高密度相互接続 PCB 市場調査レポート : 2032年までの予測

Report Overview

High Density Interconnect PCB Market Research Report – Forecast till 2032

Market Overview
High-Density Interconnect PCB Market is projected to exhibit a significant CAGR of 17.3% during the review period 2023 – 2032. HDI is a truncation for High Density Interconnector, which is a circuit board with a moderately high line circulation density that utilizes miniature visually impaired and covered opening innovation. It is vital in improving electrical execution and bringing down the weight and size of hardware. HDI PCB plans push the limits of innovation, and key market organizations are at the very front of the development, meeting the most tough particulars. The interest for HDI PCB fabricating has been growing because of innovative leap forwards and the various benefits HDI PCBs accommodate high-tech applications. Squeezing more innovation into less space with less layers limits numerous PCB makers who need particular gear and the capacity for cutting edge highlights, better lines, and tighter resiliences. HDI printed circuit board plans utilize complex elements, for example, miniature vias, blind vias, through in-cushion, and stacked and staggered vias to expand board region while upgrading execution and convenience.
Market Segment Insights
By Interconnection Layers, the High Density Interconnect (HDI) PCB market has been categorized as 1 Layer (1+N+1) HDI, 2 or more layers (2+N+2) HDI, and All Layers HDI. During the projected period, the demand for All Layers HDI segment is expected to grow rapidly.
Based on Application, the High Density Interconnect (HDI) PCB market has been segmented into Consumer Electronics, Automotive, Military and Defense, Healthcare, Industrial/ Manufacturing, and Others. During the projected period, the automotive segment is expected to rise rapidly.
Regional Insights

Asia Pacific is expected to have a significant share of the High Density Interconnect PCB Market during the projected period.
The rising utilization of printed circuit sheets in the hardware, aviation, IT, and telecom, modern, and auto businesses is driving business sector extension regarding esteem deals. Developing interest for innovation, more noteworthy interest in Research and development by undertakings in nations like China and Japan, and government backing are a portion of the drivers driving business sector extension. Consistent endeavors in printed circuit board Research and development to examine forthcoming applications in various end-use areas are supposed to drive market development during the projected period. Developing interest for printed circuit sheets in view of the expanded utilization of modern gadgets is supposed to drive market extension during the gauge time frame. China, for instance, has a muddled modern chain that incorporates copper foil, glass fiber, tar, copper-clad covers, and PCBs as its last part. The market has extended significantly more as Western nations’ longing for Asian purchaser hardware has taken off.
Major Players
The major players in the global High Density Interconnect (HDI) PCB are Compeq Manufacturing Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unimicron, Tripod Technology, and Zhen Ding Tech. Unimicron, Epec, LLC, TTM Technologies Inc., RayMing Technology, HiTech Circuits, NCAB Group Corporation, Millennium Circuits Limited, Tripod Technology, AKM Meadville, Meiko Electronics Co., Ltd., Sierra Circuits Inc., Compeq Manufacturing Co., Ltd., Advanced Circuits, and DAP Corporation.

Table of Contents

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

1.1. MARKET ATTRACTIVENESS ANALYSIS

1.1.1. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY INTERCONNECTION LAYERS

1.1.2. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY APPLICATION

1.1.3. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY REGION

2. MARKET INTRODUCTION

2.1. DEFINITION

2.2. SCOPE OF THE STUDY

2.3. MARKET STRUCTURE

2.4. KEY BUYING CRITERIA

2.5. MACRO FACTOR INDICATOR ANALYSIS

3. RESEARCH METHODOLOGY

3.1. RESEARCH PROCESS

3.2. PRIMARY RESEARCH

3.3. SECONDARY RESEARCH

3.4. MARKET SIZE ESTIMATION

3.5. FORECAST MODEL

3.6. LIST OF ASSUMPTIONS

4. MARKET DYNAMICS

4.1. INTRODUCTION

4.2. DRIVERS

4.2.1. INCREASING BENEFITS OF HIGH DENSITY INTERCONNECT TECHNOLOGY

4.2.2. RISING DEMAND OF HDI PCBS IN COMPLEX ELECTRONIC DEVICES

4.2.3. GROWING DEMAND FOR CIRCUIT MINIATURIZATION

4.2.4. DRIVERS IMPACT ANALYSIS

4.3. CHALLENGES

4.3.1. INTRODUCING HDI TECHNOLOGY IN PCB FOR SPACE APPLICATION

4.3.2. 5G TECHNOLOGY RELATED PCB DESIGN CHALLENGES

4.3.3. CHALLENGES FACED IN ANY-LAYER INTERCONNECTION HIGH DENSITY (ALV HDI) IN MASS PRODUCTIONS

4.3.4. RESTRAINTS IMPACT ANALYSIS

4.4. OPPORTUNITIES

4.4.1. TECHNOLOGICAL ADVANCEMENT IN HDI PCB

4.4.2. 5G TECHNOLOGY AS A GROWTH OPPORTUNITY FOR PCB DESIGNERS

4.4.3. RISING DEMAND FOR CONSUMER ELECTRONICS

4.5. IMPACT OF COVID-19

4.5.1. IMPACT ON SEMICONDUCTOR INDUSTRY

4.5.2. IMPACT ON THE MEDICAL ELECTRONIC INDUSTRY

4.5.3. IMPACT ON GLOBAL PCB SUPPLY CHAIN

4.5.4. RISING NEED FOR DIGITALIZATION OF THE SUPPLY CHAIN

5. MARKET FACTOR ANALYSIS

5.1. VALUE CHAIN ANALYSIS/SUPPLY CHAIN ANALYSIS

5.2. PORTER’S FIVE FORCES MODEL

5.3. BARGAINING POWER OF SUPPLIERS

5.4. BARGAINING POWER OF BUYERS

5.5. THREAT OF NEW ENTRANTS

5.6. THREAT OF SUBSTITUTES

5.7. INTENSITY OF RIVALRY

6. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY INTERCONNECTION LAYERS

6.1. INTRODUCTION

6.2. 1 LAYER (1+N+1) HDI

6.3. 2 OR MORE LAYERS (2+N+2) HDI

6.4. ALL LAYERS HDI

7. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY APPLICATION

7.1. INTRODUCTION

7.2. CONSUMER ELECTRONICS

7.3. AUTOMOTIVE

7.4. MILITARY AND DEFENSE

7.5. HEALTHCARE

7.6. INDUSTRIAL/ MANUFACTURING

7.7. OTHERS

8. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET SIZE ESTIMATION & FORECAST, BY REGION

8.1. INTRODUCTION

8.2. NORTH AMERICA

8.2.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032

8.2.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.2.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.2.4. US

8.2.5. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.2.6. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.2.7. CANADA

8.2.8. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.2.9. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.2.10. MEXICO

8.2.11. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.2.12. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.3. EUROPE

8.3.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032

8.3.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.3.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.3.4. UK

8.3.4.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.3.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.3.5. GERMANY

8.3.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.3.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.3.6. FRANCE

8.3.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.3.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.3.7. REST OF EUROPE

8.3.7.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.3.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.4. ASIA-PACIFIC

8.4.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032

8.4.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.4.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.4.4. CHINA

8.4.4.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.4.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.4.5. JAPAN

8.4.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.4.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.4.6. INDIA

8.4.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.4.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.4.7. REST OF ASIA-PACIFIC

8.4.7.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.4.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.5. MIDDLE EAST & AFRICA

8.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

8.6. SOUTH AMERICA

8.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032

8.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

9. COMPETITIVE LANDSCAPE

9.1. INTRODUCTION

9.2. KEY DEVELOPMENTS & GROWTH STRATEGIES

9.3. COMPETITOR BENCHMARKING

9.4. VENDOR SHARE ANALYSIS, 2021(% SHARE)

10. COMPANY PROFILES

10.1. UNIMICRON, EPEC, LLC

10.1.1. COMPANY OVERVIEW

10.1.2. FINANCIAL OVERVIEW

10.1.3. SOLUTION/SERVICES OFFERED

10.1.4. KEY DEVELOPMENTS

10.1.5. SWOT ANALYSIS

10.1.6. KEY STRATEGIES

10.2. TTM TECHNOLOGIES INC.

10.2.1. COMPANY OVERVIEW

10.2.2. FINANCIAL OVERVIEW

10.2.3. SOLUTION/SERVICES OFFERED

10.2.4. KEY DEVELOPMENTS

10.2.5. SWOT ANALYSIS

10.2.6. KEY STRATEGIES

10.3. RAYMING TECHNOLOGY

10.3.1. COMPANY OVERVIEW

10.3.2. FINANCIAL OVERVIEW

10.3.3. SOLUTION/SERVICES OFFERED

10.3.4. KEY DEVELOPMENTS

10.3.5. SWOT ANALYSIS

10.3.6. KEY STRATEGIES

10.4. HITECH CIRCUITS

10.4.1. COMPANY OVERVIEW

10.4.2. FINANCIAL OVERVIEW

10.4.3. SOLUTION/SERVICES OFFERED

10.4.4. KEY DEVELOPMENTS

10.4.5. SWOT ANALYSIS

10.4.6. KEY STRATEGIES

10.5. NCAB GROUP CORPORATION

10.5.1. COMPANY OVERVIEW

10.5.2. FINANCIAL OVERVIEW

10.5.3. SOLUTION/SERVICES OFFERED

10.5.4. KEY DEVELOPMENTS

10.5.5. SWOT ANALYSIS

10.5.6. KEY STRATEGIES

10.6. MILLENNIUM CIRCUITS LIMITED

10.6.1. COMPANY OVERVIEW

10.6.2. FINANCIAL OVERVIEW

10.6.3. SOLUTION/SERVICES OFFERED

10.6.4. KEY DEVELOPMENTS

10.6.5. SWOT ANALYSIS

10.6.6. KEY STRATEGIES

10.7. TRIPOD TECHNOLOGY

10.7.1. COMPANY OVERVIEW

10.7.2. FINANCIAL OVERVIEW

10.7.3. SOLUTION/SERVICES OFFERED

10.7.4. KEY DEVELOPMENTS

10.7.5. SWOT ANALYSIS

10.7.6. KEY STRATEGIES

10.8. ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED

10.8.1. COMPANY OVERVIEW

10.8.2. FINANCIAL OVERVIEW

10.8.3. SOLUTION/SERVICES OFFERED

10.8.4. KEY DEVELOPMENTS

10.8.5. SWOT ANALYSIS

10.8.6. KEY STRATEGIES

10.9. AKM MEADVILLE

10.9.1. COMPANY OVERVIEW

10.9.2. FINANCIAL OVERVIEW

10.9.3. SOLUTION/SERVICES OFFERED

10.9.4. KEY DEVELOPMENTS

10.9.5. SWOT ANALYSIS

10.9.6. KEY STRATEGIES

10.10. MEIKO ELECTRONICS CO., LTD.

10.10.1. COMPANY OVERVIEW

10.10.2. FINANCIAL OVERVIEW

10.10.3. SOLUTION/SERVICES OFFERED

10.10.4. KEY DEVELOPMENTS

10.10.5. SWOT ANALYSIS

10.10.6. KEY STRATEGIES

10.11. SIERRA CIRCUITS INC.

10.11.1. COMPANY OVERVIEW

10.11.2. FINANCIAL OVERVIEW

10.11.3. SOLUTION/SERVICES OFFERED

10.11.4. KEY DEVELOPMENTS

10.11.5. SWOT ANALYSIS

10.11.6. KEY STRATEGIES

10.12. COMPEQ MANUFACTURING CO., LTD.

10.12.1. COMPANY OVERVIEW

10.12.2. FINANCIAL OVERVIEW

10.12.3. SOLUTION/SERVICES OFFERED

10.12.4. KEY DEVELOPMENTS

10.12.5. SWOT ANALYSIS

10.12.6. KEY STRATEGIES

10.13. AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)

10.13.1. COMPANY OVERVIEW

10.13.2. FINANCIAL OVERVIEW

10.13.3. SOLUTION/SERVICES OFFERED

10.13.4. KEY DEVELOPMENTS

10.13.5. SWOT ANALYSIS

10.13.6. KEY STRATEGIES

10.14. ADVANCED CIRCUITS

10.14.1. COMPANY OVERVIEW

10.14.2. FINANCIAL OVERVIEW

10.14.3. SOLUTION/SERVICES OFFERED

10.14.4. KEY DEVELOPMENTS

10.14.5. SWOT ANALYSIS

10.14.6. KEY STRATEGIES

10.15. DAP CORPORATION

10.15.1. COMPANY OVERVIEW

10.15.2. FINANCIAL OVERVIEW

10.15.3. SOLUTION/SERVICES OFFERED

10.15.4. KEY DEVELOPMENTS

10.15.5. SWOT ANALYSIS

10.15.6. KEY STRATEGIES

LIST OF TABLES

TABLE 1 MARKET SYNOPSIS 17

TABLE 2 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 41

TABLE 3 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 43

TABLE 4 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY REGION, 2018-2032 (USD MILLION) 46

TABLE 5 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 48

TABLE 6 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 49

TABLE 7 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 49

TABLE 8 US HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 50

TABLE 9 US HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 50

TABLE 10 CANADA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 50

TABLE 11 CANADA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 51

TABLE 12 MEXICO HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 51

TABLE 13 MEXICO HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 51

TABLE 14 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 55

TABLE 15 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 55

TABLE 16 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 56

TABLE 17 GERMANY HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 57

TABLE 18 GERMANY HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 57

TABLE 19 FRANCE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 57

TABLE 20 FRANCE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 58

TABLE 21 UK HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 58

TABLE 22 UK HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 58

TABLE 23 REST OF EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 59

TABLE 24 REST OF EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 59

TABLE 25 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 61

TABLE 26 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 62

TABLE 27 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 62

TABLE 28 CHINA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 63

TABLE 29 CHINA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 63

TABLE 30 JAPAN HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 63

TABLE 31 JAPAN HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 64

TABLE 32 INDIA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 64

TABLE 33 INDIA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 64

TABLE 34 REST OF ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 65

TABLE 35 REST OF ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 65

TABLE 36 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 67

TABLE 37 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 67

TABLE 38 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 68

TABLE 39 MIDDLE EAST & AFRICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 69

TABLE 40 MIDDLE EAST & AFRICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 69

TABLE 41 SOUTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 69

TABLE 42 SOUTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 70

TABLE 43 BUSINESS EXPANSIONS/ACQUISITIONS 73

TABLE 44 UNIMICRON: PRODUCTS/SOLUTIONS/SERVICES OFFERED 77

TABLE 45 EPEC, LLC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 78

TABLE 46 EPEC, LLC: KEY DEVELOPMENTS 78

TABLE 47 TTM TECHNOLOGIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 81

TABLE 48 RAYMING TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 83

TABLE 49 HITECH CIRCUITS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 84

TABLE 50 NCAB GROUP CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 86

TABLE 51 NCAB GROUP CORPORATION: KEY DEVELOPMENTS 86

TABLE 52 MILENNIUM CIRCUITS LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 89

TABLE 53 TRIPOD TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 90

TABLE 54 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 93

TABLE 55 AKM MEADVILLE: PRODUCTS/SOLUTIONS/SERVICES OFFERED 96

TABLE 56 MEIKO ELECTRONICS CO., LTD: PRODUCTS/SOLUTIONS/SERVICES OFFERED 99

TABLE 57 MEIKO ELECTRONICS CO., LTD: KEY DEVELOPMENTS 100

TABLE 58 SIERRA CIRCUITS INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 102

TABLE 59 COMPEQ MANUFACTURING CO. LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 104

TABLE 60 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT: PRODUCTS/SOLUTIONS/SERVICES OFFERED 106

TABLE 61 ADVANCED CIRCUIT.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 108

TABLE 62 DAP CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 109

LIST OF FIGURES
FIGURE 1 MARKET ATTRACTIVENESS ANALYSIS: GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET 18
FIGURE 2 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET: MARKET STRUCTURE 20
FIGURE 3 BOTTOM-UP AND TOP-DOWN APPROACHES 25
FIGURE 4 MARKET DYNAMIC ANALYSIS OF THE GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET 28
FIGURE 5 DRIVER IMPACT ANALYSIS 30
FIGURE 6 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET: SUPPLY CHAIN ANALYSIS 36
FIGURE 7 PORTER’S FIVE FORCES ANALYSIS OF THE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET 38
FIGURE 8 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2022 (% SHARE) 40
FIGURE 9 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2022 VS 2032 (USD MILLION) 40
FIGURE 10 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2022 (% SHARE) 42
FIGURE 11 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2022 VS 2032 (USD MILLION) 42
FIGURE 12 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY REGION, 2022 (% SHARE) 45
FIGURE 13 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY REGION, 2022 VS 2032 (USD MILLION) 45
FIGURE 14 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 47
FIGURE 15 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 48
FIGURE 16 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 48
FIGURE 17 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 49
FIGURE 18 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 53
FIGURE 19 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 53
FIGURE 20 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 55
FIGURE 21 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 56
FIGURE 22 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 60
FIGURE 23 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 61
FIGURE 24 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 61
FIGURE 25 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 62
FIGURE 26 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 66
FIGURE 27 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 66
FIGURE 28 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 67
FIGURE 29 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 68
FIGURE 30 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET: COMPETITIVE BENCHMARKING 72
FIGURE 31 VENDOR SHARE ANALYSIS, 2021 (%) 73
FIGURE 32 UNIMICRON: FINANCIAL OVERVIEW SNAPSHOT 76
FIGURE 33 UNIMICRON: SWOT ANALYSIS 77
FIGURE 34 EPEC, LLC: SWOT ANALYSIS 79
FIGURE 35 TTM TECHNOLOGIES INC.: FINANCIAL OVERVIEW SNAPSHOT 81
FIGURE 36 TTM TECHNOLOGIES INC.: SWOT ANALYSIS 82
FIGURE 37 NCAB GROUP CORPORATION: FINANCIAL OVERVIEW SNAPSHOT 85
FIGURE 38 NCAB GROUP CORPORATION: SWOT ANALYSIS 88
FIGURE 39 TRIPOD TECHNOLOGY: FINANCIAL OVERVIEW SNAPSHOT 90
FIGURE 40 TRIPOD TECHNOLOGY: SWOT ANALYSIS 91
FIGURE 41 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED: FINANCIAL OVERVIEW SNAPSHOT 92
FIGURE 42 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED: SWOT ANALYSIS 93
FIGURE 43 AKM MEADVILLE (AKM INDUSTRIAL COMPANY LIMITED): FINANCIAL OVERVIEW SNAPSHOT 95
FIGURE 44 AKM MEADVILLE: SWOT ANALYSIS 97
FIGURE 45 MEIKO ELECTRONICS CO., LTD.: FINANCIAL OVERVIEW SNAPSHOT 99
FIGURE 46 MEIKO ELECTRONICS CO., LTD: SWOT ANALYSIS 100
FIGURE 47 COMPEQ MANUFACTURING CO., LTD: FINANCIAL OVERVIEW SNAPSHOT 103
FIGURE 48 COMPEQ MANUFACTURING CO. LTD.: SWOT ANALYSIS 104
FIGURE 49 AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT): FINANCIAL OVERVIEW SNAPSHOT 105
FIGURE 50 AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT): SWOT ANALYSIS 107