materials, advanced BEOL stacks, and next-gen devices 42
4.2.2 RESTRAINTS 44
4.2.2.1 Substantial upfront capital investment 44
4.2.2.2 Stringent environment and surface quality requirements 44
4.2.3 OPPORTUNITIES 45
4.2.3.1 Rising need for ultra-dense logic-to-memory connectivity in AI/ML accelerators 45
4.2.3.2 Deployment of hybrid bonding in CIS and AR/VR sensors to improve SNR and pixel density 45
4.2.4 CHALLENGES 46
4.2.4.1 Issues in maintaining ultra-low defectivity across wafers 46
4.2.4.2 Lack of standardization in die formats, pad structures, and surface pre-treatment flows 47
4.3 UNMET NEEDS AND WHITE SPACES 48
4.4 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES 49
4.5 STRATEGIC MOVES BY TIER-1/2/3 PLAYERS 50
5 INDUSTRY TRENDS 51
5.1 PORTER’S FIVE FORCES ANALYSIS 51
5.1.1 INTENSITY OF COMPETITIVE RIVALRY 52
5.1.2 BARGAINING POWER OF SUPPLIERS 52
5.1.3 BARGAINING POWER OF BUYERS 52
5.1.4 THREAT OF SUBSTITUTES 52
5.1.5 THREAT OF NEW ENTRANTS 52
5.2 MACROECONOMIC OUTLOOK 53
5.2.1 INTRODUCTION 53
5.2.2 GDP TRENDS AND FORECAST 53
5.2.3 TRENDS IN GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT INDUSTRY 53
5.2.4 TRENDS IN GLOBAL SEMICONDUCTOR INSPECTION AND METROLOGY INDUSTRY 54
5.3 SUPPLY CHAIN ANALYSIS 54
5.4 ECOSYSTEM ANALYSIS 57
5.5 PRICING ANALYSIS 58
5.5.1 AVERAGE SELLING PRICE OF WAFER BONDERS, BY KEY PLAYER, 2024 58
5.5.2 AVERAGE SELLING PRICE OF WAFER BONDERS, BY REGION, 2024 59
5.6 TRADE ANALYSIS 59
5.6.1 IMPORT SCENARIO (HS CODE 848620) 60
5.6.2 EXPORT SCENARIO (HS CODE 848620) 61
5.7 KEY CONFERENCES AND EVENTS, 2025–2026 62
5.8 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS 63
5.9 INVESTMENT AND FUNDING SCENARIO 63
5.10 CASE STUDY ANALYSIS 64
5.10.1 IMEC PARTNERS WITH EV GROUP TO DEVELOP ADVANCED PROCESS FLOWS TO ACHIEVE FINE-PITCH INTERCONNECTS 64
5.10.2 SUSS MICROTEC INTRODUCES XBC300 GEN2 TO ENABLE WAFER-TO-WAFER AND DIE-TO-WAFER BONDING IN INNOVATION CENTERS AND SEMICONDUCTOR PILOT LINES 65
5.10.3 APPLIED MATERIALS AND BESI DELIVER INTEGRATED D2W HYBRID BONDING TO SUPPORT HIGH-VOLUME MANUFACTURING 65
5.11 IMPACT OF 2025 US TARIFF – HYBRID BONDING MARKET 65
5.11.1 INTRODUCTION 65
5.11.2 KEY TARIFF RATES 66
5.11.3 PRICE IMPACT ANALYSIS 66
5.11.4 IMPACT ON COUNTRIES/REGIONS 67
5.11.4.1 US 67
5.11.4.2 Europe 67
5.11.4.3 Asia Pacific 67
5.11.5 IMPACT ON VERTICALS 67
6 TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACTS, PATENTS, INNOVATIONS, AND FUTURE APPLICATIONS 69
6.1 KEY EMERGING TECHNOLOGIES 69
6.1.1 SUB-MICRON AND DIRECT CU-TO-CU HYBRID BONDING 69
6.1.2 LOW-TEMPERATURE HYBRID BONDING (<200°C) 69
6.2 COMPLEMENTARY TECHNOLOGIES 70
6.2.1 ADVANCED CMP 70
6.3 TECHNOLOGY/PRODUCT ROADMAP 70
6.4 PATENT ANALYSIS 72
6.5 IMPACT OF AI/GEN AI ON HYBRID BONDING MARKET 75
6.5.1 TOP USE CASES AND MARKET POTENTIAL 75
6.5.2 BEST PRACTICES FOLLOWED BY OEMS IN HYBRID BONDING MARKET 76
6.5.3 CASE STUDIES RELATED TO AI IMPLEMENTATION IN HYBRID BONDING MARKET 76
6.5.4 INTERCONNECTED ECOSYSTEM AND IMPACT ON MARKET PLAYERS 76
6.5.5 CLIENTS’ READINESS TO ADOPT AI-INTEGRATED HYBRID BONDING SOLUTIONS 77
7 REGULATORY LANDSCAPE AND SUSTAINABILITY INITIATIVES 78
7.1 REGIONAL REGULATIONS AND COMPLIANCE 78
7.1.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 78
7.1.2 INDUSTRY STANDARDS 80
7.2 SUSTAINABILITY INITIATIVES 80
7.3 IMPACT OF REGULATORY POLICIES ON SUSTAINABILITY INITIATIVES 81
7.4 CERTIFICATIONS, LABELING, AND ECO-STANDARDS 82
8 CUSTOMER LANDSCAPE AND BUYER BEHAVIOR 84
8.1 DECISION-MAKING PROCESS 84
8.2 KEY STAKEHOLDERS INVOLVED IN BUYING PROCESS AND THEIR EVALUATION CRITERIA 85
8.2.1 KEY STAKEHOLDERS IN BUYING PROCESS 85
8.2.2 BUYING CRITERIA 86
8.3 ADOPTION BARRIERS AND INTERNAL CHALLENGES 86
8.4 UNMET NEEDS OF VARIOUS VERTICALS 87
9 MATERIALS FOR HYBRID BONDING 89
9.1 INTRODUCTION 89
9.2 BONDING MATERIALS (OXIDE LAYERS, COPPER, AND METALLIZATION STACKS) 89
9.3 ADHESIVES AND TEMPORARY BONDING MATERIALS 90
9.4 CLEANING AND SURFACE PREPARATION MATERIALS 91
10 HYBRID BONDING MARKET, BY BONDING TYPE 93
10.1 INTRODUCTION 94
10.2 COPPER-TO-COPPER (CU-CU) 95
10.2.1 DEMAND FOR HIGH-PERFORMANCE INTERCONNECTS AT FINE PITCHES TO DRIVE MARKET 95
10.3 COPPER-TO-PAD/METAL-TO-PAD 95
10.3.1 NEED FOR PROCESS FLEXIBILITY AND COMPATIBILITY WITH DIVERSE METALLIZATION SCHEMES TO FUEL SEGMENTAL GROWTH 95
10.4 OTHER BONDING TYPES 96
11 HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE 97
11.1 INTRODUCTION 98
11.2 WAFER-TO-WAFER (W2W) 99
11.2.1 HIGH THROUGHPUT, PITCH SCALABILITY, AND COST EFFICIENCY FOR HOMOGENEOUS HIGH-VOLUME STACKS TO SPUR DEMAND 99
11.3 DIE-TO-WAFER (D2W) 100
11.3.1 YIELD OPTIMIZATION AND HETEROGENEOUS COMPONENT INTEGRATION TO BOLSTER SEGMENTAL GROWTH 100
11.4 DIE-TO-DIE (D2D) 101
11.4.1 FOCUS ON MODULARITY, LATENCY REDUCTION, AND POWER EFFICIENCY OF COMPUTE ARCHITECTURES TO BOOST SEGMENTAL GROWTH 101
12 HYBRID BONDING MARKET, BY INTEGRATION LEVEL 104
12.1 INTRODUCTION 105
12.2 2.5D PACKAGING 106
12.2.1 NEED FOR HIGH-BANDWIDTH INTERCONNECTS AND IMPROVED SIGNAL INTEGRITY IN LATERAL DIE CONFIGURATIONS TO DRIVE MARKET 106
12.3 3D STACKED ICS 106
12.3.1 RISING ADOPTION OF STACKED COMPUTE TILES IN HPC AND DATA CENTER PROCESSORS TO FOSTER SEGMENTAL GROWTH 106
12.4 HETEROGENEOUS INTEGRATION 107
12.4.1 SUPPORT FOR ADVANCED SURFACE ACTIVATION, HIGH-ACCURACY DIE PLACEMENT, WARPAGE CONTROL, AND LOW-TEMPERATURE BONDING TO SPUR DEMAND 107
13 HYBRID BONDING MARKET, BY PROCESS FLOW 108
13.1 INTRODUCTION 109
13.2 BACK-END 110
13.2.1 FOCUS ON CREATING DENSE, LOW-LATENCY INTERCONNECTS AT PACKAGING LEVEL TO ACCELERATE SEGMENTAL GROWTH 110
13.3 FRONT-END 110
13.3.1 NEED FOR HIGH INTERCONNECT PERFORMANCE AND INTEGRATION PRECISION TO AUGMENT SEGMENTAL GROWTH 110
14 HYBRID BONDING MARKET, BY EQUIPMENT TYPE 111
14.1 INTRODUCTION 112
14.2 WAFER BONDERS 113
14.2.1 NEED FOR SUB-MICRON ALIGNMENT, ULTRA-FLAT SURFACES, AND LOW-TEMPERATURE CU–CU DIFFUSION BONDING TO FUEL SEGMENTAL GROWTH 113
14.3 SURFACE PREPARATION TOOLS 114
14.3.1 ABILITY TO SUPPORT PLASMA ACTIVATION, ION-BEAM CLEANING, AND CHEMICAL SURFACE CONDITIONING TO CONTRIBUTE TO SEGMENTAL GROWTH 114
14.4 INSPECTION & METROLOGY TOOLS 114
14.4.1 SUB-MICRON OVERLAY MEASUREMENT, VOID DETECTION, AND POST-BOND VERIFICATION ATTRIBUTES TO FOSTER SEGMENTAL GROWTH 114
14.5 CLEANING & CMP SYSTEMS 115
14.5.1 ABILITY TO PROVIDE PLANARIZED COPPER/DIELECTRIC LAYERS AND CONTAMINANT-FREE SURFACES TO BOLSTER SEGMENTAL GROWTH 115
15 HYBRID BONDING MARKET, BY APPLICATION 116
15.1 INTRODUCTION 117
15.2 COMPUTING & LOGIC 118
15.2.1 HIGH-PERFORMANCE COMPUTING (HPC) & AI ACCELERATORS 120
15.2.1.1 Requirement for massive bandwidth scaling, fine-grained parallelism, and data locality optimization to drive market 120
15.2.2 HETEROGENEOUS SOCS & CHIPLET INTEGRATION 121
15.2.2.1 Extremely dense, short-reach links of chip architectures to contribute to segmental growth 121
15.3 MEMORY & STORAGE 122
15.3.1 HIGH-BANDWIDTH MEMORY (HBM) 123
15.3.1.1 Increasing demand for multi-terabit bandwidth between GPUs/AI accelerators and memory stacks to boost segmental growth 123
15.3.2 3D NAND & STACKED DRAM 124
15.3.2.1 Rising need for ultra-large vertical stacking and reduced interconnect delay in dense memory arrays to drive market 124
15.4 SENSING & INTERFACE 125
15.4.1 CMOS IMAGE SENSORS (CIS) 127
15.4.1.1 Requirement for higher frame rates and lower latency to accelerate segmental growth 127
15.4.2 MICRO-LED DISPLAYS 128
15.4.2.1 Ability to support fine-pitch interconnects for mass transfer, reduced defect density, and high optical efficiency to spur demand 128
15.4.3 MEMS & OTHER SENSORS 129
15.4.3.1 Requirement for low-profile, multi-functional sensing stacks to augment segmental growth 129
15.5 CONNECTIVITY & COMMUNICATIONS 130
15.5.1 RF FRONT-END MODULES (FEM) 132
15.5.1.1 Reliance on hybrid bonding to shorten RF signal paths and reduce insertion loss to contribute to segmental growth 132
15.5.2 PHOTONICS & OPTICAL INTERCONNECTS 133
15.5.2.1 Focus on reducing optical power requirements and improving signal fidelity to augment segmental growth 133
15.5.3 5G DEVICES 134
15.5.3.1 Support for compact integration of RF front-end modules, antenna arrays, and baseband processors at fine pitches to spur demand 134
15.6 OTHER APPLICATIONS 135
16 HYBRID BONDING MARKET, BY VERTICAL 137
16.1 INTRODUCTION 138
16.2 IT & TELECOMMUNICATIONS 139
16.2.1 EXPANSION OF CLOUD-NATIVE INFRASTRUCTURE AND HYPERSCALE INFRASTRUCTURE TO DRIVE MARKET 139
16.2.2 DATA CENTER 140
16.2.3 CLOUD COMPUTING 140
16.3 CONSUMER ELECTRONICS 141
16.3.1 PREFERENCE FOR COMPACT, POWER-EFFICIENT, AND FEATURE-DENSE DEVICES TO ACCELERATE SEGMENTAL GROWTH 141
16.3.2 SMARTPHONES 142
16.3.3 WEARABLES 142
16.4 AUTOMOTIVE 143
16.4.1 DEMAND FOR RELIABLE ELECTRONIC ARCHITECTURES TO SUPPORT AUTONOMOUS AND SOFTWARE-DEFINED VEHICLES TO FUEL SEGMENTAL GROWTH 143
16.4.2 ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) 143
16.4.3 INFOTAINMENT 144
16.5 AEROSPACE & DEFENSE 145
16.5.1 NEED FOR ROBUST, MINIATURIZED, AND HIGH-PERFORMANCE ELECTRONIC ARCHITECTURES TO BOLSTER SEGMENTAL GROWTH 145
16.6 HEALTHCARE & MEDICAL 146
16.6.1 FOCUS ON MINIATURIZATION, PRECISION, AND DATA THROUGHPUT TO AUGMENT SEGMENTAL GROWTH 146
16.7 INDUSTRIAL AUTOMATION 148
16.7.1 ADOPTION OF ADVANCED CONTROL SYSTEMS, REAL-TIME ANALYTICS, ROBOTICS, AND EDGE AI TO FOSTER SEGMENTAL GROWTH 148
16.8 OTHER VERTICALS 149
17 HYBRID BONDING MARKET, BY REGION 151
17.1 INTRODUCTION 152
17.2 ASIA PACIFIC 153
17.2.1 CHINA 159
17.2.1.1 High emphasis on advanced packaging capabilities to accelerate market growth 159
17.2.2 JAPAN 160
17.2.2.1 Strong focus on 3D integration and expertise in ultra-precision manufacturing to fuel market growth 160
17.2.3 INDIA 161
17.2.3.1 Increasing investment in semiconductor manufacturing and advanced packaging ecosystem to boost market growth 161
17.2.4 SOUTH KOREA 162
17.2.4.1 High commitment to expand memory manufacturing and hybrid bonding equipment supply to contribute to market growth 162
17.2.5 TAIWAN 163
17.2.5.1 Rise in foundries and advanced packaging facilities to expedite market growth 163
17.2.6 REST OF ASIA PACIFIC 163
17.3 NORTH AMERICA 164
17.3.1 US 170
17.3.1.1 Leadership in chiplet architectures, AI compute, and advanced packaging R&D to augment market growth 170
17.3.2 CANADA 171
17.3.2.1 Presence of specialized research institutions and photonic integration labs to contribute to market growth 171
17.3.3 MEXICO 171
17.3.3.1 Rising deployment of hybrid-bonded semiconductor components to bolster market growth 171
17.4 EUROPE 172
17.4.1 GERMANY 179
17.4.1.1 Transition toward autonomous driving and software-defined platforms to drive market 179
17.4.2 FRANCE 179
17.4.2.1 Presence of laboratories and advanced packaging pilot lines to foster market growth 179
17.4.3 UK 180
17.4.3.1 Demand for advanced packaging from aerospace, defense, and HPC research to fuel market growth 180
17.4.4 ITALY 180
17.4.4.1 Preference for fine interconnect pitches in electronic packages to accelerate market growth 180
17.4.5 SPAIN 181
17.4.5.1 Strong focus on IoT and smart infrastructure deployment to expedite market growth 181
17.4.6 POLAND 182
17.4.6.1 Expanding electronics manufacturing clusters and government-backed semiconductor initiatives to drive market 182
17.4.7 NORDICS 182
17.4.7.1 Emphasis on deep-tech research to accelerate market growth 182
17.4.8 REST OF EUROPE 183
17.5 ROW 183
17.5.1 MIDDLE EAST 189
17.5.1.1 Growing emphasis on high-tech R&D and defense electronics modernization to fuel market growth 189
17.5.2 AFRICA 191
17.5.2.1 Development of academic research programs and electronics testing laboratories to facilitate market growth 191
17.5.3 SOUTH AMERICA 193
17.5.3.1 Growing demand for high-end electronics, industrial IoT, and research-led semiconductor development to drive market 193
18 COMPETITIVE LANDSCAPE 196
18.1 OVERVIEW 196
18.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2021–2025 196
18.3 MARKET SHARE ANALYSIS, 2024 197
18.4 REVENUE ANALYSIS, 2020–2024 201
18.5 COMPANY VALUATION AND FINANCIAL METRICS 202
18.6 PRODUCT COMPARISON 203
18.6.1 APPLIED MATERIALS, INC. 203
18.6.2 SUSS MICROTEC SE 203
18.6.3 BESI 204
18.6.4 KULICKE AND SOFFA INDUSTRIES, INC. 204
18.6.5 EV GROUP (EVG) 204
18.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024 204
18.7.1 STARS 204
18.7.2 EMERGING LEADERS 204
18.7.3 PERVASIVE PLAYERS 204
18.7.4 PARTICIPANTS 205
18.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024 206
18.7.5.1 Company footprint 206
18.7.5.2 Region footprint 206
18.7.5.3 Application footprint 207
18.7.5.4 Packaging architecture footprint 208
18.7.5.5 Equipment type footprint 208
18.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024 209
18.8.1 PROGRESSIVE COMPANIES 209
18.8.2 RESPONSIVE COMPANIES 209
18.8.3 DYNAMIC COMPANIES 209
18.8.4 STARTING BLOCKS 209
18.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2024 211
18.8.5.1 Detailed list of key startups/SMEs 211
18.8.5.2 Competitive benchmarking of key startups/SMEs 211
18.9 COMPETITIVE SCENARIO 212
18.9.1 DEALS 214
19 COMPANY PROFILES 216
19.1 INTRODUCTION 216
19.2 KEY PLAYERS 216
19.2.1 APPLIED MATERIALS, INC. 216
19.2.1.1 Business overview 216
19.2.1.2 Products/Solutions/Services offered 217
19.2.1.3 Recent developments 218
19.2.1.3.1 Product launches 218
19.2.1.3.2 Deals 219
19.2.1.3.3 Expansions 219
19.2.1.4 MnM view 220
19.2.1.4.1 Key strengths/Right to win 220
19.2.1.4.2 Strategic choices 220
19.2.1.4.3 Weaknesses/Competitive threats 220
19.2.2 SUSS MICROTEC SE 221
19.2.2.1 Business overview 221
19.2.2.2 Products/Solutions/Services offered 222
19.2.2.3 Recent developments 223
19.2.2.3.1 Product Launches 223
19.2.2.3.2 Expansions 224
19.2.2.4 MnM view 224
19.2.2.4.1 Key strengths/Right to win 224
19.2.2.4.2 Strategic choices 224
19.2.2.4.3 Weaknesses/Competitive threats 224
19.2.3 BESI 225
19.2.3.1 Business overview 225
19.2.3.2 Products/Solutions/Services offered 226
19.2.3.3 MnM view 227
19.2.3.3.1 Key strengths/Right to win 227
19.2.3.3.2 Strategic choices 227
19.2.3.3.3 Weaknesses/Competitive threats 227
19.2.4 EV GROUP (EVG) 228
19.2.4.1 Business overview 228
19.2.4.2 Products/Solutions/Services offered 229
19.2.4.3 Recent developments 229
19.2.4.3.1 Product launches 229
19.2.4.3.2 Deals 230
19.2.4.3.3 Expansions 231
19.2.4.4 MnM view 231
19.2.4.4.1 Key strengths/Right to win 231
19.2.4.4.2 Strategic choices 231
19.2.4.4.3 Weaknesses/Competitive threats 231
19.2.5 KULICKE AND SOFFA INDUSTRIES, INC. 232
19.2.5.1 Business overview 232
19.2.5.2 Products/Solutions/Services offered 233
19.2.5.3 Recent developments 234
19.2.5.3.1 Deals 234
19.2.5.4 MnM view 234
19.2.5.4.1 Key strengths/Right to win 234
19.2.5.4.2 Strategic choices 234
19.2.5.4.3 Weaknesses/Competitive threats 235
19.2.6 TOKYO ELECTRON LIMITED 236
19.2.6.1 Business overview 236
19.2.6.2 Products/Solutions/Services offered 237
19.2.6.3 Recent developments 238
19.2.6.3.1 Product launches 238
19.2.6.3.2 Deals 238
19.2.6.3.3 Expansions 239
19.2.6.4 MnM view 239
19.2.6.4.1 Key strengths/Right to win 239
19.2.6.4.2 Strategic choices 239
19.2.6.4.3 Weaknesses/Competitive threats 239
19.2.7 LAM RESEARCH CORPORATION 240
19.2.7.1 Business overview 240
19.2.7.2 Products/Solutions/Services offered 241
19.2.7.3 Recent developments 241
19.2.7.3.1 Deals 241
19.2.7.4 MnM view 242
19.2.7.4.1 Key strengths/Right to win 242
19.2.7.4.2 Strategic choices 242
19.2.7.4.3 Weaknesses/Competitive threats 242
19.2.8 SHIBAURA MECHATRONICS CORPORATION 243
19.2.8.1 Business overview 243
19.2.8.2 Products/Solutions/Services offered 244
19.2.8.3 MnM view 245
19.2.8.3.1 Key strengths/Right to win 245
19.2.8.3.2 Strategic choices 245
19.2.8.3.3 Weaknesses/Competitive threats 245
19.2.9 ASMPT 246
19.2.9.1 Business overview 246
19.2.9.2 Products/Solutions/Services offered 247
19.2.9.3 Recent developments 248
19.2.9.3.1 Deals 248
19.2.9.4 MnM view 249
19.2.9.4.1 Key strengths/Right to win 249
19.2.9.4.2 Strategic choices 249
19.2.9.4.3 Weaknesses/Competitive threats 249
19.2.10 HANMI SEMICONDUCTOR 250
19.2.10.1 Business overview 250
19.2.10.2 Products/Solutions/Services offered 251
19.2.10.3 Recent developments 251
19.2.10.3.1 Developments 251
19.2.10.4 MnM view 252
19.2.10.4.1 Key strengths/Right to win 252
19.2.10.4.2 Strategic choices 252
19.2.10.4.3 Weaknesses/Competitive threats 252
19.3 OTHER PLAYERS 253
19.3.1 ONTO INNOVATION 253
19.3.2 DISCO CORPORATION 254
19.3.3 TORAY ENGINEERING CO.,LTD. 254
19.3.4 KLA CORPORATION 255
19.3.5 BEIJING U-PRECISION TECH CO., LTD 255
19.4 END USERS 256
19.4.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 256
19.4.2 SAMSUNG 257
19.4.3 SMIC 257
19.4.4 UNITED MICROELECTRONICS CORPORATION 258
19.4.5 GLOBALFOUNDRIES 258
19.4.6 INTEL CORPORATION 259
19.4.7 SK HYNIX INC. 259
19.4.8 MICRON TECHNOLOGY, INC. 260
19.4.9 TEXAS INSTRUMENTS INCORPORATED 260
19.4.10 AMKOR TECHNOLOGY 261
19.4.11 ASE TECHNOLOGY HOLDING CO., LTD. 261
19.4.12 JSCJ 262
19.4.13 SILICONWARE PRECISION INDUSTRIES CO., LTD. 263
19.4.14 POWERTECH TECHNOLOGY INC. 264
19.4.15 SONY SEMICONDUCTOR SOLUTIONS CORPORATION 265
20 RESEARCH METHODOLOGY 266
20.1 RESEARCH DATA 266
20.1.1 SECONDARY DATA 267
20.1.1.1 Key data from secondary sources 267
20.1.1.2 List of key secondary sources 268
20.1.2 PRIMARY DATA 268
20.1.2.1 Key data from primary sources 268
20.1.2.2 List of primary interview participants 269
20.1.2.3 Breakdown of primaries 270
20.1.2.4 Key industry insights 270
20.1.3 SECONDARY AND PRIMARY RESEARCH 271
20.2 MARKET SIZE ESTIMATION 271
20.2.1 BOTTOM-UP APPROACH 272
20.2.1.1 Approach to arrive at market size using bottom-up analysis (demand side) 272
20.2.2 TOP-DOWN APPROACH 273
20.2.2.1 Approach to arrive at market size using top-down analysis (supply side) 273
20.3 DATA TRIANGULATION 274
20.4 MARKET FORECAST APPROACH 275
20.4.1 SUPPLY SIDE 275
20.4.2 DEMAND SIDE 275
20.5 RESEARCH ASSUMPTIONS 276
20.6 RESEARCH LIMITATIONS 276
20.7 RISK ANALYSIS 277
21 APPENDIX 278
21.1 INSIGHTS FROM INDUSTRY EXPERTS 278
21.2 DISCUSSION GUIDE 279
21.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 282
21.4 CUSTOMIZATION OPTIONS 284
21.5 RELATED REPORTS 284
21.6 AUTHOR DETAILS 285
LIST OF TABLES
TABLE 1 HYBRID BONDING MARKET: INCLUSIONS AND EXCLUSIONS 29
TABLE 2 UNMET NEEDS AND WHITE SPACES 48
TABLE 3 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES 49
TABLE 4 MARKET DYNAMICS 50
TABLE 5 IMPACT OF PORTER’S FIVE FORCES 51
TABLE 6 ROLE OF COMPANIES IN HYBRID BONDING ECOSYSTEM 57
TABLE 7 AVERAGE SELLING PRICE OF WAFER BONDERS PROVIDED BY KEY PLAYERS,
2024 (USD MILLION) 58
TABLE 8 AVERAGE SELLING PRICE OF WAFER BONDERS, BY REGION, 2024 (USD MILLION) 59
TABLE 9 IMPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2020–2024 (USD MILLION) 60
TABLE 10 EXPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2020–2024 (USD MILLION) 61
TABLE 11 LIST OF KEY CONFERENCES AND EVENTS, 2025–2026 62
TABLE 12 US-ADJUSTED RECIPROCAL TARIFF RATES 66
TABLE 13 TECHNOLOGY/PRODUCT ROADMAP 70
TABLE 14 LIST OF MAJOR PATENTS, 2022−2024 73
TABLE 15 TOP USE CASES AND MARKET POTENTIAL 75
TABLE 16 BEST PRACTICES FOLLOWED BY OEMS 76
TABLE 17 CASE STUDIES RELATED TO AI IMPLEMENTATION 76
TABLE 18 INTERCONNECTED ECOSYSTEM AND IMPACT ON PLAYERS IN HYBRID BONDING MARKET 76
TABLE 19 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 78
TABLE 20 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 79
TABLE 21 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 79
TABLE 22 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 79
TABLE 23 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP
THREE VERTICALS (%) 85
TABLE 24 KEY BUYING CRITERIA FOR TOP THREE VERTICALS 86
TABLE 25 UNMET NEEDS IN HYBRID BONDING MARKET, BY VERTICAL 88
TABLE 26 HYBRID BONDING MARKET, BY BONDING TYPE, 2021–2024 (USD MILLION) 94
TABLE 27 HYBRID BONDING MARKET, BY BONDING TYPE, 2025–2032 (USD MILLION) 95
TABLE 28 HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE,
2021–2024 (USD MILLION) 98
TABLE 29 HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE,
2025–2032 (USD MILLION) 98
TABLE 30 WAFER-TO-WAFER (W2W): HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 99
TABLE 31 WAFER-TO-WAFER (W2W): HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 100
TABLE 32 DIE-TO-WAFER (D2W): HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 101
TABLE 33 DIE-TO-WAFER (D2W): HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 101
TABLE 34 DIE-TO-DIE (D2D): HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 102
TABLE 35 DIE-TO-DIE (D2D): HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 102
TABLE 36 HYBRID BONDING MARKET, BY INTEGRATION LEVEL, 2021–2024 (USD MILLION) 105
TABLE 37 HYBRID BONDING MARKET, BY INTEGRATION LEVEL, 2025–2032 (USD MILLION) 105
TABLE 38 HYBRID BONDING MARKET, BY PROCESS FLOW, 2021–2024 (USD MILLION) 109
TABLE 39 HYBRID BONDING MARKET, BY PROCESS FLOW, 2025–2032 (USD MILLION) 109
TABLE 40 HYBRID BONDING MARKET, BY EQUIPMENT TYPE, 2021–2024 (USD MILLION) 112
TABLE 41 HYBRID BONDING MARKET, BY EQUIPMENT TYPE, 2025–2032 (USD MILLION) 113
TABLE 42 HYBRID BONDING MARKET, BY APPLICATION, 2021–2024 (USD MILLION) 117
TABLE 43 HYBRID BONDING MARKET, BY APPLICATION, 2025–2032 (USD MILLION) 118
TABLE 44 COMPUTING & LOGIC: HYBRID BONDING MARKET, BY TYPE,
2021–2024 (USD MILLION) 118
TABLE 45 COMPUTING & LOGIC: HYBRID BONDING MARKET, BY TYPE,
2025–2032 (USD MILLION) 119
TABLE 46 COMPUTING & LOGIC: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 119
TABLE 47 COMPUTING & LOGIC: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 119
TABLE 48 HIGH-PERFORMANCE COMPUTING & AI ACCELERATORS: HYBRID BONDING MARKET, BY REGION, 2021–2024 (USD MILLION) 120
TABLE 49 HIGH-PERFORMANCE COMPUTING & AI ACCELERATORS: HYBRID BONDING MARKET, BY REGION, 2025–2032 (USD MILLION) 120
TABLE 50 HETEROGENEOUS SOCS & CHIPLET INTEGRATION: HYBRID BONDING MARKET,
BY REGION, 2021–2024 (USD MILLION) 121
TABLE 51 HETEROGENEOUS SOCS & CHIPLET INTEGRATION: HYBRID BONDING MARKET,
BY REGION, 2025–2032 (USD MILLION) 122
TABLE 52 MEMORY & STORAGE: HYBRID BONDING MARKET, BY TYPE,
2021–2024 (USD MILLION) 122
TABLE 53 MEMORY & STORAGE: HYBRID BONDING MARKET, BY TYPE,
2025–2032 (USD MILLION) 122
TABLE 54 MEMORY & STORAGE: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 123
TABLE 55 MEMORY & STORAGE: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 123
TABLE 56 HIGH-BANDWIDTH MEMORY (HBM): HYBRID BONDING MARKET, BY REGION, 2021–2024 (USD MILLION) 124
TABLE 57 HIGH-BANDWIDTH MEMORY (HBM): HYBRID BONDING MARKET, BY REGION, 2025–2032 (USD MILLION) 124
TABLE 58 3D NAND & STACKED DRAM: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 125
TABLE 59 3D NAND & STACKED DRAM: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 125
TABLE 60 SENSING & INTERFACE: HYBRID BONDING MARKET, BY TYPE,
2021–2024 (USD MILLION) 126
TABLE 61 SENSING & INTERFACE: HYBRID BONDING MARKET, BY TYPE,
2025–2032 (USD MILLION) 126
TABLE 62 SENSING & INTERFACE: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 126
TABLE 63 SENSING & INTERFACE: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 127
TABLE 64 CMOS IMAGE SENSORS (CIS): HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 128
TABLE 65 CMOS IMAGE SENSORS (CIS): HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 128
TABLE 66 MICRO-LED DISPLAYS: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 129
TABLE 67 MICRO-LED DISPLAYS: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 129
TABLE 68 MEMS & OTHER SENSORS: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 130
TABLE 69 MEMS & OTHER SENSORS: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 130
TABLE 70 CONNECTIVITY & COMMUNICATION: HYBRID BONDING MARKET, BY TYPE,
2021–2024 (USD MILLION) 131
TABLE 71 CONNECTIVITY & COMMUNICATION: HYBRID BONDING MARKET, BY TYPE,
2025–2032 (USD MILLION) 131
TABLE 72 CONNECTIVITY & COMMUNICATION: HYBRID BONDING MARKET, BY REGION, 2021–2024 (USD MILLION) 131
TABLE 73 CONNECTIVITY & COMMUNICATION: HYBRID BONDING MARKET, BY REGION, 2025–2032 (USD MILLION) 132
TABLE 74 RF FRONT-END MODULES (FEM): HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 132
TABLE 75 RF FRONT-END MODULES (FEM): HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 133
TABLE 76 PHOTONICS & OPTICAL INTERCONNECTS: HYBRID BONDING MARKET, BY REGION, 2021–2024 (USD MILLION) 133
TABLE 77 PHOTONICS & OPTICAL INTERCONNECTS: HYBRID BONDING MARKET, BY REGION, 2025–2032 (USD MILLION) 134
TABLE 78 5G DEVICES: HYBRID BONDING MARKET, BY REGION, 2021–2024 (USD MILLION) 134
TABLE 79 5G DEVICES: HYBRID BONDING MARKET, BY REGION, 2025–2032 (USD MILLION) 135
TABLE 80 OTHER APPLICATIONS: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 135
TABLE 81 OTHER APPLICATIONS: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 136
TABLE 82 HYBRID BONDING MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 138
TABLE 83 HYBRID BONDING MARKET, BY VERTICAL, 2025–2032 (USD MILLION) 139
TABLE 84 IT & TELECOMMUNICATIONS: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 141
TABLE 85 IT & TELECOMMUNICATIONS: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 141
TABLE 86 CONSUMER ELECTRONICS: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 142
TABLE 87 CONSUMER ELECTRONICS: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 143
TABLE 88 AUTOMOTIVE: HYBRID BONDING MARKET, BY REGION, 2021–2024 (USD MILLION) 144
TABLE 89 AUTOMOTIVE: HYBRID BONDING MARKET, BY REGION, 2025–2032 (USD MILLION) 145
TABLE 90 AEROSPACE & DEFENSE: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 146
TABLE 91 AEROSPACE & DEFENSE: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 146
TABLE 92 HEALTHCARE & MEDICAL: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 147
TABLE 93 HEALTHCARE & MEDICAL: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 147
TABLE 94 INDUSTRIAL AUTOMATION: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 148
TABLE 95 INDUSTRIAL AUTOMATION: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 149
TABLE 96 OTHER VERTICALS: HYBRID BONDING MARKET, BY REGION,
2021–2024 (USD MILLION) 149
TABLE 97 OTHER VERTICALS: HYBRID BONDING MARKET, BY REGION,
2025–2032 (USD MILLION) 150
TABLE 98 HYBRID BONDING MARKET, BY REGION, 2021–2024 (USD MILLION) 152
TABLE 99 HYBRID BONDING MARKET, BY REGION, 2025–2032 (USD MILLION) 152
TABLE 100 ASIA PACIFIC: HYBRID BONDING MARKET, BY COUNTRY,
2021–2024 (USD MILLION) 154
TABLE 101 ASIA PACIFIC: HYBRID BONDING MARKET, BY COUNTRY,
2025–2032 (USD MILLION) 155
TABLE 102 ASIA PACIFIC: HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE,
2021–2024 (USD MILLION) 155
TABLE 103 ASIA PACIFIC: HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE,
2025–2032 (USD MILLION) 155
TABLE 104 ASIA PACIFIC: HYBRID BONDING MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 156
TABLE 105 ASIA PACIFIC: HYBRID BONDING MARKET, BY APPLICATION,
2025–2032 (USD MILLION) 156
TABLE 106 ASIA PACIFIC: HYBRID BONDING MARKET FOR COMPUTING & LOGIC, BY TYPE, 2021–2024 (USD MILLION) 156
TABLE 107 ASIA PACIFIC: HYBRID BONDING MARKET FOR COMPUTING & LOGIC, BY TYPE, 2025–2032 (USD MILLION) 157
TABLE 108 ASIA PACIFIC: HYBRID BONDING MARKET FOR MEMORY & STORAGE, BY TYPE, 2021–2024 (USD MILLION) 157
TABLE 109 ASIA PACIFIC: HYBRID BONDING MARKET FOR MEMORY & STORAGE, BY TYPE, 2025–2032 (USD MILLION) 157
TABLE 110 ASIA PACIFIC: HYBRID BONDING MARKET FOR SENSING & INTERFACE, BY TYPE, 2021–2024 (USD MILLION) 157
TABLE 111 ASIA PACIFIC: HYBRID BONDING MARKET FOR SENSING & INTERFACE, BY TYPE, 2025–2032 (USD MILLION) 158
TABLE 112 ASIA PACIFIC: HYBRID BONDING MARKET FOR CONNECTIVITY & COMMUNICATIONS, BY TYPE, 2021–2024 (USD MILLION) 158
TABLE 113 ASIA PACIFIC: HYBRID BONDING MARKET FOR CONNECTIVITY & COMMUNICATIONS, BY TYPE, 2025–2032 (USD MILLION) 158
TABLE 114 ASIA PACIFIC: HYBRID BONDING MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 159
TABLE 115 ASIA PACIFIC: HYBRID BONDING MARKET, BY VERTICAL,
2025–2032 (USD MILLION) 159
TABLE 116 NORTH AMERICA: HYBRID BONDING MARKET, BY COUNTRY,
2021–2024 (USD MILLION) 165
TABLE 117 NORTH AMERICA: HYBRID BONDING MARKET, BY COUNTRY,
2025–2032 (USD MILLION) 165
TABLE 118 NORTH AMERICA: HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE, 2021–2024 (USD MILLION) 165
TABLE 119 NORTH AMERICA: HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE, 2025–2032 (USD MILLION) 166
TABLE 120 NORTH AMERICA: HYBRID BONDING MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 166
TABLE 121 NORTH AMERICA: HYBRID BONDING MARKET, BY APPLICATION,
2025–2032 (USD MILLION) 166
TABLE 122 NORTH AMERICA: HYBRID BONDING MARKET FOR COMPUTING & LOGIC, BY TYPE, 2021–2024 (USD MILLION) 167
TABLE 123 NORTH AMERICA: HYBRID BONDING MARKET FOR COMPUTING & LOGIC, BY TYPE, 2025–2032 (USD MILLION) 167
TABLE 124 NORTH AMERICA: HYBRID BONDING MARKET FOR MEMORY & STORAGE, BY TYPE, 2021–2024 (USD MILLION) 167
TABLE 125 NORTH AMERICA: HYBRID BONDING MARKET FOR MEMORY & STORAGE, BY TYPE, 2025–2032 (USD MILLION) 168
TABLE 126 NORTH AMERICA: HYBRID BONDING MARKET FOR SENSING & INTERFACE,
BY TYPE, 2021–2024 (USD MILLION) 168
TABLE 127 NORTH AMERICA: HYBRID BONDING MARKET FOR SENSING & INTERFACE,
BY TYPE, 2025–2032 (USD MILLION) 168
TABLE 128 NORTH AMERICA: HYBRID BONDING MARKET FOR CONNECTIVITY & COMMUNICATIONS, BY TYPE, 2021–2024 (USD MILLION) 169
TABLE 129 NORTH AMERICA: HYBRID BONDING MARKET FOR CONNECTIVITY & COMMUNICATIONS, BY TYPE, 2025–2032 (USD MILLION) 169
TABLE 130 NORTH AMERICA: HYBRID BONDING MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 169
TABLE 131 NORTH AMERICA: HYBRID BONDING MARKET, BY VERTICAL,
2025–2032 (USD MILLION) 170
TABLE 132 EUROPE: HYBRID BONDING MARKET, BY COUNTRY, 2021–2024 (USD MILLION) 173
TABLE 133 EUROPE: HYBRID BONDING MARKET, BY COUNTRY, 2025–2032 (USD MILLION) 174
TABLE 134 EUROPE: HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE,
2021–2024 (USD MILLION) 174
TABLE 135 EUROPE: HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE,
2025–2032 (USD MILLION) 174
TABLE 136 EUROPE: HYBRID BONDING MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 175
TABLE 137 EUROPE: HYBRID BONDING MARKET, BY APPLICATION,
2025–2032 (USD MILLION) 175
TABLE 138 EUROPE: HYBRID BONDING MARKET FOR COMPUTING & LOGIC, BY TYPE,
2021–2024 (USD MILLION) 175
TABLE 139 EUROPE: HYBRID BONDING MARKET FOR COMPUTING & LOGIC, BY TYPE,
2025–2032 (USD MILLION) 176
TABLE 140 EUROPE: HYBRID BONDING MARKET FOR MEMORY & STORAGE, BY TYPE,
2021–2024 (USD MILLION) 176
TABLE 141 EUROPE: HYBRID BONDING MARKET FOR MEMORY & STORAGE, BY TYPE,
2025–2032 (USD MILLION) 176
TABLE 142 EUROPE: HYBRID BONDING MARKET FOR SENSING & INTERFACE, BY TYPE,
2021–2024 (USD MILLION) 177
TABLE 143 EUROPE: HYBRID BONDING MARKET FOR SENSING & INTERFACE, BY TYPE,
2025–2032 (USD MILLION) 177
TABLE 144 EUROPE: HYBRID BONDING MARKET FOR CONNECTIVITY & COMMUNICATIONS,
BY TYPE, 2021–2024 (USD MILLION) 177
TABLE 145 EUROPE: HYBRID BONDING MARKET FOR CONNECTIVITY & COMMUNICATIONS,
BY TYPE, 2025–2032 (USD MILLION) 178
TABLE 146 EUROPE: HYBRID BONDING MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 178
TABLE 147 EUROPE: HYBRID BONDING MARKET, BY VERTICAL, 2025–2032 (USD MILLION) 178
TABLE 148 ROW: HYBRID BONDING MARKET, BY REGION, 2021–2024 (USD MILLION) 184
TABLE 149 ROW: HYBRID BONDING MARKET, BY REGION, 2025–2032 (USD MILLION) 185
TABLE 150 ROW: HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE,
2021–2024 (USD MILLION) 185
TABLE 151 ROW: HYBRID BONDING MARKET, BY PACKAGING ARCHITECTURE,
2025–2032 (USD MILLION) 185
TABLE 152 ROW: HYBRID BONDING MARKET, BY APPLICATION, 2021–2024 (USD MILLION) 186
TABLE 153 ROW: HYBRID BONDING MARKET, BY APPLICATION, 2025–2032 (USD MILLION) 186
TABLE 154 ROW: HYBRID BONDING MARKET FOR COMPUTING & LOGIC, BY TYPE,
2021–2024 (USD MILLION) 186
TABLE 155 ROW: HYBRID BONDING MARKET FOR COMPUTING & LOGIC, BY TYPE,
2025–2032 (USD MILLION) 187
TABLE 156 ROW: HYBRID BONDING MARKET FOR MEMORY & STORAGE, BY TYPE,
2021–2024 (USD MILLION) 187
TABLE 157 ROW: HYBRID BONDING MARKET FOR MEMORY & STORAGE, BY TYPE,
2025–2032 (USD MILLION) 187
TABLE 158 ROW: HYBRID BONDING MARKET FOR SENSING & INTERFACE, BY TYPE,
2021–2024 (USD MILLION) 187
TABLE 159 ROW: HYBRID BONDING MARKET FOR SENSING & INTERFACE, BY TYPE,
2025–2032 (USD MILLION) 188
TABLE 160 ROW: HYBRID BONDING MARKET FOR CONNECTIVITY & COMMUNICATIONS,
BY TYPE, 2021–2024 (USD MILLION) 188
TABLE 161 ROW: HYBRID BONDING MARKET FOR CONNECTIVITY & COMMUNICATIONS,
BY TYPE, 2025–2032 (USD MILLION) 188
TABLE 162 ROW: HYBRID BONDING MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 189
TABLE 163 ROW: HYBRID BONDING MARKET, BY VERTICAL, 2025–2032 (USD MILLION) 189
TABLE 164 MIDDLE EAST: HYBRID BONDING MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 190
TABLE 165 MIDDLE EAST: HYBRID BONDING MARKET, BY APPLICATION,
2025–2032 (USD MILLION) 190
TABLE 166 MIDDLE EAST: HYBRID BONDING MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 191
TABLE 167 MIDDLE EAST: HYBRID BONDING MARKET, BY VERTICAL,
2025–2032 (USD MILLION) 191
TABLE 168 AFRICA: HYBRID BONDING MARKET, BY APPLICATION, 2021–2024 (USD MILLION) 192
TABLE 169 AFRICA: HYBRID BONDING MARKET, BY APPLICATION, 2025–2032 (USD MILLION) 192
TABLE 170 AFRICA: HYBRID BONDING MARKET, BY VERTICAL, 2021–2024 (USD MILLION) 193
TABLE 171 AFRICA: HYBRID BONDING MARKET, BY VERTICAL, 2025–2032 (USD MILLION) 193
TABLE 172 SOUTH AMERICA: HYBRID BONDING MARKET, BY APPLICATION,
2021–2024 (USD MILLION) 194
TABLE 173 SOUTH AMERICA: HYBRID BONDING MARKET, BY APPLICATION,
2025–2032 (USD MILLION) 194
TABLE 174 SOUTH AMERICA: HYBRID BONDING MARKET, BY VERTICAL,
2021–2024 (USD MILLION) 195
TABLE 175 SOUTH AMERICA: HYBRID BONDING MARKET, BY VERTICAL,
2025–2032 (USD MILLION) 195
TABLE 176 HYBRID BONDING MARKET: OVERVIEW OF STRATEGIES ADOPTED
BY KEY PLAYERS, JANUARY 2021–OCTOBER 2025 196
TABLE 177 HYBRID BONDING MARKET: DEGREE OF COMPETITION, 2024 198
TABLE 178 HYBRID BONDING MARKET: REGION FOOTPRINT 206
TABLE 179 HYBRID BONDING MARKET: APPLICATION FOOTPRINT 207
TABLE 180 HYBRID BONDING MARKET: PACKAGING ARCHITECTURE FOOTPRINT 208
TABLE 181 HYBRID BONDING MARKET: EQUIPMENT TYPE FOOTPRINT 208
TABLE 182 HYBRID BONDING MARKET: DETAILED LIST OF KEY STARTUPS/SMES 211
TABLE 183 HYBRID BONDING MARKET: COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES 211
TABLE 184 HYBRID BONDING MARKET: PRODUCT LAUNCHES,
JANUARY 2021–OCTOBER 2025 212
TABLE 185 HYBRID BONDING MARKET: DEALS, JANUARY 2021–OCTOBER 2025 214
TABLE 186 APPLIED MATERIALS, INC.: COMPANY OVERVIEW 216
TABLE 187 APPLIED MATERIALS, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 217
TABLE 188 APPLIED MATERIALS, INC.: PRODUCT LAUNCHES 218
TABLE 189 APPLIED MATERIALS, INC.: DEALS 219
TABLE 190 APPLIED MATERIALS, INC.: EXPANSIONS 219
TABLE 191 SUSS MICROTEC SE: COMPANY OVERVIEW 221
TABLE 192 SUSS MICROTEC SE: PRODUCTS/SOLUTIONS/SERVICES OFFERED 222
TABLE 193 SUSS MICROTEC SE: PRODUCT LAUNCHES 223
TABLE 194 SUSS MICROTEC SE: EXPANSIONS 224
TABLE 195 BESI: COMPANY OVERVIEW 225
TABLE 196 BESI: PRODUCTS/SOLUTIONS/SERVICES OFFERED 226
TABLE 197 EV GROUP (EVG): COMPANY OVERVIEW 228
TABLE 198 EV GROUP (EVG): PRODUCTS/SOLUTIONS/SERVICES OFFERED 229
TABLE 199 EV GROUP (EVG): PRODUCT LAUNCHES 229
TABLE 200 EV GROUP (EVG): DEALS 230
TABLE 201 EV GROUP (EVG): EXPANSIONS 231
TABLE 202 KULICKE AND SOFFA INDUSTRIES, INC.: COMPANY OVERVIEW 232
TABLE 203 KULICKE AND SOFFA INDUSTRIES, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 233
TABLE 204 KULICKE AND SOFFA INDUSTRIES, INC.: DEALS 234
TABLE 205 TOKYO ELECTRON LIMITED: COMPANY OVERVIEW 236
TABLE 206 TOKYO ELECTRON LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 237
TABLE 207 TOKYO ELECTRON LIMITED: PRODUCT LAUNCHES 238
TABLE 208 TOKYO ELECTRON LIMITED: DEALS 238
TABLE 209 TOKYO ELECTRON LIMITED: EXPANSIONS 239
TABLE 210 LAM RESEARCH CORPORATION: COMPANY OVERVIEW 240
TABLE 211 LAM RESEARCH CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 241
TABLE 212 LAM RESEARCH CORPORATION: DEALS 241
TABLE 213 SHIBAURA MECHATRONICS CORPORATION: COMPANY OVERVIEW 243
TABLE 214 SHIBAURA MECHATRONICS CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 244
TABLE 215 ASMPT: COMPANY OVERVIEW 246
TABLE 216 ASMPT: PRODUCTS/SOLUTIONS/SERVICES OFFERED 247
TABLE 217 ASMPT: DEALS 248
TABLE 218 HANMI SEMICONDUCTOR: COMPANY OVERVIEW 250
TABLE 219 HANMI SEMICONDUCTOR: PRODUCTS/SOLUTIONS/SERVICES OFFERED 251
TABLE 220 HANMI SEMICONDUCTOR: DEVELOPMENTS 251
TABLE 221 ONTO INNOVATION: COMPANY OVERVIEW 253
TABLE 222 DISCO CORPORATION: COMPANY OVERVIEW 254
TABLE 223 TORAY ENGINEERING CO.,LTD: COMPANY OVERVIEW 254
TABLE 224 KLA CORPORATION: COMPANY OVERVIEW 255
TABLE 225 BEIJING U-PRECISION TECH CO., LTD: COMPANY OVERVIEW 255
TABLE 226 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW 256
TABLE 227 SAMSUNG: COMPANY OVERVIEW 257
TABLE 228 SMIC: COMPANY OVERVIEW 257
TABLE 229 UNITED MICROELECTRONICS CORPORATION: COMPANY OVERVIEW 258
TABLE 230 GLOBALFOUNDRIES: COMPANY OVERVIEW 258
TABLE 231 INTEL CORPORATION: COMPANY OVERVIEW 259
TABLE 232 SK HYNIX INC.: COMPANY OVERVIEW 259
TABLE 233 MICRON TECHNOLOGY, INC.: COMPANY OVERVIEW 260
TABLE 234 TEXAS INSTRUMENTS INCORPORATED: COMPANY OVERVIEW 260
TABLE 235 AMKOR TECHNOLOGY: COMPANY OVERVIEW 261
TABLE 236 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW 261
TABLE 237 JSCJ: COMPANY OVERVIEW 262
TABLE 238 SILICONWARE PRECISION INDUSTRIES CO., LTD.: COMPANY OVERVIEW 263
TABLE 239 POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW 264
TABLE 240 SONY SEMICONDUCTOR SOLUTIONS CORPORATION: COMPANY OVERVIEW 265
TABLE 241 MAJOR SECONDARY SOURCES 268
TABLE 242 DATA CAPTURED FROM PRIMARY SOURCES 268
TABLE 243 PRIMARY INTERVIEW PARTICIPANTS 269
TABLE 244 HYBRID BONDING MARKET: RISK ANALYSIS 277
LIST OF FIGURES
FIGURE 1 HYBRID BONDING MARKET SEGMENTATION AND REGIONAL SCOPE 28
FIGURE 2 HYBRID BONDING MARKET: DURATION CONSIDERED 29
FIGURE 3 MARKET SCENARIO 32
FIGURE 4 GLOBAL HYBRID BONDING MARKET, 2021–2032 32
FIGURE 5 MAJOR STRATEGIES ADOPTED BY KEY PLAYERS IN HYBRID BONDING MARKET, 2021–2025 33
FIGURE 6 DISRUPTIONS INFLUENCING GROWTH OF HYBRID BONDING MARKET 33
FIGURE 7 HIGH-GROWTH SEGMENTS IN HYBRID BONDING MARKET, 2025–2030 34
FIGURE 8 ASIA PACIFIC TO REGISTER HIGHEST CAGR IN HYBRID BONDING MARKET, IN TERMS OF VALUE, DURING FORECAST PERIOD 35
FIGURE 9 GROWING FOCUS ON MEETING AI, HOC, AND NEXT-GEN MEMORY REQUIREMENTS TO DRIVE HYBRID BONDING MARKET 36
FIGURE 10 DIE-TO-WAFER (D2W) TO HOLD LARGEST MARKET SHARE IN 2032 36
FIGURE 11 BACK-END SEGMENT TO DOMINATE HYBRID BONDING MARKET DURING FORECAST PERIOD 37
FIGURE 12 MEMORY & STORAGE SEGMENT TO HOLD LARGEST MARKET SHARE IN 2025 37
FIGURE 13 AUTOMOTIVE TO GROW AT HIGHEST RATE DURING FORECAST PERIOD 38
FIGURE 14 ASIA PACIFIC TO DOMINATE HYBRID BONDING MARKET FROM 2025 TO 2032 38
FIGURE 15 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES 39
FIGURE 16 IMPACT ANALYSIS: DRIVERS 43
FIGURE 17 IMPACT ANALYSIS: RESTRAINTS 45
FIGURE 18 IMPACT ANALYSIS: OPPORTUNITIES 46
FIGURE 19 IMPACT ANALYSIS: CHALLENGES 47
FIGURE 20 PORTER’S FIVE FORCES ANALYSIS 51
FIGURE 21 SUPPLY CHAIN ANALYSIS 55
FIGURE 22 HYBRID BONDING ECOSYSTEM 57
FIGURE 23 AVERAGE SELLING PRICE OF WAFER BONDERS OFFERED BY KEY PLAYERS, 2024 58
FIGURE 24 IMPORT SCENARIO FOR HS CODE 848620-COMPLIANT PRODUCTS IN TOP FIVE COUNTRIES, 2020–2024 60
FIGURE 25 EXPORT SCENARIO FOR HS CODE 848620-COMPLIANT PRODUCTS IN TOP FIVE COUNTRIES, 2020–2024 61
FIGURE 26 TRENDS/DISRUPTIONS INFLUENCING CUSTOMER BUSINESS 63
FIGURE 27 INVESTMENT AND FUNDING SCENARIO, 2019–2025 64
FIGURE 28 PATENT ANALYSIS, 2015–2024 72
FIGURE 29 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE VERTICALS 85
FIGURE 30 KEY BUYING CRITERIA FOR TOP THREE VERTICALS 86
FIGURE 31 ADOPTION BARRIERS AND INTERNAL CHALLENGES 87
FIGURE 32 COPPER-TO-COPPER (CU-CU) SEGMENT TO EXHIBIT HIGHEST
CAGR FROM 2025 TO 2032 94
FIGURE 33 DIE-TO-DIE (D2D) SEGMENT TO RECORD HIGHEST CAGR FROM 2025 TO 2032 98
FIGURE 34 HETEROGENEOUS INTEGRATION SEGMENT TO REGISTER HIGHEST CAGR BETWEEN 2025 AND 2032 105
FIGURE 35 BACK-END SEGMENT TO DOMINATE MARKET DURING FORECAST PERIOD 109
FIGURE 36 WAFER BONDERS SEGMENT TO HOLD LARGEST MARKET SHARE
IN 2025 AND 2032 112
FIGURE 37 COMPUTING & LOGIC SEGMENT TO DOMINATE HYBRID BONDING MARKET DURING FORECAST PERIOD 117
FIGURE 38 AUTOMOTIVE SEGMENT TO EXHIBIT HIGHEST CAGR FROM 2025 TO 2032 138
FIGURE 39 ASIA PACIFIC TO RECORD HIGHEST CAGR IN HYBRID BONDING MARKET DURING FORECAST PERIOD 152
FIGURE 40 ASIA PACIFIC: HYBRID BONDING MARKET SNAPSHOT 154
FIGURE 41 NORTH AMERICA: HYBRID BONDING MARKET SNAPSHOT 164
FIGURE 42 EUROPE: HYBRID BONDING MARKET SNAPSHOT 173
FIGURE 43 ROW: HYBRID BONDING MARKET SNAPSHOT 184
FIGURE 44 MARKET SHARE OF COMPANIES OFFERING HYBRID BONDING EQUIPMENT, 2024 198
FIGURE 45 HYBRID BONDING MARKET: REVENUE ANALYSIS OF TOP FOUR
PLAYERS, 2020–2024 201
FIGURE 46 COMPANY VALUATION 202
FIGURE 47 FINANCIAL METRICS (EV/EBITDA) 202
FIGURE 48 PRODUCT COMPARISON 203
FIGURE 49 HYBRID BONDING MARKET: COMPANY EVALUATION MATRIX (KEY PLAYERS), 2024 205
FIGURE 50 HYBRID BONDING MARKET: COMPANY FOOTPRINT 206
FIGURE 51 HYBRID BONDING MARKET: COMPANY EVALUATION MATRIX
(STARTUPS/SMES), 2024 210
FIGURE 52 APPLIED MATERIALS, INC.: COMPANY SNAPSHOT 217
FIGURE 53 SUSS MICROTEC SE: COMPANY SNAPSHOT 222
FIGURE 54 BESI: COMPANY SNAPSHOT 226
FIGURE 55 KULICKE AND SOFFA INDUSTRIES, INC.: COMPANY SNAPSHOT 233
FIGURE 56 TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT 237
FIGURE 57 LAM RESEARCH CORPORATION: COMPANY SNAPSHOT 240
FIGURE 58 SHIBAURA MECHATRONICS CORPORATION: COMPANY SNAPSHOT 244
FIGURE 59 ASMPT: COMPANY SNAPSHOT 247
FIGURE 60 HANMI SEMICONDUCTOR: COMPANY SNAPSHOT 250
FIGURE 61 HYBRID BONDING MARKET: RESEARCH DESIGN 266
FIGURE 62 DATA CAPTURED FROM SECONDARY SOURCES 267
FIGURE 63 BREAKDOWN OF PRIMARY INTERVIEWS, BY COMPANY TYPE, DESIGNATION, AND REGION 270
FIGURE 64 CORE FINDINGS FROM INDUSTRY EXPERTS 270
FIGURE 65 HYBRID BONDING MARKET: RESEARCH APPROACH 271
FIGURE 66 HYBRID BONDING MARKET SIZE ESTIMATION (SUPPLY SIDE) 272
FIGURE 67 HYBRID BONDING MARKET: BOTTOM-UP APPROACH 273
FIGURE 68 HYBRID BONDING MARKET: TOP-DOWN APPROACH 273
FIGURE 69 HYBRID BONDING MARKET: DATA TRIANGULATION 274
FIGURE 70 HYBRID BONDING MARKET: RESEARCH ASSUMPTIONS 276
FIGURE 71 HYBRID BONDING MARKET: RESEARCH LIMITATIONS 276
FIGURE 72 HYBRID BONDING MARKET: INSIGHTS FROM INDUSTRY EXPERTS 278
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