CMP付属品:パッドコンディショナー、PVAブラシ、スラリーフィルター、リテーナーリング市場 2023年

出版:TECHCET(テクセット) 出版年月:2023年3月

CMP ANCILLARIES: PAD CONDITIONERS, PVA BRUSHES, SLURRY FILTERS & RETAINING RINGS MARKETS
CMP付属品:パッドコンディショナー、PVAブラシ、スラリーフィルター、リテーナーリング市場 2023年
CMP Ancillaries: Pad-Conditioners, Filters, Rings, and Brushes 2023-2024

ページ数183
図表数59
価格(ベーシックライセンス)USD8,900
種別英文調査報告書

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Report Overview

  • Contains information on the semiconductor related CMP Ancillaries market dynamics
  • Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
  • Includes supply-chain, market, and technical trends information relating to CMP Ancillaries market segment as used for semiconductor device manufacturing.
  • Covers information about key CMP Ancillaries suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronics material segments
  • Single User License – provides 1 portal access login to techcet.com for one person, using 2FA (two-factor authentication). The 1 user has freedom to use any of the data in the purchased report for internal or external presentations, with proper copyright attribution.*

ANALYST BIOGRAPHY

Karey Holland, Ph.D. – Chief Strategist and Co-Founder of TECHCET —has specialized in advanced semiconductor transistor fabrication, including metrology, CMP, ALD & CVD, photolithography, and interconnect technologies for over 30 years.

She was CTO of start-up NexPlanar, strategic marketing senior manager at FEI, on the Board of Directors at Nova Measuring Instruments, VP of technology at CMP pad supplier Thomas West, and CTO and VP of process technology at CMP OEM IPEC/SpeedFam-IPEC. Previously, she was manager of manufacturing planning for Motorola’s Microprocessor and Memory Technology Group. Her career began in process engineering at IBM where she managed DUV lithography technology development, and worked on interconnect integration
for 4 and 16 Mb DRAMs, which were the first chips in the world to use tungsten plugs and CMP for all interconnect dielectrics. She holds a Ph.D. in analytical chemistry from Pennsylvania State
University, a M.S. in analytical chemistry from Purdue University, and a B.A. in chemistry from Albion College.

Table of Contents

1 EXECUTIVE SUMMARY 9
1.1 CMP ANCILLARIES MARKET OVERVIEW 10
1.2 CMP ANCILLARIES REVENUE TRENDS 11
1.3 MARKET TRENDS IMPACTING CMP ANCILLARIES OUTLOOK 12
1.4 YEAR 2022 IN REVIEW AND FIVE-YEAR FORECAST 13
1.5 CMP ANCILLARIES FORECASTS BY MATERIAL SEGMENT 14
1.5.1 CMP PAD CONDITIONERS 5-YEAR REVENUE FORECAST 15
1.5.2 CMP SLURRY POINT OF USE (POU) FILTERS 5-YEAR
REVENUE FORECAST 16
1.5.3 CMP PVA BRUSHES FOR POST CMP CLEANS 5-YEAR
REVENUE FORECAST 17
1.5.4 CMP WAFER RETAINING RINGS 5-YEAR
REVENUE FORECAST 18
1.6 TECHNOLOGY TRENDS 19
1.7 PAD CONDITIONERS SUPPLIER COMPETITIVE LANDSCAPE 20
1.8 POINT-OF-USE (POU) SLURRY FILTERS SUPPLIER
COMPETITIVE LANDSCAPE 21
1.9 PVA BRUSH FOR POST-CMP CLEANS SUPPLIER
COMPETITIVE LANDSCAPE 22
1.10 RETAINING RINGS FOR WAFER POLISH HEADS
SUPPLIER COMPETITIVE LANDSCAPE 23
1.11 ANALYST ASSESSMENT 24

2 SCOPE AND METHODOLOGY 26
2.1 SCOPE 27

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK 28
3.1 WORLDWIDE ECONOMY 29
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 31
3.1.2 SEMICONDUCTOR SALES GROWTH 32
3.1.3 TAIWAN MONTHLY SALES TRENDS 33
3.1.4 UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023 – SLOWER TO
NEGATIVE SEMICONDUCTOR REVENUE GROWTH EXPECTED 34
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 35
3.2.1 SMARTPHONES 36 3.2.2 PC UNIT SHIPMENTS 37
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 38
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 39
3.2.3 SERVERS / IT MARKET 40
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 41
3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY 42
3.3.1.2 NEW FABS IN THE US 43
3.3.2 WW FAB EXPANSION DRIVING GROWTH 44
3.3.3 EQUIPMENT SPENDING TRENDS 45
3.3.4 TECHNOLOGY ROADMAPS 46
3.3.5 FAB INVESTMENT ASSESSMENT 47
3.4 POLICY & TRADE TRENDS AND IMPACT 48
3.5 SEMICONDUCTOR MATERIALS OVERVIEW 49
3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP
PRODUCTION SCHEDULES? 50
3.5.2 LOGISTICS ISSUES EASED DOWN 51 3.5.3 TECHCET WAFER
STARTS FORECAST THROUGH 2027 52
3.5.3.1 TECHCET WAFER START MODELING METHODOLOGY 53
3.5.4 TECHCET’S MATERIAL FORECAST

4 CMP ANCILLARIES MARKET TRENDS 54
4.1 CMP ANCILLARIES MARKET TRENDS 55
4.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS 56
4.2.1 3D NAND STACKING 58
4.2.2 TECHNICAL TRENDS IN ADVANCED PACKAGING 59
4.2.3 CMP FOR TSV 61
4.2.4 CMP OF SILICON CARBIDE 62
4.3 REGIONAL TRENDS 63

5 CMP PAD CONDITIONING DISKS STATISTICS & FORECASTS 64
5.1 CMP PAD CONDITIONERS 5-YEAR REVENUE FORECAST 65
5.2 CMP PAD CONDITIONERS 5-YEAR FORECAST BY UNITS 66
5.3 TOTAL PAD CONDITIONERS MARKET SHARE 67
5.4 CMP PAD CONDITIONERS M&A ACTIVITY- ANNOUNCEMENTS
AND PARTNERSHIPS 68
5.5 CMP PAD CONDITIONERS NEW ENTRANTS OR PLANT CLOSURES 69
5.6 CMP PAD CONDITIONERS PRICING TRENDS 70
5.7 TECHCET ANALYST ASSESSMENT OF CMP PAD
CONDITIONERS MARKET 71

6 CMP POU SLURRY FILTER MARKET STATISTICS & FORECASTS 72
6.1 CMP POU SLURRY FILTER 5-YEAR REVENUE FORECAST 73
6.1.1 CMP POU SLURRY FILTERS 5-YEAR FORECAST FORECAST
BY UNITS 74
6.2 CMP POU SLURRY FILTER MARKET SHARE ESTIMAGE 75
6.3 CMPPOUSLURRYFILTERM&AACTIVITY ANNOUNCEMENTS
AND PARTNERSHIPS 77
6.4 TECHCET ANALYST ASSESSMENT 78

7 CMP PVA BRUSH SUPPLIER MARKET STATISTICS & FORECASTS 79
7.1 CMP PVA BRUSH 5-YEAR REVENUE FORECAST 80
7.2 CMP PVA BRUSH 5-YEAR FORECAST BY UNITS 81
7.3 TOTAL PVA BRUSH MARKET SHARE 82
7.4 CMP PVA BRUSH PRICING TRENDS 83
7.4.1 CMP PVA BRUSHES MARKET INFORMATION 84
7.5 TECHCET ANALYST ASSESSMENT OF CMP PVA BRUSH MARKET 85

8 CMP RETAINING RING SUPPLIER MARKET STATISTICS & FORECASTS 86
8.1 CMP RETAINING RING FOR WAFER POLISHING HEADS 5-YEAR
REVENUE FORECAST 87
8.2 CMP RETAINING RING 5-YEAR FORECAST BY UNITS 88
8.3 TOTAL RETAINING RING MARKET SHARE 89
8.4 TECHCET ANALYST ASSESSMENT OF CMP RETAINING RING MARKET 90

9 SUPPLIER PROFILES 91
3M
Abrasive Technology
Ehwa Diamond
Entegris
Kinik
Morgan Advanced Materials
Saesol Diamond
…and many more

10 APPENDIX 181
APPENDIX A: CMP ANCILLARIES OVERVIEW 182
APPENDIX B: TECHCET WAFER START MODELING METHODOLOGY 183

FIGURES
FIGURE1: FORECAST PERCENT OF CMP WAFER PASSES PER YEAR 10
FIGURE 2: TOTAL CMP ANCILLARIES REVENUES ($M USD) 11
FIGURE 3: CMP STEPS FOR ADVANCED DEVICES 12
FIGURE 4: 2022 CMP ANCILLARIES TRENDS/ LESSONS 13
FIGURE 5: EST CMP PROCESS STEPS BY APPLICATION & NODE 14
FIGURE 6: CMP PAD CONDITIONERS REVENUE BY WAFER SIZE 15
FIGURE 7: CMP SLURRY POU FILTERS REVENUE BY APPLICATION 16
FIGURE 8: CMP PVA BRUSH REVENUES BY APPLICATION 17
FIGURE 9: CMP RETAINING RING REVENUES BY WAFER SIZE 18
FIGURE 10: LOGIC DEVICE ARCHITECTURE EVOLUTION 19
FIGURE 11: 2022 PAD CONDITIONERS SUPPLIER MARKET SHARES 20
FIGURE 12: 2022 SLURRY POU FILTERS SUPPLIER MARKET SHARES 21
FIGURE 13: 2022 PVA BRUSH SUPPLIER MARKET SHARES 22
FIGURE 14: 2022 RETAINING RING SUPPLIER MARKET SHARES 23
FIGURE 15: GLOBAL ECONOMY AND THE ELECTRONICS
SUPPLY CHAIN (2022) 31
FIGURE 16: WORLDWIDE SEMICONDUCTOR SALES 32
FIGURE 17: TECHCET’S TAIWAN SEMICONDUCTOR
INDUSTRY INDEX (TTSI)* 33
FIGURE 18: 2023 SEMICONDUCTOR INDUSTRY REVENUE
GROWTH FORECASTS 34
FIGURE 19: 2022 SEMICONDUCTOR CHIP APPLICATIONS 35
FIGURE 20: MOBILE PHONE SHIPMENTS WW ESTIMATES 36
FIGURE 21: WORLDWIDE PC AND TABLET FORECAST 37
FIGURE 22: ELECTRIFICATION TREND BY WORLD REGION 38
FIGURE 23: SEMICONDUCTOR AUTOMOTIVE PRODUCTION 39
FIGURE 24: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40 B 41
FIGURE 25: CHIP EXPANSIONS 2022-2027 US$360 B 42
FIGURE 26: SEMICONDUCTOR CHIP MANUFACTURING REGIONS
OF THE WORLD 44
FIGURE 27: GLOBAL TOTAL EQUIPMENT SPENDING BY SEGMENT (USD B) 45
FIGURE 28: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP 46
FIGURE 29: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST
RENDERING (ON BOTTOM) 47
FIGURE 30: EUROPE CHIP EXPANSION UPSIDE 50
FIGURE 31: PORT OF LA 51
FIGURE 32: TECHCET WAFER START FORECAST BY NODE SEGMENTS** 52
FIGURE 33: GLOBAL SEMICNDUCTOR MATERIALS OUTLOOK 53
FIGURE 34: CMP ANCILLARIES REVENUE FOR 2022 55
FIGURE 35: AVG NUMBER OF CMP STEPS FOR ADVANCED
TECHNOLOGY NODES 56
FIGURE 36: COMPARISON OF METALS RESISTIVITIES BY DIMENSION 57
FIGURE 37: 14NM VS. 7NM METALLIZATION TECHNIQUES 57
FIGURE 38: STACKING FOR 3D NAND 58
FIGURE 39: CMP OPPORTUNITIES IN ADVANCED PACKAGING 59
FIGURE 40: KEY TRENDS IN ADVANCED PACKAGING 60
FIGURE 41: CMP OPPORTUNITIES IN ADVANCED PACKAGING 61
FIGURE 42: SILICON CARBIDE-BASED POWER DEVICE 62
FIGURE 43: ANCILLARIES % REVENUES 2022 REGIONAL HQ 63
FIGURE 44: CMP PAD CONDITIONERS REVENUE BY WAFER SIZE 65
FIGURE 45: FORECASTED PAD CONDITIONERS VOLUME DEMAND 66
FIGURE 46: PAD CONDITIONERS SUPPLIER MARKET SHARES IN 2022 67
FIGURE 47: CMP POU SLURRY FILTERS REVENUE BY SLURRY TYPE 68
FIGURE 48: FORECASTED SLURRY FILTER UNITS DEMAND 69
FIGURE 49: 2022 POU SLURRY FILTER MARKET SHARE 70
FIGURE 50: CMP PVA BRUSH REVENUES BY APPLICATION 80
FIGURE 51: FORECASTED PVA BRUSH UNITS DEMAND 81
FIGURE 52: PVA BRUSH SUPPLIER MARKET SHARES IN 2022 82
FIGURE 53: CMP RETAINING RING REVENUE ($M USD) BY WAFER SIZE 87
FIGURE 54: FORECASTED RETAINING RING UNITS DEMAND 88
FIGURE 55: PAD CONDITIONERS SUPPLIER MARKET SHARES IN 2022 89
FIGURE 56: CMP FOR IC MANUFACTURING PROCESS

TABLES
TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES* 29
TABLE 2: IMF ECONOMIC OUTLOOK* 30
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES
MARKET SPENDING 2022 40