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CMP消耗品：スラリーとパッド市場　2025-2026年

CMP Consumables - Slurry And Pad Markets

CMP消耗品：スラリーとパッド市場のサプライチェーンと市場分析　2025-2026年 - 重要材料レポートシリーズ
2025-2026 CMR™ CMP CONSUMABLES - SLURRY AND PAD MARKETS: SUPPLY-CHAIN & MARKET ANALYSIS - A CRITICAL MATERIALS REPORT™

商品番号：SMB-4595
出版社TECHCET
出版年月2025年5月
ページ数123
図表数76
価格タイプベーシックライセンス
価格USD 8,900
種別英文調査報告書
※※ページ数にChapter 7（Supplier Profiles）は含まれていません。

TECHCET「CMP消耗品：スラリーとパッド市場　2025-2026年 – CMP CONSUMABLES – SLURRY and PAD MARKETS」は半導体デバイス製造用CMPに消耗品として使用されているスラリーとパッドを対象に市場動向やサプライチェーンなどを分析・解説しています。

当レポートの特長

  • 半導体製造用CMPパッドおよびスラリー市場情報を掲載。
  • サプライチェーンマネージャー、生産統合、R&D管理者、事業開発、財務に関する情報を提供。
  • 半導体デバイス製造に使用されるCMPパッド、スラリー、ディスクに関連したサプライチェーン、市場、技術動向に関する情報を提供。
  • 主要CMPパッドおよびCMPスラリーのサプライヤ、電子材料のサプライチェーンにおける課題／動向、サプライヤの市場シェア見込み、電子機器向け材料市場予測も掲載。

主な掲載内容

  • エグゼクティブサマリー
  • 調査範囲、目的、メソドロジー
  • 半導体産業の市場状況と展望
    • 世界経済と展望
    • 電子製品セグメント別チップ売上
    • 半導体製造の成長と拡大
    • 政策＆貿易動向と影響
    • 半導体材料概観
  • CMPスラリー＆消耗品市場動向
    • CMPパッドおよびスラリー市場
    • 技術における市場促進要因／材料の変化と移行 – 先端ロジックとメモリー
    • 先端パッケージングにおける技術的動向
    • 化合物半導体における技術的動向
    • 新材料のEHS問題
    • 貿易／物流問題
    • アナリストによるCMPスラリーとパッド市場動向評価
  • CMPスラリーサプライヤー市場勢力図
    • CMPスラリーの用途別数量の5年予測
    • CMPスラリーの地域別数量予測
    • CMPスラリーの用途別収益の5年予測
    • 地域別CMPスラリー市場シェア
    • サプライヤ別CMPスラリー市場シェア総計
    • 最新の四半期のサプライヤの活動＆収益（報告ベース）
    • M&A活動と提携関係
    • 工場閉鎖 – 確認できず
    • 新規参入企業 – 確認できず
    • 存続の危機にあるサプライヤまたは部品/生産ライン
    • CMPスラリーの価格動向
    • TECHCETアナリストによるCMPスラリー市場評価
  • CMPパッドサプライヤの市場勢力図
    • CMPパッドの用途別数量の5年予測
    • CMPパッドの地域別数量予測
    • CMPパッドの用途別収益の5年予測
    • CMPパッドのウエハーサイズ別収益の5年予測
    • サプライヤ別CMPパッド市場シェア総計
    • 新規参入企業 
    • CMPパッドの物流問題、M＆A活動、告知、提携関係
    • CMPパッドの価格動向
    • TECHCETアナリストによるCMPパッド市場評価
  • 材料のサブティア供給
  • サプライヤー情報

Description

This report covers the CMP Consumables market (specifically CMP slurry and pads) and supply-chain for those consumables used in semiconductor device fabrication. The report contains data and analysis from TECHCET’s data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. CMP slurries and pads are a critical in semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers. The number of CMP process steps continue to increase with each generation of new device technology.​ New device technology is characterized by more layers, new materials, tighter process control requirements, and new techniques for advanced packaging. These manufacturing challenges require new developments in CMP slurries and pads. This report looks at the market drivers, slurry and pad forecasts by application, market shares, abrasive suppliers, and includes a special focus on advanced packaging.​

  • Contains information on the semiconductor related CMP Pads & Slurry market dynamics
  • Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
  • Includes supply-chain, market, and technical trends information relating to CMP pads, slurry, and disks as used for semiconductor device manufacturing.
  • Covers information about key CMP Pads & Slurry suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronics material segments
  • Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analyst

Analyst

James Schlueter – TECHCET Senior Market Analyst for CMP.

  • Mr. Schlueter entered the semiconductor industry in 1985 and has worked in a wide variety of technical and technical leadership roles over 36 years, including an IC manufacturer, OEM’s for PVD, ion implant, and CMP, a semiconductor industry consortium, a nanomaterials startup, and a CMP slurry developer/manufacturer.
  • After a thin film process engineering positions in a Sperry Corp. fab, development of a PVD sputtering tool at Eaton Corp., and technically leading an advanced step coverage
  • PVD projects at SEMATECH, Mr. Schlueter was promoted to Project Leader for PVD and then CMP, followed by Program Manager for CMP at SEMATECH. He subsequently became the CMP Process Development Manager for SpeedFam/SpeedFamIPEC/Novellus. After serving as CTO/COO at nanomaterials startup SDCMaterials, he
    became Technical Manager and Director of CMP Slurry Development at DuPont/AirProducts/Versum Materials/EMD, where he and his teams developed a number of commercially successful CMP slurry products.
  • Mr. Schlueter semi-retired in 2022 and started EbeneWafer Consulting, LLC, which provides technical and marketing consulting services for CMP.
  • Mr. Schlueter holds two bachelor of science degrees from South Dakota State University.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

1.1 CMP PAD AND SLURRY MARKET OVERVIEW
1.2 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY CONSUMABLE SEGMENT
1.3 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY APPLICATION
1.4 CMP SLURRY VOLUME AND PAD UNIT USAGE FORECAST BY REGION
1.5 5-YEAR CMP SLURRY REVENUE FORECAST BY APPLICATION
1.6 5-YEAR CMP PAD REVENUE FORECAST BY APPLICATION
1.7 TOTAL CMP SLURRY MARKET SHARE BY SUPPLIER
1.8 TOTAL CMP PAD MARKET SHARE BY SUPPLIER
1.9 ADVANCED LOGIC TRANSISTOR TECHNOLOGY ROADMAP
1.10 EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS
1.11 ANALYST ASSESSMENT OF CMP SLURRY AND PADS

2 SCOPE, PURPOSE AND METHODOLOGY

2.1 SCOPE
2.2 PURPOSE
2.3 METHODOLOGY
2.4 OVERVIEW OF OTHER TECHCET CMR™ OFFERINGS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1 WORLDWIDE ECONOMY AND OUTLOOK
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
3.1.2 SEMICONDUCTOR SALES GROWTH
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
3.2.1 FACTORS IMPACTING ELECTRONIC SYSTEMS OUTLOOK
3.2.2 PC OUTLOOK
3.2.3 SMARTPHONE OUTLOOK
3.2.4 AUTOMOTIVE INDUSTRY OUTLOOK
3.2.5 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
3.3.2 PUBLIC FUNDS STIMULATING PRIVATE INVESTMENTS IN EXPANSION ACROSS THE GLOBE
3.3.3 SEMICONDUCTOR SUPPLY CHAIN ANNOUNCED EXPANSIONS IN THE US
3.3.4 EQUIPMENT SPENDING TRENDS
3.3.5 TECHNOLOGY ROADMAPS
3.4 POLICY & TRADE TRENDS AND IMPACT
3.5 SEMICONDUCTOR MATERIALS OVERVIEW
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2029
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 CMP SLURRY & PAD CONSUMABLES MARKET TRENDS

4.1 OVERALL CMP PAD AND SLURRY MARKET
4.1.1 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY CONSUMABLE SEGMENT
4.1.2 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY APPLICATION
4.1.3 2024 REGIONAL CMP SLURRIES AND PADS MARKET
4.1.4 REGIONAL CMP SLURRY AND PAD MARKET OUTLOOK
4.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS – ADVANCED LOGIC AND MEMORY
4.2.1 ADVANCED LOGIC TRANSISTOR TECHNOLOGY ROADMAP
4.2.2 NEW ADVANCED LOGIC TECHNOLOGY TRENDS –GAA + BACKSIDE POWER DELIVERY (BPD)
4.2.3 NEW ADVANCED LOGIC TECHNOLOGY TRENDS – BACKSIDE POWER DELIVERY (BPD)
4.2.4 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS
4.2.5 TECHNICAL DRIVERS / 3D NAND STACKING
4.2.6 TECHNICAL DRIVERS / 3D NAND STACKING
4.3 TECHNICAL TRENDS IN ADVANCED PACKAGING
4.3.1 TECHNICAL TRENDS IN ADVANCED PACKAGING – HYBRID OR DIRECT CU BONDING (DCB)
4.3.2 TECHNICAL TRENDS IN ADVANCED PACKAGING – HYBRID OR DIRECT CU BONDING (DCB)
4.3.3 TECHNICAL TRENDS IN ADVANCED PACKAGING – HYBRID OR DIRECT CU BONDING (DCB)
4.3.4 MARKET GROWTH TRENDS IN ADVANCED PACKAGING
4.4 TECHNICAL TRENDS IN COMPOUND SEMICONDUCTOR
4.5 EHS ISSUES FOR NEW MATERIALS
4.5.1 EHS ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM
4.6 TRADE/LOGISTICS ISSUES
4.7 ANALYST ASSESSMENT OF CMP SLURRY AND PAD MARKET TRENDS

5 CMP SLURRY SUPPLY-SIDE MARKET LANDSCAPE

5.1 5-YEAR CMP SLURRY VOLUME USAGE FORECAST BY APPLICATION
5.2 CMP SLURRY VOLUME USAGE FORECAST BY REGION
5.3 5-YEAR CMP SLURRY REVENUE FORECAST BY APPLICATION
5.4 REGIONAL CMP SLURRY MARKET SHARE
5.5 TOTAL CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.1 LEADING CMP SLURRY MARKET SHARE SUPPLIERS BY REVENUE
5.5.2 OXIDE (CERIA) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.3 HKMG (METAL AND OXIDE) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.4 POLYSILICON CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.5 OXIDE (SILICA) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.6 TUNGSTEN CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.7 CU BULK CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.8 CU BARRIER CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.9 NEW METALS (CO, MO, RU, ETC.) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.10 CU BACKSIDE POWER (BPD) CMP SLURRY MARKET SHARE BY SUPPLIER
5.6 CURRENT QUARTER – SUPPLIERS’ ACTIVITIES & REPORTED REVENUES
5.7 M&A ACTIVITY AND PARTNERSHIPS
5.8 PLANT CLOSURES – NONE IDENTIFIED
5.9 NEW ENTRANTS – NONE IDENTIFIED
5.10 SUPPLIERS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
5.11 CMP SLURRY PRICING TRENDS
5.12 TECHCET ANALYST ASSESSMENT OF CMP SLURRY SUPPLIERS

6 CMP PAD SUPPLY-SIDE MARKET LANDSCAPE

6.1 5-YEAR CMP PAD UNIT USAGE FORECAST BY APPLICATION
6.2 CMP PAD UNIT USAGE FORECAST BY REGION
6.3 5-YEAR CMP PAD REVENUE FORECAST BY APPLICATION
6.4 5-YEAR CMP PAD REVENUE FORECAST BY WAFER SIZE
6.5 TOTAL CMP PAD MARKET SHARE BY SUPPLIER
6.6 NEW ENTRANTS
6.7 CMP PAD LOGISTICS ISSUES, M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
6.8 CMP PAD PRICING TRENDS
6.9 PAD SUPPLIER TECHCET ANALYST ASSESSMENT

7 MATERIAL SUB-TIER SUPPLY – ABRASIVES

7.1 CMP PAD PRICING TRENDS
7.2 VERTICALLY INTEGRATED SLURRY SUPPLIERS
7.3 RAW SUPPLY-CHAIN DISRUPTORS
7.4 RAW MATERIALS M&A ACTIVITY
7.5 ABRASIVE SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
7.6 ABRASIVE SUPPLY-CHAIN “NEW” ENTRANTS OR PLANT CLOSURES
7.7 ABRASIVE SUPPLY-CHAIN PRICING TRENDS
7.8 SUB-TIER SUPPLY CHAIN: SLURRY ABRASIVE SUPPLY NOTABLES
7.9 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

8 SUPPLIER PROFILES

ACE NANOCHEM
ANJI MICRO SHANGHAI
ASAHI GLASS
BASF
DONGJIN SEMICHEM
AND MORE…

FIGURES

FIGURE 1.1: FORECASTED 2025 MARKET SIZE
FIGURE 1.2: CMP SLURRY AND PAD REVENUE FORECAST BY SEGMENT
FIGURE 1.3: CMP SLURRY AND PAD REVENUE FORECAST BY SEGMENT
FIGURE 1.4: 2025 SLURRY VOLUME AND PAD UNIT USAGE FORECAST BY REGION
FIGURE 1.5: 2023 – 2029 SLURRY REVENUE FORECAST BY APPLICATION
FIGURE 1.6: 2023 – 2029 PAD REVENUE FORECAST BY APPLICATION
FIGURE 1.7: 2024 TOTAL CMP SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 1.8: 2024 TOTAL CMP PAD SUPPLIER MARKET SHARE BY REVENUE
FIGURE3.1: HISTORICAL AND FORECASTED GDP GROWTH
FIGURE 3.2: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2024)
FIGURE 3.3: WORLDWIDE SEMICONDUCTOR SALES ($B)
FIGURE 3.4: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI) MOMENTUM TRACKER
FIGURE 3.5: 2024 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.6: SMARTPHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.7: GLOBAL LIGHT VEHICLE PRODUCTION FORECAST
FIGURE 3.8: US EV RETAIL SHARE FORECAST
FIGURE 3.9: AUTOMOTIVE SEMICONDUCTOR CONTENT BY DEVICE TYPE
FIGURE 3.10: AI INFRASTRUCTURE VALUE FORECAST
FIGURE 3.11: SCALE OF TODAY’S AI-CENTRIC DATA CENTERS
FIGURE 3.12: TSMC PHOENIX FAB INVESTMENT TO EXCEED US $65B
FIGURE 3.13: ESTIMATED GLOBAL FAB INVESTMENT 2024-2029
FIGURE 3.14: ANNOUNCED PUBLIC STIMULUS AND RESPECTIVE SEMICONDUCTOR CHIP MANUFACTURING REGIONS
FIGURE 3.15: SEMICONDUCTOR SUPPLY CHAIN EXPANSIONS WITHIN THE US ANNOUNCED MAY 2020 – AUGUST 2024
FIGURE 3.16: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M)
FIGURE 3.17: TECHCET WAFER START FORECAST BY NODE SEGMENTS MILLIONS OF 200MM EQUIVALENTS PER YEAR
FIGURE 3.18: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: FORECASTED 2025 MARKET SIZE
FIGURE 4.2: CMP SLURRY AND PAD REVENUE FORECAST BY SEGMENT
FIGURE 4.3: CMP SLURRY AND PAD REVENUE FORECAST BY APPLICATION
FIGURE 4.4: SLURRY AND PAD REVENUE BY HQ REGION
FIGURE 4.5 CMP STEPS FOR ADVANCED NODES
FIGURE 4.6: BENEFITS OF GAA + BACKSIDE POWER DELIVERY
FIGURE 4.7: EXAMPLES OF VARYING BACKSIDE POWER IMPLEMENTATION SCHEMES
FIGURE 4.8: BACKSIDE POWER IMPLEMENTATION
FIGURE 4.9: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
FIGURE 4.10: 3D NAND CROSS-SECTION
FIGURE 4.11: NUMBER OF CMP STEPS FOR MEMORY TECHNOLOGY NODES
FIGURE 4.12: KEY TRENDS IN ADVANCED PACKAGING
FIGURE 4.13: KEY TRENDS IN ADVANCED PACKAGING
FIGURE 4.14: ADVANCED PACKAGING WAFER BONDING HISTORY
FIGURE 4.15: HYBRID BONDING FLOW PROGRESSION
FIGURE 4.16: CMP OPPORTUNITIES DIE WAFER (D2W) AND WAFER TO WAFER (W2W) HYBRID BONDING
FIGURE 4.17: GROWTH IN ADVANCED PACKAGING
FIGURE 4.18: SILICON CARBIDE WAFER USAGE BY SIZE AND YEAR
FIGURE 5.1: 2023 – 2029 SLURRY VOLUME FORECAST BY APPLICATION
FIGURE 5.2: 2025 SLURRY VOLUME USAGE FORECAST BY REGION
FIGURE 5.3: 2023 – 2029 SLURRY REVENUE FORECAST BY APPLICATION
FIGURE 5.4: 2024 SUPPLIER MARKET SHARE BY HQ REGION
FIGURE 5.5: 2024 TOTAL CMP SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.6: 2024 OXIDE (CERIA) SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.7: 2024 HKMG SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.8: 2024 POLYSILICON SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.9: 2024 OXIDE (SILICA) SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.10: 2024 TUNGSTEN SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.11: 2024 CU BULK SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.12: 2024 CU BARRIER SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.13: 2024 NEW METALS SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.14: 2024 CU BACKSIDE POWER SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 6.1: 2023 – 2029 PAD USAGE FORECAST BY APPLICATION
FIGURE 6.2: 2025 PAD UNIT USAGE FORECAST BY REGION
FIGURE 6.3: 2023 – 2029 PAD REVENUE FORECAST BY APPLICATION
FIGURE 6.4: 2023 – 2029 PAD REVENUE FORECAST BY WAFER SIZE
FIGURE 6.5: 2024 TOTAL CMP PAD SUPPLIER MARKET SHARE BY REVENUE
FIGURE 7.2: SLURRY POTENTIAL HAZARDS (SDS)

TABLES

TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
TABLE 3.2: INITIALLY ANNOUNCED US RECIPROCAL TARIFF SCHEDULE, BY COUNTRY
TABLE 3.3: WORLDWIDE PC FORECAST BY SEGMENT
TABLE 3.4: IT MARKET SPENDING FORECAST, 2025
TABLE 4.1: REGIONAL CMP SLURRY AND PAD MARKETS
TABLE 4.1 REGIONAL CMP SLURRY AND PAD MARKETS, CONT’D
TABLE 4.2: SILICON CARBIDE WAFER MANUFACTURERS AND CONSUMABLES SUPPLIERS
TABLE 5.1: 2024 SLURRY MARKET LEADERS AND TAM BY APPLICATION
TABLE 5.2: MOST RECENT QUARTERLY SUPPLIER SALES OF TOP CMP SLURRY AND/OR PAD SUPPLIERS (IN LOCAL REPORTING CURRENCY)
TABLE 7.1: ABRASIVE SUPPLIERS
TABLE 7.2: VERTICALLY INTEGRATED SLURRY SUPPLIERS
TABLE 7.3: GENERAL 2024 ABRASIVE SUPPLIER RANKING

プレスリリース

[プレスリリース抄訳]

CMP消耗品は2025年に5.9％成長（米国TECHCET予測）

2025年3月26日、米国カリフォルニア州サンディエゴ

半導体材料のサプライチェーン情報を提供する電子材料のアドバイザリー企業であるTECHCETは、メモリーとロジックチップの進化が促進要因となり、CMP（化学研磨）消耗品の収益は2025年に6％増加すると予測しています。

CMP消耗品の市場予測　- TECHCET

3D NAND、FinFETロジック、DRAMデバイスの大容量生産が後押しし、CMP消耗品はTAM（Total Addressable Market）で2024年の34億2,000万ドルから2025年には36億2,000万ドルに成長すると見込まれています。TECHCETによると、製造の複雑化と課題が多くなることでさらにCMPの工数も増えることになるとのことです。 

2024年はメモリーと先端ロジックチップがやや復調になったことで、CMP消耗品の収益も1.5％増加しました。従来型デバイスへの需要は減少し、特に自動車セクターでその傾向が顕著となりました。最大セグメントである、銅、タングステン、酸化物は引き続き重要な収益要因となりました。特に先端ロジックや追加された3D NAND層向けの相互接続の増加などのデバイス技術の進化により、生産強化が続いています。

スラリーの削減や処理費用の削減を目的に、特注で配合されたスラリーやChEmpower社のCMPパッドなどのイノベーションに対する需要が成長を促進しています。また、メーカーは先進的半導体加工における効率性と所有コストの削減を強化することに注力しており、富士フイルムやDuPontのスピンオフ企業による投資が今後の市場を方向付けるでしょう。

[プレスリリース原文]

TECHCET Projects 5.9% Growth in CMP Consumables for 2025

San Diego, CA, March XX, 2025: TECHCET — the electronic materials advisory firm providing semiconductor materials supply chain information — forecasts a 6% increase in CMP Consumables revenue for 2025, driven by advances in memory and logic chips. The Total Addressable Market (TAM) for CMP Consumables is expected to grow from $3.42B in 2024 to $3.62B in 2025, fueled by high-volume manufacturing of 3D NAND, FinFET Logic, and DRAM devices, which require more CMP steps due to the increasing complexity and challenges associated with manufacturing those devices, according to TECHCET’s Critical Materials Report™ on CMP Consumables.

CMP消耗品の市場予測　- TECHCET

In 2024, CMP Consumables saw modest growth, with a 1.5% increase in revenue driven by a slight recovery in memory and advanced logic chips. Legacy devices saw weaker demand, particularly in the automotive sector. The largest segments—Copper, Tungsten, and Oxide consumables—remained key revenue drivers, as advanced device technologies (especially increasing interconnects for advanced logic and additional 3D NAND layers) continued to ramp up production.

Looking ahead, growth will be driven by increased demand for custom-formulated slurries and innovations like ChEmpower’s CMP pads, which aim to eliminate slurries and reduce disposal costs. Additionally, investments by companies like FujiFilm and DuPont’s upcoming spin-off will further shape the market, as manufacturers focus on improving efficiency and reducing the cost of ownership in advanced semiconductor processes.

CMP consumables for metals to see large growth over next 5 years

San Diego, CA, May 2, 2024:  TECHCET — the advisory firm providing materials market information for semiconductor supply chain resilience — is forecasting upwards growth of 6% in 2024 for Semiconductor CMP Consumables. CMP consumables for metals (Co, Mo, Ru) show the largest growth rate by far, increasing 94% over the next 5 years. Healthy growth is also expected for polysilicon and oxide CMP consumables, as highlighted in TECHCET’s Critical Materials Report™ on CMP Consumables.

For the slurry segment, Fujifilm Electronic Materials (FFEM) currently holds the highest share of the market at 31% due to their strong position in Cu slurry (holding the majority share in the segment). Entegris is ranked second in market share, largely due to their acquisitions of Sinmat, Chemetall Precision Microchemicals (was BASF) and CMC. For the pad segment, DuPont continues to be the dominant supplier, representing over 50% of the market.

Geopolitical events could potentially cause delays and price increases as suppliers qualify alternate sources to China and Russia for raw materials. For example, alumina, ceria, and silica raw material supply could be impacted.

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